WO2000020489A1 - Non-perfluoro fluororesin molded article having low-temperature heat sealability - Google Patents
Non-perfluoro fluororesin molded article having low-temperature heat sealability Download PDFInfo
- Publication number
- WO2000020489A1 WO2000020489A1 PCT/JP1999/005433 JP9905433W WO0020489A1 WO 2000020489 A1 WO2000020489 A1 WO 2000020489A1 JP 9905433 W JP9905433 W JP 9905433W WO 0020489 A1 WO0020489 A1 WO 0020489A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- surface layer
- low
- film
- temperature heat
- molded article
- Prior art date
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- 239000002344 surface layer Substances 0.000 claims abstract description 32
- 238000007789 sealing Methods 0.000 claims abstract description 27
- -1 perfluoro Chemical group 0.000 claims abstract description 18
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 12
- 239000013039 cover film Substances 0.000 claims abstract description 10
- 125000001153 fluoro group Chemical group F* 0.000 claims abstract description 10
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 6
- 239000010408 film Substances 0.000 claims description 53
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 2
- ACOGMWBDRJJKNB-UHFFFAOYSA-N acetic acid;ethene Chemical compound C=C.CC(O)=O ACOGMWBDRJJKNB-UHFFFAOYSA-N 0.000 claims description 2
- 239000011737 fluorine Substances 0.000 claims description 2
- 239000002033 PVDF binder Substances 0.000 claims 1
- 125000004429 atom Chemical group 0.000 claims 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N titanium dioxide Inorganic materials O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 208000028659 discharge Diseases 0.000 description 27
- 238000000034 method Methods 0.000 description 23
- 239000007789 gas Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 150000002894 organic compounds Chemical class 0.000 description 12
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 7
- 229920001577 copolymer Polymers 0.000 description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 230000003796 beauty Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 235000019253 formic acid Nutrition 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- LKMJVFRMDSNFRT-UHFFFAOYSA-N 2-(methoxymethyl)oxirane Chemical compound COCC1CO1 LKMJVFRMDSNFRT-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- QLVHFTGKDGTJDH-UHFFFAOYSA-N acetic acid;ethenyl acetate Chemical compound CC(O)=O.CC(=O)OC=C QLVHFTGKDGTJDH-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BLCTWBJQROOONQ-UHFFFAOYSA-N ethenyl prop-2-enoate Chemical compound C=COC(=O)C=C BLCTWBJQROOONQ-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- URXNVXOMQQCBHS-UHFFFAOYSA-N naphthalene;sodium Chemical compound [Na].C1=CC=CC2=CC=CC=C21 URXNVXOMQQCBHS-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-M perchlorate Inorganic materials [O-]Cl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-M 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000001612 separation test Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/306—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl acetate or vinyl alcohol (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/121—Organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/116—Primary casings; Jackets or wrappings characterised by the material
- H01M50/124—Primary casings; Jackets or wrappings characterised by the material having a layered structure
- H01M50/126—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers
- H01M50/129—Primary casings; Jackets or wrappings characterised by the material having a layered structure comprising three or more layers with two or more layers of only organic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/10—Primary casings; Jackets or wrappings
- H01M50/131—Primary casings; Jackets or wrappings characterised by physical properties, e.g. gas permeability, size or heat resistance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2323/00—Polyalkenes
- B32B2323/04—Polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2331/00—Polyvinylesters
- B32B2331/04—Polymers of vinyl acetate, e.g. PVA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/12—Photovoltaic modules
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31—Surface property or characteristic of web, sheet or block
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
Definitions
- the present invention relates to a non-perfluoro fluororesin molded article having a large bonding strength and a low-temperature heat-sealing property, particularly to a power film for a solar battery.
- the bonding of fluoroplastic bodies is performed using high-frequency gelling and supersonic wave verging commonly used in addition to general-purpose resins.
- the method referred to as wing cannot be used for corn lj because the joint cannot be re-melted.
- heat-fusible fluororesin is heated to a temperature above its melting point and pressurized in the re-melted state, so-called fusion bonding.
- fusion bonding The law is used.
- the fluororesin molded body is once melted, so that the mechanical strength in the vicinity of the joining portion is significantly reduced.
- the fluororesin molded body is joined with a different material: the surface of the fluororesin molded body is chemically modified with a sodium-naphthalene lens.
- a chemical treatment method in which bonding is performed using an adhesive, there is a problem such as coloring of the molded product, and in applications where transparency is required, there is a problem. I can not use it .
- a method of heat-sealing at a temperature of about 210 ° C without using an adhesive Japanese Patent Publication No. Hei 5-686864 , (2) Number of carbon atoms The ratio of the number of fluorine atoms to the number of fluorine atoms
- the FZC force S 1.9 to 2.0 of a perfluoro-based fluororesin compact having an oxygen content of 10 mol%
- the F / C on the surface of the molded body was reduced to 0.8 to 10% by the following low-temperature plasma treatment method using a glow discharge in a non-polymerizable gas atmosphere.
- the surface of a perfluoro-based or non-fluorofluororesin shaped article is an organic compound having a functional group (for example, A Corona discharge, global discharge, and plasma in an inert gas atmosphere including seton, glycidine, crelet, and methanol.
- Special The second 6 9 0 0 3 No. 2 Akira fine manual) soil force S that has been known, et al.
- a parallel plate type electrode is used as a processing electrode, and a fluororesin film is passed between the electrodes.
- a fluororesin film is passed between the electrodes.
- both sides of the film have been treated, so the non-stick, water-repellent, lubricious, and stain-resistant properties of fluorine resin are characteristic. , Chemical resistance etc. will be greatly reduced. Therefore, when utilizing the characteristics of such fluororesin, it is necessary to cover the non-surface-treated side with a protective film before processing. What are you?
- the processing system is used because inert gas and fluorocarbon are used. It must be kept airtight and the recovery of exhaust gas must be taken into account.
- the method (5) is characterized in that the organic compound used in the treatment atmosphere is coated with a bonding agent having a functional group having a specific relationship with the organic compound used. There is a characteristic.
- the present invention provides excellent low-temperature heat sealability to the surface of a non-fluorinated fluororesin molded article having an F / C force of 1.8 or less. The purpose is to do so. Disclosure of the invention
- the present invention relates to a non-perfluoro fluororesin shaped body having at least part of the surface layer having a low-temperature heat-sealing surface layer.
- the low-temperature heat-sealing surface layer has an FC of 0.2 ⁇ F / C ⁇ 0.9, preferably 0.3 ⁇ F / C ⁇ 0.8, Particularly preferred is 0.4 ⁇ ⁇ ⁇ ⁇ 0.8 and the ZC force is 0.09 ⁇ O / C ⁇ 0.40, preferably 0.14. ⁇ O / C ⁇ 0.30, particularly preferably 0.14 ⁇ O / C ⁇ 0.25, and the F / C of the remaining part of the surface layer is low temperature heat.
- Non-perfluoro fluororesin shaped body characterized in that 0.8 ⁇ F ⁇ C ⁇ 1.8 larger than the sealable surface layer
- the present invention relates to a film-shaped molded article.
- Such a film-like molded article has a low-temperature heat-sealing surface layer having a large heat-sealing strength on one surface of the film. It is suitable as a solar battery cover film that has been formed, and is a polyethylene-vinyl acetate-based file or Even if the sheet is directly heat-sealed at a temperature lower than the melting point of the non-perfluorofluororesin, it can be used as a solar cell power barrier mineral. Can be used for IJ. Brief explanation of drawings
- FIG. 1 is a graph showing the relationship between FZC, ⁇ / C, and heat shield strength of the ETFE film subjected to the discharge treatment measured in Example 2. . Best mode for implementing
- non-fluorinated fluororesin of the FZC force S0.7 to 1.8 used in the present invention, for example, ethylene tetra Fluoroethylene copolymers (ETFE), ethylene-tetrafluoroethylene copolymers, polyfluoropropylene copolymers, polytetrafluoroethylene copolymers (ETFE) Livinylidene fluoridolide (PVdF), vinylidene fluoridate tetrafluoroethylene copolymer, ethylene- -Black mouth trifluoroethylene copolymer (ECTFE), vinylidenefluoride chlorotrifluoroethylene copolymer, For example, vinylidene fluoridated tetrafluoroethylene copolymers (THV), etc. , For solar cell films, the transparency and mechanical strength, the stress resistance to stress, and the high point force for ETFE Power is good.
- the non-perfluoro fluororesin is preferably in the form of a film or a sheet, but is preferably in the form of a plate, a pipe, or the like. It may be a shaped body of various shapes such as a fibrous shape, a cloth shape (woven fabric, knitted fabric) and a laminate of these.
- FZCs are 0.7 to 1.8 non-perfluoro-type
- a means of lowering the surface F / C of the molded article of nitrogen resin to 0.2 to 0.9 and further reducing the OZC to 0.09 to 0.40 it is not suitable. This can be achieved by subjecting the surface of the compact to a discharge treatment in an atmosphere in which a reactive organic compound is mixed with active gas.
- Inert gases include, for example, nitrogen gas, helium gas, and argon gas.
- the reactive organic compound is a polymerizable or non-polymerizable organic compound containing an oxygen atom, such as vinyl acetate acetate and formic acid.
- Vinyl esters such as vinyl; acrylate esters such as glycidyl methacrylate; vinyl acrylate , Vinyl methyl ether, glycidyl methyl ether, etc .; carboxylic acids such as acetic acid, formic acid, etc .; methyl Alcohols such as alcohol, ethyl alcohol, phenol, ethyl alcohol, etc .; acetate, methyl alcohol Ketones such as ketones; carboxylate esters such as ethyl acetate and formate; acrylic acid, methacrylic acid, etc.
- the concentration of the reactive organic compound varies depending on the type of the organic compound, the type of the fluororesin, etc., but is usually 0.1 to 3.0% by volume. Is 0.1 to 1.0% by volume.
- the discharge treatment can be performed in the above-mentioned atmosphere gas by various kinds of discharge methods such as corona discharge and glow discharge, but the inside of the device is depressurized. You do not need to do this, in the case of film, etc. It is easy to process on one side only, and the shadow of the atmosphere gas near the electrode is small. ⁇ Stable discharge is easy to obtain. I like it.
- the release conditions depend on the intended FZC and ZC values, the type of non-fluorofluorocarbon resin, the type and degree of reactive organic compounds, and the like. It may be appropriately selected. Normally, the charge density is 0.3 to 9.0 W ⁇ sec no zcm 2 , preferably 3
- the processing temperature can be at any temperature between 0 ° C and 100 ° C
- the discharge treatment is performed only on one side, especially in the case of a molded body force file or sheet which is partially applied to the molded body. It is desirable to maintain the characteristics of the fluororesin on the other side.
- the grounding electrode is ⁇ -shaped and a fluororesin film is attached to the rolled grounding electrode.
- a method of corona discharge treatment is a method of corona discharge treatment, but it is not limited to these methods.
- the discharge treatment surface thus obtained has a FZC force of 0.2 ⁇ F
- the surface layer of the low-temperature heat sealability is 0.3 in that a good adhesive strength can be obtained when the film is heat-sealed at a low temperature.
- the force is ⁇ F / C ⁇ 0.8, and 0.14 ⁇ OZC ⁇ 0.3.
- the durability is excellent when it is exposed to a force of 0.4 ⁇ FZC ⁇ 0.8 and 0.14 ⁇ ⁇ .
- ZC 0.25.
- the F / C of the surface layer of the low-temperature heat-sealing surface is, of course, smaller than the F / C of the residual (initial) surface layer (0.7 to: 0.8). No.
- surface layer refers to an excited X-ray A by an X-ray photoelectron spectrometer (£ 380-750 manufactured by Shimadzu Corporation). l, ⁇ ⁇ 1, 2-wire (1 4 8 6. 6 e V), X -ray output 8 KV, 3 0 m A, temperature 2 0 ° C, vacuum degree of 5. 0 X 1 0 one 7 T orr This refers to the part up to the measurement depth (about 10 nm) when measuring under the following conditions. Or F / C good beauty OZC is, C 1 s was measured at ways of this, F i s your good beauty ⁇ ! It is calculated from the measured value of s .
- the non-fluorofluororesin molded article of the present invention has the same low-temperature heat-sealing surface layer portion as that of the non-fluorinated fluororesin molded article.
- Heat seal can be performed with sufficient strength with a fluorocarbon resin molded article or a different kind of material. Sufficient heat seal strength here is the strength at which the molded body is more likely to break when the heat-sealed compact is peeled off. Therefore, in the measurement, the tensile strength of each fluororesin molded article in the tensile test (according to ASTMD3336) It can be evaluated by the yield strength (gf / cm).
- the tensile yield strength of the film varies depending on the thickness of the film. For example, in the case of the non-stretched film of ETFE, the industrial yield is low.
- the tensile yield strength at a film thickness of 6 m, which is the highest film thickness, is about 120 gf / cm, which is at least higher than this. Is effective for practical use.
- the tensile yield strength is about 240 g ⁇ / cm or more. And are preferred
- the non-perfluorofluororesin molded article of the present invention and a different kind of material that can be heat-sealed include, for example, ethylene monoacetate.
- Materials such as synthetic resins such as copolymers, polyimides, and polyamide imides can be used.
- Heat over Bok Shi Lumpur known human and reports open Lumpur method by Ri non Pa - Full O B based off Tsu temperature below melting point of the fluororesin, was example, if 1 4 0 0 Celsius to Perform in the temperature range up to the melting point.
- the heat seal method is, for example, an impulse sealer or a heat press. Which method can be used, but is not limited to them
- the low-temperature heat-sealing fluororesin molded article of the present invention can be used for covering a solar battery cover film described later, a decorative steel plate, wallpaper, and the like. It is useful as a material for building interior and exterior, as well as a covering material for wrapping electric wires.
- the present invention also relates to a solar battery power buffer comprising the non-perfluorofluoropolymer film subjected to the discharge treatment.
- This cover film has a low-temperature heat seal property on one side only, and the other side is left untreated and is made of fluororesin. It uses properties such as non-adhesiveness, water repellency, lubricity, stain resistance, chemical resistance, and electrical insulation.
- the solar battery cover filem of the present invention is required to have a heat seal strength of at least 360 gf / cm from the viewpoint of weather resistance and durability. It is done.
- the solar battery cover film of the present invention is usually made of a material different from the treated surface, for example, an ethylene-vinyl acetate copolymer (EVA). It is a form of a laminated body that heats up a film or a sheet. The laminated body protects the solar battery main body. Yes.
- EVA ethylene-vinyl acetate copolymer
- the thickness of the solar battery cover film is usually about 50 / m to 0.1 mm, and the thickness of the EVA film or sheet is usually 0.1. ⁇ : About 1.0 mm.
- the discharge electrode of the Rona discharge device and the grounded contact electrode (6 (0 ° C) near the surface of a nitrogen gas containing 0.3 volume% of vinyl acetate or glycidyl methacrylate.
- the ETFE film was passed continuously while being attached to the grounding electrode, and one side of the ETFE film was subjected to corona discharge treatment at the charge density shown in Table 1.
- the corona discharge treated (low-temperature heat-sealing) surface layer was examined by the above-mentioned ESC A, and FZC and OZC were calculated. The results are shown in Table 1.
- the two treated ETFE films are heat-pressed at 170 ° C for 5 minutes with the same low-temperature heat-sealing surface layer.
- a sample for seal strength measurement was prepared. The sample was peeled 180 degrees using a universal tension tester (ASG-50D, manufactured by Shimadzu Corporation) according to JISK 6854. A separation test (tensile speed of 10 O mm Z minutes) was performed. The measured values are shown in Table 1 as the heat-sealing strength.
- Example 1 the concentration of vinyl acetate and the charge density of corona discharge were changed as appropriate, and the low-temperature temperature of various F / C and O / C values were changed.
- An ETFE film having a sealable surface layer was prepared, and the heat seal strength was measured in the same manner as in Example 1.
- Figure 1 shows the results.
- ⁇ indicates that the heat seal strength is more than 360 gf / cm, and the mouth indicates that the heat seal strength is more than 240 gf / cm.
- ⁇ means heat seal strength of more than 120 gf / cm and less than 240 gf Zcm, ⁇ means heat seal strength is 120 For those less than gf / cm, X indicates that the film has been deformed.
- the low-temperature heat-sealing surface of these ETFE films is coated on an EVA film (Pond Fast G manufactured by Sumitomo Chemical Co., Ltd., thickness: 0.0). 5 mm), stack an aluminum plate (thickness 0.2 mm), which has been subjected to degreasing with acetate, pressurize it to 60 gf Z cm 2, and The laminate was heated in a furnace at 150 ° C for 2 hours to simulate a solar cell panel. The obtained laminated body was kept for 10 hours in an environment of 85 ⁇ 2 ° C and relative humidity of 90 to 93% for 5%, and then removed. And visually observed whether the ETFE film and the EVA film had been peeled off or not. The results are shown in Table 2.
- an excellent low-temperature heat-sealing property is imparted to a non-fluorofluorocarbon resin in which low-temperature heat sealing is difficult.
- This is a fluororesin film that can be used as a cover film for solar cells that require only high levels of weather resistance and durability. Can be provided.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Photovoltaic Devices (AREA)
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99970098A EP1160270A4 (en) | 1998-10-06 | 1999-10-01 | NON-PERFLUORINATED FLUORINATED RESIN MOLDED ARTICLE WITH LOW TEMPERATURE THERMOSCELLABILITY |
JP2000574596A JP5170919B2 (ja) | 1998-10-06 | 1999-10-01 | 低温ヒートシール性をもつ非パーフルオロ系フッ素樹脂成形体 |
US09/806,828 US6392138B1 (en) | 1998-10-06 | 1999-10-01 | Non-perfluoro fluorine-containing resin molded article having low-temperature heat-sealing property |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28384498 | 1998-10-06 | ||
JP10/283844 | 1998-10-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000020489A1 true WO2000020489A1 (en) | 2000-04-13 |
Family
ID=17670903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1999/005433 WO2000020489A1 (en) | 1998-10-06 | 1999-10-01 | Non-perfluoro fluororesin molded article having low-temperature heat sealability |
Country Status (4)
Country | Link |
---|---|
US (1) | US6392138B1 (ja) |
EP (1) | EP1160270A4 (ja) |
JP (2) | JP5170919B2 (ja) |
WO (1) | WO2000020489A1 (ja) |
Cited By (9)
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JPWO2006059697A1 (ja) * | 2004-12-03 | 2008-06-05 | 旭硝子株式会社 | エチレン−テトラフルオロエチレン系共重合体成形物およびその製造方法 |
JPWO2008050626A1 (ja) * | 2006-10-23 | 2010-02-25 | ダイキン工業株式会社 | 太陽電池モジュール、積層体及び太陽電池モジュールの製造方法 |
JP2012183378A (ja) * | 2005-03-25 | 2012-09-27 | Nipro Corp | 凍結保存容器の包装体およびその製造方法 |
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- 1999-10-01 WO PCT/JP1999/005433 patent/WO2000020489A1/ja not_active Application Discontinuation
- 1999-10-01 JP JP2000574596A patent/JP5170919B2/ja not_active Expired - Fee Related
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2011
- 2011-08-12 JP JP2011177169A patent/JP5408203B2/ja not_active Expired - Lifetime
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JPWO2006059697A1 (ja) * | 2004-12-03 | 2008-06-05 | 旭硝子株式会社 | エチレン−テトラフルオロエチレン系共重合体成形物およびその製造方法 |
JP2012183378A (ja) * | 2005-03-25 | 2012-09-27 | Nipro Corp | 凍結保存容器の包装体およびその製造方法 |
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Also Published As
Publication number | Publication date |
---|---|
EP1160270A1 (en) | 2001-12-05 |
EP1160270A4 (en) | 2003-03-19 |
JP5170919B2 (ja) | 2013-03-27 |
JP5408203B2 (ja) | 2014-02-05 |
US6392138B1 (en) | 2002-05-21 |
JP2012001732A (ja) | 2012-01-05 |
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