WO2004086521A1 - 発光素子および発光素子の製造方法 - Google Patents
発光素子および発光素子の製造方法 Download PDFInfo
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- WO2004086521A1 WO2004086521A1 PCT/JP2004/003498 JP2004003498W WO2004086521A1 WO 2004086521 A1 WO2004086521 A1 WO 2004086521A1 JP 2004003498 W JP2004003498 W JP 2004003498W WO 2004086521 A1 WO2004086521 A1 WO 2004086521A1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/28—Materials of the light emitting region containing only elements of Group II and Group VI of the Periodic Table
Definitions
- the present invention relates to a light emitting device using a semiconductor, particularly a light emitting device suitable for emitting blue light or ultraviolet light, and a method for manufacturing the same.
- Japanese Patent Application Laid-Open No. 2000-450500 proposes a light-emitting element in which a less expensive MgZnO-based compound semiconductor layer is heteroepitaxially grown on a sapphire substrate. I have.
- many conventional light-emitting devices have a structure in which a p-type cladding layer is positioned on the light extraction surface side.
- the metal electrode disposed on the p-type cladding layer is formed so as to cover only a part of the light extraction surface so as not to hinder light extraction. Then, to prevent the in-plane distribution of the emission drive current from being biased toward the region near the electrodes, a current diffusion layer with an increased in-plane conductivity by doping the j-type dopant with high concentration is grown on the p-type cladding layer.
- a metal electrode is formed on the current diffusion layer.
- An object of the present invention is to improve the light extraction efficiency, comprising: a light emitting layer portion made of an Mg a Z ⁇ ⁇ ⁇ type oxide; and a high conductivity Mg Z ⁇ -based compound semiconductor layer disposed on the light extraction surface side. and to provide an excellent Mg a Z ni _ a O type oxide-based light emitting device. Disclosure of the invention
- the light emitting device of the present invention is:
- a light emitting layer portion is formed, the n-type cladding layer side is used as a light extraction surface, and Mg a Z n (where 0 ⁇ a
- An n-type low-resistance layer composed of a type oxide and having a larger amount of an n-type dopant added than an n-type cladding layer is provided.
- the low resistance layer for current spreading must also be formed as a p-type.
- M g a Z ni _ a O -type oxide in order to susceptible to oxygen deficiency at the time of growth!
- p for this purpose, specifically, it is necessary to reduce the electron concentration in the oxide.
- One approach to reducing electron concentration is to compensate for electrons with holes. This is a p-type dopant (acceptor) such as Li that generates holes.
- the n-type cladding layer side is used as a light extraction surface, and the main surface of the n-type cladding layer on the light extraction surface side is an n-type cladding layer made of MgZnO-type oxide.
- a low resistance layer was provided.
- the n-type MgZ ⁇ -type oxide is much easier to manufacture because the oxygen deficiency, which was not desirable in the case of the p-type, can be used more effectively as an n-type carrier generation source.
- a metal bonding pad can be provided so as to cover a part of the main surface of the n-type low resistance layer.
- a low resistance layer for current spreading is formed with high quality. Therefore, the light emission drive current supplied from the bonding pad can be uniformly diffused in the n-type low resistance layer surface.
- the light emitting layer can emit light uniformly and efficiently just below the light extraction surface, and a high-luminance MgZ ⁇ -type oxide-based light-emitting element can be obtained.
- the sheet resistance of the n-type low-resistance layer is approximately IX 10 16 ⁇ cm 2 or less.
- the sheet resistance can be reduced by increasing the thickness of the n-type low-resistance layer, but this leads to a reduction in manufacturing efficiency. Therefore, it is desirable to set the thickness to, for example, 0.1 ⁇ m or more and 10 ⁇ m or less.
- 11 inch effective n-type Kiyaria concentration of the low-resistance layer is 1 X 10 17 Zcm 3 or 1 X 1 0 2 ° / cm 3 or less it is desirable. If the effective n-type carrier concentration is less than 1 ⁇ 10 17 / cm 3 , a sufficient reduction in sheet resistance cannot be expected. If the effective n-type carrier concentration exceeds 1 ⁇ 10 2 Q Zcm 3 , heterogeneous phase formation due to excessive addition of the n-type dopant becomes remarkable, This is not desirable because it leads to a decrease in light emission luminance due to light absorption or the like.
- the n- type dopant concentration of the 11-type low resistance layer is 1 ⁇ 10 17 / cm 3 or more and 1 ⁇ 10 2 . / cm 3 or less is desirable.
- the n-type dopant of the 11-type low-resistance layer one, two or more of B, Al, Ga and In can be used.
- n-type low-resistance layer for example MO by VP E method, can be grown as Mg a Z ni _ a O-type oxide layer containing n-type dopant at growth stage.
- the n-type low-resistance layer is vapor-phase grown in the form of a Mg a ⁇ -type oxide layer having an n-type dopant concentration lower than the final n-type dopant concentration, and then the n-type dopant is removed from the main surface of the layer. Can be additionally diffused.
- the n-type cladding layer may be positively added with an n-type dopant, or if the required conductivity can be ensured due to oxygen deficiency in the crystal, a configuration in which the n-type dopant is not positively added may be employed. It is possible.
- active layer and the p-type cladding layer various structural measures can be taken to obtain a high-quality intrinsic or p-type semiconductor.
- active layer or p It is possible to adopt a configuration in which a p-type oxide layer, which is different from the Mg a Z i ⁇ -a O-type oxide and exhibits p-type conductivity, is interposed in the Mg Z ⁇ layer serving as the mold cladding layer. it can. According to this configuration, since the function of absorbing and compensating electrons is performed by the p-type oxide layer locally present in the MgZnO layer, it is not necessary to add a large amount of p-type dopant.
- P-type or i-type MgaZ A type oxide can be obtained, which in turn contributes to the realization of an ultraviolet or blue light emitting element with high luminous efficiency.
- the number of P-type oxide layers is not particularly limited.However, in order to expect high luminous efficiency, the electron compensation effect must be generated uniformly in the MgZ ⁇ layer. Naturally desirable. For this purpose, it is desirable to form a plurality of p-type oxide layers dispersedly in the thickness direction of the MgZ ⁇ layer, for example, to form them periodically.
- the p-type oxide layer for example, a layer mainly containing any of CuO, NiO, and LiO can be used. When CuO is used, part 11 of the same may be replaced by a group II element such as 0 & or a group II element such as Sr.
- a high-concentration doped layer having a p-type dopant concentration higher than the average concentration of the p-type cladding layer has a region width equal to or less than one molecular layer of the p-type cladding layer (so-called “p-type cladding layer”).
- p-type cladding layer a region width equal to or less than one molecular layer of the p-type cladding layer.
- ⁇ doping layer In the ⁇ -type cladding layer, by forming the high-concentration ⁇ -type dopant layer having a region width of one molecular layer or less of the ⁇ -type cladding layer, the ⁇ -type dopant is localized in a so-called layer thickness direction. Localize.
- Type cladding layer can be obtained.
- the high-concentration doped layer does not form a coarse heterophase crystal which is an aggregate of ⁇ -type dopants, but has a region width of one molecular layer or less of the ⁇ -type cladding layer. It is difficult to form non-matching hetero-phase interfaces and dislocations which cause scattering of carriers.
- the Mg a Z ⁇ ⁇ ⁇ type oxide is formed by a vapor phase growth method. can do.
- the sputtering method and the MBE method can be adopted, but the MOVP E method has the following advantages.
- the oxygen partial pressure during growth can be freely changed. Therefore, by increasing the atmospheric pressure to some extent, it is possible to effectively suppress the desorption of oxygen and the generation of oxygen vacancies.
- the light emitting element p-type Mg a Z ni of essential - a O layer in particular, becomes oxygen deficiency concentration can be realized a p-type Mg a Z eta layer was 10 or less Zc m 3. The lower the oxygen deficiency concentration, the better (ie, it does not prevent it from becoming 0 / cm 3 ).
- the oxygen partial pressure (0 2 other than oxygen-containing partial children also shall be incorporated by converting the oxygen contained in O 2) is I To rr (1 ⁇ 3 X 10 2 P a )
- the p-type cladding layer or the active layer is grown in an ultra-high vacuum (up to 10_1 D Torr). Although it cannot be suppressed, it has the advantage that the layer can be controlled on the order of the atomic layer. As a result, the crystallinity of the P-type cladding layer or the active layer can be increased. Further, by using the MBE method, the p-type oxidation The layer of the material layer and / or the highly doped layer can be controlled with high precision, and a higher quality p-type clad layer can be formed.
- the method for manufacturing a light emitting device of the present invention includes: — Light emitting layer with double hetero structure by vapor-phase growth of p-type cladding layer, active layer and n-type cladding layer composed of a O (0 a ⁇ l) type oxide in this order
- p-type cladding layer composed of a O (0 a ⁇ l) type oxide in this order
- FIG. 1 is a schematic view showing a specific example of a light emitting device of the present invention in a laminated structure.
- FIG. 2 is an explanatory view of a manufacturing process of the light emitting device of FIG.
- FIG. 3 is a schematic diagram showing a structure of a p-type cladding layer of the light emitting device of FIG.
- FIG. 4 is a schematic diagram showing an example of a gas supply sequence when the p-type cladding layer of FIG. 3 is formed by the MOVPE method.
- Figure 5 is a schematic view showing a structure of M g a Z ii i- a O-type oxide layer ⁇ doped P-type dopant.
- Figure 6 is a schematic diagram showing a M g a Z n a O-type oxide layer of FIG. 5 in the case of forming the MO VPE method, an example of a gas supply sequence.
- FIG. 7 is a schematic diagram showing a structure of a ⁇ -type cladding layer in which a ⁇ -doping layer and a ⁇ -type oxide layer are formed in a double period.
- FIG. 8 is a schematic diagram showing an example in which a ⁇ -type oxide layer is periodically formed on an active layer.
- FIG. 1 schematically shows a main part of a light-emitting element 1 according to an embodiment of the present invention in a laminated structure, in which an ⁇ -type cladding layer 32, an active layer 33 and a ⁇ -type cladding layer 34 are shown.
- both the layers 3 2-3 4 M g a Z n - a O-type oxide layer (0 ⁇ a ⁇ 1: hereinafter, also referred to as M g Z ⁇ ⁇ :
- Mg Z ⁇ O-type oxide layer
- the n-type cladding layer 32 side of the light-emitting layer portion 24 is used as a light extraction surface, and the main surface on the light extraction surface side of the n-type cladding layer 32 has Mg a Z ni — a O (0 ⁇ a ⁇ 1)
- An n-type low-resistance layer 35 is provided, which is composed of an oxide and has a larger addition amount of an n-type dopant than an n-type cladding layer.
- a bonding pad 9 made of a metal such as Au is arranged so as to cover a part of the main surface.
- a current-carrying electrode wire 47 is bonded to the bonding pad 9.
- the back surface side (p-type cladding layer 34 side) of the light emitting layer portion 24 is covered with a reflective metal layer 22 made of a metal such as Ag (Au or A1).
- MgZ ⁇ has a wurtzite structure, in which oxygen atom layers and metal atom (Zn ion or Mg ion) layers are alternately stacked in the c-axis direction.
- the n-type cladding layer 32 is adjusted so that the n-type carrier concentration is, for example, not less than 1 ⁇ 10 17 Zcm 3 and not more than 1 ⁇ 10 2 ° cm 3 so that light-emitting recombination in the active layer 33 is optimized.
- the n-type dopant one or more of B, Al, Ga and In can be added. May not be added.
- the n-type low-resistance layer 35 functions as a current spreading layer, and one or more of B, Al, Ga and In as a n-type dopant, in this embodiment, A1 is positively added.
- the thickness of the n-type low resistance layer 35 is not less than 0.1 / m and not more than 10 ⁇ , and its sheet resistance is adjusted to 1 ⁇ 10 16 ⁇ cm 2 or less in order to obtain a sufficient current spreading effect.
- n-type carrier concentration of Ri der 1 X 10 17 Zcm 3 or 5 X 10 19 / cm 3 or less effective n-type carrier concentration of Ri der 1 X 10 17 Zcm 3 or 5 X 10 19 / cm 3 or less, the concentration of n-type dopant to be positively added 1 X 10 17 / cm 3 or more 5 X 10 19 / cm 3 is less than or equal to.
- the p-type cladding layer 34 contains a trace amount of one or more of N, Ga, Al, In, and Li as a p-type dopant.
- the p-type carrier concentration is adjusted in the range of 1 ⁇ 10 1 ⁇ 3 m 3 or more and 8 ⁇ 10 18 / cm 3 or less, for example, in the range of 10 17 / cm 3 to 10 18 / cm 3 .
- the active layer 33 has an appropriate band gap according to the required emission wavelength.
- a band gap energy Eg about 3.10 eY to 2.18 eV capable of emitting light at a wavelength of 400 nm to 570 ⁇ m is selected.
- This is an emission wavelength band covering from violet to green, but especially when used for blue emission, the band gap energy E g capable of emitting light at a wavelength of 450 nm to 500 nm (2.76 eV ⁇ 2.48 eV) is selected.
- a material having a band gap energy Eg (approximately 4.43 eV to 3.10 eV) capable of emitting light at a wavelength of 280 nm to 400 ⁇ m is selected.
- the value of the mixed crystal ratio y is also a factor that determines the band gap energy E g. For example, if ultraviolet light with a wavelength of 280 nm to 400 nm is to be emitted, select a value within the range of 0 ⁇ y ⁇ 0.5.
- the discontinuity value of the band edge formed between the cladding layers 32 and 34 on both sides is 0.3 eV to 0.3 eV for the light emitting diode. For a semiconductor laser light source, it is preferable to be about 0.25 eV to about 0.5 eV.
- the ⁇ -type cladding layer 34 is made of an oxide different from the Mg a Z ⁇ ⁇ ⁇ -type oxide, for example, CuO, NiO or LiO.
- a P-type oxide layer 34b is interposed.
- the p-type oxide layer 34 b which is doped p-type Mg a Z iii-a O-type oxide layer 34 a are alternately laminated.
- the p-type oxide layer 34b By adopting such a structure, electrons existing as background carriers in the p-type cladding layer 34 are absorbed and captured by the p-type oxide layer 34b, so that M g a Z nia O-type oxidation Good even if the p-type dopant concentration in the material layer 34a is lowered! ) Type conductive characteristics can be obtained. As a result, it is difficult to form a hetero phase region in which p-type dopants are aggregated, so that a p-type or i-type MgZ ⁇ oxide layer of good quality can be obtained.
- the thickness of the p-type oxide layer 34b is made thin enough to exhibit a quantum effect, and is adjusted so as not to function as a light emitting layer by utilizing a tunnel effect.
- Mg a Z n ⁇ a O-type oxide layer 34 a in contact with the p-type oxides layer 34 b is shall be equivalent to the kind of the barrier layer, since the determined nature of an Balta crystals, conversely It is desirable to adjust the layer thickness to 15 nm or more so that the effect of the tunnel effect is not significant.
- the (!) Type oxide is different from MgZ ⁇ in both crystal structure and lattice constant.
- the p-type oxide layer 34b is not formed in the p-type cladding layer 34 in a lattice-matched manner with the Mg a Z i ⁇ -a O-type oxide layer 34a, The carrier is scattered, leading to a decrease in luminous efficiency.
- the thickness of the p-type oxide layer 34b becomes excessive, the lattice relaxes, and the gap between the p-type oxide layer 34b and the M g a Z ni a O-type oxide layer 34a contacts. Lattice mismatch occurs and threading dislocations are formed in the subsequent growth layer. In order to avoid this, it is necessary to form the p-type oxide layer 34b with a thickness (critical thickness) that does not cause lattice relaxation when forming the p-type oxide layer 34b. It is preferable to form with a layer thickness.
- the critical film thickness for lattice matching with MgZ ⁇ is about 3 to 5 molecular layers.
- the thickness of the MgZn layer 34a that is in contact with this is set to 20 nm or less, for example, a layer of about 15 nm so that b is less than the critical film thickness so that the thickness is less than the critical thickness. It is desirable to form it with a thickness.
- the number of layers of the p-type oxide layer 34b as described above is not particularly limited.However, in order to expect high luminous efficiency, the electron capture effect must be uniform in the target MgZ ⁇ layer. It is of course desirable that this occurs. To this end, as shown in FIG. 3, two or more layers, that is, a plurality of p-type oxide layers 34b are formed in a dispersing manner in the thickness direction of the p-type cladding layer 34, for example, they are formed periodically. Is desirable.
- each p-type oxide layer 34 b and each layer of the Mg a Z ni _ a O-type oxide layer 34 a alternately stacked therewith It is desirable to adjust the thickness to the above range.
- the light emitting element 1 in FIG. 1 emits light when a voltage is applied with a polarity such that the bonding pad 9 side is negative and the back electrode 15 side is positive.
- the light emission drive current is supplied to the light emitting layer section 24 by in-plane diffusion in the n-type low resistance layer 35.
- the luminous flux generated in the active layer 33 is extracted from a region around the bonding pad 9 as a light extraction region.
- the luminous flux traveling toward the back surface side of the active layer 33 is reflected by the metal reflective layer 22 and superimposed on the luminous flux on the light extraction surface side to be extracted.
- the bandgap energy of the n-type low-resistance layer 35 is set larger than that of the active layer 33, and the n-type low-resistance layer 35 is almost transparent to the emitted light beam.
- Step 1 of FIG. 2 a buffer layer 11 composed of Z ⁇ is epitaxially grown on a sapphire substrate 10.
- the n-type low resistance layer 35, the n-type cladding layer 32, the active layer 33 and the p-type cladding layer 34 are epitaxially grown in this order. Epitaxial growth of each of these layers can be performed by the MOVP E method or the MBE method described above. Hereinafter, the case of the MO VPE method will be described.
- the buffer layer 11, the n-type low resistance layer 35, the n-type cladding layer 32, the active layer 33, and the p-type cladding layer 34 can be continuously grown in the same reaction vessel.
- the temperature in the reaction vessel is adjusted by a heating source (in the present embodiment, an infrared lamp) in order to promote a chemical reaction for forming a layer.
- a heating source in the present embodiment, an infrared lamp
- the following can be used as the main raw material for each layer.
- Oxygen source gas Although oxygen gas can be used, it is preferable to supply it in the form of an oxidizing compound gas from the viewpoint of suppressing an excessive reaction with an organic metal described later.
- N 20 nitrous oxide
- Zn source gas dimethyl zinc (DMZ n), getyl zinc (DEZn), etc.
- -Ni source gas cyclopentageninolenickel, methinolecyclopentageninolenickel, etc.
- the Cu source gas, the Ni source gas, and the Li source gas are p-type oxide source gases. Further, the following can be used as the p-type dopant gas.
- Si source gas Silicon hydride such as monosilane.
- C source gas A hydrocarbon (eg, an alkyl containing one or more C).
- Se source gas hydrogen selenide, etc.
- Group III elements such as Al, Ga and In can function as a good p-type dopant by co-addition with N which is a Group V element.
- the following can be used as the dopant gas.
- Al source gas Trimethyl aluminum (TMA 1), Triethyl aluminum
- Ga source gas Trimethylgallium (TMGa), triethylgallium (TEGa), etc.
- Source gas Trimethylindium (TMI n), Triethyl indium (TE In), etc.
- N nitrogen
- Ga metal element
- a gas serving as an N source is used together with an organic metal gas serving as a Ga source when performing vapor phase growth of a p-type cladding layer.
- N 20 used as an oxygen component source also functions as an N source.
- an organic metal such as monomethylhydrazine may be used as the N source.
- the n-type cladding layer 32 may be made to obtain n-type conductivity by lowering the oxygen partial pressure during growth to actively form oxygen vacancies, or to obtain B, A1, Ga and In
- the n-type conductivity may be obtained by adding a group III element such as above alone as an n-type dopant.
- the dopant gas for A 1, G a and In, those described in the section of the type dopant can be similarly used.
- B for example, dipolane (B 2 H 6 ) can be used.
- Each of the above source gases is appropriately diluted with a carrier gas (for example, nitrogen gas) and supplied into the reaction vessel.
- a carrier gas for example, nitrogen gas
- the flow ratio of the organometallic gas MO serving as the Mg source and the Zn source is controlled by a mass flow controller (MFC) or the like for each layer depending on the mixed crystal ratio of each layer.
- the flow rate of N 2 0 and a dopant source gas is oxygen source gas is also controlled by a mass flow controller (MFC).
- the growth of the buffer layer 11 is performed, for example, as follows.
- the substrate 10 on which a layer is grown is a sapphire (alumina single crystal) substrate having a crystal main axis of the a-axis, and the main surface on the oxygen atom side is used as a layer growth surface.
- Substrate 10 prior to layer growth Is sufficiently annealed in an oxidizing gas atmosphere. Oxidizing gases are o 2 , co,
- N 20 is used in this embodiment because it is shared with an oxygen source gas during layer growth described later.
- the substrate temperature is kept at 250 ° C. to 350 ° C. (350 ° C. in the present embodiment) in order to suppress the occurrence of defects and the like while maintaining the oxidizing gas atmosphere.
- the purge time varies depending on the shape and volume of the reaction vessel, but it is effective to secure at least 5 seconds.
- an organic metal gas MO is supplied into the reaction vessel, and for example, the first metal atomic layer forming a part of the buffer layer 11 in FIG. 2 is formed as a monoatomic metal layer by the ALE method (Atomic Layer Epitaxy method).
- the ALE method the growth of the metal atomic layer saturates in one atomic layer due to the self-stopping function, and further growth of the metal atomic layer does not occur even if the supply of the organic metal gas MO is continued.
- the supply of the organic metal gas MO was stopped, the inside of the reaction vessel was replaced with nitrogen gas and the organic metal gas MO was sufficiently purged, and then N 20 was supplied as an oxygen source gas (also an oxidizing gas atmosphere).
- one atomic layer of oxygen is formed by the ALE method.
- the M g Z ⁇ ⁇ layer is formed on the substrate 10 for only one molecular layer.
- the temperature in the reaction vessel is raised to a second temperature (750 ° C. in the present embodiment) which is set to 400 to 800 ° C.
- a second temperature 750 ° C. in the present embodiment
- organic metal gas metal source gas
- the remaining part of the buffer layer is Grow by VPE method. Note that from the viewpoint of obtaining a buffer layer having higher crystallinity and flatness, the first multiple molecular layers may be grown by the ALE method.
- the n-type low resistance layer 35, the n-type cladding layer 32, the active layer 33, and the p-type cladding layer 34 are formed in this order by MOVPE.
- the n-type cladding layer 32 is grown while lowering the oxygen partial pressure to normal pressure or lower (for example, 760 torr or lower) and actively forming oxygen vacancies.
- the n-type dopant gas, Mg a Z ni - while continuing the supply of a O-type oxide layer 3 2 of the raw material gas (metal source gas and an oxygen source gas), and supplies a constant flow rate.
- n-type low-resistance layer 35 is obtained as n-type dopant is uniformly doped Mg a Z n-type oxide.
- the n-type cladding layer 32 is formed with a higher resistivity than the n-type low-resistance layer 35, and the flow rate of the n-type dopant gas is n-type low resistance, even if the n-type dopant gas is not supplied or is supplied.
- Layer 35 is set lower than during growth.
- FIG. 4 shows an example of a gas supply sequence when growing the p-type cladding layer 34. In this sequence, the flow rate of the MgZ ⁇ metal source gas is switched so as to alternate between a large flow period of NS1 and a small flow period of NS0 smaller than NS1, while the p-type oxide metal source gas is switched.
- the growth of the p-type oxide layer 34 b should proceed simultaneously while the growth of the Mg a Z ni — a O-type oxide layer 34 a continues.
- the supply of the MgZnO metal source gas is controlled so as to be a non-zero constant flow value NS0 'even during the small flow period.
- the P-type oxide layer 34b is a region where the p-type oxide and MgZnO are mixed.
- Mg a Z a ni _ a O-type oxide layer 34 a growth in a state of stopping can also be adapted to grow a p-type oxide layer 34 b.
- the flow rate NS0 of the MgZnO metal source gas is set to zero during the small flow rate period.
- Mg a Z ni - During a O-type oxide layer 34 a growth perform doping with P-type dopants (co addition of Ga and N For example).
- the p-type dopant gas can be supplied at a constant flow rate while continuing to supply the source gas (metal source gas + oxygen source gas) for the Mg a Zn— a O-type oxide layer 34a.
- Mg a Z nia O type oxide layer 34 a is assumed to have a structure in which p-type dopant is uniformly doped.
- a ⁇ -doping layer may be formed as having a region width of one molecular layer or less of the MgZZnnO-type oxide layer 34 a.
- the effect of reducing the background electron concentration becomes more remarkable, and the average p-type dopant concentration of the entire p-type cladding layer 34 can be reduced.
- the rate can be further improved.
- the electron compensation effect can be further enhanced.
- the supply amount of the ⁇ -type dopant in the ⁇ -doping layer 34c is desirably adjusted so that the coverage of the ⁇ -type dopant gas molecule is not less than 1/20 and not more than 1/4 molecular layer. If it is less than 1/20 molecular layer, the effect of reducing the electron density of the background is insufficient. On the other hand, if the thickness exceeds 1/4 molecular layer, the amount of the ⁇ -type dopant is likely to be excessive, which leads to a decrease in luminous efficiency.
- the interval between the formation of the ⁇ -doping layer 34c is preferably in the range of 10 to 500 molecular layers in terms of the molecular layer of the Mg ⁇ layer 34a.
- the ⁇ -doping layer 34 c is, by temporarily ⁇ the feed concentration ratio of p-type dopant gas to the raw material gas M g a Z n 1 _ a O -type oxide (metal source gas + oxygen source gas) Can be formed.
- FIG. 6 shows an example of the gas supply sequence, in which the flow rate of the MgZ ⁇ metal source gas is changed between a large flow period of NS1 and a small flow period of NS0 smaller than NS1.
- the flow rate of the oxygen source gas is switched so as to alternate between a large flow period of NX1 and a small flow period of NX0 smaller than NX1, while the p-type dopant gas is MgZ ⁇ raw material gas.
- the flow is switched so that the small flow period (flow rate: ND0) corresponding to the large flow period and the large flow period (flow rate: ND1) corresponding to the small flow period also alternate.
- the effect of reducing the packed ground electron concentration by the formation of the ⁇ -doping layer 34c is that the change profile of the ⁇ -type dopant concentration in the ⁇ -doping layer 34c is The more steep, the more noticeable.
- the growth mode of the Mg a Z ⁇ ⁇ ⁇ -type oxide layer 34 a by the MOVPE method is changed to the buffer layer 11 just before the supply of the p-type dopant gas. It is also effective to switch to the same ALE mode as when forming. That is, if at least the last monolayer of the Mg a Z nia O-type oxide layer 34a immediately before the supply of the type dopant gas is formed by ALE and self-stopped, and in that state, the p-type dopant gas is supplied, It is possible to obtain an extremely steep concentration change profile.
- FIG. 7 schematically shows the detailed structure of the p-type cladding layer finally obtained by the above method.
- a plurality of ⁇ -doping layers 34 c are periodically formed in the Mg a ⁇ 11 i_ a O-type oxide layer 34 a, and the M g a Z ii i— a O-type oxide layer 34 a
- the p-type oxide layer 34b is formed more periodically, that is, has a so-called double periodic structure.
- the p-type oxide layer 33b can be formed on the active layer 33 in exactly the same manner, which contributes to reduction of the background electron concentration and, consequently, improvement of the luminous efficiency.
- the entire active layer 33 must have intrinsic semiconductor type (i-type) conductivity characteristics.
- i-type intrinsic semiconductor type
- the generation of oxygen vacancies was suppressed.
- it is effective to maintain the pressure inside the reaction vessel at 1 OTorr or more. Thereby, the desorption of oxygen is further suppressed, and the MgZ ⁇ layer with less oxygen deficiency can be grown.
- the above-mentioned pressure setting prevents the dissociation of N 20 from abruptly progressing, thereby making it possible to more effectively suppress the generation of oxygen deficiency.
- Atmospheric pressure is higher as the oxygen withdrawal suppression effect is increased Higher effect even 760To rr (1. 01 X 10 5 P a or 1 atm) extent pressure of sufficient noticeable.
- the pressure is 76 OTorr or less
- the inside of the reaction vessel is at normal pressure or reduced pressure, so that there is an advantage that the vessel sealing structure can be relatively simple.
- a pressure exceeding 76 OTorr is adopted, the inside of the container will be pressurized, so that a somewhat strong sealing structure will be used to prevent gas from leaking out. Forces that need to consider structure etc. The effect of suppressing oxygen desorption is even more pronounced.
- the upper limit of the pressure should be established at an appropriate value by consideration of the oxygen withdrawal suppression effect achievable with apparatus cost (e.g., 7600 T orr ((1. 01 X 1 0 6 P a or 10 atm) Degree).
- the p-type cladding layer 34 is annealed in an oxidizing gas atmosphere without growing the subsequent layers, and then the active layer 33 and the n-type cladding layer 32 are formed. You may make it grow by vapor phase. Thereby, the generation of oxygen deficiency in the p-type cladding layer 34 can be more effectively suppressed, and a high-quality P-type cladding layer with less oxygen deficiency can be obtained. Also, after the growth of the active layer 33 and before the growth of the n-type cladding layer 32, the active layer 33 can be subjected to an annealing treatment in a similar oxidizing gas atmosphere, so that a high-quality active layer is similarly obtained.
- the annealing treatment can be set to a temperature almost equal to the growth temperature of the layer. In this case, after growing the p-type cladding layer 34 or the active layer 33 at a predetermined temperature, stopping the supply of the source gas while keeping the temperature, and introducing an oxidizing gas into the reaction vessel instead, annealing Processing can be performed very easily.
- the oxidizing gas addition of 0 2, N. ⁇ , NO, N0 2, CO, H 2 0 , etc. Can be adopted.
- Step 2 when the growth is completed as described above, as shown in Step 2, the Si substrate on which the back electrode 15 and the metal reflection layer 22 are formed in advance is replaced with the p-type cladding layer 34.
- the main back surface is superimposed and adhered, and then heat-treated at an appropriate temperature for lamination.
- the sapphire substrate 10 and the buffer layer 11 are removed from the n-type low-resistance layer 35, a bonding pad 9 is formed on the removed surface by vapor deposition or the like, and an electrode wire 47 is bonded.
- Light-emitting element 1 shown in 1 is obtained.
- each layer is grown by the MOVPE method.
- the MBE method can be adopted.
- a LiO layer is formed as a p-type oxide layer or Li is used as a p-type dopant, solid !: i can be used as a p-type oxide forming material or a doping source. .
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KR100631981B1 (ko) * | 2005-04-07 | 2006-10-11 | 삼성전기주식회사 | 수직구조 3족 질화물 발광 소자 및 그 제조 방법 |
TWI303473B (en) * | 2005-12-12 | 2008-11-21 | High Power Optoelectronics Inc | Semiconductor device integrated with heat sink and method of fabricating the same |
JP2007173404A (ja) * | 2005-12-20 | 2007-07-05 | Rohm Co Ltd | 酸化物半導体発光素子 |
JP5207511B2 (ja) | 2007-05-23 | 2013-06-12 | 独立行政法人産業技術総合研究所 | 半導体素子 |
KR100885190B1 (ko) * | 2007-06-29 | 2009-02-24 | 우리엘에스티 주식회사 | 발광소자와 그의 제조방법 |
US20100176369A2 (en) * | 2008-04-15 | 2010-07-15 | Mark Oliver | Metalized Silicon Substrate for Indium Gallium Nitride Light-Emitting Diodes |
KR101125334B1 (ko) * | 2010-04-09 | 2012-03-27 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지 |
CN101894893B (zh) * | 2010-06-08 | 2014-05-14 | 浙江大学 | 基于双层MgZnO薄膜异质结的电致发光器件 |
CN103843083B (zh) * | 2011-10-06 | 2015-11-18 | 国立研究开发法人科学技术振兴机构 | 结晶及层叠体 |
JP6092586B2 (ja) * | 2012-02-28 | 2017-03-08 | スタンレー電気株式会社 | ZnO系半導体層とその製造方法、及びZnO系半導体発光素子の製造方法 |
JP6100590B2 (ja) * | 2013-04-16 | 2017-03-22 | スタンレー電気株式会社 | p型ZnO系半導体層の製造方法、ZnO系半導体素子の製造方法、及び、n型ZnO系半導体積層構造 |
JP6116989B2 (ja) * | 2013-04-22 | 2017-04-19 | スタンレー電気株式会社 | Cuドープp型ZnO系半導体結晶層とその製造方法 |
JP6136717B2 (ja) * | 2013-07-31 | 2017-05-31 | 日亜化学工業株式会社 | 発光素子、発光装置及び発光素子の製造方法 |
JP6387264B2 (ja) * | 2013-08-02 | 2018-09-05 | スタンレー電気株式会社 | p型ZnO系半導体層の製造方法、及び、ZnO系半導体素子の製造方法 |
JP6231841B2 (ja) * | 2013-10-04 | 2017-11-15 | スタンレー電気株式会社 | p型ZnO系半導体層の製造方法、及び、ZnO系半導体素子の製造方法 |
CN110808535A (zh) * | 2019-11-21 | 2020-02-18 | 江苏索尔思通信科技有限公司 | 一种高可靠性的应变量子阱激光器的外延片生长方法 |
JP7276221B2 (ja) * | 2020-03-25 | 2023-05-18 | 信越半導体株式会社 | 接合ウェーハの製造方法及び接合ウェーハ |
US11342484B2 (en) | 2020-05-11 | 2022-05-24 | Silanna UV Technologies Pte Ltd | Metal oxide semiconductor-based light emitting device |
WO2023084274A1 (en) | 2021-11-10 | 2023-05-19 | Silanna UV Technologies Pte Ltd | Epitaxial oxide materials, structures, and devices |
US20230143766A1 (en) | 2021-11-10 | 2023-05-11 | Silanna UV Technologies Pte Ltd | Epitaxial oxide materials, structures, and devices |
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