Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F27/00—Details of transformers or inductances, in general
  • H01F27/28—Coils; Windings; Conductive connections
  • H01F27/29—Terminals; Tapping arrangements for signal inductances
  • H01F27/292—Surface mounted devices
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
  • H01F21/00—Variable inductances or transformers of the signal type
  • H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped

Definitions

• the present invention relates to a terminal for fixing a coil terminal to a coil component such as a transformer or an inductor, the terminal of which is soldered to a printed circuit board. Regarding the fixing structure to the resin base.
• the coil parts such as transformers and inductors
• those that are to be soldered to the printed circuit board are bobbin or core wound coils.
• the coil is soldered to the terminal fixed to the bobbin or base with a winding machine, and the terminal is soldered to the conductor on the printed circuit board. Fix it.
• this terminal was fixed to the bobbin flange or base by integral molding, etc., and the vicinity of the coiled end of the terminal was bent and the bent part was bent.
• the tip was soldered to the conductor on the printed circuit board, (1) the terminal was fixed to the terminal of the coil terminal and the printed circuit board was soldered.
• the coil terminal structure shown in the perspective view of Fig. 9 and the front view of Fig. 10 (A) has been developed and proposed (Japanese Utility Model Application Laid-Open No. 3-1511).
• the coil terminal structure has a rectangular resin base 1 (8 is a drum core fixed on the base 1 with an adhesive, and 3 is a drum core 8).
• the wound coil 12 is a ring core fixed to the drum core 8 with an adhesive 13), and has an L-shaped bent shape as a whole.
• the terminal 10 is fixed by integral molding with the lead frame that is the material, and one end of each terminal 10 is protruded from one side of the base 1, and the protruding portion 1 0 a, and lift the coil end 3 a by soldering, and make the other end protrude from the adjacent side perpendicular to the side surface of the base 1, and form a Z-shaped soldering part 1. 0b is formed, and the soldered portion 10b is connected to the conductor 15 on the printed circuit board 6 with a solder 5 (the solder 5 is fused with the solder 4 of the kinked portion 10a). Is by Ri is fixed to the low), Rere Ru and surface mount.
• the force is the same as that of the kinking portion 10a and the soldering portion 10b described above.
• the protrusion width of the terminal 10 is smaller than that of (1), (1) the soldered portion 10b of the terminal 10 is bent into a Z-shape, and this bending work is performed. Therefore, a bent space L1 must be secured as shown in FIG. 10 (A), and the end face 1a of the base 1 and the terminals of the ⁇ 1 are used to save space.
• the protrusion width of 10 is limited, this song Due to the presence of the soldering space LI, the length L 2 of the flat surface for soldering becomes small, which is a problem in terms of the reliability of soldering.
• the protrusion width (L 1 + L 2) of the terminal 10 from the end face la 3 ⁇ of the base 1 becomes large, and the space saving ridge is reduced. It will be difficult for them to proceed.
• the bending space L1 In order to reduce the protrusion width (L1 + L2) of the terminal, the bending space L1 must be reduced, and this bending space must be reduced. If L 1 is reduced, bending becomes difficult, and the dimensional variation increases.
• the present invention has been made in view of the above-described problems, and has been made in consideration of the characteristics of the coil terminal structure of the prior application which has already been developed, that is, the connecting portion of the coil terminal and the printer.
• the advantage is that the soldering part to the board is not in the same place, so that the soldering of the terminal to the printed board is good.
• the mounting space becomes smaller, it is intended to further extend the advantages of the rail and to provide a coil terminal structure that allows easy processing of the soldering part. Target.
• the planar shape of the terminal cut out from the lead frame is a curved shape.
• One end of the lever is a portion to be soldered to the printed circuit board, and the other end is a binding portion of the coil terminal.
• the soldered portion is bent in the vertical direction, and the soldered portion is bent vertically.
• the height of the attachment portion and the height of the deflecting portion are made different from each other.
• the terminal is formed integrally with the base so that the bent portion in the direction is buried in the resin base, whereby the flap is attached to the printed circuit board of the base.
• the semiconductor device is characterized in that the soldering portion is formed almost on the same surface as the mounting surface, while being floated from the surface.
• the present invention has the above-described structure, the space between the coiled portion of the terminal and the soldered portion is buried in the base, similarly to the previously developed one. With this structure, the thermal influence between the coil terminal of the terminal and the soldered portion to the printed circuit board is reduced.
• the upper and lower bent portions of the terminal are provided in the base, and the protruding soldering portion is formed so that the soldering surface is formed almost flush with the base mounting surface.
• the entire surface of the soldering portion protruding from the base is used as a half-mounting surface, and the soldering area is increased.
• FIG. 1 is a perspective view of a coil component showing one embodiment of a coil terminal structure of the present invention.
• FIG. 2 is a plan view of the base of the coil component of the embodiment, and (B) is a side view of the same.
• FIG. 3 is a bottom view of the base of the embodiment.
• FIG. 4 is a plan view of the lead frame of the embodiment, and (B) is a side view of the same.
• FIG. 5 is a plan view showing a lead frame after press molding of the present embodiment.
• (A) and (B) of FIG. 6 are a sectional view taken along the line E--E and a sectional view taken along the line F--F of FIG. 5, respectively.
• FIG. 7 is a plan view showing a lead frame after base molding of the present embodiment.
• FIG. 8 are a G-G cross-sectional view and an H-H cross-sectional view of FIG. 7, respectively.
• Figure 9 is a perspective view of a coil part showing the conventional coil terminal structure.
• FIG. 10 is a front view illustrating the dimensional relationship of the coil terminal structure of FIG. 9, and (B) is a front view illustrating the dimensional relationship of the embodiment of the present invention.
• FIG. 1 is a perspective view of a coil part showing one embodiment of a coil terminal structure according to the present invention
• FIG. 2 (A) is a plan view of a base of the coil part
• FIG. 3 is a bottom view of the base.
• the same reference numerals as those in FIGS. 9 and 10 (A) denote components provided for the purpose of performing the same function. Since the terminal 10 according to the present invention has a substantially L-shaped planar shape, one end of the terminal 10 is connected to a solder base 10 b to the printed circuit board 6 by a solder.
• the other end is a force-releasing portion 10a of the coil terminal 3a, and the vicinity of the soldering portion 10b is vertically bent (10c) so that an inclined surface is formed. Then, the height of the soldering portion 10b and the height of the force-releasing portion 10a are made different. Then, the terminal 10 is connected to a substantially rectangular resin pan.
• the base 1 is integrally formed so that portions other than both ends are buried in the base 1, and the bulging portion 10 a is protruded from a side surface of one side of the base 1.
• the soldering portion 10b is projected horizontally from the side adjacent to one side of the base 1 and the soldering surface of the soldering portion 10b (the conductor 1 on the printed circuit board 6).
• the mounting surface 1b is attached to the surface of the base 1 facing the printed circuit board 6 so as to support the base of each soldered portion 10b. It is formed as a protruding surface. Then, in the same manner as described above, the terminal 3a of the coil is tied and soldered (4) to the entanglement portion 10a, and the solder attachment portion 10b is printed. The solder is attached to the substrate 6 (5).
• FIG. 8 shows a manufacturing process for realizing the coil structure of the present embodiment.
• the terminal 10 of the present invention has a lead frame 16 formed in a predetermined shape in advance. It is cut out and manufactured.
• the lead frame 16 is joined by a punching process at a bridging portion 16c in which the left and right band portions 16a and 16b are arranged at equal intervals.
• Each book is formed.
• the left and right strips 16a and 16b are It has a hole 17 for positioning and a projection formed around a guide roller (not shown) is applied to each hole 17 to rotate the guide roller.
• the lead frame 16 is moved and forced.
• FIG. 6 Using such a lead frame 16, a plan view of FIG. 5 and a cross-sectional view of each of E-E and F-F are shown in FIG. 6 (A). As shown in (B) and (B), the narrow band portion 16d is raised by the press. The two-dot chain line 18 in FIG. 5 indicates a raised portion, and the bent portion 10c of the terminal 10 is formed by this brace, and the product remains as it is. A curved portion 16 e is formed. 16 f is a notch for opening the coil terminal.
• the base 1 is integrally formed so as to include a part of the raised portion 18 and the curved portion 10c and not to include the cutout 16f.
• the strip 16 d for forming terminals is cut along the line 19 shown in FIG. 7 and separated from the strips 16 a, 16 b and the bridging section 16 c.
• the base 1 to which the drum core 8 is bonded is made independent.
• the force is applied to the connecting part 10 a of the child 10. Subsequently, the terminal 3 a is soldered and fixed with the solder 4.
• the ring core 12 is put on the outside of the drum core 8, and the adhesive 13 is applied to the upper gap between the cores 8 and 12, dried and solidified.
• the upper and lower bent portions 1 Oc of the terminal 10 are buried in the base 1 and are protruded from the soldering portion 1. Since the soldering surface of 0b is formed almost horizontally on the same surface as the mounting surface 1b of the base 1, the entire surface of the soldering portion 10b protruding from the base 1 is flush with the soldering surface. Used as Therefore, in the structure of FIG. 10 (A), the projection width L3 is smaller in the case of the present invention than in the case where the bending space L1 is required. In addition, the soldering area is increased while the protrusion width L3 is reduced. Therefore, space saving and increase in soldering strength and reliability are achieved. Also, since the bent portion 10c is formed in the state of the lead frame, the molding is easy.
• the terminal 10 has a substantially L-shape, and the space between the buckling portion 10a and the soldering portion 10b is embedded in the base 1.
• the coil terminal 3a is Raise the connecting part 10a different from the soldering part 10b. Therefore, the tension does not increase and the wire does not break. Also, since the force-releasing portion 10a of the coil terminal 3a and the solder-attaching portion 10b to the printed circuit board 6 are separately provided, they are separated.
• solder 10 a When the terminal 10 is fixed to the printed circuit board 6 by the solder 5, heat is not applied to the cover 10 a, and the solder 10 a is attached to the force release 10 a.
• the solderability is good, and the reliability of soldering is improved.
• the connecting portion 10a and the soldering portion 10b of the coil terminal 3a are located at different places, a solder joint is provided at the force-releasing portion 10a. Even if it occurs, the soldered portion 10b is far from the soldered portion 10b because the soldered portion 10b is far away.
• the base 1 is formed in a rectangular shape, but it may be formed in a circular shape, and the planar shape of the terminal 10 is not limited to the L shape, but may be other shapes such as an arc shape. It may be formed into a curved shape.
• the effect of the structure that is, the base with respect to the printed circuit board is provided. Even if it expands and contracts, the tension at the coil end does not increase, preventing the occurrence of disconnection failure. Also, when fixing the terminal to the printed circuit board by the solder, the kinked part Heat is not applied to the heat sink, and the solderability of the lashing part is good, and the effect of improving the reliability of the solder is improved. Even if the solder parts are generated, when the solder is attached to the printed circuit board, the solder parts are not generated at the solder joints, so the coil parts are pre-printed.
• the part formed as a part to be soldered to the printed board is a horizontal protruding piece, and is almost the same as the mounting surface of the base to the printed circuit board.
• the surface to be soldered to the printed circuit board is formed wider, and the soldering strength and reliability of the printed circuit board are improved, and the soldering area is improved. Since no space is required for bending, the width of the projecting part of the soldered part to the printed circuit board from the base can be small, and if space saving is achieved. In both cases, since the soldering portion is formed at the stage of the base frame, molding is easy. Doo ing.
• the present invention can be widely used when an electronic component having a coil, such as a transformer or an inductor, is mounted on a printed circuit board.

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• Engineering & Computer Science (AREA)
• Power Engineering (AREA)
• Coils Or Transformers For Communication (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=11761890

Family Applications (1)

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Families Citing this family (2)

Citations (3)

Family Cites Families (6)

• 1991
  • 1991-02-06 JP JP1991010852U patent/JPH0499808U/ja active Pending
• 1992
  • 1992-01-31 KR KR1019920001502A patent/KR960000913B1/ko not_active Expired - Fee Related
  • 1992-02-05 WO PCT/JP1992/000117 patent/WO1992014254A1/ja active Application Filing
  • 1992-02-05 DE DE924290287T patent/DE4290287T1/de active Pending
  • 1992-02-05 DE DE4290287A patent/DE4290287C2/de not_active Expired - Fee Related
  • 1992-03-13 TW TW081101913A patent/TW198174B/zh active

Patent Citations (3)

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