WO2003088370A3 - Hermetische verkapselung von organischen elektro-optischen elementen - Google Patents

Hermetische verkapselung von organischen elektro-optischen elementen Download PDF

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Publication number
WO2003088370A3
WO2003088370A3 PCT/EP2003/003883 EP0303883W WO03088370A3 WO 2003088370 A3 WO2003088370 A3 WO 2003088370A3 EP 0303883 W EP0303883 W EP 0303883W WO 03088370 A3 WO03088370 A3 WO 03088370A3
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WO
WIPO (PCT)
Prior art keywords
optical elements
organic electro
hermetic encapsulation
applying
organic
Prior art date
Application number
PCT/EP2003/003883
Other languages
English (en)
French (fr)
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WO2003088370A2 (de
Inventor
Clemens Ottermann
Oliver Fritz
Dietrich Mund
Joern Pommerehne
Original Assignee
Schott Glas
Zeiss Stiftung
Clemens Ottermann
Oliver Fritz
Dietrich Mund
Joern Pommerehne
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10222964A external-priority patent/DE10222964B4/de
Priority to DE10222958A priority Critical patent/DE10222958B4/de
Priority claimed from DE10222609A external-priority patent/DE10222609B4/de
Priority to AU2003233974A priority patent/AU2003233974A1/en
Priority to PCT/EP2003/003883 priority patent/WO2003088370A2/de
Priority to JP2003585192A priority patent/JP2005527076A/ja
Application filed by Schott Glas, Zeiss Stiftung, Clemens Ottermann, Oliver Fritz, Dietrich Mund, Joern Pommerehne filed Critical Schott Glas
Priority to EP03727306A priority patent/EP1495501A2/de
Priority to KR1020047016642A priority patent/KR100942038B1/ko
Priority to CN038133024A priority patent/CN1659720A/zh
Priority to CA002505014A priority patent/CA2505014A1/en
Publication of WO2003088370A2 publication Critical patent/WO2003088370A2/de
Publication of WO2003088370A3 publication Critical patent/WO2003088370A3/de

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B19/00—Other methods of shaping glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • C—CHEMISTRY; METALLURGY
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    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
    • C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
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    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C—CHEMISTRY; METALLURGY
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    • C03C4/00—Compositions for glass with special properties
    • C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
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    • H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
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    • H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
    • H01L21/02266—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by physical ablation of a target, e.g. sputtering, reactive sputtering, physical vapour deposition or pulsed laser deposition
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
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    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
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    • C03C2218/10—Deposition methods
    • C03C2218/15—Deposition methods from the vapour phase
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    • C03C2218/00—Methods for coating glass
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    • H01L2924/12—Passive devices, e.g. 2 terminal devices
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    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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Abstract

Um eine erhöhte Lebensdauer organischer, elektro-optischer Elemente zu erreichen, sieht die Erfindung ein Verfahren zu deren Herstellung vor, welches die Schritte umfasst: Bereitstellen eines Trägers (3), Aufbringen einer ersten leitfähigen Schicht (13), Aufbringen zumindest einer Schicht (15), welche zumindest ein organisches, elektro-optisches Material aufweist, Aufbringen einer zweiten leitfähigen Schicht (17), sowie den Schritt des Abscheiden zumindest einer Schicht (7, 71, 72,…, 7N) mit glasartiger Struktur.
PCT/EP2003/003883 2002-04-15 2003-04-15 Hermetische verkapselung von organischen elektro-optischen elementen WO2003088370A2 (de)

Priority Applications (8)

Application Number Priority Date Filing Date Title
DE10222958A DE10222958B4 (de) 2002-04-15 2002-05-23 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element
CA002505014A CA2505014A1 (en) 2002-04-15 2003-04-15 Hermetic encapsulation of organic electro-optical elements
CN038133024A CN1659720A (zh) 2002-04-15 2003-04-15 有机电光元件的气密封装
PCT/EP2003/003883 WO2003088370A2 (de) 2002-04-15 2003-04-15 Hermetische verkapselung von organischen elektro-optischen elementen
JP2003585192A JP2005527076A (ja) 2002-04-15 2003-04-15 有機電気光学素子の気密封止
AU2003233974A AU2003233974A1 (en) 2002-04-15 2003-04-15 Hermetic encapsulation of organic electro-optical elements
EP03727306A EP1495501A2 (de) 2002-04-15 2003-04-15 Hermetische verkapselung von organischen elektro-optischen elementen
KR1020047016642A KR100942038B1 (ko) 2002-04-15 2003-04-15 유기 광전 소자 및 유기 광전 소자 제조 방법

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
DE20205830 2002-04-15
DE20205830.1 2002-04-15
DE10222964A DE10222964B4 (de) 2002-04-15 2002-05-23 Verfahren zur Gehäusebildung bei elektronischen Bauteilen sowie so hermetisch verkapselte elektronische Bauteile
DE10222609.1 2002-05-23
DE10222958.9 2002-05-23
DE10222609A DE10222609B4 (de) 2002-04-15 2002-05-23 Verfahren zur Herstellung strukturierter Schichten auf Substraten und verfahrensgemäß beschichtetes Substrat
DE10222958A DE10222958B4 (de) 2002-04-15 2002-05-23 Verfahren zur Herstellung eines organischen elektro-optischen Elements und organisches elektro-optisches Element
DE10222964.3 2002-05-23
DE10252787A DE10252787A1 (de) 2002-04-15 2002-11-13 Verfahren zur Herstellung eines Kopierschutzes für eine elektronische Schaltung
DE10252787.3 2002-11-13
DE10301559.0 2003-01-16
DE10301559A DE10301559A1 (de) 2002-04-15 2003-01-16 Verfahren zur Herstellung eines Erzeugnisses mit einer strukturierten Oberfläche
PCT/EP2003/003883 WO2003088370A2 (de) 2002-04-15 2003-04-15 Hermetische verkapselung von organischen elektro-optischen elementen

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WO2003088370A3 true WO2003088370A3 (de) 2004-06-17

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DE10222958A1 (de) 2003-10-30
AU2003233974A1 (en) 2003-10-27
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CA2505014A1 (en) 2003-10-23
CN1659720A (zh) 2005-08-24
JP2005527076A (ja) 2005-09-08
EP1495501A2 (de) 2005-01-12

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