WO2004083334A2 - Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength - Google Patents

Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength Download PDF

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Publication number
WO2004083334A2
WO2004083334A2 PCT/US2004/008157 US2004008157W WO2004083334A2 WO 2004083334 A2 WO2004083334 A2 WO 2004083334A2 US 2004008157 W US2004008157 W US 2004008157W WO 2004083334 A2 WO2004083334 A2 WO 2004083334A2
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WO
WIPO (PCT)
Prior art keywords
group
integer
terminated
carbon atoms
alternatively
Prior art date
Application number
PCT/US2004/008157
Other languages
English (en)
French (fr)
Other versions
WO2004083334A3 (en
Inventor
Dorab Edul Bhagwagar
Loren Durfee
Michael Lutz
Timothy Mitchell
Original Assignee
Dow Corning Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Corporation filed Critical Dow Corning Corporation
Priority to EP04749406A priority Critical patent/EP1603988B1/en
Priority to JP2006507279A priority patent/JP4684996B2/ja
Priority to US10/544,249 priority patent/US7687591B2/en
Priority to DE602004014743T priority patent/DE602004014743D1/de
Publication of WO2004083334A2 publication Critical patent/WO2004083334A2/en
Publication of WO2004083334A3 publication Critical patent/WO2004083334A3/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/12—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/08—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
    • C09J151/085—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds on to polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C08G2170/40—Compositions for pressure-sensitive adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
PCT/US2004/008157 2003-03-17 2004-03-16 Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength WO2004083334A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP04749406A EP1603988B1 (en) 2003-03-17 2004-03-16 Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
JP2006507279A JP4684996B2 (ja) 2003-03-17 2004-03-16 向上した高温粘着強度を有する無溶媒シリコーン感圧接着剤
US10/544,249 US7687591B2 (en) 2003-03-17 2004-03-16 Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength
DE602004014743T DE602004014743D1 (de) 2003-03-17 2004-03-16 Lösemittelfreie druckempfindliche siliconklebemittel mit verbesserter hoch-temperatur kohäsion

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US45519303P 2003-03-17 2003-03-17
US60/455,193 2003-03-17

Publications (2)

Publication Number Publication Date
WO2004083334A2 true WO2004083334A2 (en) 2004-09-30
WO2004083334A3 WO2004083334A3 (en) 2005-05-12

Family

ID=33029971

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/008157 WO2004083334A2 (en) 2003-03-17 2004-03-16 Solventless silicone pressure sensitive adhesives with improved high temperature cohesive strength

Country Status (8)

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US (1) US7687591B2 (US07687591-20100330-C00005.png)
EP (1) EP1603988B1 (US07687591-20100330-C00005.png)
JP (1) JP4684996B2 (US07687591-20100330-C00005.png)
KR (1) KR101067257B1 (US07687591-20100330-C00005.png)
CN (1) CN100374525C (US07687591-20100330-C00005.png)
AT (1) ATE399830T1 (US07687591-20100330-C00005.png)
DE (1) DE602004014743D1 (US07687591-20100330-C00005.png)
WO (1) WO2004083334A2 (US07687591-20100330-C00005.png)

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JP2008524420A (ja) * 2004-12-21 2008-07-10 ロディア・シミ 重付加架橋可能な単一成分系粘着性シリコーンエラストマー組成物
EP2081971A2 (en) * 2006-08-28 2009-07-29 Cytec Surface Specialties, S.A. Polymer compositions
CN101333426B (zh) * 2008-07-22 2012-05-30 株洲时代新材料科技股份有限公司 一种少胶云母带有机硅胶粘剂及其制备方法
WO2012166870A1 (en) * 2011-06-02 2012-12-06 Dow Corning Corporation Thick film pressure sensitive adhesive and laminated structure made therefrom
CN103184031A (zh) * 2013-04-03 2013-07-03 深圳市锦联科技有限公司 一种led封装胶及其制备方法
WO2013123619A1 (en) 2012-02-23 2013-08-29 Dow Corning Taiwan Inc. Pressure sensitive adhesive sheet and method of producing thereof
CN114929829A (zh) * 2019-12-30 2022-08-19 美国陶氏有机硅公司 压敏粘合剂组合物

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CN101258209B (zh) * 2005-07-28 2012-07-04 陶氏康宁公司 具有改进的剥离力特征的剥离涂料组合物
JP4957898B2 (ja) * 2007-04-05 2012-06-20 信越化学工業株式会社 付加硬化型シリコーンゴム組成物及びその硬化物
US20090092760A1 (en) * 2007-10-03 2009-04-09 Adam Brager Metal protectant and method of application
CN101842454A (zh) * 2007-10-31 2010-09-22 洛德公司 用于改善与油性基底的粘合性的添加剂
JP4865688B2 (ja) * 2007-12-11 2012-02-01 セイコーエプソン株式会社 液滴吐出ヘッドおよび液滴吐出装置
US20100028668A1 (en) * 2008-07-29 2010-02-04 Janda Amber L Structural insulated sheathing with highly efficient adhesive
US8264354B2 (en) * 2009-10-14 2012-09-11 Attend Systems, Llc Data center equipment location and monitoring system
JP5234064B2 (ja) 2010-08-23 2013-07-10 信越化学工業株式会社 無溶剤型付加型シリコーン粘着剤組成物及び粘着性物品
JP5629957B2 (ja) * 2010-08-23 2014-11-26 独立行政法人 宇宙航空研究開発機構 宇宙空間用シリコーン粘着性物品およびその使用方法
CN103119103A (zh) 2010-09-30 2013-05-22 道康宁公司 制备包含金属纳米粒子的有机硅组合物的方法
CN102127389B (zh) * 2011-01-11 2012-10-10 广东达美新材料有限公司 一种高固含量耐高温有机硅压敏胶及其制备方法
CN102174309B (zh) * 2011-01-13 2014-08-13 深圳市森日有机硅材料有限公司 一种无溶剂型的有机硅压敏胶粘剂及其制备方法
CN110527484B (zh) 2011-03-21 2022-05-24 艾利丹尼森公司 非流动性有机硅粘合剂
KR101253991B1 (ko) * 2011-12-07 2013-04-11 도레이첨단소재 주식회사 연성인쇄회로기판용 점착제 조성물 및 이를 이용한 연성인쇄회로기판용 점착필름
JP2014205762A (ja) * 2013-04-12 2014-10-30 信越化学工業株式会社 無溶剤型シリコーン粘着剤組成物及び粘着性物品
JP6308592B2 (ja) * 2014-04-02 2018-04-11 信越化学工業株式会社 Ｅｕｖ用ペリクル
CN106103629B (zh) * 2014-06-18 2019-12-20 信越化学工业株式会社 基材密合性优异的有机硅粘合剂组合物及粘合性物品
JP2018522954A (ja) 2015-05-01 2018-08-16 ロード コーポレイション ゴム接合用接着剤
US9777203B2 (en) 2015-06-08 2017-10-03 Momentive Performance Materials Silicone pressure sensitive adhesive compositions and protective films containing the same
CN105086921B (zh) * 2015-08-10 2017-09-12 东莞市新星有机硅科技有限公司 一种耐低温有机硅密封胶及其制备方法
KR20170110998A (ko) 2016-03-24 2017-10-12 다우 코닝 코포레이션 낮은 스토리지 모듈러스 실리콘 기재층을 포함하는 광학용 실리콘 양면 테이프
JP6515876B2 (ja) * 2016-06-17 2019-05-22 信越化学工業株式会社 付加反応硬化型シリコーン粘着剤組成物及び粘着テープ
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CN108314896A (zh) * 2017-01-18 2018-07-24 湖南利德电子浆料股份有限公司 一种高粘结易储存单组份加成型液体硅橡胶
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US20060189767A1 (en) 2006-08-24
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EP1603988A2 (en) 2005-12-14
WO2004083334A3 (en) 2005-05-12
CN1756822A (zh) 2006-04-05
CN100374525C (zh) 2008-03-12
ATE399830T1 (de) 2008-07-15
US7687591B2 (en) 2010-03-30
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JP4684996B2 (ja) 2011-05-18
JP2006520838A (ja) 2006-09-14

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