Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
  • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
  • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
  • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
  • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
  • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0393—Flexible materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
  • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/05—Flexible printed circuits [FPCs]
  • H05K2201/056—Folded around rigid support or component
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09145—Edge details
  • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the printed circuit board [PCB] or at the walls of large holes
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
  • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/095—Conductive through-holes or vias
  • H05K2201/09554—Via connected to metal substrate
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09209—Shape and layout details of conductors
  • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
  • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
  • H05K2201/10742—Details of leads
  • H05K2201/10886—Other details
  • H05K2201/10924—Leads formed from a punched metal foil
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
  • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
  • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Definitions

• the present invention relates to a metal core wiring board, and more particularly to a metal core wiring board suitable for manufacturing a high-density printed wiring or a hybrid Ic.
• the metal core wiring board which has been generally used in the past, has a complicated manufacturing process because an insulating layer is attached to the surface of the metal plate as a core and the required conductive pattern through holes are formed on it. Therefore, there was a defect that the cost was high.
• a printed circuit board that directly adheres to the core metal surface and mounts components on this printed circuit board.
• the method used to improve the component mounting density by forming a circuit pattern on the back surface (the adhesive surface with the metal) of the back surface and connecting it to the front-mounted components via through-holes is called the circuit on the back surface.
• a substrate for manufacturing a hybrid IC a ceramic plate or a laminated plate of plastics has conventionally been generally used, but the former is expensive because the substrate itself is expensive.
• the conductor pattern formed on the substrate was also expensive, such as requiring a silver-palladium base.
• through holes are required, but this processing was rather troublesome.
• the plastics laminated board does not have the above-mentioned problems, but requires a process of connecting and fixing the lead terminals, and not only requires a considerable amount of man-hours, but also requires a process through these lead terminals.
• the upright printed wiring board will be as high as the height of the above-mentioned lead terminal fixing part, which will reduce the size of the electronic circuit.
• the upright printed wiring board will be as high as the height of the above-mentioned lead terminal fixing part, which will reduce the size of the electronic circuit.
• the present invention eliminates the defects of the conventional metal core wiring board as described above, particularly the defects of a decrease in component mounting density and an increase in the stacking height, and an electronic circuit and lead terminals formed thereon. It is an object of the present invention to provide a metal core wiring board which facilitates connection with a metal wiring board and solves the problem of further connecting the wiring board to another printed wiring board.
• the substrate has the following configuration. That is, one flat conductor thin plate is formed into a required shape including a lead terminal and a metal core by a method such as etching and the surface of the conductor substrate is covered with an insulating material. A conductive pattern is formed on the coating, or a printed board on which printed wiring has been completed is adhered to one or both sides of the metal core with an adhesive, and through the printed board through holes and the like. The wiring pattern is connected to a lead terminal base formed on the periphery of the core by, for example, soldering.
• FIGS. 1 (a) and 1 (b) are a perspective view and an A-A cross-sectional view, respectively, showing an embodiment of a metal core wiring board according to the present invention
• FIG. 2 is a view showing a manufacturing process thereof
• FIG. FIGS. 4 (a) and 4 (b) are manufacturing process diagrams for manufacturing a hybrid IC using a metal core wiring board according to the present invention
• FIGS. FIG. 5 is a sectional view taken along the line X--X
• FIG. 5 is a sectional view taken along the line Y--Y showing the manufacturing process
• FIGS. 6 to 9 are sectional views showing still another application example of the metal core wiring board according to the present invention.
• a plan view is a plan view.
• FIGS. 1) and (b) are a perspective view and a cross-sectional view taken along line AA of a metal core wiring board according to the present invention, respectively.
• reference numeral 1 denotes a conductor thin plate serving as a core of a substrate, and lead terminals 2, 2, and 3 ;
• the bases 3 and 4 are formed in a state of being electrically insulated from the thin plate 1 by a method to be described later, and these are integrally fixed by an insulating coating 4.
• conductor patterns 5, 5, are formed on the surface of the coating 4 by printing or the like, and the required pattern is formed by the lead terminals 2, 2, and 3,,
• the metal core wiring board as described above can be easily manufactured by employing, for example, the process shown in FIG. Immediately, as shown in Fig. 2 (a), prepare a conductor thin plate 1 such as iron, copper or phosphor bronze plate of the required thickness and apply a photo resist 7 on the surface or dry film. (See FIG., This is exposed using a required mask, and then the photosensitive portion is removed (FIG. (C)). Thereafter, etching is performed (see FIG. Lead terminal 2: 2, (lead terminal 2; 2 ......
• the base and the metal core are incorporated into the unevenness.
• an adhesive polymer dielectric material or a horn opening may be appropriately selected and applied or screen-printed.
• the surface of the insulation coating 4 was desirably coated with a conductive ink.
• the pattern 5 may be printed, and the solder paste 6 may be printed at a desired position on the pattern 5 ((f) in the same figure).
• the basic configuration of the present invention has been described above, but the metal core wiring board according to the present invention can be mounted on both sides as follows in order to increase the mounting area of electronic components.
• Fig. 3 is a board manufacturing process diagram showing one embodiment of the present invention.
• through holes are generally required, so photo resist 7 is attached to both sides of conductor core 1.
• Through-holes 11 and 11 are formed by etching after the exposure step (mask (c)) through the mask of the required pattern.
• a conductive paste 5 is printed on the insulating coating 4 to form a required conductive pattern, and at the same time, the through holes 11 and 11 are formed. Also, a conductive paste is used to secure conduction between both sides of the buried substrate (see ( ⁇ ) in the figure).
• both sides of the substrate 1 are bent to form a DIP shape (FIG. (H)), and the electronic components 9 and the like together with the conductive parameters 5 are formed. Molding with a molding material 10, such as plastic, (see FIG. 3)) completes the DI ⁇ -type hybrid Ic.
• the method of directly attaching a conductor pattern to a metal core wiring board is to connect the conductor patterns on the front and back of the board with through holes when high-density mounting of electronic components is to be performed using both sides of the board.
• FIG. 4 ⁇ shows an embodiment of the idea as described above, and is a cross-sectional view taken along the line XX in the plan view of the metal core shown in FIG.
• lead terminals 2 and 2 are formed at appropriate positions around the metal thin plate 1 serving as a core of the substrate by a method such as etching described below, and the lead terminal base and the metal thin plate 1 serving as a core are formed.
• the gap is fixed completely by the adhesive 4 and the flexible substrate 13 on which the wiring of the print pattern 12 has been completed is completely bonded to the core 1 using the adhesive 4 described above.
• the base of the lead terminals 2, 2, and A through-hole 11 is provided as necessary in the portion of the flexible printed circuit board to prevent the adhesive 4 from adhering only to the portion, and the through-hole 11 is used to prevent the adhesive 4.
• the bases of the lead terminals 2, 2, and the wiring terminals 12 are connected by solder 14.
• the component 9 to be mounted may be connected and fixed on the wiring pattern 12 by using a technique such as reflow.
• the metal core wiring board having the above-described structure can be easily manufactured by using, for example, the following method.
• the process diagram in Fig. 5 relates to the section taken along the line Y-Y in Fig. 4 (b).
• the core thickness of 0, 1 to 1.0 orchid is iron, K steel, copper or copper.
• a lead terminal 2> 2 having a desired shape, is formed on the periphery of the core 1, but these are used to prevent the lead terminal 2 from falling off when the remaining photosensitive layer is removed in the next step. Are all temporarily connected to core 1 by read frame 15.
• an adhesive 4 is printed and applied to the entire surface of the core 1 except for a required portion of the base surface of the lead terminal 2 on the surface of the core 1, and the base of the lead terminal 2 is formed.
• a U advance purine as shown ⁇ 1 and performs Ze' fixed to (a 7) preparative wiring and the through - off gravel completing Le 1 1 formed
• the sibling print substrate 13 is bonded.
• the printed wiring 12 and the lead terminal 2 are electrically connected to each other by solder or a conductive adhesive 14 through the through hole 11.
• the required parts are mounted on the metal core wiring board manufactured by the above-described procedure using the method of ⁇ - ⁇ , but before or after this mounting, the lead frame is mounted.
• the metal core wiring board according to the present invention may be modified as follows.
• the flexible printed circuit boards 13 and 13 ' may be connected to both sides of the core 1 as shown in FIG. 6, or two cores may be formed as a pair as shown in FIG.
• the center folded part 16 is provided with a lead frame 17 : 17, and a suitable sewing machine line or groove line is provided to make it easier to bend the center part, so that the left and right cores 1 are provided.
• the flexible print substrate may be bonded to the surface, and then folded back at the folded portion 16 to manufacture a metal core double-sided substrate. At this time, the lead frame of the folded portion 16 17, 17,...
• the cores 1 and 2 are made electrically independent.
• the flexible printed circuit board 13 with the printed circuit board 12 insulated is connected to the edge of the metal core wiring board.
• the board Around the board and allow high-density mounting on both sides if possible
• the present invention is not limited to this. Rather, as shown in FIG. It is suitable for combining a printed circuit board with the core 1 so that the circuit pattern 12 is concentrated on the bonding surface with the core 1 and the components are densely mounted on the surface through the through holes 11, 11. Accordingly, high-density mounting and utilization of the core as a large-area installation plate can be simultaneously and easily realized. It is possible that the electrical connection between at least one of the leads and the conductor substrate can be maintained so that the conductor substrate can be grounded via the leads.
• the present invention is configured as described above, it is possible to provide a low-cost print substrate that can meet strict requirements for high-density mounting of electronic circuits.
• the core and the lead terminals are on the same plane and are formed inside the printed wiring part, many wiring boards are erected on the mother board and electrically connected to each other. As a result, when the mounting density is to be further increased in a certain space, the height of the wiring board can be reduced by the width of the lead terminal base, and the volume of the entire electronic circuit can be reduced. It is also advantageous in reducing
• the metal core wiring board according to the present invention is extremely effective in constructing a hybrid IC or the like which is required to have good heat dissipation and good electrostatic or magnetic shielding properties.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Insulated Metal Substrates For Printed Circuits (AREA)
• Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
• Combinations Of Printed Boards (AREA)
• Multi-Conductor Connections (AREA)
• Coupling Device And Connection With Printed Circuit (AREA)

Priority Applications (1)

Applications Claiming Priority (2)

Publications (1)

Family

ID=15740424

Family Applications (1)

Country Status (2)

Families Citing this family (6)

Citations (3)

Family Cites Families (1)

• 1985
  • 1985-07-22 JP JP60161711A patent/JPS6222497A/ja active Granted
• 1986
  • 1986-07-22 WO PCT/JP1986/000386 patent/WO1990007857A1/ja unknown

Patent Citations (3)

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