WO2001074726A1 - Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen - Google Patents
Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen Download PDFInfo
- Publication number
- WO2001074726A1 WO2001074726A1 PCT/EP2001/003385 EP0103385W WO0174726A1 WO 2001074726 A1 WO2001074726 A1 WO 2001074726A1 EP 0103385 W EP0103385 W EP 0103385W WO 0174726 A1 WO0174726 A1 WO 0174726A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- thin glass
- larger
- glass pane
- glass panes
- small
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000011265 semifinished product Substances 0.000 title claims description 7
- 239000005357 flat glass Substances 0.000 title abstract 9
- 239000011521 glass Substances 0.000 claims abstract description 124
- 238000000034 method Methods 0.000 claims abstract description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000007639 printing Methods 0.000 claims abstract description 10
- 238000000926 separation method Methods 0.000 claims abstract description 9
- 238000007650 screen-printing Methods 0.000 claims abstract description 4
- 239000012876 carrier material Substances 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000005388 borosilicate glass Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 238000004100 electronic packaging Methods 0.000 abstract description 2
- 239000004568 cement Substances 0.000 abstract 1
- 238000005304 joining Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
- Y10T83/041—By heating or cooling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0405—With preparatory or simultaneous ancillary treatment of work
- Y10T83/041—By heating or cooling
- Y10T83/0414—At localized area [e.g., line of separation]
Definitions
- the invention relates to a method for producing small thin glass panes with a predetermined geometric structure and lateral dimensions in the millimeter range by cutting out from a larger thin glass pane
- the invention further relates to such a larger thin glass pane with dimensions in the centimeter range as a semi-finished product for the manufacture of small thin glass panes with lateral dimensions in the millimeter range
- micro- and optoelectronic components such as quartz crystals, SAW filters, CCD components, the so-called “electronic packaging”, small containers are used, among other things, which are completely or partially closed on at least one side by a thin glass pane
- Thick glass covers are also used in the housing of micro- and optoelectronic components.
- the thickness s of these small thin glass panes is typically in the range of 10 ⁇ m ⁇ s 500 ⁇ m.
- thin glass panes of different geometries rectangular, circular, etc. are used.
- connection is typically formed by gluing or soldering.
- soldering metal or glass solders are used as joining material.
- glass solders are used
- the thin glass panes are first cut in the manner described above and then fed to the subsequent further processing steps (assembly and jointing process).
- the thin glass panes are connected to the housing by a soldering process.
- the solder material is applied to the glass using a dispensing ice
- the solder material is applied in the edge area of the thin glass panes and therefore usually forms a thin, closed, frame-shaped contour. Glass or metal notes are used here.
- solder material into the joint zone in use pre-sintered solder frames
- the thin glass panes and a free, also very thin, pre-sintered solder frame made of glass solder must be positioned and partially fixed relative to the housing to which the thin glass panes are to be connected
- the invention is based on the object, the method described at the outset for producing small thin glass panes with a given geometric structure and lateral dimensions in the millimeter range by cutting them out of a larger thin glass pane, and such a larger thin glass pane as a semi-finished product for heating the small thin glass panes train that transportation of the small slices is simplified, there is a more rational production sequence of the individual small panes, and that the handling, in particular the positioning of the individual thin glass panes, is simplified immediately before the joining process and can be automated better
- the larger thin glass pane is preferably scratched along the desired separation lines by means of a laser beam at a predetermined depth before the separation
- the object of the invention is achieved in that the larger thin glass pane on one side with a joint material corresponding to the joint zone geometry of the small ones to be removed
- the object of the invention is achieved in that the larger thin glass pane on one side with a joint material corresponding to the joint zone geometry of the small ones to be removed
- the object of the invention is achieved in that the larger thin glass pane on one side with a joint material corresponding to the joint zone geometry of the small ones to be removed
- the object of the invention is achieved in that the larger thin glass pane on one side with a joint material corresponding to the joint zone geometry of the small ones to be removed
- the essence of the invention therefore consists in the production of a larger thin glass substrate pane structured in accordance with the geometry of the small thin glass panes, which is separated into individual small thin glass panes only immediately before the joining process.
- Such a larger thin glass pane which is initially still connected, can be characterized in that the jointing material already exists applied to the glass substrate top and firmly connected to the glass substrate Furthermore, such a large thin glass pane is preferably provided with a crack structure on the underside in accordance with the geometry of the smaller thin glass panes, which allows the thin glass pane to be geometrically defined by simple mechanical breaking immediately before the joining process Separating individual disks with a high degree of edge crushing The separation can also be carried out by thermally induced, locally acting mechanical stresses, for example by partial laser radiation
- Another possibility for improving the manufacturing or sealing process of electronic components with thin glass panes is to first joint (solder) the entire structured thin glass pane (s) with the corresponding number of associated housing components and only after this joining process by mechanical breaking separating Likewise, the separating (breaking) could not be done purely mechanically, but also here by thermally induced, locally acting mechanical stresses, for example by partial laser radiation
- the joining of the individual small thin glass panes to other components, in particular with the edge of flat components is advantageously facilitated if a frame-like structure of the joint material is printed on, which has a predetermined frame width and pe ⁇ pher along the target dividing lines on the small thin glass panes to be removed
- the printing of the larger thin glass pane with the jointing material is advantageously carried out by means of screen printing, which ensures economical and effective production of the corresponding geometric structure.
- Other printing techniques can also be used in principle, for example stencil printing
- Glass solder is preferably used as the jointing material, which can be easily processed by means of the usual printing techniques, in particular screen printing, and which adheres well to the thin glass panes
- Drawn borosilicate glass which has the necessary mechanical and chemical properties when using the small thin glass panes, is particularly suitable as the glass material for the thin glass panes
- the printed and scratched larger thin glass pane is applied to a carrier material, preferably a plastic carrier film, which is preferably mechanically clamped.
- a carrier material preferably a plastic carrier film
- FIG. 1 shows a top view of a first exemplary embodiment of a larger thin glass pane structured and scored according to the invention, which serves as a semi-finished product for the production of smaller, rectangular thin glass panes,
- Figure 2 is a cross-sectional view taken along section line A-A in
- FIG. 3 shows a top view of a further embodiment of the semi-finished thin-glass pane designed according to the invention with hexagonal structures
- FIG. 1 in connection with the cross-sectional illustration according to FIG. 2 shows a larger thin glass pane 1 structured according to the invention using the example of a rectangular geometry.
- This thin glass pane 1 has the edge lengths B and L which are in the range of several centimeters
- the aforementioned larger thin glass pane 1 is subdivided into smaller, likewise rectangular segments with edge lengths b and 1 in accordance with the geometry of the smaller thin glass panes 2 to be separated, that is to say to be separated, one of which is pulled out as a cutout in the separated state.
- edge lengths of the smaller thin glass panes 2 are present in the range of a few millimeters
- Each segment that forms the respective spatulated small thin glass pane 2 has a solder 3 applied in the edge region made of glass solder, which is designed in accordance with the later joint zone geometry, in this example also i real square
- the solder frame structures 3 made of glass solder, which are thereby formed on the upper side of the thin glass pane 1, are applied by screen or stencil printing in one or more work steps.
- the typical solder frame width "d" (FIG. 2) is in the range 300 ⁇ m ⁇ d ⁇ 900 ⁇ m
- the thickness "h "of the printed solder frame structures 3 typically lies in the range 15 ⁇ m ⁇ h 200 ⁇ m.
- the distance" c "between the solder frames 3 typically lies in the range 0 ⁇ m ⁇ c ⁇ 500 ⁇ m
- the large thin glass pane 1 has a peripheral edge 4 that is not coated with solder material.
- the edge widths (r B r L ) are typically in the range of several millimeters
- the subdivision of the thin glass pane 1 into the smaller segments, ie the smaller thin glass panes 2, is carried out on the basis of a crack structure 5 which is introduced on the rear side and is shown in dashed lines the thickness s of the glass substrate is (Fig 2)
- the cracks 5 introduced on the back and defined in their course and depth are preferably introduced by thermally induced stresses due to laser radiation. These cracks vei preferably run in a straight line over the entire larger thin glass pane 1
- the aforementioned laser beam scribing methods differ in particular in the configuration of the focal spot.
- the method according to DE 693 04 194 T2 uses a laser beam with an elliptical cross section with a trailing cooling spot
- EP 0 872 303 A2 describes a laser beam scribing method which provides a focal spot with a U-shaped or V-shaped contour which opens in the separating direction. Contours modified therefrom, such as X-shaped focal spots, are also described
- a thin glass pane 1 structured in the manner described above can be handled comparatively easily and can be separated into small individual panes 2 by simple mechanical breaking
- a polygon structure according to FIG. 3 or rounded structures can also be used.
- the edge length k or the diameter of the small thin glass panes are also in the range of a few millimeters
- the crack course 5 is not straight, but adapted to the contour geometry of the structures.
- the shape of the larger thin glass pane 1 does not necessarily have to be rectangular.
- Polygonal or round or partially round panes (wafers) can also be used
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50100387T DE50100387D1 (de) | 2000-04-04 | 2001-03-24 | Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen |
EP01927799A EP1252112B1 (de) | 2000-04-04 | 2001-03-24 | Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen |
JP2001572424A JP4880852B2 (ja) | 2000-04-04 | 2001-03-24 | 小板ガラス板の製造方法及び小板ガラス板を製造するための半仕上げ製品としての大板ガラス板 |
US10/240,354 US7371431B2 (en) | 2000-04-04 | 2001-03-24 | Method for producing small, sheet glass plates and larger sheet glass plates as semifinished products for producing the former |
AU2001254735A AU2001254735A1 (en) | 2000-04-04 | 2001-03-24 | Method for producing small, sheet glass plates and larger sheet glass plates as semi-finished products for producing the former |
AT01927799T ATE245128T1 (de) | 2000-04-04 | 2001-03-24 | Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10016628.8 | 2000-04-04 | ||
DE10016628A DE10016628A1 (de) | 2000-04-04 | 2000-04-04 | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2001074726A1 true WO2001074726A1 (de) | 2001-10-11 |
Family
ID=7637488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2001/003385 WO2001074726A1 (de) | 2000-04-04 | 2001-03-24 | Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen |
Country Status (10)
Country | Link |
---|---|
US (1) | US7371431B2 (de) |
EP (1) | EP1252112B1 (de) |
JP (1) | JP4880852B2 (de) |
KR (1) | KR100549982B1 (de) |
CN (1) | CN1250469C (de) |
AT (1) | ATE245128T1 (de) |
AU (1) | AU2001254735A1 (de) |
DE (2) | DE10016628A1 (de) |
TW (1) | TWI282780B (de) |
WO (1) | WO2001074726A1 (de) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004221541A (ja) * | 2002-11-15 | 2004-08-05 | Nippon Electric Glass Co Ltd | 固体撮像素子用カバーガラス |
US6919531B2 (en) | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
KR100904002B1 (ko) | 2002-11-15 | 2009-06-22 | 니폰 덴키 가라스 가부시키가이샤 | 고체촬상소자용 커버 글래스 |
CN101284709B (zh) * | 2007-04-12 | 2012-01-11 | 细美事有限公司 | 划线单元、板子划线装置、划线方法和基底制造方法 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10129876C1 (de) * | 2001-06-21 | 2003-01-02 | Schott Glas | Verfahren zur Ritzspurmarkierung laserinduzierter Ritze |
DE10257544A1 (de) * | 2002-12-10 | 2004-07-08 | Schott Glas | Verfahren zum Brechen von lasergeritzten, flachen Werkstücken aus sprödem Material |
DE10337920B4 (de) * | 2003-08-18 | 2008-08-28 | Schott Ag | Verfahren zur Herstellung einer Mehrzahl von Bauteilen und Zwischenprodukt in Form eines Schichtverbundes |
JP4805167B2 (ja) * | 2004-01-20 | 2011-11-02 | エリコン・トレーディング・アクチェンゲゼルシャフト,トリュープバッハ | 円環セグメントの製造方法、および、円環セグメントからカラーホイールを製造する方法 |
DE102004053598A1 (de) * | 2004-11-05 | 2006-05-11 | Hegla Fahrzeug- Und Maschinenbau Gmbh & Co. Kg | Verfahren und Vorrichtung zum Aufteilen einer Rohglastafel in Einzelglasscheiben |
DE102005024497B4 (de) * | 2005-05-27 | 2008-06-19 | Schott Ag | Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material |
DE102005046031B3 (de) * | 2005-09-26 | 2007-07-12 | Schott Ag | Verfahren zur Separierung von Teilen aus einem Substrat |
DE102005062230A1 (de) * | 2005-12-21 | 2007-06-28 | Jenoptik Automatisierungstechnik Gmbh | Verfahren und Vorrichtung zum Trennen von Scheiben aus sprödem Material, insbesondere von Wafern |
KR100702255B1 (ko) * | 2006-09-12 | 2007-04-03 | (주)한국나노글라스 | 표시창용 박판유리의 연삭장치 |
CN101450839B (zh) * | 2007-11-28 | 2011-03-23 | 鸿富锦精密工业(深圳)有限公司 | 滤光片的切割方法 |
JP2010023071A (ja) * | 2008-07-18 | 2010-02-04 | Mitsuboshi Diamond Industrial Co Ltd | 貼り合わせ基板の端子加工方法 |
JP5609870B2 (ja) * | 2009-07-03 | 2014-10-22 | 旭硝子株式会社 | 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス |
US8932510B2 (en) | 2009-08-28 | 2015-01-13 | Corning Incorporated | Methods for laser cutting glass substrates |
US8946590B2 (en) * | 2009-11-30 | 2015-02-03 | Corning Incorporated | Methods for laser scribing and separating glass substrates |
JP5669001B2 (ja) * | 2010-07-22 | 2015-02-12 | 日本電気硝子株式会社 | ガラスフィルムの割断方法、ガラスロールの製造方法、及びガラスフィルムの割断装置 |
TWI513670B (zh) * | 2010-08-31 | 2015-12-21 | Corning Inc | 分離強化玻璃基板之方法 |
JP2013055160A (ja) * | 2011-09-01 | 2013-03-21 | Canon Inc | 光透過性部材、光学装置およびそれらの製造方法 |
DE102011084129A1 (de) * | 2011-10-07 | 2013-04-11 | Schott Ag | Glasfolie mit speziell ausgebildeter Kante |
KR101265246B1 (ko) | 2011-11-07 | 2013-05-16 | 루미너스 옵티컬 테크놀로지 컴퍼니 리미티드 | 표면에 압축응력층의 도안을 구비한 유리기판 |
DE102012100881A1 (de) * | 2012-02-02 | 2013-08-08 | Scanlab Ag | Verfahren zum Bearbeiten eines Werkstücks mittels eines Lasers |
TWI481576B (zh) * | 2012-05-02 | 2015-04-21 | Taiwan Mitsuboshi Diamond Ind Co Ltd | 切割玻璃之方法及切割設備 |
US9938180B2 (en) | 2012-06-05 | 2018-04-10 | Corning Incorporated | Methods of cutting glass using a laser |
US9610653B2 (en) | 2012-09-21 | 2017-04-04 | Electro Scientific Industries, Inc. | Method and apparatus for separation of workpieces and articles produced thereby |
US9126857B2 (en) | 2012-11-15 | 2015-09-08 | Corning Incorporated | Separation apparatuses for separating sheets of brittle material and methods for separating sheets of brittle material |
JP6218038B2 (ja) * | 2014-05-26 | 2017-10-25 | 日本電気硝子株式会社 | ガラスフィルムを含む積層体、ガラスフィルムを含む積層体の製造方法、及びガラス物品の製造方法 |
FR3024137B1 (fr) * | 2014-07-24 | 2016-07-29 | Saint Gobain | Procede de fabrication de feuilles de verre de forme complexe |
CN104310779A (zh) | 2014-09-29 | 2015-01-28 | 合肥鑫晟光电科技有限公司 | 一种激光切割基板的方法及激光切割设备 |
WO2016122972A1 (en) | 2015-01-29 | 2016-08-04 | Corning Incorporated | Methods and apparatus for fabricating respective sections from a glass web |
EP3109208A1 (de) * | 2015-06-22 | 2016-12-28 | Flabeg France SAS | Verfahren zum vereinzeln eines glassubstrats |
CN105645750A (zh) * | 2016-01-11 | 2016-06-08 | 信利光电股份有限公司 | 一种蓝玻璃的切割方法、蓝玻璃及其应用 |
EP3470936B1 (de) * | 2017-10-16 | 2020-06-03 | The Swatch Group Research and Development Ltd | Verfahren zum schneiden von uhrglas |
CN108971772B (zh) * | 2018-08-29 | 2020-08-14 | 杭州千皓科技有限公司 | 一种激光光学玻璃切割的裂片工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300933A (en) * | 1980-05-27 | 1981-11-17 | Ppg Industries, Inc. | Method of manufacturing automotive windows by coating a scored substrate |
US4300934A (en) * | 1980-05-27 | 1981-11-17 | Ppg Industries, Inc. | Method of and apparatus for scoring a coated substrate |
EP0062484A1 (de) * | 1981-04-01 | 1982-10-13 | Creative Glassworks International | Verfahren zum Schneiden von Glas mittels eines Lasers |
DE3339334C1 (de) * | 1983-10-29 | 1985-01-24 | VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen | Verfahren zum Herstellen von Autoglasscheiben mit streifenförmigen Blendschutzfiltern durch Bedampfen oder Sputtern, und Vorrichtung zur Durchführung des Verfahrens |
DE3400843A1 (de) * | 1983-10-29 | 1985-07-18 | VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen | Verfahren zum herstellen von autoglasscheiben mit streifenfoermigen blendschutzfiltern durch bedampfen oder sputtern, und vorrichtung zur durchfuehrung des verfahrens |
EP0872303A2 (de) * | 1997-04-14 | 1998-10-21 | Schott Glas | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas |
WO1999046211A1 (fr) * | 1998-03-11 | 1999-09-16 | Hitachi, Ltd. | Substrat en verre a cristaux liquides, procede de decoupe de ce substrat, coupeuse destinee a ce substrat et ecran utilisant ce substrat |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1885245A (en) * | 1929-02-21 | 1932-11-01 | Duplate Corp | Apparatus for separating composite glass plates |
DE2342022B2 (de) * | 1973-08-20 | 1978-09-14 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Flüssigkristallzelle |
US4120220A (en) * | 1977-01-14 | 1978-10-17 | Mullen Wayne C | Glass cutter apparatus |
DE2735493C2 (de) * | 1977-08-05 | 1981-10-15 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung einer Flüssigkristallzelle und danach hergestellte Flüssigkristallzelle |
JPS627646A (ja) * | 1985-07-02 | 1987-01-14 | Toshiba Corp | コ−テイングガラスの製造方法 |
JPS6270241A (ja) | 1985-09-20 | 1987-03-31 | Nikou Kogaku Kk | 模様印刷片の加工方法 |
DE3739333C2 (de) * | 1987-11-20 | 1995-04-20 | Telefunken Microelectron | Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen |
JP2946931B2 (ja) * | 1992-03-06 | 1999-09-13 | 日本電気株式会社 | 高温高湿型原子間力顕微鏡及び化学反応の観察・定量化方法 |
FR2689119B1 (fr) * | 1992-03-26 | 1997-01-03 | Vertal Nord Est | Vitres de securite en verre feuillete; leurs procedes de fabrication. |
RU2024441C1 (ru) | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
DE4305107C2 (de) | 1993-02-19 | 1995-02-23 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Schneiden eines spröden Körpers mit Laserstrahlung |
JP2524477B2 (ja) * | 1993-12-20 | 1996-08-14 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 液晶パネル形成用基板及びその製造方法 |
JPH0823085A (ja) * | 1994-07-08 | 1996-01-23 | Matsushita Electron Corp | 固体撮像装置 |
DE19649332C1 (de) * | 1996-11-28 | 1998-01-22 | Tele Quarz Gmbh | Resonator mit Kristall |
DE19830237C2 (de) | 1998-07-07 | 2001-10-04 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff |
DE19959921C1 (de) | 1999-12-11 | 2001-10-18 | Schott Spezialglas Gmbh | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material |
US6498387B1 (en) * | 2000-02-15 | 2002-12-24 | Wen-Ken Yang | Wafer level package and the process of the same |
DE10224710B4 (de) * | 2002-06-04 | 2005-12-08 | Schott Ag | Verfahren zur hermetischen Gehäusung von optischen Bauelementen sowie verfahrensgemäß hergestellte optische Bauelemente |
-
2000
- 2000-04-04 DE DE10016628A patent/DE10016628A1/de not_active Withdrawn
-
2001
- 2001-03-24 JP JP2001572424A patent/JP4880852B2/ja not_active Expired - Fee Related
- 2001-03-24 US US10/240,354 patent/US7371431B2/en not_active Expired - Fee Related
- 2001-03-24 AU AU2001254735A patent/AU2001254735A1/en not_active Abandoned
- 2001-03-24 DE DE50100387T patent/DE50100387D1/de not_active Expired - Lifetime
- 2001-03-24 EP EP01927799A patent/EP1252112B1/de not_active Expired - Lifetime
- 2001-03-24 KR KR1020027013124A patent/KR100549982B1/ko not_active IP Right Cessation
- 2001-03-24 WO PCT/EP2001/003385 patent/WO2001074726A1/de active IP Right Grant
- 2001-03-24 AT AT01927799T patent/ATE245128T1/de not_active IP Right Cessation
- 2001-03-24 CN CNB01807510XA patent/CN1250469C/zh not_active Expired - Fee Related
- 2001-04-20 TW TW090108127A patent/TWI282780B/zh not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4300933A (en) * | 1980-05-27 | 1981-11-17 | Ppg Industries, Inc. | Method of manufacturing automotive windows by coating a scored substrate |
US4300934A (en) * | 1980-05-27 | 1981-11-17 | Ppg Industries, Inc. | Method of and apparatus for scoring a coated substrate |
EP0062484A1 (de) * | 1981-04-01 | 1982-10-13 | Creative Glassworks International | Verfahren zum Schneiden von Glas mittels eines Lasers |
DE3339334C1 (de) * | 1983-10-29 | 1985-01-24 | VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen | Verfahren zum Herstellen von Autoglasscheiben mit streifenförmigen Blendschutzfiltern durch Bedampfen oder Sputtern, und Vorrichtung zur Durchführung des Verfahrens |
DE3400843A1 (de) * | 1983-10-29 | 1985-07-18 | VEGLA Vereinigte Glaswerke GmbH, 5100 Aachen | Verfahren zum herstellen von autoglasscheiben mit streifenfoermigen blendschutzfiltern durch bedampfen oder sputtern, und vorrichtung zur durchfuehrung des verfahrens |
EP0872303A2 (de) * | 1997-04-14 | 1998-10-21 | Schott Glas | Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas |
WO1999046211A1 (fr) * | 1998-03-11 | 1999-09-16 | Hitachi, Ltd. | Substrat en verre a cristaux liquides, procede de decoupe de ce substrat, coupeuse destinee a ce substrat et ecran utilisant ce substrat |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6919531B2 (en) | 2002-03-25 | 2005-07-19 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
US7026573B2 (en) | 2002-03-25 | 2006-04-11 | Agilent Technologies, Inc. | Methods for producing glass substrates for use in biopolymeric microarrays |
JP2004221541A (ja) * | 2002-11-15 | 2004-08-05 | Nippon Electric Glass Co Ltd | 固体撮像素子用カバーガラス |
KR100904002B1 (ko) | 2002-11-15 | 2009-06-22 | 니폰 덴키 가라스 가부시키가이샤 | 고체촬상소자용 커버 글래스 |
CN101284709B (zh) * | 2007-04-12 | 2012-01-11 | 细美事有限公司 | 划线单元、板子划线装置、划线方法和基底制造方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE245128T1 (de) | 2003-08-15 |
JP4880852B2 (ja) | 2012-02-22 |
DE10016628A1 (de) | 2001-10-18 |
EP1252112A1 (de) | 2002-10-30 |
AU2001254735A1 (en) | 2001-10-15 |
KR20020093877A (ko) | 2002-12-16 |
JP2003529521A (ja) | 2003-10-07 |
DE50100387D1 (de) | 2003-08-21 |
EP1252112B1 (de) | 2003-07-16 |
US7371431B2 (en) | 2008-05-13 |
US20030148057A1 (en) | 2003-08-07 |
KR100549982B1 (ko) | 2006-02-07 |
CN1250469C (zh) | 2006-04-12 |
CN1420849A (zh) | 2003-05-28 |
TWI282780B (en) | 2007-06-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP1252112A1 (de) | Verfahren zum herstellen von kleinen dünnglasscheiben und grössere dünnglasscheibe als halbfabrikat für dieses herstellen | |
DE102005024497B4 (de) | Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material | |
EP3416921B1 (de) | Verfahren zur kantenbearbeitung von glaselementen und verfahrensgemäss bearbeitetes glaselement | |
EP2028164B1 (de) | Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser | |
DE10041519C1 (de) | Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten | |
EP1924392B1 (de) | Verfahren zum durchtrennen von spröden flachmaterialien mittels laser entlang einer zuvor erzeugten spur | |
DE112004000768B4 (de) | Verfahren zum Trennen eines plattenartigen Elements | |
DE112004000581B4 (de) | Verfahren zum Schneiden von Glas | |
DE102004024643B4 (de) | Werkstückteilungsverfahren unter Verwendung eines Laserstrahls | |
DE2802654C3 (de) | Befestigung einer Halbleiterplatte an einer Läppscheibe | |
DE102006052694A1 (de) | Waferprodukt und Herstellungsverfahren dafür | |
DE1815129A1 (de) | Verfahren zum Unterteilen von Unterlagen in eine Mehrzahl diskreter Einheiten | |
WO2015018425A1 (de) | Verfahren zum bearbeiten eines plattenartigen werkstückes mit einer transparenten, gläsernen, glasartigen, keramischen und/oder kristallinen lage, trennvorrichtung für ein derartiges werkstück sowie produkt aus einem derartigen werkstück | |
DE112013003503B4 (de) | Verfahren zur Bearbeitung einer Glasplatte | |
DE102018205548B4 (de) | Teilungsverfahren für ein werkstück | |
EP2990172A1 (de) | Verfahren zum Teilen von plattenförmigen Objekten aus spröden Werkstoffen | |
DE102012213071A1 (de) | Vorgespanntes Substrat und Verfahren zu dessen Herstellung | |
DE10001292C1 (de) | Verfahren und Vorrichtung zum Heraustrennen von kreisringförmigen Glasscheiben aus Glasplatten | |
EP4263449A1 (de) | Verfahren zum bearbeiten, insbesondere zum vortrennen, eines flaechigen substrats | |
DE4006070C2 (de) | ||
DE112020005006T5 (de) | Glasplattenbearbeitungsverfahren, glasplatte | |
EP3177426B1 (de) | Verfahren zur herstellung dünner substrate | |
DE112021001175T5 (de) | Werkstückschneideverfahren und Harzaufbringungsvorrichtung | |
DE102013014623A1 (de) | Vorrichtung und Verfahren zur Herstellung eines Wafers mit einer selektiven Positionierung im Trägersystem | |
EP2843713B1 (de) | Vorrichtung und Verfahren zur Herstellung eines Wafers mit einer Rissverlaufsbeeinflussung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2001927799 Country of ref document: EP |
|
ENP | Entry into the national phase |
Ref country code: JP Ref document number: 2001 572424 Kind code of ref document: A Format of ref document f/p: F |
|
WWE | Wipo information: entry into national phase |
Ref document number: 01807510X Country of ref document: CN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020027013124 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 2001927799 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1020027013124 Country of ref document: KR |
|
REG | Reference to national code |
Ref country code: DE Ref legal event code: 8642 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10240354 Country of ref document: US |
|
WWG | Wipo information: grant in national office |
Ref document number: 2001927799 Country of ref document: EP |
|
WWG | Wipo information: grant in national office |
Ref document number: 1020027013124 Country of ref document: KR |