WO1996034126A1 - Bain de depot sans apport de courant mettant en ×uvre un agent de chelation - Google Patents

Bain de depot sans apport de courant mettant en ×uvre un agent de chelation Download PDF

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Publication number
WO1996034126A1
WO1996034126A1 PCT/JP1996/001105 JP9601105W WO9634126A1 WO 1996034126 A1 WO1996034126 A1 WO 1996034126A1 JP 9601105 W JP9601105 W JP 9601105W WO 9634126 A1 WO9634126 A1 WO 9634126A1
Authority
WO
WIPO (PCT)
Prior art keywords
acid
plating bath
electroless plating
diacetate
plating
Prior art date
Application number
PCT/JP1996/001105
Other languages
English (en)
Japanese (ja)
Inventor
Hiroshi Yamamoto
Yasuyuki Takayanagi
Osamu Takano
Original Assignee
Nitto Chemical Industry Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP12046795A external-priority patent/JPH08296049A/ja
Priority claimed from JP14011095A external-priority patent/JPH0913175A/ja
Priority claimed from JP15547195A external-priority patent/JPH08325742A/ja
Priority claimed from JP23319695A external-priority patent/JPH0949084A/ja
Application filed by Nitto Chemical Industry Co., Ltd. filed Critical Nitto Chemical Industry Co., Ltd.
Publication of WO1996034126A1 publication Critical patent/WO1996034126A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents

Abstract

L'invention se rapporte à un bain de dépôt sans apport de courant mettant en ÷uvre un agent de chélation biodégradable utilisé comme agent complexant. Les agents complexants utilisés jusqu'ici comprennent l'EDTA, pour des bains de cuivrage sans apport de courant, et de l'acide citrique et l'EDTA, pour des bains de nickelage sans apport de courant. Toutefois, l'EDTA étant difficilement biodégradable, il faudrait, par conséquent, éviter de l'utiliser afin de protéger l'environnement. De plus, les bains de nickelage sans apport de courant mettant en ÷uvre l'acide citrique ont tendance à réduire la teneur en phosphore du revêtement de nickel dans des conditions alcalines qui augmentent la vitesse de dépôt, l'utilisation de l'acide nitrique étant ainsi inappropriée à la production, à haut rendement, d'un revêtement de nickel à forte teneur en phosphore. L'utilisation d'au moins un élément sélectionné parmi des agents de chélation monoaminés, tels que l'acide aspartique/acide acétique, et des agents de chélation diaminés, tels que l'acide éthylènediaminedisuccinique utilisé comme agent complexant dans des bains de dépôt sans apport de courant, permet d'obtenir des bains de cuivrage hautement biodégradables et très stables , et également de réaliser un revêtement de nickelage à forte teneur en phosphore et à vitesse élevée.
PCT/JP1996/001105 1995-04-24 1996-04-24 Bain de depot sans apport de courant mettant en ×uvre un agent de chelation WO1996034126A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP12046695 1995-04-24
JP7/120467 1995-04-24
JP12046795A JPH08296049A (ja) 1995-04-24 1995-04-24 モノアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴
JP7/120466 1995-04-24
JP14011095A JPH0913175A (ja) 1995-04-24 1995-05-16 ジアミン型生分解性キレート剤を用いた無電解Ｎｉメッキ浴
JP7/140110 1995-05-16
JP15547195A JPH08325742A (ja) 1995-05-31 1995-05-31 モノアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
JP15547295 1995-05-31
JP7/155471 1995-05-31
JP7/155472 1995-05-31
JP23319695A JPH0949084A (ja) 1995-05-31 1995-08-21 ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
JP7/233196 1995-08-21

Publications (1)

Publication Number Publication Date
WO1996034126A1 true WO1996034126A1 (fr) 1996-10-31

Family

ID=27552579

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1996/001105 WO1996034126A1 (fr) 1995-04-24 1996-04-24 Bain de depot sans apport de courant mettant en ×uvre un agent de chelation

Country Status (1)

Country Link
WO (1) WO1996034126A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2627319C1 (ru) * 2016-10-25 2017-08-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Тверской государственный университет" Электролит для осаждения цинк-никелевых покрытий
DE102019124958A1 (de) * 2019-09-17 2021-03-18 Zschimmer & Schwarz Mohsdorf GmbH & Co. KG. Phosphonsäurederivate und Verfahren zu deren Herstellung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148239A (fr) * 1974-05-22 1975-11-27
JPS5370931A (en) * 1976-12-07 1978-06-23 Tokyo Shibaura Electric Co Nonnelectrolytic copper plating method
JPS5548103B2 (fr) * 1975-10-09 1980-12-04
JPS61231176A (ja) * 1985-04-02 1986-10-15 Nec Corp 無電解めつき方法
JPS63199295A (ja) * 1986-11-10 1988-08-17 ザ、プロクター、エンド、ギャンブル、カンパニー エチレンジアミン−ｎ，ｎ′−ジコハク酸を含有する洗剤組成物
JPH05194996A (ja) * 1991-08-06 1993-08-03 W R Grace & Co 洗剤組成物
JPH05295556A (ja) * 1992-04-20 1993-11-09 Deitsupusoole Kk 無電解メッキ液及びそれを使用するメッキ方法
JPH0789913A (ja) * 1993-09-17 1995-04-04 Nitto Chem Ind Co Ltd アミノポリカルボン酸類およびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148239A (fr) * 1974-05-22 1975-11-27
JPS5548103B2 (fr) * 1975-10-09 1980-12-04
JPS5370931A (en) * 1976-12-07 1978-06-23 Tokyo Shibaura Electric Co Nonnelectrolytic copper plating method
JPS61231176A (ja) * 1985-04-02 1986-10-15 Nec Corp 無電解めつき方法
JPS63199295A (ja) * 1986-11-10 1988-08-17 ザ、プロクター、エンド、ギャンブル、カンパニー エチレンジアミン−ｎ，ｎ′−ジコハク酸を含有する洗剤組成物
JPH05194996A (ja) * 1991-08-06 1993-08-03 W R Grace & Co 洗剤組成物
JPH05295556A (ja) * 1992-04-20 1993-11-09 Deitsupusoole Kk 無電解メッキ液及びそれを使用するメッキ方法
JPH0789913A (ja) * 1993-09-17 1995-04-04 Nitto Chem Ind Co Ltd アミノポリカルボン酸類およびその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2627319C1 (ru) * 2016-10-25 2017-08-07 Федеральное государственное бюджетное образовательное учреждение высшего образования "Тверской государственный университет" Электролит для осаждения цинк-никелевых покрытий
DE102019124958A1 (de) * 2019-09-17 2021-03-18 Zschimmer & Schwarz Mohsdorf GmbH & Co. KG. Phosphonsäurederivate und Verfahren zu deren Herstellung
WO2021052768A1 (fr) 2019-09-17 2021-03-25 Zschimmer & Schwarz Mohsdorf GmbH & Co. KG Dérivés d'acide phosphonique et leur procédé de préparation
DE102019124958B4 (de) 2019-09-17 2023-03-23 Zschimmer & Schwarz Mohsdorf GmbH & Co. KG. Phosphonsäurederivate und Verfahren zu deren Herstellung

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