WO2004113041A3 - Verfahren zum herstellen eines keramik-metall-substrates - Google Patents

Verfahren zum herstellen eines keramik-metall-substrates Download PDF

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Publication number
WO2004113041A3
WO2004113041A3 PCT/DE2004/001012 DE2004001012W WO2004113041A3 WO 2004113041 A3 WO2004113041 A3 WO 2004113041A3 DE 2004001012 W DE2004001012 W DE 2004001012W WO 2004113041 A3 WO2004113041 A3 WO 2004113041A3
Authority
WO
WIPO (PCT)
Prior art keywords
producing
ceramic
metal substrate
metal
applying
Prior art date
Application number
PCT/DE2004/001012
Other languages
English (en)
French (fr)
Other versions
WO2004113041A2 (de
Inventor
Juergen Schulz-Harder
Kurt Mitteregger
Karl Exel
Juergen Weisser
Original Assignee
Curamik Electronics Gmbh
Juergen Schulz-Harder
Kurt Mitteregger
Karl Exel
Juergen Weisser
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Curamik Electronics Gmbh, Juergen Schulz-Harder, Kurt Mitteregger, Karl Exel, Juergen Weisser filed Critical Curamik Electronics Gmbh
Priority to JP2006515661A priority Critical patent/JP5047615B2/ja
Priority to US10/560,525 priority patent/US20060183298A1/en
Priority to EP04732932A priority patent/EP1634326A2/de
Publication of WO2004113041A2 publication Critical patent/WO2004113041A2/de
Publication of WO2004113041A3 publication Critical patent/WO2004113041A3/de

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/4807—Ceramic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H01L21/481—Insulating layers on insulating parts, with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/102—Using microwaves, e.g. for curing ink patterns or adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Chemically Coating (AREA)

Abstract

Die Erfindung bezieht sich auf ein neuartiges Verfahren zum Herstellen eines Metall­-Keramik-Substrates, bei dem (Verfahren) auf wenigstens einer Oberflächenseite einer Keramikschicht mindestens ein Metallbereich aufgebracht wird.
PCT/DE2004/001012 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates WO2004113041A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006515661A JP5047615B2 (ja) 2003-06-16 2004-05-14 セラミック金属基板の製造方法
US10/560,525 US20060183298A1 (en) 2003-06-16 2004-05-14 Method for manufacturing a ceramic/metal substrate
EP04732932A EP1634326A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10327360A DE10327360B4 (de) 2003-06-16 2003-06-16 Verfahren zum Herstellen eines Keramik-Metall-Substrates
DE10327360.3 2003-06-16

Publications (2)

Publication Number Publication Date
WO2004113041A2 WO2004113041A2 (de) 2004-12-29
WO2004113041A3 true WO2004113041A3 (de) 2005-02-24

Family

ID=33495108

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2004/001012 WO2004113041A2 (de) 2003-06-16 2004-05-14 Verfahren zum herstellen eines keramik-metall-substrates

Country Status (5)

Country Link
US (1) US20060183298A1 (de)
EP (1) EP1634326A2 (de)
JP (1) JP5047615B2 (de)
DE (1) DE10327360B4 (de)
WO (1) WO2004113041A2 (de)

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DE102005022160A1 (de) * 2005-05-13 2006-11-16 Daimlerchrysler Ag Ölpumpe mit integrierter Stromregeleinrichtung
US20080070378A1 (en) * 2006-09-19 2008-03-20 Jong-Souk Yeo Dual laser separation of bonded wafers
SI2131994T1 (sl) 2007-02-28 2014-03-31 Ceramtec Gmbh Postopek za izdelavo gradnika ob uporabi asimetričnega vnosa energije vzdolž ločevalne ali vnaprej določene prelomne linije
KR101534124B1 (ko) 2007-04-25 2015-07-06 세람테크 게엠베하 칩 저항기 기판
DE102009015520A1 (de) * 2009-04-02 2010-10-07 Electrovac Ag Metall-Keramik-Substrat
JP5537081B2 (ja) * 2009-07-28 2014-07-02 浜松ホトニクス株式会社 加工対象物切断方法
US9035163B1 (en) 2011-05-10 2015-05-19 Soundbound, Inc. System and method for targeting content based on identified audio and multimedia
DE102012102611B4 (de) * 2012-02-15 2017-07-27 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102012104903B4 (de) * 2012-05-10 2023-07-13 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
DE102013105528B4 (de) * 2013-05-29 2021-09-02 Rogers Germany Gmbh Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates
KR20180097554A (ko) * 2015-12-22 2018-08-31 헤레우스 도이칠란트 게엠베하 운트 코. 카게 피코 레이저를 사용하여 금속-세라믹 기판을 생성하기 위한 방법
JP6853455B2 (ja) * 2017-02-23 2021-03-31 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
US11430741B2 (en) * 2017-05-16 2022-08-30 Heraeus Deutschland GmbH & Co. KG Ceramic-metal substrate with low amorphous phase
TWI651193B (zh) * 2017-12-06 2019-02-21 李宜臻 金屬陶瓷積層散熱基板之製造方法、及包含該金屬陶瓷積層散熱基板之電子裝置及發光二極體
CN111684584A (zh) * 2018-02-01 2020-09-18 康宁股份有限公司 用于卷形式的电子封装和其他应用的单一化基材
WO2019222330A2 (en) * 2018-05-17 2019-11-21 Corning Incorporated Singulated electronic substrates on a flexible or rigid carrier and related methods
JPWO2019225273A1 (ja) * 2018-05-23 2021-05-27 住友ベークライト株式会社 回路基板の製造方法
US20200368804A1 (en) * 2019-05-24 2020-11-26 Trusval Technology Co., Ltd. Manufacturing process for heat sink composite having heat dissipation function and manufacturing method for its finished product
CN116904913A (zh) * 2023-08-01 2023-10-20 江苏富乐华半导体科技股份有限公司 一种dcb的铜片氧化方法

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US6207221B1 (en) * 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

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US3556366A (en) * 1969-05-01 1971-01-19 Teletype Corp Methods of severing materials employing a thermal shock
US5626777A (en) * 1993-03-02 1997-05-06 Hoechst Ceramtec Ag Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate
US6207221B1 (en) * 1997-03-01 2001-03-27 Jürgen Schulz-Harder Process for producing a metal-ceramic substrate and a metal-ceramic substrate
US6420678B1 (en) * 1998-12-01 2002-07-16 Brian L. Hoekstra Method for separating non-metallic substrates
US6444499B1 (en) * 2000-03-30 2002-09-03 Amkor Technology, Inc. Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components

Also Published As

Publication number Publication date
JP5047615B2 (ja) 2012-10-10
US20060183298A1 (en) 2006-08-17
JP2006527666A (ja) 2006-12-07
DE10327360A1 (de) 2005-01-05
DE10327360B4 (de) 2012-05-24
WO2004113041A2 (de) 2004-12-29
EP1634326A2 (de) 2006-03-15

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