WO2001041208A1 - Dispositif de montage d'une puce - Google Patents

Dispositif de montage d'une puce Download PDF

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Publication number
WO2001041208A1
WO2001041208A1 PCT/JP2000/008399 JP0008399W WO0141208A1 WO 2001041208 A1 WO2001041208 A1 WO 2001041208A1 JP 0008399 W JP0008399 W JP 0008399W WO 0141208 A1 WO0141208 A1 WO 0141208A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
stage
substrate
mounting
head
Prior art date
Application number
PCT/JP2000/008399
Other languages
English (en)
Japanese (ja)
Inventor
Akira Yamauchi
Original Assignee
Toray Engineering Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co., Ltd. filed Critical Toray Engineering Co., Ltd.
Priority to JP2001542382A priority Critical patent/JP4610150B2/ja
Publication of WO2001041208A1 publication Critical patent/WO2001041208A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Abstract

L'invention concerne un dispositif de montage d'une puce sur un substrat, qui comprend une tête (1) pour retenir, presser et fixer la puce sur le substrat par déplacement le long de l'axe Z formant avec les axes X et Y un plan orthogonal. Le dispositif comprend également un plateau (2) qui reçoit le substrat et peut être déplacé dans au moins une des directions le long des axes X et Y pour monter la puce sur le substrat dans une position préétablie et l'ajuster finement pour l'aligner. La rigidité requise du cadre de la tête (1) est réduite, le poids de la tête (1) est réduit, les limitations, comme l'augmentation de l'inertie due à l'augmentation du poids de la tête (1), sont éliminées, et le plateau (2) ne vibre pas pendant le mouvement. Ainsi, la puce peut être montée de manière précise dans une position déterminée et cela, à une grande vitesse.
PCT/JP2000/008399 1999-11-30 2000-11-29 Dispositif de montage d'une puce WO2001041208A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001542382A JP4610150B2 (ja) 1999-11-30 2000-11-29 チップ実装装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11/341088 1999-11-30
JP34108899 1999-11-30

Publications (1)

Publication Number Publication Date
WO2001041208A1 true WO2001041208A1 (fr) 2001-06-07

Family

ID=18343152

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2000/008399 WO2001041208A1 (fr) 1999-11-30 2000-11-29 Dispositif de montage d'une puce

Country Status (3)

Country Link
JP (1) JP4610150B2 (fr)
KR (1) KR100715725B1 (fr)
WO (1) WO2001041208A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111987032A (zh) * 2019-05-22 2020-11-24 倍科有限公司 粘接装置以及粘接方法
CN113421837A (zh) * 2021-05-24 2021-09-21 中国电子科技集团公司第十一研究所 基于自动贴片设备的贴片工装、贴片装置及贴片方法
CN117182841A (zh) * 2023-09-08 2023-12-08 深圳市镭恩特自动化技术有限公司 一种用于贴压电陶瓷片的加压机械装置
JP7455117B2 (ja) 2018-09-28 2024-03-25 ロヒンニ リミテッド ライアビリティ カンパニー 微調整により半導体デバイスの転写速度を加速する方法および装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100868297B1 (ko) * 2007-11-16 2008-11-11 임채열 Ic 칩 및 pcb를 위한 정렬수단 및 이송수단이 구비된 휴대용 전자제품 데이터 복구시스템
KR101613196B1 (ko) 2010-11-17 2016-04-19 한화테크윈 주식회사 플립칩 장착 방법 및 플립칩 장착기

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04334036A (ja) * 1991-05-10 1992-11-20 Matsushita Electric Ind Co Ltd リードのボンディング装置
JPH0677263A (ja) * 1992-08-28 1994-03-18 Nec Corp ダイボンディング装置
JPH06140470A (ja) * 1992-10-28 1994-05-20 Fujitsu Ltd フリップチップボンディング装置
JPH06236904A (ja) * 1993-02-08 1994-08-23 Toray Eng Co Ltd ワーク位置決めステージ装置のパラメータ補正方法
JPH08162503A (ja) * 1994-11-30 1996-06-21 Casio Comput Co Ltd 電子部品の位置合わせ方法及びその装置
JPH08330393A (ja) * 1995-03-24 1996-12-13 Matsushita Electric Ind Co Ltd フラットパネルディスプレイへのｉｃ部品の接合方法
JPH098104A (ja) * 1995-06-21 1997-01-10 Toray Eng Co Ltd チップボンディング装置におけるキャリブレーション方法
JPH0936180A (ja) * 1995-07-13 1997-02-07 Toray Eng Co Ltd チップボンディング装置
JP2525813Y2 (ja) * 1991-04-01 1997-02-12 株式会社東芝 フィルムキャリア部品の実装装置
JPH10223685A (ja) * 1997-02-04 1998-08-21 Sony Corp フリツプチツプ実装型電子部品の実装方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004236904A (ja) * 2003-02-07 2004-08-26 Mizuno Technics Kk ゴルフクラブヘッドの刻印用打刻装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2525813Y2 (ja) * 1991-04-01 1997-02-12 株式会社東芝 フィルムキャリア部品の実装装置
JPH04334036A (ja) * 1991-05-10 1992-11-20 Matsushita Electric Ind Co Ltd リードのボンディング装置
JPH0677263A (ja) * 1992-08-28 1994-03-18 Nec Corp ダイボンディング装置
JPH06140470A (ja) * 1992-10-28 1994-05-20 Fujitsu Ltd フリップチップボンディング装置
JPH06236904A (ja) * 1993-02-08 1994-08-23 Toray Eng Co Ltd ワーク位置決めステージ装置のパラメータ補正方法
JPH08162503A (ja) * 1994-11-30 1996-06-21 Casio Comput Co Ltd 電子部品の位置合わせ方法及びその装置
JPH08330393A (ja) * 1995-03-24 1996-12-13 Matsushita Electric Ind Co Ltd フラットパネルディスプレイへのｉｃ部品の接合方法
JPH098104A (ja) * 1995-06-21 1997-01-10 Toray Eng Co Ltd チップボンディング装置におけるキャリブレーション方法
JPH0936180A (ja) * 1995-07-13 1997-02-07 Toray Eng Co Ltd チップボンディング装置
JPH10223685A (ja) * 1997-02-04 1998-08-21 Sony Corp フリツプチツプ実装型電子部品の実装方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7455117B2 (ja) 2018-09-28 2024-03-25 ロヒンニ リミテッド ライアビリティ カンパニー 微調整により半導体デバイスの転写速度を加速する方法および装置
CN111987032A (zh) * 2019-05-22 2020-11-24 倍科有限公司 粘接装置以及粘接方法
CN113421837A (zh) * 2021-05-24 2021-09-21 中国电子科技集团公司第十一研究所 基于自动贴片设备的贴片工装、贴片装置及贴片方法
CN113421837B (zh) * 2021-05-24 2022-06-28 中国电子科技集团公司第十一研究所 基于自动贴片设备的贴片工装、贴片装置及贴片方法
CN117182841A (zh) * 2023-09-08 2023-12-08 深圳市镭恩特自动化技术有限公司 一种用于贴压电陶瓷片的加压机械装置

Also Published As

Publication number Publication date
JP4610150B2 (ja) 2011-01-12
KR100715725B1 (ko) 2007-05-08
KR20020042741A (ko) 2002-06-05

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