WO2000035015A1 - Module de circuit rf - Google Patents
Module de circuit rf Download PDFInfo
- Publication number
- WO2000035015A1 WO2000035015A1 PCT/JP1999/003236 JP9903236W WO0035015A1 WO 2000035015 A1 WO2000035015 A1 WO 2000035015A1 JP 9903236 W JP9903236 W JP 9903236W WO 0035015 A1 WO0035015 A1 WO 0035015A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dielectric substrate
- dielectric
- circuit module
- circuit
- semiconductor device
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/162—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits the devices being mounted on two or more different substrates
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020007008694A KR20010040800A (ko) | 1998-12-09 | 1999-06-17 | 알에프 회로 모듈 |
EP99973352A EP1056133A1 (en) | 1998-12-09 | 1999-06-17 | Rf circuit module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10/350265 | 1998-12-09 | ||
JP35026598A JP3538045B2 (ja) | 1998-12-09 | 1998-12-09 | Rf回路モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000035015A1 true WO2000035015A1 (fr) | 2000-06-15 |
Family
ID=18409339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/003236 WO2000035015A1 (fr) | 1998-12-09 | 1999-06-17 | Module de circuit rf |
Country Status (6)
Country | Link |
---|---|
US (1) | US6335669B1 (ja) |
EP (1) | EP1056133A1 (ja) |
JP (1) | JP3538045B2 (ja) |
KR (1) | KR20010040800A (ja) |
CN (1) | CN1296642A (ja) |
WO (1) | WO2000035015A1 (ja) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
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US6542720B1 (en) | 1999-03-01 | 2003-04-01 | Micron Technology, Inc. | Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devices |
JP3976297B2 (ja) * | 1999-09-29 | 2007-09-12 | 株式会社ルネサステクノロジ | 高周波回路モジュールおよび通信装置 |
US6631555B1 (en) * | 2000-02-08 | 2003-10-14 | Cardiac Pacemakers, Inc. | Method of thin film deposition as an active conductor |
US6360431B1 (en) * | 2000-09-29 | 2002-03-26 | Intel Corporation | Processor power delivery system |
US6462950B1 (en) * | 2000-11-29 | 2002-10-08 | Nokia Mobile Phones Ltd. | Stacked power amplifier module |
US7075112B2 (en) * | 2001-01-31 | 2006-07-11 | Gentex Corporation | High power radiation emitter device and heat dissipating package for electronic components |
JP3612031B2 (ja) * | 2001-03-29 | 2005-01-19 | Tdk株式会社 | 高周波モジュール |
US6627987B1 (en) * | 2001-06-13 | 2003-09-30 | Amkor Technology, Inc. | Ceramic semiconductor package and method for fabricating the package |
US20070133001A1 (en) * | 2001-09-12 | 2007-06-14 | Honeywell International Inc. | Laser sensor having a block ring activity |
US7015457B2 (en) * | 2002-03-18 | 2006-03-21 | Honeywell International Inc. | Spectrally tunable detector |
JP3662219B2 (ja) * | 2001-12-27 | 2005-06-22 | 三菱電機株式会社 | 積層高周波モジュール |
US7470894B2 (en) * | 2002-03-18 | 2008-12-30 | Honeywell International Inc. | Multi-substrate package assembly |
US7276798B2 (en) * | 2002-05-23 | 2007-10-02 | Honeywell International Inc. | Integral topside vacuum package |
TWM248187U (en) * | 2003-01-15 | 2004-10-21 | Abocom Sys Inc | Printed circuit board structure of RF transmission device |
US6971162B2 (en) * | 2003-05-13 | 2005-12-06 | Motorola, Inc. | Localized enhancement of multilayer substrate thickness for high Q RF components |
JP3858854B2 (ja) | 2003-06-24 | 2006-12-20 | 富士通株式会社 | 積層型半導体装置 |
JP2005026263A (ja) * | 2003-06-30 | 2005-01-27 | Nec Compound Semiconductor Devices Ltd | 混成集積回路 |
US6982879B1 (en) * | 2003-07-19 | 2006-01-03 | Intel Corporation | Apparatus to provide connection between a microelectronic device and an antenna |
US7167688B2 (en) * | 2003-07-30 | 2007-01-23 | Chi Mei Communication Systems, Inc. | RF transceiver module formed in multi-layered ceramic |
US6888063B1 (en) * | 2003-10-15 | 2005-05-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling |
KR100631673B1 (ko) | 2003-12-30 | 2006-10-09 | 엘지전자 주식회사 | 이동통신용 고주파 모듈 구조 |
US20050231922A1 (en) * | 2004-04-16 | 2005-10-20 | Jung-Chien Chang | Functional printed circuit board module with an embedded chip |
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1998
- 1998-12-09 JP JP35026598A patent/JP3538045B2/ja not_active Expired - Fee Related
-
1999
- 1999-06-17 KR KR1020007008694A patent/KR20010040800A/ko not_active Application Discontinuation
- 1999-06-17 WO PCT/JP1999/003236 patent/WO2000035015A1/ja not_active Application Discontinuation
- 1999-06-17 EP EP99973352A patent/EP1056133A1/en not_active Withdrawn
- 1999-06-17 CN CN99804934A patent/CN1296642A/zh active Pending
- 1999-07-27 US US09/361,213 patent/US6335669B1/en not_active Expired - Lifetime
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JPH04219966A (ja) * | 1990-12-20 | 1992-08-11 | Fujitsu Ltd | 半導体素子 |
JPH10135406A (ja) * | 1996-11-01 | 1998-05-22 | Nec Corp | 半導体装置の実装構造 |
Also Published As
Publication number | Publication date |
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JP3538045B2 (ja) | 2004-06-14 |
JP2000174204A (ja) | 2000-06-23 |
US6335669B1 (en) | 2002-01-01 |
KR20010040800A (ko) | 2001-05-15 |
EP1056133A1 (en) | 2000-11-29 |
CN1296642A (zh) | 2001-05-23 |
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