Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Definitions

• the present invention relates to an apparatus for bonding an anisotropically electroconductive tape onto a substrate.
• anisotropically electroconductive tape to secure an electronic component part such as, for example, a TCP (tape carrier package) onto one or more electrodes on a substrate such as, for example, a liquid crystal panel.
• the anisotropically electroconductive tape is generally bonded to one of opposite surfaces of a backing tape (also referred to as a leader tape or a separator tape) and is wound around a supply reel together with the backing tape.
• the aniso ⁇ tropically electroconductive tape together with the backing tape is drawn out from the supply reel towards a cutting station where the length of anisotropically electroconductive tape is cut to provide an anisotropically electroconductive tape segment of a desired or required length which is subsequently placed at a work station on the substrate.
• the anisotropically electroconductive tape segment so placed on the substrate is pressed by a pressure applying tool firmly against the substrate to bond the tape segment to the substrate. After the tape segment so bonded to the substrate, the length of backing tape is peeled off from the tape segment.
• Fig. 36 showing one of the prior art tape cutting methods
• a generally V-sectioned incision is formed by a cutter blade 3 at a location spaced from the foremost end of the anisotropically electroconductive tape 1 a distance chosen to be equal to a desired or required length, but not in the length of leader tape 2, to thereby provide an anisotropically electroconductive tape segment remaining bonded to the length of leader tape.
• This method has a problem which will now be described with reference to Fig. 37.
• any possible lateral displacement of the pressure applying tool 6 relative to the position of the incision in an upstream direction with respect to the transport direction M may result in that not only is the anisotropically electro ⁇ conductive tape segment pressed against the substrate, but a leading end of the remaining length of anisotropically electroconductive tape 2 neighboring the anisotropically electroconductive tape segment may also be pressed against the same substrate. Accordingly, the prior art method shown in Figs. 36 and 37 requires a stringent supervision of the feed accuracy with which the length of leader tape 1 is fed and the positioning accuracy with which the pressure applying tool 5 is positioned relative to the substrate.
• a so-called burn-out technique is employed for burning a portion of the length of anisotropically electroconductive tape 2 to provide a space of separation dividing only the length of anisotropically electroconductive tape into the anisotropically electroconductive tape segment and the remaining length of anisotropically electro ⁇ conductive tape by the use of a burning tool 6. More specifically, at the cutting station, a debris removal tape 7 is supported on a cushioning support 8 positioned below the length of anisotropically electroconductive tape 2 carried by the length of leader tape 1. Then, as shown in Fig.
• the burning tool 6 heated to a high temperature is lowered to press a portion of the anisotropically electroconductive tape 2 through a corresponding portion of the leader tape 1 against the debris removal tape 7 resting on the cushioning support 8 so that only that portion of the anisotropically electroconductive tape 2 can be burned to provide the space of separation with a burned debris (shown by 21 in Fig. 40) removed by the debris removal tape 7, thereby leaving the anisotropically electroconductive tape segment.
• the present invention is intended to provide an improved apparatus, and an improved method, for bonding an anisotropically electroconduc ⁇ tive tape onto a substrate, which is effective to accomplish a satisfactory and smooth cutting of the length of anisotropically electroconductive tape.
• the present invention provides an apparatus for bonding an anisotropically electroconductive tape onto a substrate, which comprises a tape supply unit for supplying in one transport direction a length of leader tape having one surface to which a length of anisotropi- cally electroconductive tape is bonded; a tape transport unit for transporting the length of leader tape, supplied from the leader tape supply unit, In the transport direction; a tape cutting unit for cutting only the length of anisotropically electroconductivetape to provide an anisotropically electroconductive tape segment of a predetermined length with respect to the transport direction; a substrate positioning unit for positioning a substrate to which the anisotropically electro ⁇ conductive tape segment is bonded; and a tape pressing unit for pressing the anisotropically electroconductive tape segment to bond the latter to the substrate.
• the tape cutting unit includes an incision forming member for forming in the length of anisotropically electroconductive tape two incisions spaced from each other a distance in a direction conforming to the transport direction to thereby provide an anisotropically electroconductive tape segment of a desired or required length equal to the distance of spacing between the incisions, and a removal means for removing a piece of anisotropically electroconductive tape which is bound between the spaced incisions.
• the incision forming member comprises two cutting blades spaced from each other a distance equal to the desired or required length for form ⁇ ing the respective incisions in the length of anisotropically electroconductive tape.
• the incision forming member forms the two incisions in the length of anisotropically electroconductive tape, which incisions are spaced a predetermined distance in a direction conforming to the transport direction.
• the piece of anisotropically electroconductive tape bound between the spaced incisions is removed by the removal means to thereby leave the anisotropically electroconductive tape segment on one side downstream of the remaining length of anisotropically electroconductive tape.
• the resultant anisotropically electroconductive tape segment still sticking to the length of leader tape together with the remaining length of anisotropically electroconductive tape is subsequently bonded to the substrate.
• Fig. 1 is a schematic perspective view of a tape bonding apparatus according to the present invention
• Fig. 2 is a schematic perspective view, on an enlarged scale, of a substrate positioning unit and a tape applicator unit both employed in the tape bonding apparatus;
• Fig. 3 is a schematic side view of the substrate positioning unit and the tape applicator unit shown in Fig. 2;
• Fig. 4 is a schematic perspective view, on an enlarged scale, of a chuck employed in the tape bonding apparatus;
• Figs. 5 to 8 are schematic front elevational views of the chuck in different operative positions, respectively;
• Fig. 9 is a schematic front elevational view of the tape bonding apparatus of the present invention.
• Fig. 10 is a schematic sectional view of a leader tape take-up unit employed in the tape bonding apparatus of the present invention.
• Fig. 1 1 is a schematic front elevational view, on an enlarged scale, of a tape cutting unit employed in the tape bonding apparatus of the present invention
• Figs. 12 to 17 are schematic sectional view of a suction block shown in relation to the tape cutting unit, showing the sequence of cutting operation with the tape cutting unit held at different operative positions, respectively;
• Fig . 18 illustrates a block diagram of a control system employed in the tape bonding apparatus of the present invention
• Figs. 19 to 35 are schematic diagrams showing the sequence of operation of the tape bonding apparatus of the present invention with the various component parts held at different operative positions, respectively;
• Fig. 36 is a schematic diagram showing how a length of anisotropically electroconductive tape is cut according to one of prior art methods;
• Fig. 37 is a schematic diagram showing how an anisotropically electroconductive tape segment, cut from the length of anisotropically electroconductive tape in the manner shown in Fig. 36, is bonded to a substrate according to the prior art method;
• Figs. 38 to 40 are schematic diagram showing how the length of anisotropically electroconductive tape is supplied, pressed against a debris removal tape and cut, respectively, by the use of a burn-out technique according another one of the prior art method.
• the tape bonding apparatus shown therein comprises a machine bench 9 including a substrate positioning unit 10 mounted thereon for positioning a substrate 4.
• the substrate positioning unit 10 includes an X-table 1 1 adapted to be driven by an X-motor 12 in a direction shown by the arrow X, a Y-table 13 mounted above the X-table 11 and adapted to be driven by a Y- motor 14 in a direction shown by the arrow Y and at right angles to the direction X, and a 0-table 15 mounted above the Y-table 13 for turning the substrate 4 in a horizontal plane.
• the machine bench 9 carries handlers 16 and 17 positioned on respective sides of the substrate positioning unit 10 and has an upright support bed 9a rigidly mounted thereon so as to extend substantially parallel to the direction M of transport of a length of anisotropically electroconductive tape 2 as will subsequently be described.
• the machine bench 9 also includes a top carrier plate 18 mounted thereon by means of a plurality of columns or any suitable support legs so as to overlay the substrate positioning unit 0.
• a tape applicator unit 19 as will be described later is supported immediately above the substrate positioning unit 10 by means of a frame 20 secured from below to the top carrier plate 18.
• the apparatus also comprises, in the order from an upstream side towards a downstream side with respect to the direction M of transport of the length of anisotropically electroconductive tape 2, a tape supply unit 21 from which a length of leader tape 1 having the anisotropically electroconductivetape 2 bonded thereto is supplied; a tape cutting unit 23 for successively forming transverse spaces of separation, as will be described later, in the length of anisotropically electroconductive tape 2 to thereby provide anisotropically electroconductive tape segments; a tape end detecting sensor 26 in the form of a height measuring sensor for detecting one end of the anisotropically electroconductive tape segment as will be described later; a tape transport unit 22 for transporting the leader tape 1 in the direction M of transport along a predetermined transport path; and a leader tape take-up unit 24 for taking up the length of leader tape 1 into a leader tape recovery box 25.
• the frame 20 is of a shape similar to the shape of an inverted figure of "L", including a horizontal wall rigidly secured from below to the top carrier plate 18 and also including a vertical wall.
• Guide rails 32 and 33 are secured the vertical wall of the frame 20 so as to extend at right angles to the direction M of transport and spaced a distance from each other in a direction conforming to the transport direction M.
• a generally U-shaped slide plate 34 carrying a pressure applying tool 35 secured to a horizontal portion thereof is mounted on the guide rails 32 and 33 for sliding motion therealong so that the pressure applying tool 35 can be selectively lowered and lifted.
• a pressure applying cylinder 36 including a downwardly oriented piston rod 37 is secured to the vertical wall of the frame 20 at a location intermediate between the guide rails 32 and 33 with a free end of said piston rod 37 connected to the slide plate 34.
• a plurality of, for example, two, drive cylinders 28 each having a piston rod 28a are mounted atop the machine bench 9 and below the tape applicator unit 9 with a horizontal support plate 27 mounted on respective free ends of the piston rods 28a.
• the tape supply unit 21 , the tape end detecting sensor 26, the leader tape take-up unit 24 and the leader tape recovery box 25, all referred to above, are mounted on this horizontal support plate 27 for simultaneous movement up and down together with the horizontal support plate 27.
• the tape supply unit 21 includes a cassette mounting plate 29 on which a tape supply cassette 30 accommodating therein a leader tape supply reel 57 around which the length of leader tape 1 is wound and from which the leader tape 1 is drawn outwardly is detachably mounted.
• This tape supply unit 21 also includes a tape suction block 31 disposed at a location spaced a certain distance downstream from the tape supply cassette 30 on the cassette mounting plate 29 with respect to the transport direction M.
• This tape suction block 31 has a perforated undersurface adapted to suck the leader tape 1 to keep the latter so as to extend horizontally and, for this purpose, the suction block 31 has a suction passage 31 a (Figs. 12 to 17) of a generally comb-like configuration defined therein which opens outwardly through a plurality of suction ports opening at the undersurface thereof.
• the tape transport unit 22 positioned below the substrate positioning unit 10 includes a chuck drive table 39 extending a distance in a direction along the transport direction M and a chuck 38 mounted on the chuck drive table 39 for movement along the chuck drive table 39 in the direction X when a chuck drive motor 40 is driven.
• the substrate positioning unit 10 includes, as best shown in Fig. 2, a suction retainer 41 mounted on the 0-table 15, adapted to be driven by a 0-table 42, for sucking a central portion of the undersurface of the substrate 4 to support the latter in position.
• the chuck drive table 39 is comprised of a generally elongated cover 39 of a generally square cross-section having a slid defined in a top wall thereof so as to extend lengthwise thereof, a guide rail 44 positioned inside the elongated cover 39 and fixedly mounted on a bottom wall thereof so as to extend lengthwise thereof, a slider 45 positioned inside the elongated cover 39 and slidably mounted on the guide rail 44, a carrier block 46 fixedly mounted on the slider 45 and having a through-hole defined therein so as to extend in a direction parallel to the direction X, and a ball nut 47 secured to the carrier block 46 in alignment with the through-hole defined in such carrier block 46.
• a bearing 49 forming a part of the chuck 38 is fixedly mounted on the carrier block 46 and positioned outside the elongated cover 43.
• the bearing 49 has a chuck cylinder 51 and a lock cylinder 52 carried thereby so as to protrude therefrom towards the tape transport path immediately above the upright support bed 9a.
• the chuck cylinder 51 includes drive pieces 51a and 51 b movable in a direction close to and away from each other and nipping rollers 63 and 54 carried respectively by the drive pieces 5 a and 51 b for move- ment together therewith in a manner as will be described later. These nipping rollers 53 and 54 cooperate with each other to nip a portion of the length of leader tape 1 therebetween as shown in Fig. 4 when the drive pieces 51a and 51 b are driven in a direction close to each other.
• the lock cylinder 52 includes drive pieces 52a and 52b movable in a direction close to and away from each other and lock fingers 55 and 56 carried respectively by the drive pieces 52a and 52b for movement together therewith in a manner as will be similarly described later.
• Each of the lock fingers 55 and 56 is of a shape having one end secured to the associated drive piece 52a or 52b and the opposite end terminating above or below the nipping roller 53 or 54, a generally intermediate portion thereof having been bent perpendicularly.
• the lock fingers 55 and 56 cooperate with each other in such a manner that, when the drive pieces 52a and 52b are driven close to each other, the lock fingers 55 and 56 clamp therebetween the nipping rollers 53 and 54 then held in position to nip that portion of the length of leader tape 1.
• the nipping rollers 53 and 54 are so clamped by the lock fingers 55 and 56, the nipping rollers 53 and 54 are unable to rotate freely and, therefore, the length of leader tape 1 is constrained as nipped by and between the nipping rollers 53 and 54.
• the bearing 49 supports the chuck cylinder 51 and the lock cylinder 52 so as to permit the chuck and lock cylinders 51 and 52 to be turned about an axis coaxial with the longitudinal axis of the nipping roller 53 then moved close to the nipping roller 54.
• a chuck rotating cylinder 50 in the form of a rotary cylinder is utilized to turn the chuck and lock cylinders 51 and 52 simultaneously about the axis coaxial with the longitudinal axis of the nipping roller 53 then moved close to the nipping roller 54.
• a condition of Fig. 5 in which both of the chuck and lock cylinders 51 and 52 are held at an "open" position with the nipping rollers 53 and 54 separated away from each other and the lock fingers 55 and 56 similarly separated away from each other is referred to as the chuck 38 being held at a release position and that a condition of Fig. 6 in which both of the chuck and lock cylinders 51 and 52 are held at a "closed" position with the nipping rollers 53 and 54 moved close to each other and also with the lock fingers 55 and 56 moved similarly close to each other is referred to as the chuck 38 being held at a clamp position.
• the chuck rotating cylinder 50 is driven t turn the chuck and lock cylinders 51 and 52 90° counterclockwise about the axi coaxial with the longitudinal axis of the nipping roller 53, allowing that portion o the length of leader tape 1 to be bent to assume a shape substantially similar to th shape of a figure "S" as shown in Fig. 7.
• the lock cylinder 52 i brought into the open position while the chuck cylinder 51 remains held in th closed position, and starting from the condition shown in Fig. 7, the chuck 38 i moved in a direction counter to the transport direction M.
• a portio of the leader tape 1 which extends downstream of the nipping roller 54 wit respect to the transport direction M can be upwardly shifted relative to anothe portion of the leader tape 1 which extends upstream of the nipping roller 53 wit respect to the transport direction M.
• that portion of the leader tape extending downstream of the nipping roller 54 with respect to the transpor direction M is shifted upwardly relative to the length of anisotropically electro conductive tape 2 and, therefore, the leader tape 4 can be peeled off from th anisotropically electroconductive tape segment then bonded to the substrate 4.
• the leader tape take-up unit 24 comprises housing 60 enclosing various component parts of the leader tape take-up unit 2 as will be subsequently described.
• the housing 60 has a front upright wa provided with dual bearings 63.
• the leader tape take-up unit 24 also comprise feed rollers 58 and 59 rigidly mounted on horizontally extending shafts 61 and 6 for rotation together therewith, respectively, and cooperable with each other t feed the length of leader tape 1 while nipping it therebetween.
• the shafts 61 an 62 rotatably extend through and are in turn supported by the bearings 63, an drums 64 and 65 are mounted on respective ends of the shafts 61 and 62 remote from the associated feed rollers 58 and 59 for rotation together therewith.
• a feed motor 66 housed within the housing 60 and installed on the bottom thereof is drivingly coupled with the shaft 62 through an endless drive belt 68 drivingly trained between a drive pulley 67 on a motor shaft of the feed motor 66 and a driven pulley 69 that is coupled with the shaft 62 through a friction clutch 70.
• the friction clutch 70 is so designed that only a predetermined quantity of torques can be transmitted from the feed motor 66 to the shaft 62.
• a lock cylinder 71 is installed at the bottom thereof, having a piston rod 72 oriented upwardly.
• This piston rod 72 has upper and lower friction pads 73 and 74 secured thereto so as to protrude transverse therefrom with the friction pad 73 positioned between the drums 64 and 65 and with the friction pad 74 positioned immediately below the drum 65.
• a plurality of sleeve-like guide legs are fixedly mounted atop the machine bench 9 at a location adjacent to and downstream of the tape supply unit 21.
• the guide legs 76 slidably receive therein corresponding rods 77 rigidly secured to and extending downwardly from an upright frame 78 to permit the latter to be movable up and down.
• This vertical movement of the upright frame 78 with the rods 77 guided within the corresponding guide legs 76 is effected by a tape cutting cylinder
• the tape cutting unit 23 comprises an adhesive tape supply reel 80 mounted on the upright frame 78 for rotation about an axis perpendicular to the upright frame 78, and an adhesive tape take-up reel 81 mounted on the upright frame 78 for rotation about an axis parallel to the axis of rotation of the adhesive tape supply reel 80.
• a length of adhesive tape 79 having adhesive-coated and non- coated surfaces opposite to each other extends from the adhesive tape supply reel 80 to the adhesive tape take-up reel 81 by way of guide rollers 82, 83 and 84 all rotatably mounted on the upright frame 78, said guide rollers 83 and 84 being disposed on the upright frame so that a portion of the length of adhesive tape 79 extending between those guide rollers 83 and 84 may extend substantially horizon ⁇ tally below the tape suction block 31 and across a cutting station. It is to be noted that the length of adhesive tape 79 has its adhesive-coated surface oriented upwardly towards the tape suction block 31 as it travels across the cutting station by the reason which will be described later.
• the adhesive tape take-up reel 81 is drivingly coupled with a tape take-up motor 86 by means of a substantially endless belt 87 so that the length of adhesive tape 79 can travel from the supply reel 80 towards the take-up reel 81 by way of the guide rollers 82, 83 and 84 across the cutting station.
• a back-up guide plate 85 secured to an upper portion of the upright frame 78 for the support from below of that portion of the length of adhesive tape 79 with the adhesive-coated surface thereof oriented upwardly, i.e., in a direction counter to the back-up guide plate 85.
• a slider 89 having a bracket 90 secured thereto is slidably engaged on a vertical guide 88 which is secured to the upright frame 78 at a location below the back-up guide plate 85 so as to extend perpendicular thereto.
• the bracket 90 carries a cutter fixture 91 mounted atop the bracket 90 and is normally urged upwardly by a spring 92 interposed between the bracket 90 and the upright frame 78.
• a pair of cutter blades 93 and 94 each having a width substantially equal to or slightly greater than the width of the length of anisotropically electroconductive tape 2 are fixedly mounted on the cutter fixture 91 so as to extend upwardly one on each side of that portion of the length of adhesive tape 79 extending between the guide rollers 83 and 84.
• Each of the cutter blades 93 and 94 is of a type having a free end remote from the cutter fixture 91 which is sharpened over the entire width thereof conforming to the widthwise direction of the length of anisotropically electroconductive tape 2.
• the tape cutting unit 23 of the above described structure operates in the following manner which will now be described with reference to Figs. 12 to 17.
• the suction passage 31a in the tape suction block 31 is evacuated by a suction device 104 (Fig. 18) so that a portion of the length of anisotropically electroconductive tape 2 together with a corresponding portion of the leader tape 1 which extends immediately below the tape suction block 31 can be sucked onto the perforated undersurface of such tape suction block 31 to keep such portion of the anisotropically electroconductive tape 2 horizontally as shown in Fig. 12.
• the tape cutting cylinder 75 is driven to elevate the upright frame 78, causing the spaced cutter blades 83 and 84 to plunge into that portion of the anisotropically electroconductive tape 2, but not into that portion of the leader tape 1. While the cutter blades 83 and 84 having plunged into that portion of the anisotropically electroconductive tape 2 in the manner described above, the upright frame 79 is further elevated.
• the tape cutting cylinder 75 is driven to lower the upright frame 78 accompanied by a corresponding downward shift of that portion of the adhesive tape 79 backed up by the back-up guide plate 85, the piece of anisotropi ⁇ cally electroconductive tape 2 having been cut by the cutting blades 93 and 94 and sticking to the adhesive-coated surface of the adhesive tape 79 is removed from the leader tape 1 as shown in Fig. 15, leaving in the length of anisotropically electroconductive tape 2 a space of separation 95 corresponding in length to the spacing between the cutter blades 93 and 94. Further lowering of the upright frame 78 results in a corresponding downward shift of the cutter blades 93 and 94 away from the suction block 31 as shown in Fig. 6 in readiness for feed of the length of anisotropically electroconductive tape 2 together with the corresponding length of leader tape 1 in the transport direction M, thereby completing one cycle of tape cutting.
• the tape end detecting sensor 26 detects passage of the separation space 95 to measure the position of leading and trailing ends of the separation space 95 with respect to the transport direction M.
• Fig. 18 illustrates a block diagram of a control system employed in the tape bonding apparatus of the present invention.
• reference numeral 96 represents a heater built in the pressure applying tool 35 for heating the latter;
• reference numeral 97 represents a heater drive circuit for energizing the heater 96;
• reference numeral 98 represents a cylinder drive unit for driving various cylinders such as the lock cylinder 52 and so on;
• reference numeral 99 represents an axle control unit for driving various motors such as the chuck drive motor 40 and so on;
• reference numeral 100 represents a main control unit such as, for example, a central processing unit (CPU);
• reference numeral 101 represents a storage unit comprised of various memories for the storage of data to be referred to by the main control unit 100, particularly those including the desired cutting length L1 , dis ⁇ tances D1 , D2 and D3 as will be discussed later, and the spacing C between the cutter blades 93 and 94;
• reference numeral 102 represents a height calculating unit
• reference numeral 106 represents a handler control unit for controlling the operation of the handlers 16 and 17.
• the tape bonding apparatus has all fixed in position s cutting position P3 at which the cutter blade 94 is positioned; a sensing position PO spaced a distance D3 from the cutting position P3 in a downstream direction with respect to the transport direction M and where the tape end detecting sensor 26 detects passage of an end of the length of anisotropically electroconductive tape; a tape end position P1 spaced a distance D1 from the sensing position PO from the sens ⁇ ing position PO in a downstream direction with respect to the transport direction M and where an upstream end of the anisotropically electroconductive segment 107 with respect to the transport direction M should assume when such anisotropically electroconductive segment 107 is to be pressed by the pressure applying tool 35 onto the substrate 4; and a chuck retracted position P2 spaced a distance D2 from the sensing position PO in a downstream direction with respect to the transport direction M and defined at a location downstream of the pressure applying tool 35 with respect to the
• the nipping rollers 53 and 53 of the chuck 38 are brought to a position below the pressure applying tool 35 and are reciprocatingly moved, while the chuck 38 are repeatedly brought into the release position as shown in Fig. 5 and the clamp position as shown in Fig. 6 one at a time, to thereby pull the length of leader tape 1 in the transport direction until the tape end detecting sensor 26 detects passage of the leading end of the length of anisotro ⁇ pically electroconductive tape 4.
• the leader tape take-up unit 24 performs a feeding operation in synchronism with a tape drawing operation performed by the chuck 38 in the manner described above.
• the tape cutting operation which has been described in detail with reference to Figs. 12 to 16 is carried out.
• the separation space 95 is formed in the length of anisotropically electroconductive tape 2 to provide the anisotropically electroconductive tape segment 107 on a downstream side of the cutting blade 94 with respect to the transport direction M.
• the trailing end of the anisotropically electroconductive tape segment 107 that has been separated from the remaining length of anisotropically electroconductive tape 2 and the leading end of the remaining length of anisotropically electroconductive tape 2 will not be deformed irregularly.
• the leader tape 1 is again fed by the chuck 38 including the nipping rollers 53 and 54 and the leader tape take-up unit 24 in a manner similar to that described hereinabove until the tape end detecting sensor 26 detects passage of the separation space 95, specifically arrival of the leading end of the remaining length of anisotropically electroconductive tape 2 separated from the anisotropically electroconductive tape segment 107 at the sensing position.
• the tape end detecting sensor 26 detects passage of the separation space 95, specifically arrival of the leading end of the remaining length of anisotropically electroconductive tape 2 separated from the anisotropically electroconductive tape segment 107 at the sensing position.
• the length of leader tape 1 carrying the length of anisotropically electroconductive tape 2 including the anisotropically electroconductive tape segment 107 is further moved downstream by movement of the chuck 38 in the transport direction until the trailing end of the anisotropically electroconductive tape segment 107, spaced by the separation space 95 from the remaining length of anisotropically electroconductive tape 2, is brought into alignment with the tape end position P1 as shown in Fig. 27. After this alignment, and as shown in Fig.
• the cylinders 28 are driven to lower the horizontal support plate 27 together with those component parts (the tape supply unit 21 , the tape end detecting sensor
• the pressure applying cylinder 36 is driven to lower the pressure applying tool 35 to apply a pressure through the leader tape 1 to the anisotropically electro ⁇ conductive tape segment 107 to cause the latter to be bonded to the substrate 4.
• the pressure applying tool 35 is driven to lower the pressure applying tool 35 to apply a pressure through the leader tape 1 to the anisotropically electro ⁇ conductive tape segment 107 to cause the latter to be bonded to the substrate 4.
• the pressure applying tool 35 is elevated by driving the pressure applying cylinder 36 and the chuck 38 is rotated counterclockwise about the longitudinal axis of the nipping roller 53 by driving the chuck rotating cylinder 50, thereby bringing the chuck 38 in a condition ready to peel the leader tape 1 away from the anisotropically electroconductive tape segment 107 as shown in
• Figs. 7 and 30 While the chuck 38 is retained in that ready-to-peel condition, the chuck 38 is moved upstream with respect to the transport direction as shown in Fig. 31 , thereby peeling the length of leader tape 1 completely away from the anisotropically electroconductive tape segment 107. At this time, rotation of the feed rollers 58 end 59 of the leader tape take-up unit 24 are inhibited to thereby avoid any possible withdrawal of that portion of the length of leader tape 25 which has been recovered into the leader tape recovery box 25. Upon complete removal of that portion of the leader tape 1 from the anisotropically electroconductive tape segment 107, and as shown in Fig.
• the cylinders 28 are driven to elevate the horizontal support plate 27 together with the component parts enclosed by the single-dotted chain line and the chuck 38 is returned to the initial position with the nipping rollers 58 and 59 positioned one above the other.
• the chuck 38 is brought into the release position and is subsequently moved to the predetermined position E2, spaced a distance DE2 from the sensing position PO downstream of the transport direction, to chuck the length of leader tape 1 for the next succeeding cycle.
• the distance DE2 is equal to D2 + D3 - L1 - x.
• the tape bonding apparatus of the present invention comprises a tape supply unit for supplying in one transport direction a length of leader tape having one surface to which a length of anisotropically electroconductive tape is bonded; a tape transport unit for transporting the length of leader tape, supplied from the leader tape supply unit, in the transport direction; a tape cutting unit for cutting only the length of anisotropically electroconductive tape to provide an anisotropically electroconduc ⁇ tive tape segment of a predetermined length with respect to the transport direction; a substrate positioning unit for positioning a substrate to which the anisotropically electroconductive tape segment is bonded; and a tape pressing unit for pressing the anisotropically electroconductive tape segment to bond the latter to the substrate.
• the tape cutting unit employed in the tape bonding apparatus in accordance with the present invention comprises an incision forming member forming two incisions in the length of anisotropically electroconductive tape which are spaced a predetermined distance from each other in a direction lengthwise of the anisotropically electroconductive tape, and a removal means for removing a piece of anisotropically electroconductive tape, bound between the spaced incisions, from the length of leader tape.
• This cutting unit is so designed as to provide a space of separation in the length of anisotropically electroconductive tape that divides it into the anisotropically electroconductive tape segment and the remaining length of anisotropically electroconductive tape.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Electric Connection Of Electric Components To Printed Circuits (AREA)
• Die Bonding (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
• Lining Or Joining Of Plastics Or The Like (AREA)
• Manufacturing Of Electrical Connectors (AREA)
• Adhesive Tape Dispensing Devices (AREA)
• Wire Bonding (AREA)
• Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)

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• 1994
  • 1994-10-06 JP JP24279094A patent/JP3206331B2/ja not_active Expired - Fee Related
• 1995
  • 1995-10-04 WO PCT/JP1995/002019 patent/WO1996011494A1/en active IP Right Grant
  • 1995-10-04 KR KR1019970702271A patent/KR100293893B1/ko not_active IP Right Cessation
  • 1995-10-05 TW TW084110485A patent/TW280983B/zh active

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