WO2001046288A1 - Composition de resine durcissable avec des rayons d'energie actinique - Google Patents
Composition de resine durcissable avec des rayons d'energie actinique Download PDFInfo
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- WO2001046288A1 WO2001046288A1 PCT/JP2000/008812 JP0008812W WO0146288A1 WO 2001046288 A1 WO2001046288 A1 WO 2001046288A1 JP 0008812 W JP0008812 W JP 0008812W WO 0146288 A1 WO0146288 A1 WO 0146288A1
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- active energy
- energy ray
- resin
- curable resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
- C08L67/06—Unsaturated polyesters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
- C09D167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
Definitions
- Active energy ray-curable resin composition Active energy ray-curable resin composition
- the present invention relates to an active energy ray-curable resin composition, and more particularly to an active energy ray-curable composition for protecting various electrodes such as copper and silver electrodes.
- thermosetting resin composition there is an epoxy resin-based resin composition as disclosed in Japanese Patent Publication No. 11-198834, and as an ultraviolet-curing resin composition, There is an acrylic resin composition as disclosed in Japanese Patent Application Laid-Open No. 60-103334.
- thermosetting resin compositions require long-time heating during the curing treatment, so that workability is poor and adverse effects on other members are feared.
- UV-curable resin compositions have the advantage that they cure quickly and can be cured at low temperatures, but because of their large shrinkage due to curing, their adhesion to the substrate is poor, leaving distortion in the cured product and cracking. It has defects such as generation and poor water resistance.
- Room temperature-curable resin compositions do not require curing equipment and have the advantage of being inexpensive, but require a long time for curing and also need to secure a place for curing, resulting in poor workability. There are drawbacks.
- the electrodes are fired on a glass substrate by patterning them in a narrow pitch by the photolithographic method. Created in silver paste. Therefore, even if the metal electrode patterned in such a narrow pitch is protected by the conventional resin composition as described above, sufficient protection performance cannot be obtained.
- an object of the present invention is to solve the problems of the prior art as described above, and to provide the advantages of an ultraviolet-curable resin composition, while being excellent in water resistance and adhesion to a substrate,
- An object of the present invention is to provide an active energy linear curable resin composition capable of withstanding a short between electrodes caused by the above.
- an active energy ray-curable resin composition comprising (A) an active energy ray-curable resin and (B) a photoradical polymerization initiator.
- 50% by mass or more of the component (A) has one radically polymerizable ethylenically unsaturated double bond, one or more hydroxyl groups and an aromatic ring in a molecule of ( ⁇ ′).
- An active energy ray-curable resin is characterized in that, in the second embodiment, the component ( ⁇ ) is an active energy ray-curable resin having ( ⁇ ) one ethylenic unsaturated double bond in a molecule.
- sex Resin and further comprises (C) an epoxy resin.
- the first embodiment also contains the epoxy resin (C).
- the epoxy resin (C) a resin having a softening point of 40 ° C. or more and being in a semi-solid or solid state at room temperature is preferable.
- the active energy ray-curable resin composition of the present invention comprises at least one selected from the group consisting of (D) a saturated polyester resin, (E) a vinyltriazine derivative, and (F) a silane coupling agent. Contains one kind.
- the active energy ray-curable resin composition of the present invention containing the above-described components has better workability than conventional thermosetting or room-temperature curing resin compositions, and has high water-repellency and various adhesion properties. It has excellent adhesion to the body and an effect of preventing migration of various electrodes.
- the active energy ray-curable resin composition of the present invention comprises, as the active energy ray-curable resin (A), one radically polymerizable ethylenically unsaturated double bond in the molecule;
- An active energy ray-curable resin ( ⁇ ′) having at least one hydroxyl group and an aromatic ring is an essential component, and is characterized by containing 50% by mass or more of the component ( ⁇ ).
- This active energy ray-curable resin ( ⁇ ') limits the number of functional groups (ethylenically unsaturated double bonds) involved in the photocuring reaction to one in one molecule. It is thought that this minimizes the effects of cure shrinkage and contributes to the prevention of a decrease in adhesion. It is considered that the presence of the hydroxyl group greatly contributes to the adhesion to the substrate, and the presence of the aromatic ring also contributes to the water resistance.
- the active energy ray-curable resin ( ⁇ ′) industrially easily available monofunctional epoxy (meth) acrylates can be used, and the glycidyl group of the monofunctional epoxy resin can be obtained by a general production method. Meta) Accelerated. Specific examples include phenylglycidyl ether, 0-bif (Meth) acrylates such as enyldaricidyl ether and naphthyl glycidyl ether.
- a novel active energy ray-curable resin a (meth) acrylate compound represented by the following general formula (1) or (2), specifically 0-biphenyl glycidyl ether, naphthyl glycidyl ether, etc.
- the (meth) acrylate is excellent in hydrophobicity.
- X represents a hydrogen atom or a methyl group
- Y represents —C (CH 3 ) 2 —, —S 0 2 —, one CH 2 — or a direct bond
- R 1 and R 2 have 1 carbon atom.
- ⁇ 12 represents a linear, cyclic or branched alkyl group
- m represents an integer of 0-4, and n represents an integer of 0-5.
- the content is within a range that does not adversely affect the properties of the composition, that is, within a range of less than 50% by mass of the entire component (A).
- A an active energy ray-curable resin having two or more ethylenically unsaturated double bonds in a molecule, and / or an active energy ray-curable resin having no hydroxyl group or aromatic ring.
- An active energy ray-curable compound other than the above-mentioned component ( ⁇ ′) can be blended.
- Such an active energy ray-curable resin (A w ) is not particularly limited as long as it is a compound in which an ethylenic unsaturated double bond undergoes radical polymerization by irradiation with an active energy ray, but is not particularly limited. Is particularly preferred. Further, it may have a functional group other than an acryloyl group (methacryloyl group). Furthermore, it is advantageous in terms of adhesiveness and hydrophobicity to have a monofunctional and aromatic aromatic cyclo ring in the resin skeleton.
- the active energy ray-curable resin (A) an active energy ray-curable resin having one ethylenically unsaturated double bond in the molecule is used.
- a characteristic feature is that the conductive resin (AII) is an essential component and is contained together with the epoxy resin.
- this active energy ray-curable resin (A ⁇ ) minimizes the effect of curing shrinkage during photo-radical polymerization and reduces adhesion. It is thought that it has contributed to prevention.
- the use of the active energy ray-curable resin (k ”) alone is not sufficient for migration resistance and adhesion to the base material depending on the intended use, so it is necessary to use it together with the epoxy resin (C).
- the epoxy resin (C) has no effect on curing, so it is effective in reducing cure shrinkage (improving adhesion), and the reason for the epoxy resin (C) is not clear. However, it is also effective in improving migration resistance.
- the active energy ray-curable resin (A ⁇ ) is not particularly limited as long as it is a compound in which an ethylenic unsaturated double bond undergoes radical polymerization upon irradiation with an active energy ray, and is preferably a (meth) acrylate compound. Is particularly preferred. Further, it may have a functional group other than an acryloyl group (methacryloyl group). Further, it is advantageous in terms of hydrophobicity to have an aromatic ring / cyclo ring in the resin skeleton.
- These monofunctional (meth) acrylates may be those in which a glycidyl group is (meth) acrylated.
- Specific examples include (meth) acrylates such as o-phenylphenylglycidyl ether, naphthylglycidylether, and phenylglycidylether.
- the photo-radical polymerization initiator ( ⁇ ) is not particularly limited as long as it is a compound that radically polymerizes the active energy linear curing resin ( ⁇ ) with an active energy ray.
- photo-radical polymerization initiator (II) examples include thioxane such as 2,4-dimethylthioxanthone, 2,4-getylthioxanthone, 2-clothixoxanthone, and 2,4-diisopropylthioxanthone Tons; 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 1-chloroanthraquinone and other anthraquinones; 4,4,1-bisethylenaminobenzophenone and other benzophenones; Hydroxy ketones such as droxy-cyclohexyl-phenyl-ketone and 2-hydroxy-1-methyl-1-phenylpropane-1-one; 2,4,6-trimethylbenzoy (Bis) acylphosphinoxides such as ludiphenylphosphine oxide; bis (2,4-cyclopentene) _ 1 yl
- the photo-radical polymerization initiator (B) may be used in combination of several types depending on the light source to be used. For example, 2 _methyl-1- 1-[4- (methylthio) phenyl] — 2 — Combination of aminoacetophenones such as morpholinopropane-1-one and thioxanthones or aminobenzophenone; combination of benzophenones and aminobenzophenones; 1—hydroxy-cyclohexylphene Examples include a combination of a hydroxyketone such as nitroketone and a (bis) acylphosphinoxide such as 2,4,6_trimethylbenzoyldiphenylphosphinoxide.
- a tertiary amine such as triethanolamine
- a photoinitiator such as isoamyl dimethylaminobenzoate and dimethylaminoethyl methyl acrylate can be added to these known and commonly used photoradical polymerization initiators.
- photoradical polymerization initiators (B) as described above, 2-hydroxy-2-methyl-1-phenylpropane_1_one, 1-hydroxycyclohexylphenylketone, 1— (4— 1-Propylphenyl) 2-Hydroxy-2-methylpropane 1-one, 2-methyl-1— [4- (Methylthio) phenyl] —2-morpholinopropane 1-one, 2-benzyl-2 —Dimethylamino-1 — (4-morpholinophenyl) phenylketone-based compounds such as butanenon_1, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, etc. (Bis) acylphosphine oxides and titanocene compounds are preferred.
- the amount of the photo-radical polymerization initiator (B) to be added is suitably from 0.5 to 20 parts by mass based on 100 parts by mass of the active energy ray-curable resin (A). Preferably it is 0.5 to 5 parts by mass. If the amount of the photo-radical polymerization initiator (B) is less than 0.5 part by mass, the photocuring by the active energy ray does not proceed sufficiently. Is saturated This is not economical, and conversely, it may remain after photo-curing of the composition and reduce the properties of the cured product.
- the epoxy resin is an essential component, but in the first embodiment, further improvement of the properties is achieved by adding the epoxy resin. Is done. As described above, since the epoxy resin (C) does not participate in the photocuring reaction, it is effective in reducing curing shrinkage (improving adhesion).
- epoxy resin (C) examples include various commonly used epoxy resins, for example, bisphenol II type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, brominated bisphenol A type epoxy resin, hydrogenated bisphenol A Epoxy resin, biphenol type epoxy resin, bixylphenol type epoxy resin, alicyclic epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, brominated phenol novolak type epoxy resin, bisphenol A Glycidyl ether compounds such as novolak-type epoxy resins, glycidyl ester compounds such as terephthalic acid diglycidyl ester, hexahydrid phthalic acid diglycidyl ester, dimer monoacid diglycidyl ester, and triglycidyl Socyanurate, N, N, N ', N'-Tetraglycidyl mexylenediamine, N, N, N ', N'-Tetraglycidyl bisaminomethylcyclohe
- the active energy ray-curable resin composition of the present invention among these epoxy resins, it is particularly preferable to use an epoxy resin having a softening point of 40 ° C. or more and being in a semi-solid or solid state at room temperature. Thereby, the surface curability (dryness to touch) and water resistance of the resin composition are improved. Furthermore, by selecting an epoxy resin having a hydrophobic skeleton, the hydrophobicity of the resin composition can be improved, and migration can be effectively prevented.
- the present inventors have selected an epoxy resin that is in a semi-solid or solid state at room temperature as described above from among a number of hydrophobic resins including an epoxy resin as a resin that contributes to migration resistance.
- X represents an epoxy group or / and a vinyl group
- p represents an integer of 1 to 100.
- the molecule contains at least one epoxy group.
- the ratio of the number of functional groups represented by the following formulas (a) and (b) in an epoxy compound having a partial structure represented by the above general formula (3) in the molecule is preferable. It is preferable that (a) / (b) average 1.0 to 4.0.
- Examples of such an epoxy resin include Cellox 315 and Celloxide 285 manufactured by Daicel Chemical Industries, Ltd.
- the polyether type epoxy resin having a functional group represented by the above general formula (3) comprises a compound having active hydrogen and 4-vinylcyclohexene 1-oxide or, if necessary, another epoxy group. Partially or completely epoxidize the vinyl group of the polyether compound obtained by reacting a compound having two or more compounds with a catalyst in the presence of a peracid such as peracetic acid or an oxidizing agent such as hydroperoxides. Obtained by: At this time, a small amount of an acetyl group or the like may be introduced.
- Examples of the compound having active hydrogen include alcohols, for example, linear or branched aliphatic alcohols, preferably polyhydric alcohols such as trimethylol pulp, phenols, carboxylic acids, amines, and thiols. And the like.
- the compound having active hydrogen is not limited to the case where only one functional group represented by the general formula (3) is introduced, and a plurality of functional groups can be introduced, and it is more preferable. However, even when a plurality of functional groups are introduced, if the number of the repeating unit of the functional group is too large, the compound will have a high melting point. Therefore, it is preferable that the total number be 100 or less.
- other polyether-type epoxy resins described in JP-B-7-25864 can also be used. Such a polyether type epoxy resin is described in detail in the above-mentioned publication, so please refer to the above-mentioned publication for details.
- the mixing amount of these epoxy resins (C) is suitably from 5 parts by mass to 60 parts by mass with respect to 100 parts by mass of the active energy ray-curable resin (A), preferably from 5 to 40 parts by mass. Parts by weight. If the blending amount of the epoxy resin (C) is less than 5 parts by mass, it is difficult to obtain the above-mentioned effects, while if the blending amount exceeds 60 parts by mass, the expected effect is saturated. Not economical and also Conversely, the photocurability of the composition may be hindered.
- the active energy ray-curable resin composition of the present invention preferably further contains a saturated polyester resin (D) in addition to the components described above.
- the saturated polyester resin (D) is not particularly limited as long as it has an effect of improving the adhesion to the adherend.
- Specific examples of the saturated polyester resin (D) include Byron 200, 220, 240, 245, 270, 280 of Toyobo Byron Series (manufactured by Toyobo Co., Ltd.).
- such a saturated polyester resin has a characteristic of excellent repairability in that an act of peeling a cured product from a base material becomes easy, in addition to an effect of improving adhesion.
- the amount of the saturated polyester resin (D) is suitably from 5 parts by mass to 50 parts by mass with respect to 100 parts by mass of the active energy ray-curable resin (A), preferably from 5 to 3 parts by mass. 0 parts by mass. If the amount of the saturated polyester resin (D) is less than 5 parts by mass, it is difficult to obtain the above-mentioned effects, while if the amount exceeds 50 parts by mass, the expected effect becomes saturated. Therefore, it is not economical, and on the contrary, there is a possibility that the photocurability of the composition is impaired or the properties of the cured product are deteriorated.
- the active energy ray-curable resin composition of the present invention further contains a vinyltriazine derivative (E) in addition to the components described above.
- the purpose of using this vinyl triazine derivative (E) is to prevent migration of the metal electrode more effectively.
- vinyl triazine derivative (E) examples include 2,4-diamino-16-vinyl-S-triazine, 2,4-diamino-6-methacryloyloxy-S-triazine, and their isocyanuric acid adducts Is mentioned. These vinyltriazine compounds or derivatives thereof (E) may be used alone or in combination of two or more. Can be used as a mixture.
- the amount of the vinyltriazine derivative (E) to be blended is suitably from 0.5 to 20 parts by mass, preferably from 0.5 to 5 parts by mass, per 100 parts by mass of the active energy ray-curable resin (A). Parts by weight. If the blending amount of the vinyltriazine derivative (E) is less than 0.5 parts by mass, it is difficult to sufficiently enhance the migration resistance effect. On the other hand, the expected effect is saturated even if the amount exceeds 20 parts by mass. This is not economical because it is in a state, and conversely, the composition may remain after photocuring and deteriorate the properties of the cured product.
- the active energy ray-curable resin composition of the present invention may optionally contain a silane coupling agent (F).
- the purpose of adding the silane coupling agent (F) is to improve the adhesion to the substrate, particularly to glass.
- the silane coupling agent (F) is not particularly limited as long as it improves the adhesion to the substrate.
- silane coupling agent (F) examples include A-143, A-150, A-151, A-171, A-172, A-172, manufactured by Nippon Tunicer Co., Ltd. A-174, A-186, A-187, A-189, A-110, A-112 and A-116, Toshiba Silicone Co., Ltd. TSL—831 0, TSL—831 1, TSL—832 0, TSL—8395, TSL—832 5, TSL—833 1s TSL—834 0 , TSL — 835, TSL — 835, TSL—835, TSL—835, TSL—835, and TSL—835.
- additives can be appropriately compounded in addition to the above-mentioned components.
- organic or inorganic fillers can be combined from the viewpoint of reducing the curing shrinkage, reducing the thermal expansion coefficient, improving the dimensional stability, improving the elastic modulus, adjusting the viscosity, improving the thermal conductivity, improving the strength, and improving the toughness.
- a filler a polymer, a ceramic, a metal, a metal oxide, a metal salt, or the like can be used, and the shape is not particularly limited, such as a particle shape and a fibrous shape.
- it is used as a filler
- it can be dissolved, semi-dissolved or micro-dispersed in the active energy linear curable resin composition as a polymer blend or a polymer alloy.
- the active energy ray-curable resin composition of the present invention may be blended with a coloring agent such as an organic or inorganic pigment or dye as an additive, and used for applications such as paints and inks.
- a coloring agent such as an organic or inorganic pigment or dye as an additive
- a softener e.g., a plasticizer, a flame retardant, a storage stabilizer, an antioxidant, an ultraviolet absorber, and a thixotropic agent are provided.
- Agents, dispersion stabilizers, flowability-imparting agents and the like can be appropriately compounded.
- the active energy ray-curable resin composition of the present invention is applied on a substrate by a known and commonly used method, and the formed coating layer is irradiated with active energy rays to photo-radical polymerize a compound having an ethylenically unsaturated bond. It cures by being allowed to do so.
- Suitable sources of active energy rays include low-pressure mercury lamps, medium-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, xenon lamps, and metal halide lamps.
- laser beams, electron beams, etc. can also be used as active energy rays for exposure.
- the resin composition of the present invention can be used in any of liquid, paste and film forms.
- the viscosity can be appropriately adjusted using a known viscosity modifier such as an organic solvent in order to adjust the viscosity of the resin composition.
- Each component shown in Table 3 was mixed with a stirrer so as to have a predetermined ratio to prepare an active energy ray-curable resin composition of various components.
- composition parts by mass
- properties properties
- Each of the resin compositions thus prepared was evaluated for water absorption, migration resistance, adhesion, warpage, and repairability.
- the evaluation method is as follows.
- Each resin composition was used ultraviolet irradiation device (ORC Manufacturing Co. main Taruharai Doranpu), and cured at dose 2 0 0 O m J / cm 2.
- Each resin composition sample was poured into a circular Teflon container having a diameter of 150 mm and a depth of 2 mm, and then cured to prepare a measurement pellet. After measuring the mass (a) of this measuring pellet, it was immersed in ion-exchanged water at 20 ° C. for 24 hours, and the mass (b) after immersion was measured. The water absorption at this time is the value (%) obtained by ⁇ ((b) — (a)) / (a) ⁇ x 100.
- the resin composition was dried in a thermo-hygrostat at a temperature of 85 ° C and a relative humidity of 85%. Left for 0 hours.
- the voltage applied to the comb-shaped electrode at this time was DC100 V, and the insulation resistance was measured in a thermo-hygrostat at any time.
- the insulation resistance measurement is 1. 0 X 1 0 regarded 5 Omega and shorting the time of showing the value of the following were evaluated by the time until the short circuit from the start of the test.
- Each resin composition was applied to a 100 micron thick PET film using an applicator so as to have a film thickness of 25 microns, and after curing, a film cut into 2 cm x 5 cm was used as a test piece. This was put into a thermo-hygrostat at a temperature of 40 ° C and a relative humidity of 95%, and the state of peeling was evaluated.
- the warpage of the test piece prepared in the adhesion test (4) was measured.
- the amount of warpage is 1 mm or less, and hardly warps.
- ⁇ The amount of warpage is 2 mm or less.
- Warpage is 2 mm or more.
- Each component shown in Table 4 was mixed with a stirrer so as to have a predetermined ratio to prepare an active energy ray-curable resin composition having various component compositions.
- each of the resin compositions thus prepared was evaluated for water absorption, migration resistance, and adhesion (to glass substrate) in the same manner as the above evaluation method.
- each resin composition was cured with an irradiation amount of 2000 mJ / cm 2 using an ultraviolet irradiation device (Metalhala Dump Co., Ltd.).
- Trimethylol 7 ° roast acrylate
- the composition can be applied to a silver electrode of a fine pitch. A sufficient electrode protection effect can be obtained.
- the active energy ray-curable resin composition of the present invention has better workability than conventional thermosetting and room temperature curing resin compositions, adhesion to various adherends, and prevention of migration of various electrodes. It is extremely useful as an active energy ray-curable adhesive and coating agent with excellent effects.
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Description
Claims
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP36427799A JP4497610B2 (ja) | 1999-12-22 | 1999-12-22 | 光硬化性樹脂組成物 |
JP11/364277 | 1999-12-22 | ||
JP2000054077A JP4713704B2 (ja) | 2000-02-29 | 2000-02-29 | 活性エネルギー線硬化性樹脂組成物 |
JP2000/54077 | 2000-02-29 |
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WO2001046288A1 true WO2001046288A1 (fr) | 2001-06-28 |
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PCT/JP2000/008812 WO2001046288A1 (fr) | 1999-12-22 | 2000-12-13 | Composition de resine durcissable avec des rayons d'energie actinique |
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KR (1) | KR100696412B1 (ja) |
CN (1) | CN1196748C (ja) |
TW (1) | TW530079B (ja) |
WO (1) | WO2001046288A1 (ja) |
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KR102128799B1 (ko) * | 2013-01-15 | 2020-07-01 | 닛산 가가쿠 가부시키가이샤 | 경화막 형성용 수지 조성물 |
CN109642140B (zh) * | 2016-08-30 | 2021-08-31 | 日产化学株式会社 | 感光性粘接剂组合物 |
CN109321145B (zh) * | 2017-07-31 | 2022-01-04 | 东洋油墨Sc控股株式会社 | 光学用活性能量线聚合性粘接剂及光学用层叠体 |
DE102018121067A1 (de) | 2018-08-29 | 2020-03-05 | Delo Industrie Klebstoffe Gmbh & Co. Kgaa | Härtbare Zweikomponentenmasse |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049024A (ja) * | 1983-08-29 | 1985-03-18 | Shikoku Chem Corp | エポキシ樹脂硬化方法 |
JPS6084323A (ja) * | 1983-10-13 | 1985-05-13 | Shikoku Chem Corp | エポキシ樹脂硬化方法 |
JPH05186755A (ja) * | 1992-01-08 | 1993-07-27 | Yokohama Rubber Co Ltd:The | 光硬化型接着剤組成物 |
US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
US5948514A (en) * | 1995-06-06 | 1999-09-07 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable thermosettting resin composition developable with aqueous alkali solution |
-
2000
- 2000-12-13 WO PCT/JP2000/008812 patent/WO2001046288A1/ja active Application Filing
- 2000-12-13 CN CNB008176795A patent/CN1196748C/zh not_active Expired - Fee Related
- 2000-12-13 KR KR1020027008125A patent/KR100696412B1/ko not_active IP Right Cessation
- 2000-12-19 TW TW089127271A patent/TW530079B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6049024A (ja) * | 1983-08-29 | 1985-03-18 | Shikoku Chem Corp | エポキシ樹脂硬化方法 |
JPS6084323A (ja) * | 1983-10-13 | 1985-05-13 | Shikoku Chem Corp | エポキシ樹脂硬化方法 |
JPH05186755A (ja) * | 1992-01-08 | 1993-07-27 | Yokohama Rubber Co Ltd:The | 光硬化型接着剤組成物 |
US5948514A (en) * | 1995-06-06 | 1999-09-07 | Taiyo Ink Manufacturing Co., Ltd. | Photocurable thermosettting resin composition developable with aqueous alkali solution |
US5707780A (en) * | 1995-06-07 | 1998-01-13 | E. I. Du Pont De Nemours And Company | Photohardenable epoxy composition |
Also Published As
Publication number | Publication date |
---|---|
CN1196748C (zh) | 2005-04-13 |
KR100696412B1 (ko) | 2007-03-20 |
TW530079B (en) | 2003-05-01 |
CN1413225A (zh) | 2003-04-23 |
KR20020064958A (ko) | 2002-08-10 |
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