WO2002025678A1 - Procede de fabrication d'un condensateur electrolytique solide - Google Patents
Procede de fabrication d'un condensateur electrolytique solide Download PDFInfo
- Publication number
- WO2002025678A1 WO2002025678A1 PCT/JP2001/008182 JP0108182W WO0225678A1 WO 2002025678 A1 WO2002025678 A1 WO 2002025678A1 JP 0108182 W JP0108182 W JP 0108182W WO 0225678 A1 WO0225678 A1 WO 0225678A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- capacitor element
- solder
- capacitor
- lead wire
- solid electrolytic
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 67
- 239000007787 solid Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 229910000679 solder Inorganic materials 0.000 claims abstract description 37
- 239000011888 foil Substances 0.000 claims abstract description 33
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 25
- 239000007784 solid electrolyte Substances 0.000 claims description 16
- 238000000576 coating method Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 16
- 229920001940 conductive polymer Polymers 0.000 description 9
- 238000007789 sealing Methods 0.000 description 7
- 238000007654 immersion Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical compound C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 102220644724 Pleckstrin homology domain-containing family M member 1_H60A_mutation Human genes 0.000 description 1
- 102220644723 Pleckstrin homology domain-containing family M member 1_H63A_mutation Human genes 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000002255 enzymatic effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FYMCOOOLDFPFPN-UHFFFAOYSA-K iron(3+);4-methylbenzenesulfonate Chemical compound [Fe+3].CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1.CC1=CC=C(S([O-])(=O)=O)C=C1 FYMCOOOLDFPFPN-UHFFFAOYSA-K 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
Definitions
- the present invention relates to a solid electrolytic capacitor in which a solid electrolyte layer is formed in a capacitor element having an anode member on which a dielectric film is formed, and the capacitor element is housed in an outer case and sealed.
- a solid electrolytic capacitor with a configuration as shown in Fig. 1 is formed as a solid electrolytic capacitor in which a cathode electrolyte layer is formed in a capacitor element provided with an anode member on which a dielectric film is formed, and the capacitor element is housed in an outer case and sealed. It has been known.
- a solid electrolyte layer made of a TCNQ complex, a conductive polymer, etc. is provided in a capacitor element 7 in which an anode foil on which a dielectric film is formed and an opposite cathode foil are wound through a separator. After being formed, the capacitor element is housed in a bottomed cylindrical outer case 8 and sealed with a sealing rubber 9:> A seat plate 10 for surface mounting is mounted. Reference numerals 51 and 52 indicate lead wires drawn from the anode foil and the cathode foil.
- solder-coated lead coated with lead-containing solder, lead-free solder, or the like is used as the lead, in the step of forming the solid electrolyte layer in the capacitor element, as described in [1] and [2] above. After a heat history of about 200 ° C or more, An oxide film may be formed on the surface of the covered lead wire, or the solder coating layer itself may be melted and peeled off, and when the capacitor is mounted on a printed wiring board as a finished product, the solderability of the lead wire becomes poor.
- An object of the present invention is to provide a technique for improving the solder wettability of a lead wire in a solid electrolytic capacitor using a solder-coated lead wire.
- the method for manufacturing a solid electrolytic capacitor according to the first aspect of the present invention comprises: winding an anode foil having a dielectric film formed thereon and an opposite cathode foil through a separator, and coating the anode foil and the cathode foil with solder.
- the step of forming a solid electrolyte layer in the capacitor element includes a sub-step of raising the temperature of the capacitor element to about 200 or more, and after the temperature raising step, polishing the surface of the lead wire by polishing. It is characterized by applying.
- the method for manufacturing a solid electrolytic capacitor according to the second aspect of the present invention comprises: winding an anode foil having a dielectric film formed thereon and an opposing cathode foil through a separator; and coating the anode foil and the cathode foil with solder.
- the step of forming a solid electrolyte layer in the capacitor element includes a sub-step of raising the temperature of the capacitor element to about 200 or more. After the temperature raising step, a solder coating process is performed on a surface of the lead wire. Is performed.
- the solder wettability of the lead wire is improved.
- FIG. 1 is a cross-sectional view of a solid electrolytic capacitor.
- FIG. 2 is an exploded perspective view of the capacitor element.
- a solid electrolytic capacitor manufactured according to one embodiment of the present invention has a wound type capacitor element 7 in which a conductive polymer layer is formed, and the capacitor element is placed in an aluminum outer case 8. After sealing and attaching a rubber sealing member 9, a seat plate 10 for surface mounting is attached.
- the wound type capacitor element is etched and converted
- the aluminum foil 1 which has been treated is used as an anode, and is wound in a cylindrical shape with a separator 3 sandwiched between the aluminum foil 1 and the counter cathode foil 2.
- the lead wires 51, 52 coated with lead-containing solder, lead-free solder, etc. are drawn out.
- a conductive polymer layer 'in a wound-type capacitor element In order to form a conductive polymer layer 'in a wound-type capacitor element, first, 3,4-ethylenedioxythiophene as a monomer that becomes a conductive polymer by oxidation polymerization, and as an oxidizing agent Prepare a chemical polymerization solution containing iron (III) p-toluenesulfonate and n-butyl alcohol as a diluent. Then, after the capacitor element is immersed in the chemical polymerization solution, a heat treatment is performed for about 200 ° C. for several minutes, so that the capacitor element is brought into close contact with the anodized foil and the opposing cathode foil in the capacitor element. A polymer layer of tylene dioxythiophene is formed.
- the capacitor element 7 on which the conductive polymer layer is formed is housed in a bottomed cylindrical aluminum outer case 8 with the sealing rubber 9 attached to the root portions 61, 62 of the lead wire, and The opening is subjected to horizontal drawing and curling, and a seat plate 10 for surface mounting is mounted.
- the step of forming the conductive polymer layer if a heat history of raising the temperature to about 200 ° C. or more as described above occurs, an oxide film is formed on the surface of the solder-coated lead wire, The solder coating layer itself may be melted and peeled off.
- the oxide film can be removed by subjecting the surface of the lead wire to air blasting using crow beads as an abrasive.
- the oxide film may be removed by a water blast method instead of the air blast method. To solve the problem of melting and peeling of the solder coating layer, it is effective to perform a solder coating process again on the surface of the lead wire.
- Either the polishing treatment or the solder coating treatment may be employed, or both may be used in combination. Also, it may be performed immediately after the temperature raising step or after storing the capacitor element in the case.
- Example 1 in which an oxide film was removed by an air blast method
- Example 2 in which an enzymatic film was removed by a war blast method
- a solder coating treatment Example 3
- the oxide film was removed by the warm blast method, and then the solder coating was applied.
- Example 4 the conventional capacitor without polishing or solder coating was prototyped and soldered under the conditions shown in Table 1.
- a wettability test was performed. The results are shown in Table 2. Item.
- a non-defective item is 2 seconds or less.
- a polymer of 3,4-ethylenedioxythiophene was used as a material for the cathode electrolyte, but other conductive polymers (for example, a polymer obtained by oxidative polymerization of pyrrole, thiophene, aniline, or a derivative thereof). ) May be used, or an organic semiconductor such as a TCNQ complex may be used.
- an epoxy resin sealing may be employed instead of the rubber sealing as a sealing means of the case for housing the capacitor element.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Traditionnellement, on fabrique un condensateur électrolytique solide en utilisant un procédé au cours duquel sont enroulées une feuille d'anode sur laquelle un film diélectrique est formé, une feuille de cathode opposée et un séparateur situé entre les feuilles. On achemine des fils recouverts de soudure hors des feuilles d'anode et de cathode, on forme une couche électrolytique solide dans l'élément du condensateur ainsi fabriqué, on loge l'élément de condensateur dans un boîtier scellé et on amène lesdits fils hors du boîtier. Dans ce procédé, lorsque l'étape de formation de la couche électrolytique solide dans l'élément du condensateur comprend une sous-étape de chauffage dudit élément à une température d'au moins environ 200 °C, on peut former un film d'oxyde sur les fils recouverts de soudure ou on peut faire fondre et éliminer la couche revêtue de soudure. Ainsi, lorsque le condensateur est monté à un tableau de connexions imprimé comme produit fini du condensateur, la mouillabilité des fils peut se dégrader. Selon cette invention, le procédé est caractérisé en ce que la surface des fils est polie ou à nouveau recouverte de soudure, après la sous-étape d'augmentation de la température.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AU2001288075A AU2001288075A1 (en) | 2000-09-20 | 2001-09-20 | Method for manufacturing solid electrolytic capacitor |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000284446A JP2002093661A (ja) | 2000-09-20 | 2000-09-20 | 固体電解コンデンサの製造方法 |
| JP2000-284446 | 2000-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2002025678A1 true WO2002025678A1 (fr) | 2002-03-28 |
Family
ID=18768653
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2001/008182 WO2002025678A1 (fr) | 2000-09-20 | 2001-09-20 | Procede de fabrication d'un condensateur electrolytique solide |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2002093661A (fr) |
| AU (1) | AU2001288075A1 (fr) |
| WO (1) | WO2002025678A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5337943B2 (ja) * | 2010-02-10 | 2013-11-06 | ニチコン株式会社 | 固体電解コンデンサおよびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074770A (fr) * | 1973-11-09 | 1975-06-19 | ||
| JPH07245245A (ja) * | 1994-03-07 | 1995-09-19 | Marcon Electron Co Ltd | 固体電解コンデンサの製造方法 |
-
2000
- 2000-09-20 JP JP2000284446A patent/JP2002093661A/ja active Pending
-
2001
- 2001-09-20 AU AU2001288075A patent/AU2001288075A1/en not_active Abandoned
- 2001-09-20 WO PCT/JP2001/008182 patent/WO2002025678A1/fr active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5074770A (fr) * | 1973-11-09 | 1975-06-19 | ||
| JPH07245245A (ja) * | 1994-03-07 | 1995-09-19 | Marcon Electron Co Ltd | 固体電解コンデンサの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| AU2001288075A1 (en) | 2002-04-02 |
| JP2002093661A (ja) | 2002-03-29 |
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