WO2004007150A1 - 搬送用ロボットシステムおよび搬送用ロボットの制御方法 - Google Patents
搬送用ロボットシステムおよび搬送用ロボットの制御方法 Download PDFInfo
- Publication number
- WO2004007150A1 WO2004007150A1 PCT/JP2003/006085 JP0306085W WO2004007150A1 WO 2004007150 A1 WO2004007150 A1 WO 2004007150A1 JP 0306085 W JP0306085 W JP 0306085W WO 2004007150 A1 WO2004007150 A1 WO 2004007150A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- robot
- coordinate system
- transfer robot
- teaching
- control method
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1694—Programme controls characterised by use of sensors other than normal servo-feedback from position, speed or acceleration sensors, perception control, multi-sensor controlled systems, sensor fusion
- B25J9/1697—Vision controlled systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Definitions
- the present invention relates to a transfer robot that unloads a thin wafer or the like placed at a predetermined mounting position or loads a thin wafer or the like at a predetermined position, and particularly relates to a transfer robot system and a transfer robot system.
- the present invention relates to a method for controlling a transfer robot.
- a robot In a wafer transfer device, it is necessary for a robot to accurately transfer a wafer to a predetermined position in a processing unit in order to prevent a problem such as a dropping of a wafer or an inability to perform processing correctly.
- a problem such as a dropping of a wafer or an inability to perform processing correctly.
- the transfer robot Even if the transfer robot is actually moved to the design value position, the wafer is transferred accurately to the specified position. Can not do it. Therefore, it is necessary to teach the transfer port bot prior to the operation of the transfer device.
- reference numeral 14 denotes a jig composed of a disk having the same shape and size as the wafer and a columnar pin erected at the center of the disk.
- the detection means 16 is provided on the front surface of the transfer machine 15 for transferring a wafer, and is a detection means for optically detecting the position of the jig 14.
- the transfer machine 15 installed at its home position, the operator detects the disk portion and the pins of the jig 14 inserted into the boat 17 by the detection means 16 and the transfer machine Acquire the position of the jig 14 in the X-axis direction, Y-axis direction, and Z-axis direction with reference to 15. ''
- position data of the transfer machine 15 for inserting a wafer into the boat 17 can be obtained.
- the transfer robot system further comprising: a robot having a mounting portion on which an object having a thin shape is mounted to transfer the object and the robot.
- a transfer robot system including a robot controller for controlling a robot, a jig mounted on a mounting portion of the robot and having an imaging unit, an image processing unit for processing an image captured by the imaging unit, And a higher-level control unit that controls the robot controller and the image processing unit from a higher level.
- the control method of a transfer robot according to claim 2 is a control method of a transfer robot that transfers an object having a thin shape placed at a predetermined placement position, wherein a jig having imaging means in advance is provided.
- the robot is mounted on a mounting portion at the tip of the arm of the robot, and the robot is moved to a position where the imaging unit can detect a characteristic location existing near the predetermined mounting position.
- An image including the characteristic part is captured, a position of the characteristic part in a coordinate system of the imaging unit is obtained based on the captured image, and a position of the imaging unit on the coordinate system is determined. It is characterized in that it is converted into a position on the robot's coordinate system and the above-mentioned placement position is obtained.
- teaching can be performed even when an operator cannot approach the teaching position for transferring a wafer or the like, thereby greatly shortening the teaching work and saving labor. Can be realized.
- a conversion matrix for converting a relationship between the coordinate system of the imaging unit and the coordinate system of the robot by translation and rotation is obtained in advance, and the coordinate system of the imaging unit is determined.
- the position of the characteristic portion is converted into a position in the robot coordinate system by the conversion matrix.
- the teaching position of the transfer robot can be obtained by detecting the position of the characteristic location by the imaging unit.
- the jig can be shared by a plurality of transfer robots, and the maintenance cost can be reduced.
- a method for controlling a transfer robot wherein a characteristic portion such as a hole, a pin, a mark, a character pattern, or the like is provided near the installation position.
- various objects near the mounting position can be used as characteristic places.
- FIG. 1 is a perspective view of a wafer transfer device showing an embodiment of the present invention.
- FIG. 2 is a perspective view of the inside of the hand unit and the processing unit showing the embodiment of the present invention.
- FIG. 3 is a configuration diagram showing the overall configuration of the embodiment of the present invention.
- FIG. 4 is a block diagram showing the overall configuration of the embodiment of the present invention.
- FIG. 5 is a flowchart illustrating a processing procedure according to the embodiment of the present invention.
- FIG. 6 is a diagram showing an image of the positioning mark viewed from the camera.
- FIG. 7 is a diagram showing an image of the positioning mark viewed from the camera.
- FIG. 8 is a perspective view showing a jig according to a conventional example.
- FIG. 9 is a configuration diagram of a semiconductor manufacturing apparatus according to a conventional example.
- FIG. 10 is a schematic diagram of a coordinate system according to the second embodiment of the present invention.
- a conventional non-illustrated non-contact sensor provided at the tip of the hand detects the height at which a thin object such as a wafer is placed, and the teaching position in the height direction has already been determined.
- the processing related to the detection of the mounting position of a wafer or the like is described below.
- FIG. 1 is a diagram of a wafer transfer device showing an embodiment of the present invention.
- reference numeral 1 denotes a wafer transfer robot, and a hand 2 for mounting a wafer is attached to the tip of the robot.
- the wafer transfer robot 1 has an arm having a total of three degrees of freedom, an axis for rotating the hand 2 about a vertical axis, an axis for moving the hand 2 forward and backward, and an axis for moving the hand 2 up and down.
- the hand 2 is inserted into the processing unit 5 to be loaded, and a wafer unloading operation is performed.
- Reference numeral 3 denotes a teaching jig placed on the hand 2 instead of the wafer.
- the teaching jig 3 is placed on the hand 2 only during teaching, and is removed from the hand 2 during normal wafer transport.
- the teaching jig 3 has an arc of the same diameter as the wafer so that it is arranged in the same manner as the wafer when placed on the hand 2. Further, although not shown, the teaching jig 3 has a positioning mechanism so that it always has a fixed direction when it is placed on the hand 2, and when it is placed on the hand 2 again, its position is fixed. It falls within the tolerance range.
- Reference numeral 4 denotes a camera provided as imaging means, which is installed so as to photograph the lower side of the teaching jig 3. It is desirable that the camera 4 is as small and lightweight as possible. The camera 4 is installed at the center of the teaching jig 3.
- FIG. 2 is a view of the hand 2 inserted into the processing unit 5.
- the wafer mounting location in the processing unit has various shapes. One of the examples will be described as an example where there is a hole and three pins where the wafer is mounted.
- Reference numeral 7 denotes a positioning mark which is a characteristic place during teaching work.
- the positioning marks 7 are holes that are located at equal intervals from each of the three pins 6, but are clearly defined as peripheral portions such as cross marks, circular marks, and character patterns. If there is a geometric shape or pattern that can be distinguished, The present invention can be implemented.
- the user coordinate system means coordinates defined on the basis of at least three arbitrary points on the robot coordinates (origin O, X direction constant point XX, Y direction definition point XY).
- the positioning mark 7 is reflected in the center of the field of view of the camera 4.
- the target position and the current position of the transfer robot can be determined based on the positions of the characteristic points viewed from the camera 4. You can know the relationship.
- FIG. 3 is a schematic diagram showing the overall configuration of the embodiment of the present invention
- FIG. 4 is a block diagram showing the overall configuration.
- reference numeral 8 denotes an image processing unit that processes images from the camera 4
- 9 denotes a mouth pot controller that operates the wafer transfer robot 1
- 10 denotes a command to the image processing unit 8 and the robot controller 9.
- This is a teaching control unit that outputs, and 11 is a monitor. It also includes a wafer transfer robot 1, a node 2, a teaching jig 3, and a camera 4 installed at the center of the teaching jig 3.
- the camera 4 is connected to the image processing unit 8. Upon receiving a command from the teaching control unit 10, the image processing unit 8 executes a hand-over operation according to a program stored in advance.
- the positioning mark (7) in the processing unit (5) can be extracted from the image of the camera (4) mounted on the teaching jig (3), and the camera (4) is located directly above the positioning mark (7). Is calculated from the current position of the
- the information is output to 10.
- the teaching control unit 10 calculates the position data of each axis of the wafer transfer robot 1 based on the information, outputs a command to the robot controller 9, and outputs the command to the robot controller 9.
- the teaching control unit 10 is provided separately from the robot controller 9, but may be provided in the robot controller 9.
- the distance in the height direction between the camera and the positioning mark is known. Therefore, the ratio of how long one pixel of the camera image corresponds to on the surface where the positioning mark exists can be known in advance.
- the position of the wafer transfer robot 1 may be directly obtained by detecting the position of the positioning mark 7, here, the correction amount is calculated based on the position taught first, and a command is issued to the mouth bot controller 9. An example of outputting is described with reference to a flowchart shown in FIG.
- FIG. 5 a portion surrounded by a dotted line relates to the teaching in the height direction which has been completed before the present embodiment.
- the image processing unit 8 controls the teaching. Image processing is performed in response to a command from the unit 10.First, the pixel of the horizontal displacement dx (12 in FIG. 6) and the vertical displacement dy (13 in FIG. 6) between the center of the positioning mark 7 and the center of the screen Find the number.
- the coordinate system of the transfer robot 1 and the coordinate system of the camera 4 have the same origin and direction, and how much one pixel of the camera image is on the surface where the positioning mark exists.
- the two coordinate systems are in a calibrated state because the ratio of whether they correspond to the lengths of the pixels is known.By multiplying dx and dy by the ratio of the number of pixels to the length, The movement amount can be obtained.
- a and b are stored in the image processing unit 8 in advance.
- the image processing unit 8 returns these X and Y values to the teaching control unit 10.
- the teaching control unit 10 converts this value into the motion of each axis of the wafer transfer robot 1 based on this value, shortens the telescopic axis to the robot controller 9, and turns the turning axis in the counterclockwise direction. Command so that the positioning mark 7 appears in the center of the screen as shown in Fig. 7.
- the image captured by the camera 4 is output to the monitor 11, and the operator can confirm the series of teaching work by the monitor 11.
- a second embodiment of the present invention will be described with reference to FIG.
- the coordinate system 31 of the camera 4 is a coordinate system unique to the camera itself.
- a user coordinate system 32 having the same origin and coordinate axis direction as the coordinate system 31 of the force camera 4 is defined.
- the coordinate system 31 is a pixel unit, but the coordinate system 32 is the same unit as the coordinate system 30 of the transfer robot 1, for example, 0.001 mm.
- the coordinate system 32 is defined in the robot controller 9. That is, the relationship between the coordinate system 32 and the coordinate system 30 is
- the coordinate system 30 of the transfer robot 1 is calculated by a simple calculation by converting the detection position of the image captured by the camera 4 using the transformation matrix M. It is possible to do.
- the wafer transfer robot 1 can Is positioned to the ganging position. Also, the teaching operation can be performed by adjusting the position of the wafer transfer robot 1 manually while checking the image on the monitor 11 without using the image processing unit 8 and the teaching control unit 10.
- the teaching jig 3 can be used in other wafer transfer devices.
- the present invention as described above has the following effects.
- teaching can be performed even when an operator cannot approach the teaching position for transferring a wafer or the like, thereby greatly shortening the teaching work and saving labor. Can be realized.
- the teaching position of the transfer robot can be obtained by detecting the position of the characteristic location by the imaging unit.
- the jig can be shared by a plurality of transfer robots, and the maintenance cost can be reduced.
- the present invention relates to a transfer robot for unloading a wafer or the like having a thin shape placed at a predetermined mounting position or loading a wafer or the like having a thin shape at a predetermined position, and particularly relates to a transfer robot system and a transfer robot system. This is useful as a control method for a transfer robot.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/521,572 US7805219B2 (en) | 2002-07-17 | 2003-05-15 | Carrier robot system and control method for carrier robot |
CN038169827A CN1668424B (zh) | 2002-07-17 | 2003-05-15 | 搬运用机器人系统和搬运用机器人的控制方法 |
KR1020057000745A KR100787704B1 (ko) | 2002-07-17 | 2003-05-15 | 반송용 로봇 티칭 장치 및 반송용 로봇의 티칭 방법 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002207675A JP4257570B2 (ja) | 2002-07-17 | 2002-07-17 | 搬送用ロボットのティーチング装置および搬送用ロボットのティーチング方法 |
JP2002-207675 | 2002-07-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2004007150A1 true WO2004007150A1 (ja) | 2004-01-22 |
Family
ID=30112827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/006085 WO2004007150A1 (ja) | 2002-07-17 | 2003-05-15 | 搬送用ロボットシステムおよび搬送用ロボットの制御方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7805219B2 (ja) |
JP (1) | JP4257570B2 (ja) |
KR (1) | KR100787704B1 (ja) |
CN (1) | CN1668424B (ja) |
TW (1) | TW200402117A (ja) |
WO (1) | WO2004007150A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004082014A1 (en) * | 2003-03-11 | 2004-09-23 | Applied Materials, Inc. | Vision system and method for calibrating a wafer carrying robot |
US7085622B2 (en) | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
CN110600397A (zh) * | 2018-06-12 | 2019-12-20 | 株式会社荏原制作所 | 用于基板输送系统的示教装置及示教方法 |
Families Citing this family (62)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7107125B2 (en) * | 2003-10-29 | 2006-09-12 | Applied Materials, Inc. | Method and apparatus for monitoring the position of a semiconductor processing robot |
JP4122521B2 (ja) * | 2005-01-17 | 2008-07-23 | 村田機械株式会社 | 天井走行車システム |
JP2006224279A (ja) * | 2005-02-21 | 2006-08-31 | Fanuc Ltd | ロボット撮像装置 |
US7321299B2 (en) * | 2005-06-08 | 2008-01-22 | Axcelis Technologies, Inc. | Workpiece handling alignment system |
JP4663493B2 (ja) * | 2005-11-21 | 2011-04-06 | ルネサスエレクトロニクス株式会社 | ティーチング装置、およびティーチング方法 |
US8364514B2 (en) * | 2006-06-27 | 2013-01-29 | Microsoft Corporation | Monitoring group activities |
US7970637B2 (en) * | 2006-06-27 | 2011-06-28 | Microsoft Corporation | Activity-centric granular application functionality |
US20070299713A1 (en) * | 2006-06-27 | 2007-12-27 | Microsoft Corporation | Capture of process knowledge for user activities |
US20070300225A1 (en) * | 2006-06-27 | 2007-12-27 | Microsoft Coporation | Providing user information to introspection |
US7761393B2 (en) * | 2006-06-27 | 2010-07-20 | Microsoft Corporation | Creating and managing activity-centric workflow |
US20070297590A1 (en) * | 2006-06-27 | 2007-12-27 | Microsoft Corporation | Managing activity-centric environments via profiles |
US7620610B2 (en) * | 2006-06-27 | 2009-11-17 | Microsoft Corporation | Resource availability for user activities across devices |
US20070300185A1 (en) * | 2006-06-27 | 2007-12-27 | Microsoft Corporation | Activity-centric adaptive user interface |
JP4869852B2 (ja) * | 2006-09-28 | 2012-02-08 | 株式会社ダイヘン | 搬送用ロボットの教示方法 |
SG195592A1 (en) | 2007-12-27 | 2013-12-30 | Lam Res Corp | Arrangements and methods for determining positions and offsets in plasma processing system |
SG187402A1 (en) | 2007-12-27 | 2013-02-28 | Lam Res Corp | Systems and methods for calibrating end effector alignment in a plasma processing system |
US8954287B2 (en) | 2007-12-27 | 2015-02-10 | Lam Research Corporation | Systems and methods for calibrating end effector alignment using at least a light source |
JP5336513B2 (ja) | 2007-12-27 | 2013-11-06 | ラム リサーチ コーポレーション | 動的アラインメント・ビーム校正のためのシステムおよび方法 |
US8401702B2 (en) * | 2008-06-06 | 2013-03-19 | Panasonic Corporation | Robot, and control apparatus, control method, and control program for robot |
JP2010087358A (ja) * | 2008-10-01 | 2010-04-15 | Muratec Automation Co Ltd | 搬送システム及びズレ検出用治具 |
JP2010131711A (ja) * | 2008-12-05 | 2010-06-17 | Honda Motor Co Ltd | ロボットアームの制御方法 |
TW201111127A (en) * | 2009-06-30 | 2011-04-01 | Ulvac Inc | Robot teaching apparatus and robot teaching method |
JPWO2013157119A1 (ja) * | 2012-04-19 | 2015-12-21 | 株式会社安川電機 | ロボットシステム |
US9352466B2 (en) * | 2012-06-01 | 2016-05-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | Robot positioning system for semiconductor tools |
JP5983763B2 (ja) * | 2012-11-30 | 2016-09-06 | 株式会社安川電機 | ロボットシステム |
JP6006103B2 (ja) * | 2012-12-07 | 2016-10-12 | 株式会社ダイヘン | ロボットの教示方法、搬送方法、および搬送システム |
JP6111065B2 (ja) * | 2012-12-28 | 2017-04-05 | 川崎重工業株式会社 | 自動教示システム及び教示方法 |
CN103264394A (zh) * | 2013-01-11 | 2013-08-28 | 清华大学 | 化学机械抛光传输机器人晶圆抓取自适应控制方法及装置 |
CN103112008B (zh) * | 2013-01-29 | 2015-09-02 | 上海智周自动化工程有限公司 | 用于地板切割的双视觉机器人自动定位和搬运方法 |
JP5673716B2 (ja) * | 2013-03-19 | 2015-02-18 | 株式会社安川電機 | ロボットシステム及び被加工物の製造方法 |
KR101465652B1 (ko) * | 2013-04-12 | 2014-11-28 | 성균관대학교산학협력단 | 로봇 핸드와 로봇 핸드에 부착된 카메라의 캘리브레이션 방법 및 장치 |
CN104162889B (zh) * | 2013-05-15 | 2016-10-26 | 上海和辉光电有限公司 | 一种机械臂控制系统及控制方法 |
JP5860021B2 (ja) * | 2013-10-24 | 2016-02-16 | ファナック株式会社 | 複数の締結部材を締結するための締結装置、ロボットシステム、および締結方法 |
CN104626147A (zh) * | 2013-11-11 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | 一种机械手自动示教系统及方法 |
CN104626167A (zh) * | 2013-11-11 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | 一种自动示教用无线通信晶圆系统及方法 |
JP6380828B2 (ja) * | 2014-03-07 | 2018-08-29 | セイコーエプソン株式会社 | ロボット、ロボットシステム、制御装置、及び制御方法 |
CN105252516A (zh) * | 2014-07-14 | 2016-01-20 | 沈阳芯源微电子设备有限公司 | 一种机械手自动示教系统及控制方法 |
JP6443837B2 (ja) * | 2014-09-29 | 2018-12-26 | セイコーエプソン株式会社 | ロボット、ロボットシステム、制御装置、及び制御方法 |
US9966290B2 (en) | 2015-07-30 | 2018-05-08 | Lam Research Corporation | System and method for wafer alignment and centering with CCD camera and robot |
CN105182887A (zh) * | 2015-08-05 | 2015-12-23 | 上海腾滨自动化技术有限公司 | 一种应用于工业机器人的自动化控制方法 |
KR101812210B1 (ko) * | 2016-02-15 | 2017-12-26 | 주식회사 이오테크닉스 | 마킹 위치 보정장치 및 방법 |
JP6596375B2 (ja) * | 2016-03-31 | 2019-10-23 | 株式会社荏原製作所 | ティーチング装置およびティーチング方法 |
CN107324041B (zh) | 2016-04-29 | 2019-11-26 | 上海微电子装备(集团)股份有限公司 | 用于片盒夹持的机械手及自动片盒搬运装置 |
US9987747B2 (en) * | 2016-05-24 | 2018-06-05 | Semes Co., Ltd. | Stocker for receiving cassettes and method of teaching a stocker robot disposed therein |
CN105923348B (zh) * | 2016-06-06 | 2018-06-08 | 珠海格力电器股份有限公司 | 一种单侧移动式的压缩机识别搬运系统及其搬运方法 |
JP6741538B2 (ja) * | 2016-09-28 | 2020-08-19 | 川崎重工業株式会社 | ロボット、ロボットの制御装置、及び、ロボットの位置教示方法 |
JP6741537B2 (ja) * | 2016-09-28 | 2020-08-19 | 川崎重工業株式会社 | ロボット、ロボットの制御装置、及び、ロボットの位置教示方法 |
TWI614103B (zh) * | 2016-10-21 | 2018-02-11 | 和碩聯合科技股份有限公司 | 機械手臂定位方法及應用其的系統 |
WO2018207462A1 (ja) * | 2017-05-11 | 2018-11-15 | 村田機械株式会社 | 搬送システム及び搬送方法 |
TWI718338B (zh) * | 2017-09-11 | 2021-02-11 | 光寶科技股份有限公司 | 照明裝置的安裝方法以及機械手臂 |
US10551179B2 (en) | 2018-04-30 | 2020-02-04 | Path Robotics, Inc. | Reflection refuting laser scanner |
CN108858280A (zh) * | 2018-06-05 | 2018-11-23 | 厦门攸信信息技术有限公司 | 一种录制人类行为的多机械臂组合工作系统 |
CN109859605A (zh) * | 2019-02-28 | 2019-06-07 | 江苏集萃微纳自动化系统与装备技术研究所有限公司 | 工业机器人无示教器的3d示教方法 |
CN109940590B (zh) * | 2019-04-09 | 2020-09-22 | 东莞长盈精密技术有限公司 | 机器人放料方法和放料装置 |
JP7390822B2 (ja) * | 2019-08-09 | 2023-12-04 | キヤノントッキ株式会社 | ティーチング装置、基板搬送装置、基板処理装置、ティーチング方法、及び電子デバイスの製造方法 |
WO2022016152A1 (en) | 2020-07-17 | 2022-01-20 | Path Robotics, Inc. | Real time feedback and dynamic adjustment for welding robots |
JP2022045522A (ja) | 2020-09-09 | 2022-03-22 | キヤノントッキ株式会社 | ティーチング装置、基板搬送装置、基板処理装置、ティーチング方法、及び電子デバイスの製造方法 |
WO2022182896A2 (en) | 2021-02-24 | 2022-09-01 | Path Robotics Inc. | Autonomous welding robots |
CN113206031B (zh) * | 2021-07-05 | 2021-10-29 | 宁波润华全芯微电子设备有限公司 | 一种晶圆自动定位示教系统及方法 |
JPWO2023026678A1 (ja) * | 2021-08-26 | 2023-03-02 | ||
CN115148660B (zh) * | 2022-07-29 | 2023-03-21 | 北京北方华创微电子装备有限公司 | 晶圆承载装置及其调节机构、半导体工艺设备 |
WO2024057836A1 (ja) * | 2022-09-12 | 2024-03-21 | 株式会社島津製作所 | 対象物の搬送を制御する制御方法、対象物を搬送する搬送装置、および搬送装置を備える作業システム |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1089943A (ja) * | 1996-09-18 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 物体位置決め方法及び装置 |
JP2002002909A (ja) * | 2000-06-19 | 2002-01-09 | Shinko Electric Co Ltd | ストッカ用ロボットの教示確認方法 |
JP2002018754A (ja) * | 2000-07-10 | 2002-01-22 | Toyota Central Res & Dev Lab Inc | ロボット装置及びその制御方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4636137A (en) * | 1980-10-24 | 1987-01-13 | Lemelson Jerome H | Tool and material manipulation apparatus and method |
US4380696A (en) * | 1980-11-12 | 1983-04-19 | Unimation, Inc. | Method and apparatus for manipulator welding apparatus with vision correction for workpiece sensing |
US4453085A (en) * | 1981-05-11 | 1984-06-05 | Diffracto Ltd. | Electro-optical systems for control of robots, manipulator arms and co-ordinate measuring machines |
US4613942A (en) * | 1982-02-19 | 1986-09-23 | Chen Richard M | Orientation and control system for robots |
US4483407A (en) * | 1982-03-26 | 1984-11-20 | Hitachi, Ltd. | Variable configuration track laying vehicle |
US4753569A (en) * | 1982-12-28 | 1988-06-28 | Diffracto, Ltd. | Robot calibration |
US4698775A (en) * | 1985-05-17 | 1987-10-06 | Flexible Manufacturing Systems, Inc. | Self-contained mobile reprogrammable automation device |
US4853771A (en) * | 1986-07-09 | 1989-08-01 | The United States Of America As Represented By The Secretary Of The Navy | Robotic vision system |
US5219264A (en) * | 1986-09-19 | 1993-06-15 | Texas Instruments Incorporated | Mobile robot on-board vision system |
JPS6489943A (en) * | 1987-09-30 | 1989-04-05 | Shicoh Eng Co Ltd | Five-phase dc motor |
JPH02160499A (ja) | 1988-12-12 | 1990-06-20 | Fujitsu Ltd | ロボットデータの測定装置 |
JP3538506B2 (ja) | 1996-09-13 | 2004-06-14 | 株式会社東芝 | ロボットのための画像処理プログラム自動生成方法、その装置およびロボットプログラム自動修正方法 |
US6433463B1 (en) * | 1999-06-04 | 2002-08-13 | Wisconsin Alumni Research Foundation | Method and apparatus for stress pulsed release and actuation of micromechanical structures |
WO2001084621A1 (en) * | 2000-04-27 | 2001-11-08 | Ebara Corporation | Rotation holding device and semiconductor substrate processing device |
US20030110649A1 (en) * | 2001-12-19 | 2003-06-19 | Applied Materials, Inc. | Automatic calibration method for substrate carrier handling robot and jig for performing the method |
-
2002
- 2002-07-17 JP JP2002207675A patent/JP4257570B2/ja not_active Expired - Fee Related
-
2003
- 2003-05-15 US US10/521,572 patent/US7805219B2/en not_active Expired - Fee Related
- 2003-05-15 CN CN038169827A patent/CN1668424B/zh not_active Expired - Fee Related
- 2003-05-15 WO PCT/JP2003/006085 patent/WO2004007150A1/ja active Application Filing
- 2003-05-15 KR KR1020057000745A patent/KR100787704B1/ko not_active IP Right Cessation
- 2003-05-23 TW TW092114065A patent/TW200402117A/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1089943A (ja) * | 1996-09-18 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 物体位置決め方法及び装置 |
JP2002002909A (ja) * | 2000-06-19 | 2002-01-09 | Shinko Electric Co Ltd | ストッカ用ロボットの教示確認方法 |
JP2002018754A (ja) * | 2000-07-10 | 2002-01-22 | Toyota Central Res & Dev Lab Inc | ロボット装置及びその制御方法 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7085622B2 (en) | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US7233841B2 (en) | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US7627395B2 (en) | 2002-04-19 | 2009-12-01 | Applied Materials, Inc. | Vision system |
WO2004082014A1 (en) * | 2003-03-11 | 2004-09-23 | Applied Materials, Inc. | Vision system and method for calibrating a wafer carrying robot |
CN110600397A (zh) * | 2018-06-12 | 2019-12-20 | 株式会社荏原制作所 | 用于基板输送系统的示教装置及示教方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2004050306A (ja) | 2004-02-19 |
KR20050023424A (ko) | 2005-03-09 |
TWI320589B (ja) | 2010-02-11 |
CN1668424B (zh) | 2012-03-14 |
KR100787704B1 (ko) | 2007-12-21 |
US7805219B2 (en) | 2010-09-28 |
US20060106497A1 (en) | 2006-05-18 |
CN1668424A (zh) | 2005-09-14 |
TW200402117A (en) | 2004-02-01 |
JP4257570B2 (ja) | 2009-04-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2004007150A1 (ja) | 搬送用ロボットシステムおよび搬送用ロボットの制御方法 | |
US5329469A (en) | Calibration method for a visual sensor | |
US9517560B2 (en) | Robot system and calibration method of the robot system | |
US20050273199A1 (en) | Robot system | |
US7532949B2 (en) | Measuring system | |
JP2020011339A (ja) | ロボットシステムの制御方法、およびロボットシステム | |
US20010055069A1 (en) | One camera system for component to substrate registration | |
JP5370774B2 (ja) | トレイ移載装置及び方法 | |
JP2016185572A (ja) | ロボット、ロボット制御装置およびロボットシステム | |
JP4794011B2 (ja) | 画像処理装置、およびロボット制御システム | |
KR100701080B1 (ko) | 티칭 검사 장치와 그 방법, 티칭 검사 장치를 구비하는기판 이송 시스템 및 그의 티칭 방법 | |
KR20090051418A (ko) | 기판 이송 로봇을 구비하는 반도체 제조 설비 및 그의 티칭방법, 그리고 그의 자동 티칭 장치 및 방법 | |
JP2004276151A (ja) | 搬送用ロボットおよび搬送用ロボットの教示方法 | |
CN110303505B (zh) | 机器人的位置信息恢复方法 | |
CN110154038B (zh) | 机器人的位置信息恢复方法 | |
KR20070122271A (ko) | 로봇 자세 제어 시스템 및 로봇 자세 제어 방법 | |
CN112598752B (zh) | 基于视觉识别的标定方法及作业方法 | |
KR101792499B1 (ko) | 반도체 제조 장치의 티칭 방법 | |
JP3978844B2 (ja) | 移動体の停止位置ズレ量検出装置及び無人搬送車 | |
JP2009184069A (ja) | ウエハ搬送装置及びその調整方法 | |
CN113905859B (zh) | 机器人控制系统及机器人控制方法 | |
WO2019123517A1 (ja) | 作業装置及びその制御方法 | |
JP3419870B2 (ja) | 視覚認識装置の認識用光学系のキャリブレーション方法及びその方法を用いた視覚認識装置 | |
JPH05204423A (ja) | 視覚装置付きロボット装置における座標較正方法 | |
EP4385684A1 (en) | Robot inspection system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): CN KR US |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020057000745 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 20038169827 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 1020057000745 Country of ref document: KR |
|
ENP | Entry into the national phase |
Ref document number: 2006106497 Country of ref document: US Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10521572 Country of ref document: US |
|
WWP | Wipo information: published in national office |
Ref document number: 10521572 Country of ref document: US |