DE3739333C2 - Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen - Google Patents
Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und MikroelektronikanwendungenInfo
- Publication number
- DE3739333C2 DE3739333C2 DE19873739333 DE3739333A DE3739333C2 DE 3739333 C2 DE3739333 C2 DE 3739333C2 DE 19873739333 DE19873739333 DE 19873739333 DE 3739333 A DE3739333 A DE 3739333A DE 3739333 C2 DE3739333 C2 DE 3739333C2
- Authority
- DE
- Germany
- Prior art keywords
- chips
- adhesive
- laser
- heating
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/124—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using adhesives based on a macromolecular component
- C08J5/128—Adhesives without diluent
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/8388—Hardening the adhesive by cooling, e.g. for thermoplastics or hot-melt adhesives
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0106—Neodymium [Nd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01077—Iridium [Ir]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/0665—Epoxy resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Wire Bonding (AREA)
Description
Claims (4)
- a) Beschichtung der Wafer rückseitig mit einer Schmelzkleber-Lösung oder mit einem Kleberlack in einer Lackschleuderanlage,
- b) anschließend Zersägen der Wafer in einzelne Chips,
- c) Vereinzelung der Chips und Trocknung der verein zelten Chips,
- d) Abheben und Aufbringen der vereinzelten Chips auf ein Schaltungssubstrat mit einer automatischen Be stückungsanlage,
- e) Erwärmen der Kleberschicht mit einem Nd:YAG-Laser, wobei
- e1) fortlaufend die Wärmeabstrahlung des erhitzten Klebers gemessen und die beim Erweichen, Schmelzen oder Aushärten entstehenden Unstetigkeiten in der Wärmeabstrahlung zur Steuerung des Lasers herange zogen werden und
- e2) während des Erwärmens bereits der nächste Chip ge mäß Schritt d) aufgenommen wird.
- a) rückseitiges Kaschieren des Wafers mit einer feuchtigkeitsbeständigen, thermoplastischen und härtbaren Polyimidfolie,
- b) anschließend Zersägen der Wafer in einzelne Chips,
- c) Vereinzelung der Chips und Trocknung der verein zelten Chips,
- d) Abheben und Aufbringen der vereinzelten Chips auf ein Schaltungssubstrat mit einer automatischen Be stückungsanlage,
- e) Erwärmen der Kleberschicht mit einem Nd:YAG-Laser, wobei
- e1) fortlaufend die Wärmeabstrahlung des erhitzten Klebers gemessen und die beim Erweichen, Schmelzen oder Aushärten entstehenden Unstetigkeiten in der Wärmeabstrahlung zur Steuerung des Lasers herange zogen werden und
- e2) während des Erwärmens bereits der nächste Chip ge mäß Schritt d) aufgenommen wird.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873744764 DE3744764A1 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur herstellung von klebeverbindungen mittels laser |
DE19873739333 DE3739333C2 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19873744764 DE3744764A1 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur herstellung von klebeverbindungen mittels laser |
DE19873739333 DE3739333C2 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3739333A1 DE3739333A1 (de) | 1989-06-01 |
DE3739333C2 true DE3739333C2 (de) | 1995-04-20 |
Family
ID=25861985
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873744764 Granted DE3744764A1 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur herstellung von klebeverbindungen mittels laser |
DE19873739333 Expired - Fee Related DE3739333C2 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur Herstellung von Klebeverbindungen für Elektronik- und Mikroelektronikanwendungen |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19873744764 Granted DE3744764A1 (de) | 1987-11-20 | 1987-11-20 | Verfahren zur herstellung von klebeverbindungen mittels laser |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE3744764A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10016628A1 (de) * | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2707189B2 (ja) * | 1992-08-26 | 1998-01-28 | 株式会社日立製作所 | 電子部品の基板からの取外し方法及び装置 |
KR100377981B1 (ko) * | 1994-06-07 | 2003-05-27 | 텍사스 인스트루먼츠 인코포레이티드 | 성형화합물큐어링방법 |
US7114541B2 (en) | 2000-09-07 | 2006-10-03 | Gesim Gesselschaft Fur Silizium-Mikrosysteme Mbh | Method for producing a 3-D micro flow cell and a 3-D micro flow cell |
DE20321146U1 (de) * | 2003-08-25 | 2006-03-09 | Technische Universität Braunschweig Carolo-Wilhelmina | Mikrosystembauelement |
DE102014201778A1 (de) | 2014-01-31 | 2015-08-06 | Henkel Ag & Co. Kgaa | Verfahren zum Verkleben mit Klebstoffschichten unter Zuhilfenahme eines Lasers |
CN109817532B (zh) * | 2019-03-28 | 2020-12-15 | 惠州西文思技术股份有限公司 | 一种用于芯片的加工设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
US4624724A (en) * | 1985-01-17 | 1986-11-25 | General Electric Company | Method of making integrated circuit silicon die composite having hot melt adhesive on its silicon base |
-
1987
- 1987-11-20 DE DE19873744764 patent/DE3744764A1/de active Granted
- 1987-11-20 DE DE19873739333 patent/DE3739333C2/de not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10016628A1 (de) * | 2000-04-04 | 2001-10-18 | Schott Glas | Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen |
Also Published As
Publication number | Publication date |
---|---|
DE3744764A1 (de) | 1989-06-01 |
DE3739333A1 (de) | 1989-06-01 |
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