WO2002022740A1 - Composition de resine polyimide, produit de polyimide forme dans un film, et bande de transfert intermediaire comprenant ladite composition - Google Patents
Composition de resine polyimide, produit de polyimide forme dans un film, et bande de transfert intermediaire comprenant ladite composition Download PDFInfo
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- WO2002022740A1 WO2002022740A1 PCT/JP2001/007753 JP0107753W WO0222740A1 WO 2002022740 A1 WO2002022740 A1 WO 2002022740A1 JP 0107753 W JP0107753 W JP 0107753W WO 0222740 A1 WO0222740 A1 WO 0222740A1
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- intermediate transfer
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/14—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base
- G03G15/16—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer
- G03G15/1605—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support
- G03G15/162—Apparatus for electrographic processes using a charge pattern for transferring a pattern to a second base of a toner pattern, e.g. a powder pattern, e.g. magnetic transfer using at least one intermediate support details of the the intermediate support, e.g. chemical composition
Definitions
- the present invention relates to a resin composition having an intermediate resistance value, a polyimide film molded article using the same, and a polyimide intermediate transfer belt having a stable intermediate resistance value and excellent transferability. It is. Background art
- Polyimide resins are useful for various applications because of their excellent heat resistance, solvent resistance, high strength and high durability. Depending on the application, various additional properties are required for the polyimide resin.
- One of the inherent characteristics of polyimide is that it has high insulation properties, but it also has the property of being relatively easily charged.
- Polyimide is often used in electrical and electronic components, and static electricity is stored in electrical and electronic components, which can be a problem. Especially in semiconductor peripheral materials
- intermediate resistance in the present invention refers to a resistance value in the range of 1 0 6 ⁇ 1 0 12 ⁇ ⁇ cm.
- JP-A-2-110138 discloses a product comprising an aromatic polyimide matrix and finely divided electrically conductive particles, wherein the particles are uniformly dispersed and present in an amount of 10 to 45% by weight of the whole.
- JP-A-63-311263 discloses an aromatic polyamide film or an aromatic polyamide film containing 5 to 2 Owt% of car pump racks and having a surface resistance Rs ( ⁇ port) of 10 7 ⁇ Rs ⁇ l 0 15.
- Rs surface resistance
- Polyimide has a high resistance value among various resins.
- the volume resistance value of acrylic resin is about 10 14 ⁇ 'cm
- the volume resistance value of wholly aromatic linear polyimide is 10 Indicates a value of 16 ⁇ ⁇ cm or more.
- the degree of difficulty is higher because a partial variation significantly reduces insulation reliability.
- the fillers reduce the strength of the belt and cause damage to the belt due to use.
- the resistance value is stably controlled by using various conductive materials as fillers. Even when screening for effects, good results were not obtained with a single conductive substance. Therefore, as described above, it is said that the polyimide resin can reduce the volume resistance value by blending a conductive substance.However, if the polyimide resin is blended with a single conductive substance, the object of the present invention is It was found that it was not possible to obtain an intermediate transfer belt based on a polyimide resin based on a good intermediate resistance ground that meets the requirements of oil and fat, and with high insulation reliability.
- the present invention has verified the combination of various conductive substances to obtain a specific effect by combining various materials. As a result, the present invention has an intermediate resistance value and insulation reliability. It is an object of the present invention to provide a polyimide resin-based intermediate transfer belt having high performance. Disclosure of the invention
- the present invention relates to a poly (ethylene) resin containing 0.5 to 20 parts by weight of a force-sensitive black powder and 5 to 40 parts by weight of a plate-like or column-like conductive powder with respect to 100 parts by weight of a polyimide resin. It is a mid resin composition.
- the present invention provides a polyimide resin composition containing 0.5 to 20 parts by weight of carbon black and 5 to 40 parts by weight of a plate-like or columnar conductive powder with respect to 100 parts by weight of a polyimide resin.
- the volume resistivity value of the measurement voltage 1 0 0 V is in the range of 1 X 1 0 6 ⁇ 1 X 1 0 12 ⁇ ⁇ cm, a polyimide film-shaped molded body.
- the polyimide film-shaped molded body has a volume resistivity value of the measurement voltage 1 0 0 V may be in the range of 1 X 1 0 7 ⁇ 1 X 1 0 10 ⁇ 'cm.
- the force pump rack may be a Ketchen rack, and the blending amount may be 0.5 to 5 parts by weight based on 100 parts by weight of the polyimide resin.
- the plate-shaped or columnar conductive powder may be a mica-like substance subjected to a conductive treatment.
- the polyimide film-shaped molded article may be in the form of a tube or a belt.
- the intermediate transfer belt of the present invention has the polyimide film-like molded body as a base material.
- the intermediate transfer belt of the present invention has a fluororesin layer containing a conductive substance on its surface, The surface resistance can be in the range of 1 ⁇ 10 8 to 1 ⁇ 10 13 ⁇ / cm 2 .
- the polyimide resin composition of the present invention basically contains at least carbon black and conductive powder as a filler in a polyimide resin.
- a polyimide resin for car pump racks, 0 for 100 parts by weight of polyimide resin. 5 to 20 parts by weight, the conductive powder has a plate-like or columnar shape, and contains 5 to 40 parts by weight with respect to 100 parts by weight of the polyimide resin.
- the polyimide film-shaped molded article of the present invention uses the above-mentioned polyimide resin composition, and the mixing ratio of the force pump rack and the plate-like or columnar conductive powder to the polyimide resin is optimal within the above-mentioned mixing ratio.
- the composition is selected and blended.
- the volume resistivity of the film-shaped molded product is within a certain range, that is, the volume resistivity at a measurement voltage of 100 V is within the range of 1 ⁇ 10 6 to 1 ⁇ 10 12 ⁇ ⁇ cm.
- the compounding ratio of carbon black and the plate-like or columnar conductive powder is optimally selected and compounded in the range of the above-mentioned compounding ratio in the polyimide resin to be used.
- certain range that is, when the volume resistance value in the measured voltage 1 0 0 V is in the range of 1 X 1 0 6 ⁇ 1 X 1 0 12 ⁇ ⁇ cm is partially resistance abnormality on the intermediate transfer belt
- Such transfer failure and image disturbance do not occur at all.
- the polyimide resin in the present invention refers to all resins having an imide bond in the structure, and includes not only resins called by general names such as polyetherimide, polyesterimide, polyesterimide, and polyamideimide, but also other resins. Also includes copolymers and blends.
- General polyimides are usually produced using a diamine compound and tetracarboxylic dianhydride as monomers.
- diamine compound for example, N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-N-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl-N-(2-aminoethyl)-2-aminoethyl
- X represents a divalent organic group selected from the following organic groups.
- R is the same or different and consists of hydrogen, halogen, one CH 3 , -OCH 3 , one (CH 2 ) nCH 3- , one (CH 2 ) nCH 3 , one CF 3 , -0CF 3 Shows at least one group selected from the group.
- A is the same or different
- C ( ⁇ ) Indicates at least one group selected from the group consisting of ⁇ and NHCO.
- m is an integer of 1 to 4, and n is an integer of 1 or more.
- Y is a tetravalent organic group selected from
- n is an integer of 1 or more.
- Various monomers represented by the following formulas can be used. By combining these, various characteristics can be expressed, and selection can be made according to the situation such as the application and the processing method.
- a diamine containing a large number of bent chains (preferably two or more) and / or an aromatic ring having a bond at the meta position is used, and di-anhydride of two or more rings is used. If so, a thermoplastic polyimide can be obtained, and a resin composition that can be heated and melt molded can be provided.
- a combination of benzophenonetetracarboxylic dianhydride, or a combination of 2,3,3'4'biphenyltetracarboxylic dianhydride and 4,4'diaminodiphenyl ether, or a combination of oxydiphthalic dianhydride and 3,4'diaminodiphenyl Examples include a combination of two channels.
- polyimide generally has a high water absorption due to the presence of an imide group, but a characteristic having a relatively low water absorption can be imparted by a combination of specific monomers.
- acid dianhydrides represented by As the diamine compound used in this case it is preferable to use a monomer having a relatively long chain in order to reduce the imide group content.
- a monomer having a relatively long chain for example, 1,4-bis (4-aminophenoxy) benzene and its bonding position isomer, 2,2′-bis (4-aminophenoxyphenyl) propane and the like can be mentioned.
- the structure having many long chains and bent chains is also a condition for simultaneously developing the above-mentioned thermoplasticity, and is inappropriate when sufficient heat resistance is required. It is.
- a monomer having a long chain and having a linear structure in whole or in part is suitable.
- tetracarboxylic dianhydride as tetracarboxylic dianhydride,
- TMHQ p-phenylenebistrimellitate dianhydride
- a powder is mixed with the polyimide resin.
- the powder is preferably a conductive inorganic substance. Since the toughness is inevitably reduced by the blending of the inorganic substance, a higher toughness is required for the polyimide as the base resin as compared with the case of using the polyimide alone. However, if the toughness of the polyimide itself is not sufficient, the toughness is inevitably reduced due to the blending of the powder, so that the polyimide may not be practically used.
- Most preferred from the viewpoint of toughness is a polyimide composed of pyromellitic dianhydride and 4,4 ′ diaminodiphenyl ether. Such a polyimide structure has sufficient heat resistance and high toughness, and has well-balanced properties that can maintain the properties under a wide range of processing conditions.
- the fine shape of the powder is preferably plate-like or column-like.
- the carbon black to be blended with the polyimide resin various existing carbon blacks can be used as long as they have conductivity. Examples include fan black, acetylene black, thermal black, and channel black. Among these, it is one kind of furnace black. Particularly, when a carbon black called Ketjen Black having a large specific surface area is used, the blending amount of the carbon black may be smaller.
- Examples of the plate-shaped conductive powder used in the present invention include a mica-based substance that has been subjected to a conductive treatment by coating a substance obtained by coating antimony on tin oxide, or a flaky metal powder. Can be.
- Examples of the columnar conductive powder include those obtained by subjecting titanium oxide to a similar conductive treatment with tin oxide and antimony.
- a mica-based material whose surface is made conductive can be suitably used.
- the mixing ratio thereof is 0.5 to 20 parts by weight, preferably 0.5 to 10 parts by weight of carbon black and 5 to 40 parts by weight, preferably 10 to 35 parts by weight based on 100 parts by weight of the polyimide resin. Is used. In particular, when Ketjen Black is used as carbon black, it is preferable that Ketjen Black is used in an amount of 0.5 to 5 parts by weight based on 100 parts by weight of the polyimide resin.
- Each substance is used at least one kind, but it is also possible to use two or more kinds of substances.
- the resistance can be reduced by adding only tens of parts of carbon black alone. However, it is difficult to stably control the resistance in the middle range of the resistance value, and when a large amount of carbon black is blended, it is difficult to eliminate the cohesion and insulation reliability is poor. Atsuta.
- the mechanism is not known at this time, but the addition of a large amount of plate or columnar conductive material has the potential to reduce the overall resistance of the material, while the conductive material is non-conductive. Because it is continuous, a state occurs in which no breakdown due to perfect conduction occurs. It is presumed that by taking a structure in which a small amount of carbon black fills the gap between the discontinuous conductive materials, the effect of substantially lowering the resistance value to a suitable level is produced.
- Non-conductive fillers include, for example, small-diameter particulate substances such as titanium oxide and silica, swelling mica, plate-like and non-swelling mica-based mica-based substances, scale-like substances, and titanic acid. Various materials such as short fibrous or whisker-like substances such as barium and titanate rim are used.
- the non-conductive filler is added for controlling characteristics such as elastic modulus.
- the non-conductive powder appropriately assists the dispersion of the conductive powder, so that the aggregation of the conductor can be more highly prevented and the resistance value can be stabilized.
- Various methods can be used as a method for dispersing the plate-like or columnar conductive powder and the force pump rack to be added to the polyimide resin.
- the polyimide resin is solvent-soluble
- a preparatory dispersion method it is effective to add powders to a solvent and sufficiently disperse the particles by an ultrasonic disperser.
- the plate-like powder may be damaged in shape when subjected to excessive shearing force, and therefore, a method using no three rolls is preferable.
- the above-mentioned preliminary dispersion is added to a solution of the polyamic acid, which is a precursor of the polyimide, and mixed in the same manner.
- a method of performing kneading or the like is also possible.
- a dispersant for assisting the dispersibility of the solid powder can be used in combination as long as the characteristic deterioration of the polyimide does not significantly occur.
- the dispersibility is more improved by adding the polyamic acid solution to the preliminary dispersion liquid while stirring it little by little than in the reverse procedure as described above.
- powders are first added to a solvent and sufficiently dispersed by an ultrasonic disperser or the like, and the raw material of polyimide (polyamic acid) is added thereto. And a diamine compound and an acid dianhydride compound are added to carry out a polymerization reaction.
- the dispersion at the micro-mouth level is favorably maintained by ultrasonic dispersion or the like, and at the same time, the stirring is always carried out from the initial solid powder dispersion to the polymerization, so that the macro level is obtained. Is also very good.
- the solution is a polyimide solution, it is processed into a belt shape, and then the solvent is volatilized by heating or, in some cases, using a reduced pressure, to obtain a polyimide molded body.
- a belt can be obtained by the same steps as in the case of the polyimide solution.
- an acid anhydride such as acetic anhydride or a tertiary amine can be used alone or in combination as a dehydrating agent or a catalyst to promote imidization prior to heating.
- acid anhydrides not only accelerate the imidization reaction but also may cause the breakage of the main chain of the polyamic acid, so the combination of acid anhydrides and tertiary amines is important for the mechanical properties of polyimide.
- addition of only tertiary amine is more preferable.
- the curing reaction of the polyamic acid solution to which the acid anhydride and the tertiary amine are added starts immediately after the mixing, which makes it difficult to handle in a batch-type manufacturing process. Therefore, the addition of only tertiary amine is most preferably employed.
- the polyimide resin composition obtained by adding at least two types of fillers to a polyimide resin is formed into a film-shaped molded product.
- Examples of specific molding methods for various shapes are shown. Examples of a method for forming a film or sheet include the following methods.
- the polyimide resin solution in which each of the above-mentioned inorganic components is dispersed is applied on an endless belt while controlling the thickness by using a T-die or by passing through a comma coat or a dough blade.
- the resin solution is heated and dried with hot air until it has self-supporting properties, and then peeled off from the endless belt.
- a film-like molded product can be obtained by fixing both ends of the peeled semi-dry film with pins and clips and sequentially passing the film through a high-temperature heating furnace while defining the length in the width direction.
- a film or a sheet-shaped polyimide molded body fixed in a sheet shape is applied to a continuous sheet-like support made of metal or the like by the same method and then passed through a heating furnace. After that, a method of peeling off from the support sheet or removing the support sheet by means of etching or the like can be adopted.
- Examples of the method of molding into a belt or a tube include the following methods. First, a film or sheet-like molded body is obtained by the above-described method, etc. The easiest way is to cut to a predetermined length and width and join them in a belt or tube shape to obtain a belt or tube. Adhesives or adhesive tapes can be used for joining, but this method inevitably causes inconveniences depending on the application because there are steps or cuts at joints.
- the resin solution is applied to the inner or outer surface of the cylindrical mold, and the solvent is volatilized by heating or drying under reduced pressure, etc., and this is heated as it is to the final baking temperature or once peeled off, and finally the inner diameter is specified.
- the mold is inserted into the outer periphery of another mold and heated to the final firing temperature.
- the final firing temperature must be appropriately selected depending on the structure of the polyimide and the heat resistance of the added carbon fiber.
- the temperature is preferably 450 ° C.
- the maximum firing temperature in the range of 350 ° C. to 420 ° C.
- the glass transition point temperature of the polyimide is ⁇ 20 ° C. to -20 ° C.
- a suitable range is between 10 and 100 ° C.
- the polyimide belt formed in this manner can be used as an intermediate transfer belt as it is, but a surface layer having a resistance adjusted as an outer layer can be provided in order to obtain characteristics suitable for the intermediate transfer belt.
- the intermediate transfer belt according to the second embodiment of the present invention comprises 0.5 to 20 parts by weight of carbon black and 5 to 40 parts by weight of plate-like or columnar conductive powder with respect to 100 parts by weight of the polyimide resin. And a surface resistance of 1 ⁇ 10 8 to 1 ⁇ on the surface of a polyimide belt having a volume resistance value within a range of 1 ⁇ 10 6 to 1 ⁇ 10 12 ⁇ cm. A resistance-adjusted surface layer within the range of 10 13 ⁇ cm 2 is formed.
- the surface layer has a resistance value within the range of 1 X 10 9 to 1 X 10 12 QZcm 2 It is more preferable to use a fluororesin as the matrix resin in order to transfer the toner to paper satisfactorily. Further, a surface layer formed by using a fluororesin as a matrix resin and adding a conductive substance to the fluororesin is more preferable.
- the conductive substance for adjusting the surface resistance to the above range the same substance as the substance added to the polyimide layer can be used.
- the resistance value of the fluororesin layer is easier to control than the polyimide resin, and it has a track record of controlling the intermediate resistance region.Conventionally, the addition of carbon black alone can control the above range. It is possible. Similarly, various other conductive substances can be added. In addition, a combination with a non-conductive filler may be appropriately performed for the purpose of stabilizing the resistance value or imparting other properties such as thermal conductivity.
- the volume resistance value was determined by cutting four sheets of 10 cm square from a polyimide belt, setting them as samples 1 to 4, leaving them for 48 hours in an environment of a temperature of 23 ° C and a humidity of 60% Rh.
- the volume resistance at 10 V, 30 V, 50 V, and 100 V was measured using a digital ultra-high resistance / micro ammeter R 8340 and a resistance chamber R 12702A.
- the surface resistance at 100 V was also measured.
- DMF dimethylformamide
- PMDA pyromellitic dianhydride
- the polyimide intermediate transfer belt having a thickness of about 85 / m was removed by applying air pressure from the inside of the porous metal mold.
- Table 1 shows the results of measuring the volumetric resistance of the polyimide belt (Examples 11 to 11).
- Dimethylformamide (DMF) 1 100 g of Mitsubishi Chemical Carbon Black 3030 B. 4g and 32.9g of Ishihara Sangyo conductive titanium oxide ET-500W (rutile crystal, titanium oxide base, tin oxide coating, antimonyd) were added and uniformly dispersed by ultrasonic dispersion. . While stirring this dispersion in a water bath at about 10 ° C. under a nitrogen stream, 86.2 g of 4,4 ′ diaminodiphenyl ether (hereinafter, DADPE) powder was added and completely dissolved. Subsequently, 91.0 g of pyromellitic dianhydride (hereinafter, PMDA) powder was added little by little while stirring was continued, and stirring was continued for 30 minutes.
- DADPE 4,4 ′ diaminodiphenyl ether
- PMDA pyromellitic dianhydride
- a polyimide intermediate transfer belt was prepared in the same manner as in Example 1 except that this polyamic acid solution was used.
- the carbon black 3030 B is 10 parts by weight and the column-shaped conductive powder ET-500 W is 20 parts by weight with respect to 100 parts by weight of the polyimide solid content in the belt.
- Table 1 shows the results of evaluating the volume resistance of this belt in the same manner as in Example 1.
- DMF dimethylformamide
- Ketjen Black EC-600 JD manufactured by Lion and Dentol TM-200 manufactured by Otsuka Chemical (My power base, tin oxide coated antimony dope) lg was added and dispersed uniformly by ultrasonic dispersion. While stirring this dispersion in a water bath at about 10 ° C. under a nitrogen stream, 86.2 g of 4,4 s diaminodiphenyl ether (hereinafter referred to as D ADPE) powder was added and completely dissolved.
- D ADPE 4,4 s diaminodiphenyl ether
- a polyimide intermediate transfer belt was prepared in the same manner as in Example 1 except that this polyamic acid solution was used.
- Table 1 shows the results of evaluating the volume resistance of this belt in the same manner as in Example 1.
- Ketjen Black 1.5 parts of Ketjen Black and 25 parts of Dentol TM-200, which is a plate-like conductive powder, are 100 parts by weight of the solid content of polyimide in the belt.
- a polyimide belt-like belt was prepared in the same manner as in Example 1 except that the thickness was 65 m.
- Table 1 shows the results of evaluating the volume resistance of this polyimide belt at a measurement voltage of 100 V in the same manner as in Example 1.
- the fluororesin solution was uniformly sprayed on the surface of the polyimide belt using an air spray gun so that the thickness after baking was about 15 zm.
- This belt was fitted over the core, placed in an oven so that the surface was not touched, and heated at 120 ° C for 5 minutes and at 380 ° C for 10 minutes.
- the belt was gradually cooled to room temperature, taken out of the opening, and removed from the core to obtain a target intermediate transfer belt.
- the measured surface resistance of the fluororesin copolymer one up surface of the intermediate transfer bell Bok, 2. a X 10 9 ⁇ port.
- a polyimide belt having a thickness of about 85 xm was obtained in the same manner as in Example 1 except that the amount of dents of the conductive powder to be added was changed to 32.9 g. Belt.
- 20 parts of Dentitol TM-200 was used for 100 parts by weight of the polyimide solid content in this belt.
- Table 1 shows the results of evaluating the volume resistance of this belt at a measurement voltage of 100 V in the same manner as in Example 1. '
- Example 2 The same operation as in Example 1 was carried out except that the amount of conductive powder to be added was 49.3 g only for Denthol TM-200 (without adding Ripbon Black). The belt was obtained to obtain a polyimide intermediate transfer belt. Dentitol TM-200 is 30 parts with respect to 100 parts by weight of the polyimide solid content in this belt.
- Table 2 shows the results of evaluating the resistance value of this belt in the same manner as in Example 1.
- Comparative Example 2 A belt was manufactured and the resistance value was evaluated in the same manner as in Comparative Example 1, except that conductive titanium oxide ET_500W was used instead of Dentol TM-200. Table 2 shows the results.
- a belt was manufactured and the resistance value was evaluated in the same manner as in Comparative Example 1 except that Denbon TM-200 was replaced with Rikibon Black 300 B. Table 2 shows the results.
- Tables 1 and 2 show that, for each of Examples and Comparative Examples, the obtained polyimide intermediate transfer was incorporated as a transfer belt of a commercially available printer, and a 100-sheet print test was performed. When a good image was obtained, it was judged as "Good”, and when the image was slightly disturbed, but it was within a practically acceptable range, it was judged as "OK”. If a fault occurs or the belt is damaged, this is indicated as “defective”.
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Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01963487A EP1327666A4 (en) | 2000-09-13 | 2001-09-06 | POLYIMIDE RESIN COMPOSITION, POLYIMIDE PRODUCT FORMED IN FILM, AND INTERMEDIATE TRANSFER STRIP COMPRISING THE SAME |
US10/380,459 US20040024107A1 (en) | 2000-09-13 | 2001-09-06 | Polyimide resin composition and, polyimide product formed into film and intermediate transfer belt comprising the same |
KR10-2003-7002646A KR20030026352A (ko) | 2000-09-13 | 2001-09-06 | 폴리이미드 수지 조성물 및 그것으로 이루어지는폴리이미드 필름상 성형체 및 중간 전사 벨트 |
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JP2000277961A JP2002088242A (ja) | 2000-09-13 | 2000-09-13 | ポリイミド樹脂組成物及びポリイミドフィルム状成形体 |
JP2000-277961 | 2000-09-13 | ||
JP2001-057617 | 2001-03-02 | ||
JP2001057617A JP2002258625A (ja) | 2001-03-02 | 2001-03-02 | 中間転写ベルト |
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WO2002022740A1 true WO2002022740A1 (fr) | 2002-03-21 |
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PCT/JP2001/007753 WO2002022740A1 (fr) | 2000-09-13 | 2001-09-06 | Composition de resine polyimide, produit de polyimide forme dans un film, et bande de transfert intermediaire comprenant ladite composition |
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EP (1) | EP1327666A4 (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100514005B1 (ko) * | 2002-09-11 | 2005-09-09 | 제일모직주식회사 | 신규한 기능성 디아민 및 이를 사용하여 제조된 액정 배향막 |
CN102030988A (zh) * | 2009-09-24 | 2011-04-27 | 可隆股份有限公司 | 无缝带及其制造方法 |
CN110699023A (zh) * | 2019-10-28 | 2020-01-17 | 中原工学院 | 一种高温导电胶及其应用 |
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KR100677587B1 (ko) * | 2005-05-23 | 2007-02-02 | 삼성전자주식회사 | 화상전사유닛 및 이를 구비한 전자사진방식 화상형성장치 |
CN101831075B (zh) * | 2010-05-18 | 2011-09-28 | 华东理工大学 | 改性聚酰亚胺膜 |
KR101045823B1 (ko) * | 2011-02-18 | 2011-07-04 | 에스케이씨코오롱피아이 주식회사 | 블랙 폴리이미드 필름 |
TW201302858A (zh) | 2011-06-24 | 2013-01-16 | Du Pont | 有色聚醯亞胺膜及與其有關之方法 |
KR20130113778A (ko) * | 2012-04-06 | 2013-10-16 | 에스케이씨코오롱피아이 주식회사 | 블랙 폴리이미드 필름 |
KR102089408B1 (ko) * | 2016-04-01 | 2020-04-23 | 주식회사 엘지화학 | 폴리이미드 조성물 |
KR102167222B1 (ko) * | 2016-11-29 | 2020-10-19 | 주식회사 엘지화학 | 경화성 조성물 |
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US5922440A (en) * | 1998-01-08 | 1999-07-13 | Xerox Corporation | Polyimide and doped metal oxide intermediate transfer components |
JP2000248086A (ja) * | 1999-03-02 | 2000-09-12 | Gunze Ltd | 耐久・耐熱性シームレス管状フィルム及びその使用 |
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2001
- 2001-09-06 KR KR10-2003-7002646A patent/KR20030026352A/ko not_active Application Discontinuation
- 2001-09-06 EP EP01963487A patent/EP1327666A4/en not_active Withdrawn
- 2001-09-06 WO PCT/JP2001/007753 patent/WO2002022740A1/ja not_active Application Discontinuation
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GB2115396A (en) * | 1982-02-08 | 1983-09-07 | Potters Industries Inc | Mica conductive flakes |
EP0117700A1 (en) * | 1983-02-21 | 1984-09-05 | Kuraray Co., Ltd. | Rigid resin composition having electromagnetic shielding properties |
JPS62246959A (ja) * | 1986-04-21 | 1987-10-28 | Toray Ind Inc | 帯電防止性樹脂組成物 |
JPH08176319A (ja) * | 1994-12-26 | 1996-07-09 | Gunze Ltd | 円筒状ポリイミドフィルム及びその製造方法 |
JP2001215808A (ja) * | 2000-02-07 | 2001-08-10 | Fuji Xerox Co Ltd | 中間転写体、及び画像形成装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100514005B1 (ko) * | 2002-09-11 | 2005-09-09 | 제일모직주식회사 | 신규한 기능성 디아민 및 이를 사용하여 제조된 액정 배향막 |
CN102030988A (zh) * | 2009-09-24 | 2011-04-27 | 可隆股份有限公司 | 无缝带及其制造方法 |
CN102030988B (zh) * | 2009-09-24 | 2014-02-26 | 可隆股份有限公司 | 无缝带及其制造方法 |
CN110699023A (zh) * | 2019-10-28 | 2020-01-17 | 中原工学院 | 一种高温导电胶及其应用 |
Also Published As
Publication number | Publication date |
---|---|
EP1327666A4 (en) | 2005-01-12 |
EP1327666A1 (en) | 2003-07-16 |
KR20030026352A (ko) | 2003-03-31 |
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