WO1992014254A1 - Structure of coil terminal - Google Patents

Structure of coil terminal Download PDF

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Publication number
WO1992014254A1
WO1992014254A1 PCT/JP1992/000117 JP9200117W WO9214254A1 WO 1992014254 A1 WO1992014254 A1 WO 1992014254A1 JP 9200117 W JP9200117 W JP 9200117W WO 9214254 A1 WO9214254 A1 WO 9214254A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
terminal
circuit board
printed circuit
coil
Prior art date
Application number
PCT/JP1992/000117
Other languages
French (fr)
Japanese (ja)
Inventor
Norio Sato
Shigenori Kato
Original Assignee
Tdk Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corporation filed Critical Tdk Corporation
Priority to DE924290287T priority Critical patent/DE4290287T1/en
Priority to DE4290287A priority patent/DE4290287C2/en
Publication of WO1992014254A1 publication Critical patent/WO1992014254A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped

Definitions

  • the present invention relates to a terminal for fixing a coil terminal to a coil component such as a transformer or an inductor, the terminal of which is soldered to a printed circuit board. Regarding the fixing structure to the resin base.
  • the coil parts such as transformers and inductors
  • those that are to be soldered to the printed circuit board are bobbin or core wound coils.
  • the coil is soldered to the terminal fixed to the bobbin or base with a winding machine, and the terminal is soldered to the conductor on the printed circuit board. Fix it.
  • this terminal was fixed to the bobbin flange or base by integral molding, etc., and the vicinity of the coiled end of the terminal was bent and the bent part was bent.
  • the tip was soldered to the conductor on the printed circuit board, (1) the terminal was fixed to the terminal of the coil terminal and the printed circuit board was soldered.
  • the coil terminal structure shown in the perspective view of Fig. 9 and the front view of Fig. 10 (A) has been developed and proposed (Japanese Utility Model Application Laid-Open No. 3-1511).
  • the coil terminal structure has a rectangular resin base 1 (8 is a drum core fixed on the base 1 with an adhesive, and 3 is a drum core 8).
  • the wound coil 12 is a ring core fixed to the drum core 8 with an adhesive 13), and has an L-shaped bent shape as a whole.
  • the terminal 10 is fixed by integral molding with the lead frame that is the material, and one end of each terminal 10 is protruded from one side of the base 1, and the protruding portion 1 0 a, and lift the coil end 3 a by soldering, and make the other end protrude from the adjacent side perpendicular to the side surface of the base 1, and form a Z-shaped soldering part 1. 0b is formed, and the soldered portion 10b is connected to the conductor 15 on the printed circuit board 6 with a solder 5 (the solder 5 is fused with the solder 4 of the kinked portion 10a). Is by Ri is fixed to the low), Rere Ru and surface mount.
  • the force is the same as that of the kinking portion 10a and the soldering portion 10b described above.
  • the protrusion width of the terminal 10 is smaller than that of (1), (1) the soldered portion 10b of the terminal 10 is bent into a Z-shape, and this bending work is performed. Therefore, a bent space L1 must be secured as shown in FIG. 10 (A), and the end face 1a of the base 1 and the terminals of the ⁇ 1 are used to save space.
  • the protrusion width of 10 is limited, this song Due to the presence of the soldering space LI, the length L 2 of the flat surface for soldering becomes small, which is a problem in terms of the reliability of soldering.
  • the protrusion width (L 1 + L 2) of the terminal 10 from the end face la 3 ⁇ of the base 1 becomes large, and the space saving ridge is reduced. It will be difficult for them to proceed.
  • the bending space L1 In order to reduce the protrusion width (L1 + L2) of the terminal, the bending space L1 must be reduced, and this bending space must be reduced. If L 1 is reduced, bending becomes difficult, and the dimensional variation increases.
  • the present invention has been made in view of the above-described problems, and has been made in consideration of the characteristics of the coil terminal structure of the prior application which has already been developed, that is, the connecting portion of the coil terminal and the printer.
  • the advantage is that the soldering part to the board is not in the same place, so that the soldering of the terminal to the printed board is good.
  • the mounting space becomes smaller, it is intended to further extend the advantages of the rail and to provide a coil terminal structure that allows easy processing of the soldering part. Target.
  • the planar shape of the terminal cut out from the lead frame is a curved shape.
  • One end of the lever is a portion to be soldered to the printed circuit board, and the other end is a binding portion of the coil terminal.
  • the soldered portion is bent in the vertical direction, and the soldered portion is bent vertically.
  • the height of the attachment portion and the height of the deflecting portion are made different from each other.
  • the terminal is formed integrally with the base so that the bent portion in the direction is buried in the resin base, whereby the flap is attached to the printed circuit board of the base.
  • the semiconductor device is characterized in that the soldering portion is formed almost on the same surface as the mounting surface, while being floated from the surface.
  • the present invention has the above-described structure, the space between the coiled portion of the terminal and the soldered portion is buried in the base, similarly to the previously developed one. With this structure, the thermal influence between the coil terminal of the terminal and the soldered portion to the printed circuit board is reduced.
  • the upper and lower bent portions of the terminal are provided in the base, and the protruding soldering portion is formed so that the soldering surface is formed almost flush with the base mounting surface.
  • the entire surface of the soldering portion protruding from the base is used as a half-mounting surface, and the soldering area is increased.
  • FIG. 1 is a perspective view of a coil component showing one embodiment of a coil terminal structure of the present invention.
  • FIG. 2 is a plan view of the base of the coil component of the embodiment, and (B) is a side view of the same.
  • FIG. 3 is a bottom view of the base of the embodiment.
  • FIG. 4 is a plan view of the lead frame of the embodiment, and (B) is a side view of the same.
  • FIG. 5 is a plan view showing a lead frame after press molding of the present embodiment.
  • (A) and (B) of FIG. 6 are a sectional view taken along the line E--E and a sectional view taken along the line F--F of FIG. 5, respectively.
  • FIG. 7 is a plan view showing a lead frame after base molding of the present embodiment.
  • FIG. 8 are a G-G cross-sectional view and an H-H cross-sectional view of FIG. 7, respectively.
  • Figure 9 is a perspective view of a coil part showing the conventional coil terminal structure.
  • FIG. 10 is a front view illustrating the dimensional relationship of the coil terminal structure of FIG. 9, and (B) is a front view illustrating the dimensional relationship of the embodiment of the present invention.
  • FIG. 1 is a perspective view of a coil part showing one embodiment of a coil terminal structure according to the present invention
  • FIG. 2 (A) is a plan view of a base of the coil part
  • FIG. 3 is a bottom view of the base.
  • the same reference numerals as those in FIGS. 9 and 10 (A) denote components provided for the purpose of performing the same function. Since the terminal 10 according to the present invention has a substantially L-shaped planar shape, one end of the terminal 10 is connected to a solder base 10 b to the printed circuit board 6 by a solder.
  • the other end is a force-releasing portion 10a of the coil terminal 3a, and the vicinity of the soldering portion 10b is vertically bent (10c) so that an inclined surface is formed. Then, the height of the soldering portion 10b and the height of the force-releasing portion 10a are made different. Then, the terminal 10 is connected to a substantially rectangular resin pan.
  • the base 1 is integrally formed so that portions other than both ends are buried in the base 1, and the bulging portion 10 a is protruded from a side surface of one side of the base 1.
  • the soldering portion 10b is projected horizontally from the side adjacent to one side of the base 1 and the soldering surface of the soldering portion 10b (the conductor 1 on the printed circuit board 6).
  • the mounting surface 1b is attached to the surface of the base 1 facing the printed circuit board 6 so as to support the base of each soldered portion 10b. It is formed as a protruding surface. Then, in the same manner as described above, the terminal 3a of the coil is tied and soldered (4) to the entanglement portion 10a, and the solder attachment portion 10b is printed. The solder is attached to the substrate 6 (5).
  • FIG. 8 shows a manufacturing process for realizing the coil structure of the present embodiment.
  • the terminal 10 of the present invention has a lead frame 16 formed in a predetermined shape in advance. It is cut out and manufactured.
  • the lead frame 16 is joined by a punching process at a bridging portion 16c in which the left and right band portions 16a and 16b are arranged at equal intervals.
  • Each book is formed.
  • the left and right strips 16a and 16b are It has a hole 17 for positioning and a projection formed around a guide roller (not shown) is applied to each hole 17 to rotate the guide roller.
  • the lead frame 16 is moved and forced.
  • FIG. 6 Using such a lead frame 16, a plan view of FIG. 5 and a cross-sectional view of each of E-E and F-F are shown in FIG. 6 (A). As shown in (B) and (B), the narrow band portion 16d is raised by the press. The two-dot chain line 18 in FIG. 5 indicates a raised portion, and the bent portion 10c of the terminal 10 is formed by this brace, and the product remains as it is. A curved portion 16 e is formed. 16 f is a notch for opening the coil terminal.
  • the base 1 is integrally formed so as to include a part of the raised portion 18 and the curved portion 10c and not to include the cutout 16f.
  • the strip 16 d for forming terminals is cut along the line 19 shown in FIG. 7 and separated from the strips 16 a, 16 b and the bridging section 16 c.
  • the base 1 to which the drum core 8 is bonded is made independent.
  • the force is applied to the connecting part 10 a of the child 10. Subsequently, the terminal 3 a is soldered and fixed with the solder 4.
  • the ring core 12 is put on the outside of the drum core 8, and the adhesive 13 is applied to the upper gap between the cores 8 and 12, dried and solidified.
  • the upper and lower bent portions 1 Oc of the terminal 10 are buried in the base 1 and are protruded from the soldering portion 1. Since the soldering surface of 0b is formed almost horizontally on the same surface as the mounting surface 1b of the base 1, the entire surface of the soldering portion 10b protruding from the base 1 is flush with the soldering surface. Used as Therefore, in the structure of FIG. 10 (A), the projection width L3 is smaller in the case of the present invention than in the case where the bending space L1 is required. In addition, the soldering area is increased while the protrusion width L3 is reduced. Therefore, space saving and increase in soldering strength and reliability are achieved. Also, since the bent portion 10c is formed in the state of the lead frame, the molding is easy.
  • the terminal 10 has a substantially L-shape, and the space between the buckling portion 10a and the soldering portion 10b is embedded in the base 1.
  • the coil terminal 3a is Raise the connecting part 10a different from the soldering part 10b. Therefore, the tension does not increase and the wire does not break. Also, since the force-releasing portion 10a of the coil terminal 3a and the solder-attaching portion 10b to the printed circuit board 6 are separately provided, they are separated.
  • solder 10 a When the terminal 10 is fixed to the printed circuit board 6 by the solder 5, heat is not applied to the cover 10 a, and the solder 10 a is attached to the force release 10 a.
  • the solderability is good, and the reliability of soldering is improved.
  • the connecting portion 10a and the soldering portion 10b of the coil terminal 3a are located at different places, a solder joint is provided at the force-releasing portion 10a. Even if it occurs, the soldered portion 10b is far from the soldered portion 10b because the soldered portion 10b is far away.
  • the base 1 is formed in a rectangular shape, but it may be formed in a circular shape, and the planar shape of the terminal 10 is not limited to the L shape, but may be other shapes such as an arc shape. It may be formed into a curved shape.
  • the effect of the structure that is, the base with respect to the printed circuit board is provided. Even if it expands and contracts, the tension at the coil end does not increase, preventing the occurrence of disconnection failure. Also, when fixing the terminal to the printed circuit board by the solder, the kinked part Heat is not applied to the heat sink, and the solderability of the lashing part is good, and the effect of improving the reliability of the solder is improved. Even if the solder parts are generated, when the solder is attached to the printed circuit board, the solder parts are not generated at the solder joints, so the coil parts are pre-printed.
  • the part formed as a part to be soldered to the printed board is a horizontal protruding piece, and is almost the same as the mounting surface of the base to the printed circuit board.
  • the surface to be soldered to the printed circuit board is formed wider, and the soldering strength and reliability of the printed circuit board are improved, and the soldering area is improved. Since no space is required for bending, the width of the projecting part of the soldered part to the printed circuit board from the base can be small, and if space saving is achieved. In both cases, since the soldering portion is formed at the stage of the base frame, molding is easy. Doo ing.
  • the present invention can be widely used when an electronic component having a coil, such as a transformer or an inductor, is mounted on a printed circuit board.

Abstract

Terminals (10) which are cut off a lead frame have L-shapes. One end (10b) of each terminal is soldered to a printed circuit board, and the other end (10a) is a part around which one end of a coil is twined. The terminals (10) are bent in the thickness direction of a base (1) so that the heights, with respect to the base (1), of the soldered ends (10b) and twining ends (10a) may be different from each other. The terminals (10) and the base (1) made of resin are formed into one piece, with the bent portions of the terminals (10) buried in the base (1). Thereby, the twining parts are floating from the mounting face of the base (1) (with this mounting face down, the coil and base (1) are mounted on a printed circuit board). On the other hand, the soldered ends (10b) are nearly on the same level as that of the mounting face.

Description

明 細 書  Specification
コ イ ル端子構造  Coil terminal structure
産業上の利用 分野  Industrial applications
本発明 は 、 プ リ ン ト 基板 に端子が半田 付 け さ れ る 卜 ラ ン ス 、 イ ン ダ ク タ 等の コ イ ル部品 に ぉ レ、 て 、 コ イ ル 端末 を 固定す る 端子の樹脂製ベース に対す る 固定構造 に 関 す る 。  The present invention relates to a terminal for fixing a coil terminal to a coil component such as a transformer or an inductor, the terminal of which is soldered to a printed circuit board. Regarding the fixing structure to the resin base.
従来の技術  Conventional technology
ト ラ ン ス や イ ン ダ ク タ 等の コ イ ル部品の う ち 、 プ リ ン ト 基板 に 半 田 付 け す る も の は 、 ボ ビ ン あ る い は コ ア に 巻 い た コ イ ル を 、 ボ ビ ン あ る い は ベー ス に 固定 し た 端子 に 巻線機 に よ り か ら げて半田付 け し 、 該端子 を プ リ ン ト 基板上の 導体に半田付け し て 固定 す る 。 従来 は こ の 端子 を 、 ボ ビ ン の鍔や ベース に 一体成形等 に よ り 固 定 し 、 端子 の コ イ ル端末 か ら げ部 の 近傍 を 折 り 曲 げ、 そ の折 り 曲 げた部分 よ り 先端部分 を プ リ ン ト 基板 上の導体 に 半田 付 け し て い た が、 （ 1 ) 端子に コ イ ル 端末の か ら げ部 と プ リ ン 卜 基板の半田 に よ る 固 定部が 同 方向 に 形成 さ れて い る た め 、 端子の ベー ス 等か ら の 突 出部形状が複雑 と な り 、 コ イ ル部品の プ リ ン 卜 基板 へ の搭載ス ペー ス が大 き く な り 、 （ 2 ) 半田揚げの 際 に 、 端子の周 囲 に半田 ッ ノ が形成 さ れ、 プ リ ン ト 基板 へ搭載す る 際 に 平面度が保 た れな い等の 問題点が あ つ た 。  Of the coil parts such as transformers and inductors, those that are to be soldered to the printed circuit board are bobbin or core wound coils. The coil is soldered to the terminal fixed to the bobbin or base with a winding machine, and the terminal is soldered to the conductor on the printed circuit board. Fix it. Conventionally, this terminal was fixed to the bobbin flange or base by integral molding, etc., and the vicinity of the coiled end of the terminal was bent and the bent part was bent. Although the tip was soldered to the conductor on the printed circuit board, (1) the terminal was fixed to the terminal of the coil terminal and the printed circuit board was soldered. Since the parts are formed in the same direction, the shape of the protruding part from the base of the terminal becomes complicated, and the mounting space of the coil component on the printed circuit board is large. (2) When soldering, solder knobs are formed around the terminals, and the flatness is not maintained when mounted on a printed circuit board. There was.
本発明者等 は こ の よ う な 問題点 を解決す る た め 、 図 9 の斜視図お よ び図 1 0 ( A ) の正面図 に示す コ イ ル 端子構造を 開発 し提案 し て い る （実開平 3-1511号） 。 こ の コ イ ル端子構造は 、 四角形を な す樹脂製ベー ス 1 ( 8 はベース 1 上に接着剤 に よ り 固定 さ れた ド ラ ム コ ァ 、 3 は該 ド ラ ム コ ア 8 に 巻かれた コ イ ル、 1 2 は該 ド ラ ム コ ア 8 に 接着剤 1 3 に よ り 固 定 し た リ ン グ コ ァ ） に 、 全体 と し て L 字形 に 曲 げ た 形状 を な す端子 1 0 を そ の素材で あ る リ ー ド フ レー ム と の一体成形に よ り 固定 し 、 各端子 1 0 の一端を ベース 1 の一側面 よ り 突出 さ せ、 そ の突出部 1 0 a に コ イ ル端末 3 a を 力 > ら げて半田揚げ し 、 他端を ベース 1 の側面に直交す る 隣接辺 よ り 突出 さ せ、 かつ Z字形に 曲成 し た半田付け 部 1 0 b を形成 し 、 該半田付け部 1 0 b をプ リ ン ト 基 板 6 上 の 導体 1 5 に 半 田 5 ( 該半 田 5 は 、 か ら げ部 1 0 a の半田 4 よ り 融点が低い ） に よ り 固定 し 、 表面 実装 し て レヽ る 。 In order to solve such problems, the present inventors The coil terminal structure shown in the perspective view of Fig. 9 and the front view of Fig. 10 (A) has been developed and proposed (Japanese Utility Model Application Laid-Open No. 3-1511). The coil terminal structure has a rectangular resin base 1 (8 is a drum core fixed on the base 1 with an adhesive, and 3 is a drum core 8). The wound coil 12 is a ring core fixed to the drum core 8 with an adhesive 13), and has an L-shaped bent shape as a whole. The terminal 10 is fixed by integral molding with the lead frame that is the material, and one end of each terminal 10 is protruded from one side of the base 1, and the protruding portion 1 0 a, and lift the coil end 3 a by soldering, and make the other end protrude from the adjacent side perpendicular to the side surface of the base 1, and form a Z-shaped soldering part 1. 0b is formed, and the soldered portion 10b is connected to the conductor 15 on the printed circuit board 6 with a solder 5 (the solder 5 is fused with the solder 4 of the kinked portion 10a). Is by Ri is fixed to the low), Rere Ru and surface mount.
発明の 目 的  Purpose of invention
し 7 ^ し 図 9 、 図 1 0 ( A ) に示 し た従来構造に よ る と 、 前述 し た か ら げ部 1 0 a と 半田付け部 1 0 b と 力 同 じ 個所に あ る も の に比較 し て端子 1 0 の突出幅は小 さ く な る も の の 、 （ 1 ) 端子 1 0 の半田付け部 1 0 b を Z 字形 に 曲成 し て お り 、 こ の 曲 成作業 の た め 、 図 1 0 ( A ) に示す よ う に 曲 げス ペース L 1 を確保 し な けれ ば な ら ず、 省ス ペース化の た め 、 ベース 1 の端面 1 a ； ^ ら の端子 1 0 の突出幅に制限力 あ る と 、 こ の 曲 げ ス ペー ス L I の存在の た め 、 半田付 け 用 平面部の長 さ L 2 が小 さ く な り 、 半田付 けの信頼性の面で問題 で あ り 、 換言す れば、 半田付 け の信頼性を高め よ う と す る と 、 ベ ー ス 1 の 端面 l a 3 ^ ら の 端子 1 0 の 突 出 幅 ( L 1 + L 2 ) が大 と な り 、 省ス ペースィ匕を さ ら に 進 め る こ と が困難 と な る 。 According to the conventional structure shown in FIG. 9 and FIG. 10 (A), the force is the same as that of the kinking portion 10a and the soldering portion 10b described above. Although the protrusion width of the terminal 10 is smaller than that of (1), (1) the soldered portion 10b of the terminal 10 is bent into a Z-shape, and this bending work is performed. Therefore, a bent space L1 must be secured as shown in FIG. 10 (A), and the end face 1a of the base 1 and the terminals of the ^ 1 are used to save space. If the protrusion width of 10 is limited, this song Due to the presence of the soldering space LI, the length L 2 of the flat surface for soldering becomes small, which is a problem in terms of the reliability of soldering. In order to improve the reliability of the connection, the protrusion width (L 1 + L 2) of the terminal 10 from the end face la 3 ^ of the base 1 becomes large, and the space saving ridge is reduced. It will be difficult for them to proceed.
ま た 、 端子 の 突 出 幅 （ L 1 + L 2 ) を 小 さ く す る た め に は 、 前記曲 げス ペース L 1 を狭 く し な ければな ら ず、 こ の 曲 げス ペース L 1 を狭 く す る と 、 曲 げ加工が困難 で有 り 、 寸法の ば ら つ き が大 き く な る 。  Also, in order to reduce the protrusion width (L1 + L2) of the terminal, the bending space L1 must be reduced, and this bending space must be reduced. If L 1 is reduced, bending becomes difficult, and the dimensional variation increases.
本発明 は 、 こ の よ う な 問題点に鑑み、 す で に 開発 し て い る前記先願の コ イ ル端子構造の特質、 す な わ ち コ ィ ル端末か ら げ部 と プ リ ン ト 基板へ の半田付 け部 と が 同 所 に な い こ と に よ っ て も た ら さ れ る長所に カ卩 え 、 端 子の ブ リ ン ト 基板への半田付 け が良好 に 行 な わ れ、 搭 載ス ペー ス が小 さ く な る と レヽ ぅ 長所を さ ら に の ば し 、 かつ半田 付 け部の加工が容易 な コ イ ル端子構造 を提供 す る こ と を 目 的 と す る 。  The present invention has been made in view of the above-described problems, and has been made in consideration of the characteristics of the coil terminal structure of the prior application which has already been developed, that is, the connecting portion of the coil terminal and the printer. The advantage is that the soldering part to the board is not in the same place, so that the soldering of the terminal to the printed board is good. In other words, as the mounting space becomes smaller, it is intended to further extend the advantages of the rail and to provide a coil terminal structure that allows easy processing of the soldering part. Target.
発明 の 開示  Disclosure of invention
本発明 は 、 ブ リ ン 卜 基板 に端子が半田付 け さ れ る コ ィ ル部品 に お い て 、 リ ー ド フ レーム よ り 切 り 取 ら れ る 端子の平面形状 を 曲成形状 と し て そ の一端を プ リ ン ト 基板へ の半田 付 け部、 他端 を コ イ ル端末の か ら げ部 と し 、 前記半 田付 け部側 を上下方向 に 曲成 し て 、 前記半 田 付 け部 と 前記か ら げ部の高 さ を異 な ら せ 、 前記上下 方向 の 曲成部が樹脂製ベース に埋没す る よ う に前記端 子を該ベース に一体成形す る こ と に よ り 、 前記か ら げ 部を前記ベース の プ リ ン 卜 基板への取付け面 よ り 浮か せ る 一方、 前記半田付け部は前記取付け面 と ほ ぼ同面 に形成 し た こ と を特徴 と す る 。 According to the present invention, in a coil component in which a terminal is soldered to a printed circuit board, the planar shape of the terminal cut out from the lead frame is a curved shape. One end of the lever is a portion to be soldered to the printed circuit board, and the other end is a binding portion of the coil terminal. The soldered portion is bent in the vertical direction, and the soldered portion is bent vertically. The height of the attachment portion and the height of the deflecting portion are made different from each other, The terminal is formed integrally with the base so that the bent portion in the direction is buried in the resin base, whereby the flap is attached to the printed circuit board of the base. The semiconductor device is characterized in that the soldering portion is formed almost on the same surface as the mounting surface, while being floated from the surface.
本発明 は 、 上述の構造を有す る の で、 前記先に 開発 し た も の と 同様に 、 端子の コ イ ル端末か ら げ部 と 半田 付 け部 と の 間がベース に埋没 し た構造 と な り 、 端子の コ イ ル端末か ら げ部 と プ リ ン ト 基板への半田付け部 と の熱的影響が少な く な る 。 ま た 、 端子の上下の 曲成部 は ベース 内 に設 け ら れ、 突出 し て い る 半田付け部は半 田付 け面がベース取付 け面 と ほ ぼ同面に水平に形成 さ れ る か ら 、 ベース か ら突出 し た半田付け部の全面が半 3付け面 と し て使用 さ れ、 半田付け面積が大 き く と れ る 。  Since the present invention has the above-described structure, the space between the coiled portion of the terminal and the soldered portion is buried in the base, similarly to the previously developed one. With this structure, the thermal influence between the coil terminal of the terminal and the soldered portion to the printed circuit board is reduced. In addition, the upper and lower bent portions of the terminal are provided in the base, and the protruding soldering portion is formed so that the soldering surface is formed almost flush with the base mounting surface. In addition, the entire surface of the soldering portion protruding from the base is used as a half-mounting surface, and the soldering area is increased.
図面の簡単な説明  BRIEF DESCRIPTION OF THE FIGURES
図 1 は本発明 の コ イ ル端子構造の一実施例を示す コ ィ ル部品の斜視図で あ る 。  FIG. 1 is a perspective view of a coil component showing one embodiment of a coil terminal structure of the present invention.
図 2 の （ A ) は該実施例の コ イ ル部品の ベース の平 面図 、 （ B ) は そ の側面図で あ る 。  (A) of FIG. 2 is a plan view of the base of the coil component of the embodiment, and (B) is a side view of the same.
図 3 は該実施例の ベース の底面図 で あ る 。  FIG. 3 is a bottom view of the base of the embodiment.
図 4 の （ A ) は 該実施例 の リ ー ド フ レ ー ム の 平面 図 、 （ B ) は そ の側面図で あ る 。  (A) of FIG. 4 is a plan view of the lead frame of the embodiment, and (B) is a side view of the same.
図 5 は本実施例の プ レ ス成形後の リ 一 ド フ レーム を 示す平面図 で あ る 。 図 6 の （ A ) 、 （ B ) は そ れぞれ図 5 の E — E 断面 図 、 F — F 断面図で あ る 。 FIG. 5 is a plan view showing a lead frame after press molding of the present embodiment. (A) and (B) of FIG. 6 are a sectional view taken along the line E--E and a sectional view taken along the line F--F of FIG. 5, respectively.
図 7 は 本実施例の ベース成形後の リ 一 ド フ レー ム を 示 す平面図 で あ る 。  FIG. 7 is a plan view showing a lead frame after base molding of the present embodiment.
図 8 の （ A ) 、 （ B ) は そ れぞれ図 7 の G — G 断面 図 、 H — H 断面図 で あ る 。  (A) and (B) of FIG. 8 are a G-G cross-sectional view and an H-H cross-sectional view of FIG. 7, respectively.
図 9 は 従来の コ イ ル端子構造 を示す コ イ ル部品の斜 視図 で あ る 。  Figure 9 is a perspective view of a coil part showing the conventional coil terminal structure.
図 1 0 の （ A ) は 図 9 の コ イ ル端子構造の寸法関係 を 説明 す る 正面図 、 （ B ) は本発明 の実施例の寸法関 係 を 説明 す る 正面図 で あ る 。  (A) of FIG. 10 is a front view illustrating the dimensional relationship of the coil terminal structure of FIG. 9, and (B) is a front view illustrating the dimensional relationship of the embodiment of the present invention.
実施例  Example
図 1 は 本発明 に よ る コ イ ル端子構造の一実施例 を示す コ イ ル部品の斜視図、 図 2 ( A ) は該 コ イ ル部品の ベ — ス の平面図 、 同 （ B ) は そ の側面図 、 図 3 は該ベー ス の 底面図 で あ る 。 図 1 な い し 図 3 に お い て 、 図 9 、 図 1 0 ( A ) と 同一符号は 同 じ 機能 を発揮す る こ と を 目 的 と し て 設 け ら れた構成部品 を示す 。 本発明 に よ る 端子 1 0 は 、 平面形状 が ほ ぼ L 字形 を な す も の で 、 端 子 1 0 の 一 端 を ブ リ ン ト 基 板 6 へ の 半 田 付 け 部 1 0 b 、 他 端 を コ イ ル端末 3 a の 力 ら げ 部 1 0 a と し 、 前記半田 付 け部 1 0 b の近傍 を 傾斜面が形成 さ れ る よ う に 上下方向 に 曲成 （ 1 0 c ) し て 、 前記半 田付 け 部 1 0 b と 前 記 力ゝ ら げ部 1 0 a の 高 さ を 異 な ら せ る 。 そ し て 、 該端子 1 0 を ほ ぼ四 角 形 を な す樹脂製べ ース 1 に 、 両端部以外の部分がベース 1 に埋没す る よ う に一体成形 し て前記か ら げ部 1 0 a を前記ベース 1 の一辺の側面 よ り 突出 さ せ る と 共に 、 該ベース 1 の一 辺 に隣接す る 辺 よ り 前記半田付け部 1 0 b を水平に突 出 さ せ、 かつ該半田付け部 1 0 b の半田付け面 （ プ リ ン ト 基板 6 上の導体 1 5 に対面す る面） を ベース 1 の プ リ ン 卜 基板 6 への取付け面 1 b と ほ ぼ同面に形成す る 。 な お 、 本実施例に お い て は 、 該取付け面 1 b は 、 各半田付 け部 1 0 b の基部を支持す る よ う に 、 ベース 1 の プ リ ン ト 基板 6 側対向面に突出 し た面 と し て形成 さ れて い る 。 そ し て、 前記同様に 、 前記か ら げ部 1 0 a に コ イ ルの端末 3 a をか ら げて半田付け （ 4 ) し 、 前記半 田 付 け 部 1 0 b を プ リ ン 卜 基板 6 に 半 田 付 け ( 5 ) す る 。 FIG. 1 is a perspective view of a coil part showing one embodiment of a coil terminal structure according to the present invention, FIG. 2 (A) is a plan view of a base of the coil part, and FIG. Is a side view of the base, and FIG. 3 is a bottom view of the base. In FIGS. 1 to 3, the same reference numerals as those in FIGS. 9 and 10 (A) denote components provided for the purpose of performing the same function. Since the terminal 10 according to the present invention has a substantially L-shaped planar shape, one end of the terminal 10 is connected to a solder base 10 b to the printed circuit board 6 by a solder. The other end is a force-releasing portion 10a of the coil terminal 3a, and the vicinity of the soldering portion 10b is vertically bent (10c) so that an inclined surface is formed. Then, the height of the soldering portion 10b and the height of the force-releasing portion 10a are made different. Then, the terminal 10 is connected to a substantially rectangular resin pan. The base 1 is integrally formed so that portions other than both ends are buried in the base 1, and the bulging portion 10 a is protruded from a side surface of one side of the base 1. The soldering portion 10b is projected horizontally from the side adjacent to one side of the base 1 and the soldering surface of the soldering portion 10b (the conductor 1 on the printed circuit board 6). 5) is formed almost flush with the mounting surface 1b of the base 1 on the printed circuit board 6. In this embodiment, the mounting surface 1b is attached to the surface of the base 1 facing the printed circuit board 6 so as to support the base of each soldered portion 10b. It is formed as a protruding surface. Then, in the same manner as described above, the terminal 3a of the coil is tied and soldered (4) to the entanglement portion 10a, and the solder attachment portion 10b is printed. The solder is attached to the substrate 6 (5).
図 4 な レヽ し 図 8 は本実施例の コ イ ル構造を実現す る た め の 製造工程を示す も の であ る 。 本発明の端子 1 0 は 、 図 4 ( A ) の平面図お よ び同 （ B ) の側面図 に示 す よ う に 、 予め所定形状に形成さ れた リ ー ド フ レー ム 1 6 か ら 切 り 取 ら れて製作さ れる も の で あ る 。 該 リ ー ド フ レーム 1 6 は 、 打抜 き 加工に よ り 、 左右の帯状部 1 6 a , 1 6 b 間が等間隔に配設 さ れ る橋絡部 1 6 c で結合 さ れ、 かつ左右の帯状部 1 6 a ， 1 6 b と 橋絡 部 1 6 c と の 間 に 、 こ れ ら に 両端が結合 さ れ た ほ ぼ L 字形の端子結合用細帯部 1 6 d が 3 本ずつ形成 さ れて い る 。 ま た 、 左右の帯状部 1 6 a , 1 6 b に は 、 送 り お よ び位置決め 用 の孔 1 7 を有 し 、 各孔 1 7 に ガ イ ド ロ ー ラ （ 図示せ ず） の周 囲 に形成 し た突起 を掛 け 、 ガ ィ ド ロ ー ラ の 回転に よ り リ ー ド フ レ ー ム 1 6 が移動 さ れ 、 力 Πェ さ れ る 。 FIG. 8 shows a manufacturing process for realizing the coil structure of the present embodiment. As shown in the plan view of FIG. 4 (A) and the side view of FIG. 4 (B), the terminal 10 of the present invention has a lead frame 16 formed in a predetermined shape in advance. It is cut out and manufactured. The lead frame 16 is joined by a punching process at a bridging portion 16c in which the left and right band portions 16a and 16b are arranged at equal intervals. In addition, between the left and right strips 16a, 16b and the bridging part 16c, there are three L-shaped terminal connecting narrow strips 16d of approximately L-shape, both ends of which are connected. Each book is formed. The left and right strips 16a and 16b are It has a hole 17 for positioning and a projection formed around a guide roller (not shown) is applied to each hole 17 to rotate the guide roller. Thus, the lead frame 16 is moved and forced.
こ の よ う な リ ー ド フ レー ム 1 6 を使用 し 、 図 5 の平 面図 と 、 そ れぞれそ の E — E 断面図 と F — F 断面図 で あ る 図 6 ( A ) 、 （ B ) に 示す よ う に 、 細帯部 1 6 d を プ レ ス に よ り 隆起 さ せ る 。 図 5 の 2 点鎖線 1 8 は 隆 起部 を 示 し 、 こ の ブ レ ス に よ り 端子 1 0 の前記曲成部 1 0 c が形成 さ れ、 ま た製品 と し て は残 ら な い 曲成部 1 6 e が形成 さ れ る 。 1 6 f は コ イ ル端末 を か ら げ る た め の切欠 き で あ る 。  Using such a lead frame 16, a plan view of FIG. 5 and a cross-sectional view of each of E-E and F-F are shown in FIG. 6 (A). As shown in (B) and (B), the narrow band portion 16d is raised by the press. The two-dot chain line 18 in FIG. 5 indicates a raised portion, and the bent portion 10c of the terminal 10 is formed by this brace, and the product remains as it is. A curved portion 16 e is formed. 16 f is a notch for opening the coil terminal.
次 に 、 図 7 の平面図 と 、 そ れぞれそ の G — G 断面図 と H — H断面図 で あ る 図 8 ( A ) 、 （ B ) に 示 す よ う に 、 樹脂製ベース 1 で前記隆起部 1 8 の一部 と 前記曲 成部 1 0 c を 含み、 かつ前記切欠 き 1 6 f は含 ま な い よ う に 、 ベー ス 1 を一体 に成形す る 。  Next, as shown in the plan view of FIG. 7 and the G—G sectional view and the H—H sectional view of FIG. 8 (A) and (B), respectively, as shown in FIG. Then, the base 1 is integrally formed so as to include a part of the raised portion 18 and the curved portion 10c and not to include the cutout 16f.
次 に ベース 1 の 凹部 9 上 に接着剤 を塗布 し 、 図 1 に 示 し た ド ラ ム コ ア 8 を 凹部 9 上 に押 し 付 け 、 乾燥 す る こ と に よ り 、 ド ラ ム コ ア 8 を ベース 1 に接着す る 。  Next, an adhesive is applied onto the concave portion 9 of the base 1, and the drum core 8 shown in FIG. 1 is pressed onto the concave portion 9, and dried to obtain a drum core. A. Adhere 8 to the base 1.
次 に 図 7 に 示 す 線 1 9 に 沿 っ て 端子形成 用 細 帯 部 1 6 d を切断 し て帯状部 1 6 a , 1 6 b お よ び橋絡部 1 6 c カゝ ら 分離 し 、 ド ラ ム コ ア 8 を接着 し た 各ベー ス 1 を 独立 さ せ る 。  Next, the strip 16 d for forming terminals is cut along the line 19 shown in FIG. 7 and separated from the strips 16 a, 16 b and the bridging section 16 c. The base 1 to which the drum core 8 is bonded is made independent.
次 に ド ラ ム コ ア 8 に コ イ ル 3 を巻 き 、 端末 3 a を端 % Next, wind coil 3 around drum core 8, and terminate terminal 3a. %
子 1 0 のか ら げ部 1 0 a に 力 > ら げる 。 続い て こ の端末 3 a を半田揚げ し て半田 4 に よ り 固定す る 。  The force is applied to the connecting part 10 a of the child 10. Subsequently, the terminal 3 a is soldered and fixed with the solder 4.
次 に リ ン グ コ ア 1 2 を ド ラ ム コ ア 8 の外側 に被せ 、 接着剤 1 3 を 両 コ ア 8 ， 1 2 の上部隙間 に塗布 し 、 乾 燥 し て 固化す る 。  Next, the ring core 12 is put on the outside of the drum core 8, and the adhesive 13 is applied to the upper gap between the cores 8 and 12, dried and solidified.
こ の構造に よ れば、 図 1 0 ( B ) に示す よ う に 、 端 子 1 0 の上下の 曲成部 1 O c はベース 1 内 に埋没 し 、 突出 し て い る半田付け部 1 0 b は半田付け面がベース 1 の 取付 け面 1 b と ほ ぼ 同 面 に 水平 に 形成 さ れ る か ら 、 ベース 1 か ら 突出 し た半田付け部 1 0 b の全面が 半田付け面 と し て使用 さ れ る 。 従 っ て 、 図 1 0 ( A ) の構造に お い て は折 り 曲 げス ペース L 1 が必要 と な る の に比較 し 、 本発明 に よ る場合は突出幅 L 3 が小 さ く な り 、 ま た こ の突出幅 L 3 が小さ く な る割 に は 、 半田 付け面積が大 き く と れ る 。 従 っ て 、 省ス ペース化 と 、 半 田 付 け 強度 お よ び信頼性 の 増大 が達成 さ れ る 。 ま た 、 リ ー ド フ レーム の状態で曲成部 1 0 c が形成 さ れ る た め 、 成形が容易 で あ る 。  According to this structure, as shown in FIG. 10 (B), the upper and lower bent portions 1 Oc of the terminal 10 are buried in the base 1 and are protruded from the soldering portion 1. Since the soldering surface of 0b is formed almost horizontally on the same surface as the mounting surface 1b of the base 1, the entire surface of the soldering portion 10b protruding from the base 1 is flush with the soldering surface. Used as Therefore, in the structure of FIG. 10 (A), the projection width L3 is smaller in the case of the present invention than in the case where the bending space L1 is required. In addition, the soldering area is increased while the protrusion width L3 is reduced. Therefore, space saving and increase in soldering strength and reliability are achieved. Also, since the bent portion 10c is formed in the state of the lead frame, the molding is easy.
こ の構造は、 端子 1 0 がほ ぽ L 字形を な し 、 か ら げ 部 1 0 a と 半田付け部 1 0 b と の間がベース 1 内 に埋 め こ ま れて い る の で、 前述 し た図 9 の コ イ ル端子構造 の利点を 当然有す る 。 す なわ ち 、 熱衝擊等に よ り 、 端 子 1 0 の半田 5 に よ る 固定部に対 し て ベース 1 が垂直 あ る い は水平方向 に伸縮 し て も 、 コ イ ル端末 3 a は半 田付 け部 1 0 b と は別の か ら げ部 1 0 a に 力 ら げて あ る た め 、 張力 が増大せ ず、 断線 し な い 。 ま た 、 コ イ ル 端末 3 a の 力ゝ ら げ部 1 0 a と 、 プ リ ン ト 基板 6 へ の半 田 付 け部 1 0 b と が別 々 に設 け ら れて レヽ る の で 、 半 田 5 に よ る 端子 1 0 の プ リ ン ト 基板 6 への 固定の 際、 か ら げ部 1 0 a に 熱が加わ ら ず、 力ゝ ら げ部 1 0 a の半 田 付 け性が良好で有 り 、 半田付 け の信頼性が向上す る 。 ま た 、 コ イ ル端末 3 a の か ら げ部 1 0 a と 半田付 け部 1 0 b と が別 々 の場所に あ る た め 、 力 ら げ部 1 0 a に 半 田 ッ ノ が生 じ て も 、 半田付 け部 1 0 b は離れ て い る た め半 田 ッ ノ が半田付 け部 1 0 b に 及ぶ こ と は な い 。 In this structure, the terminal 10 has a substantially L-shape, and the space between the buckling portion 10a and the soldering portion 10b is embedded in the base 1. Naturally, it has the advantage of the coil terminal structure of Fig. 9 described above. That is, even if the base 1 expands or contracts vertically or horizontally with respect to the fixing portion of the terminal 10 with the solder 5 due to thermal shock, the coil terminal 3a is Raise the connecting part 10a different from the soldering part 10b. Therefore, the tension does not increase and the wire does not break. Also, since the force-releasing portion 10a of the coil terminal 3a and the solder-attaching portion 10b to the printed circuit board 6 are separately provided, they are separated. When the terminal 10 is fixed to the printed circuit board 6 by the solder 5, heat is not applied to the cover 10 a, and the solder 10 a is attached to the force release 10 a. The solderability is good, and the reliability of soldering is improved. In addition, since the connecting portion 10a and the soldering portion 10b of the coil terminal 3a are located at different places, a solder joint is provided at the force-releasing portion 10a. Even if it occurs, the soldered portion 10b is far from the soldered portion 10b because the soldered portion 10b is far away.
上記実施例 に お い て は 、 ベース 1 を 四角 形 に 形成 し た が、 円形 に 形成 し て も 良 く 、 ま た 、 端子 1 0 の平面 形状 も L 字形 に 限 ら ず、 弧状等他の 曲成形状 に し て も 良 い 。  In the above embodiment, the base 1 is formed in a rectangular shape, but it may be formed in a circular shape, and the planar shape of the terminal 10 is not limited to the L shape, but may be other shapes such as an arc shape. It may be formed into a curved shape.
発明 の効果  The invention's effect
本発明 に よ れ ば、 基本的 に は先に 開発 し た構造 を 踏 襲 し た の で 、 前記そ の構造に よ る 効果、 す な わ ち 、 プ リ ン ト 基板 に 対 し て ベース が伸縮 し て も 、 コ イ ル端末 の 張力 が増大せ ず、 断線不良の発生が防止 さ れ る 効果 と 、 半 田 に よ る 端子の プ リ ン ト 基板へ の 固定の 際、 か ら げ部 に 熱が加わ ら ず、 か ら げ部の半田付 け性が良好 で あ り 、 半 田 の信頼性が向上す る 効果 と 、 か ら げ部の 半 田揚 げ に よ り 多少の半田 ッ ノ が生 じ て も 、 プ リ ン ト 基板へ の 半 田 付 け の 際 に は 、 半 田付 け部 に は半 田 ッ ノ は生 じ て い な い た め 、 コ イ ル部品 を プ リ ン ト 基板 に 対 し て傾斜 さ せ る こ と な く 、 平面度を保持 し て取付け ら れ る 効果が得 ら れ、 さ ら に 、 端子の上下の 曲成部がベ ース 内部 に埋没 し て い る構造 と し た の で 、 プ リ ン ト 基 板へ の半田付 け部 と し て形成 さ れ る 部分が水平の突出 片 と し て 、 ベース の ブ リ ン ト 基板への取付け面 と ほ ぼ 同面に形成 さ れ る か ら 、 ブ リ ン ト 基板への半田付け面 が広 く 形成 さ れ、 ブ リ ン ト 基板への半田付け強度お よ びそ の信頼性が向上 し 、 かつ半田付け部は 、 折 り 曲 げ の た め の ス ペース が必要で な い ため 、 プ リ ン ト 基板へ の半田付け部の ベース か ら の突出幅小さ く て すみ、 省 ス ペース化が達成さ れる と 共に 、 ベース フ レーム の段 階で前記半田付け部が形成さ れ る の で、 成形が容易 と な る 。 According to the present invention, since the structure basically developed following the structure developed earlier, the effect of the structure, that is, the base with respect to the printed circuit board is provided. Even if it expands and contracts, the tension at the coil end does not increase, preventing the occurrence of disconnection failure. Also, when fixing the terminal to the printed circuit board by the solder, the kinked part Heat is not applied to the heat sink, and the solderability of the lashing part is good, and the effect of improving the reliability of the solder is improved. Even if the solder parts are generated, when the solder is attached to the printed circuit board, the solder parts are not generated at the solder joints, so the coil parts are pre-printed. To the printed circuit board It is possible to obtain the effect of mounting while maintaining flatness without tilting the terminal, and furthermore, the structure where the upper and lower bent parts of the terminal are buried inside the base Therefore, the part formed as a part to be soldered to the printed board is a horizontal protruding piece, and is almost the same as the mounting surface of the base to the printed circuit board. Formed on the printed circuit board, the surface to be soldered to the printed circuit board is formed wider, and the soldering strength and reliability of the printed circuit board are improved, and the soldering area is improved. Since no space is required for bending, the width of the projecting part of the soldered part to the printed circuit board from the base can be small, and if space saving is achieved. In both cases, since the soldering portion is formed at the stage of the base frame, molding is easy. Doo ing.
産業上の利甩可能性  Industrial availability
本発明 は 、 ト ラ ンス 、 イ ン ダ ク タ 等の コ イ リレを も つ 電子部品 を プ リ ン 卜 基板に実装す る場合に広 く 利用 す る こ と がで き る 。  INDUSTRIAL APPLICABILITY The present invention can be widely used when an electronic component having a coil, such as a transformer or an inductor, is mounted on a printed circuit board.

Claims

請求の範囲 The scope of the claims
プ リ ン ト 基板 に端子が半 田付 け さ れ る コ イ ル部品 に お い て 、 リ ー ド フ レ ー ム よ り 切 り 取 ら れ る 端子の平面 形状 を 曲成形状 と し て そ の一端を プ リ ン ト 基板へ の半 田 付 け部、 他端 を コ イ ル端末の か ら げ部 と し 、 前記半 田 付 け部側 を上下方向 に 曲成 し て 、 前記半田付 け部 と 前記か ら げ部の高 さ を異 な ら せ、 前記上下方向 の 曲成 部が樹脂製ベー ス に埋没す る よ う に前記端子 を該ベ ー ス に 一体成形 す る こ と に よ り 、 前記か ら げ部を前記べ ー ス の プ リ ン ト 基板への取付 け面 よ り 浮かせ る 一方、 前記半 田付 け部 は前記取付 け面 と ほ ぼ同面に形成 し た こ と を特徴 と す る コ イ ル端子構造。  For coil parts whose terminals are to be soldered to the printed circuit board, the planar shape of the terminal cut out from the lead frame is curved. One end of the solder connection portion to the printed circuit board is provided, and the other end thereof is a connection portion of a coil terminal. The solder connection portion side is bent in the vertical direction, and the solder connection portion is formed. The terminal is integrally formed with the base so that the height of the bent portion is different from the height of the bent portion, and the vertically bent portion is buried in a resin base. Thus, the flaps are raised above the mounting surface of the base to the printed circuit board, while the solder attachment portions are formed substantially flush with the mounting surfaces. A coil terminal structure characterized by this.
PCT/JP1992/000117 1991-02-06 1992-02-05 Structure of coil terminal WO1992014254A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE924290287T DE4290287T1 (en) 1991-02-06 1992-02-05 COIL CONNECTOR
DE4290287A DE4290287C2 (en) 1991-02-06 1992-02-05 Coil connection device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3/10852U 1991-02-06
JP1991010852U JPH0499808U (en) 1991-02-06 1991-02-06

Publications (1)

Publication Number Publication Date
WO1992014254A1 true WO1992014254A1 (en) 1992-08-20

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Application Number Title Priority Date Filing Date
PCT/JP1992/000117 WO1992014254A1 (en) 1991-02-06 1992-02-05 Structure of coil terminal

Country Status (5)

Country Link
JP (1) JPH0499808U (en)
KR (1) KR960000913B1 (en)
DE (2) DE4290287T1 (en)
TW (1) TW198174B (en)
WO (1) WO1992014254A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH058914U (en) * 1991-07-16 1993-02-05 テイーデイーケイ株式会社 Coil parts
CN109411211A (en) * 2018-09-26 2019-03-01 上海安费诺永亿通讯电子有限公司 A kind of Wireless charging coil and a kind of production method of Wireless charging coil

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS4928541B1 (en) * 1969-02-05 1974-07-27
JPH0279005U (en) * 1988-12-05 1990-06-18
JPH02125310U (en) * 1989-03-24 1990-10-16

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61203606A (en) * 1985-03-07 1986-09-09 Matsushita Electric Ind Co Ltd Chip inductor
JPH06103651B2 (en) * 1988-06-09 1994-12-14 松下電器産業株式会社 High frequency transformer
JPH02146706A (en) * 1988-11-28 1990-06-05 Murata Mfg Co Ltd Chip inductor
JPH02150005A (en) * 1988-12-01 1990-06-08 Toudai Musen Kk Method of mounting terminal to base
JPH031511U (en) * 1989-05-25 1991-01-09
JP2786072B2 (en) * 1993-02-23 1998-08-13 住友ゴム工業株式会社 Pneumatic tire

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4928541B1 (en) * 1969-02-05 1974-07-27
JPH0279005U (en) * 1988-12-05 1990-06-18
JPH02125310U (en) * 1989-03-24 1990-10-16

Also Published As

Publication number Publication date
DE4290287C2 (en) 1995-05-04
JPH0499808U (en) 1992-08-28
KR920017525A (en) 1992-09-26
TW198174B (en) 1993-01-11
DE4290287T1 (en) 1993-01-28
KR960000913B1 (en) 1996-01-15

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