USD864135S1 - Semiconductor device - Google Patents

Semiconductor device Download PDF

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Publication number
USD864135S1
USD864135S1 US29/685,061 US201929685061F USD864135S US D864135 S1 USD864135 S1 US D864135S1 US 201929685061 F US201929685061 F US 201929685061F US D864135 S USD864135 S US D864135S
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United States
Prior art keywords
semiconductor device
view
ornamental design
side perspective
designs
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/685,061
Inventor
Shuhei Yokoyama
Maki Hasegawa
Shigeru Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Filing date
Publication date
Priority claimed from JPD2017-23790F external-priority patent/JP1604093S/ja
Priority claimed from JPD2017-23791F external-priority patent/JP1604094S/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to US29/685,061 priority Critical patent/USD864135S1/en
Assigned to MITSUBISHI ELECTRIC CORPORATION reassignment MITSUBISHI ELECTRIC CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HASEGAWA, MAKI, MORI, SHIGERU, YOKOYAMA, SHUHEI
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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;
FIG. 2 is a rear, top and left side perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a top view thereof;
FIG. 6 is a bottom view thereof;
FIG. 7 is a left side view thereof; and,
FIG. 8 is a right side view thereof.
The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims (1)

    CLAIM
  1. The ornamental design for a semiconductor device, as shown and described.
US29/685,061 2017-10-26 2019-03-26 Semiconductor device Active USD864135S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/685,061 USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2017-023790 2017-02-13
JPD2017-23790F JP1604093S (en) 2017-10-26 2017-10-26
JPD2017-23791F JP1604094S (en) 2017-10-26 2017-10-26
JP2017-023791 2017-10-26
US29/643,229 USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device
US29/685,061 USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/643,229 Division USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device

Publications (1)

Publication Number Publication Date
USD864135S1 true USD864135S1 (en) 2019-10-22

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US29/643,229 Active USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device
US29/685,061 Active USD864135S1 (en) 2017-10-26 2019-03-26 Semiconductor device

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US29/643,229 Active USD859334S1 (en) 2017-10-26 2018-04-05 Semiconductor device

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Cited By (16)

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USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD953565S1 (en) * 2019-08-30 2022-05-31 Kyocera Corporation Analysis chip for biochemical testing machine
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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USD864884S1 (en) * 2017-10-23 2019-10-29 Mitsubishi Electric Corporation Semiconductor device
USD856948S1 (en) * 2018-05-07 2019-08-20 Adura Led Solutions Llc Circuit board having arrangements of light-emitting diodes
JP1632999S (en) * 2018-06-12 2019-06-03
USD933618S1 (en) 2018-10-31 2021-10-19 Asahi Kasei Microdevices Corporation Semiconductor module
JP1633578S (en) * 2018-11-07 2019-06-10
JP1665773S (en) * 2018-11-07 2020-08-11
USD902164S1 (en) * 2019-01-24 2020-11-17 Toshiba Memory Corporation Integrated circuit card
USD920264S1 (en) * 2019-11-27 2021-05-25 The Noco Company Semiconductor device
USD932452S1 (en) * 2019-11-27 2021-10-05 The Noco Company Semiconductor device
JP1711706S (en) * 2021-07-29 2022-04-04
USD1033355S1 (en) * 2021-07-29 2024-07-02 Rohm Co., Ltd. Semiconductor module
JP1711705S (en) * 2021-07-29 2022-04-04
JP1727399S (en) * 2022-01-28 2022-10-14 semiconductor element
JP1725616S (en) * 2022-02-25 2022-09-26 semiconductor module

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USD548202S1 (en) 2006-04-17 2007-08-07 Kabushiki Kaisha Toshiba Semiconductor
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD717255S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717254S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD717253S1 (en) 2012-10-11 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719113S1 (en) 2012-09-20 2014-12-09 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD719926S1 (en) * 2012-09-20 2014-12-23 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
USD770994S1 (en) 2014-04-02 2016-11-08 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device

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US3602846A (en) 1969-07-14 1971-08-31 Pulse Eng Inc Delay line
US3762039A (en) 1971-09-10 1973-10-02 Mos Technology Inc Plastic encapsulation of microcircuits
USD259560S (en) 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
US4663833A (en) 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
USD317592S (en) * 1987-01-19 1991-06-18 Canon Kabushiki Kaisha Semiconductor element
US4916519A (en) * 1989-05-30 1990-04-10 International Business Machines Corporation Semiconductor package
US5172213A (en) * 1991-05-23 1992-12-15 At&T Bell Laboratories Molded circuit package having heat dissipating post
USD345731S (en) 1992-12-03 1994-04-05 Motorola, Inc. Semiconductor package
US5557504A (en) 1993-08-31 1996-09-17 Sgs-Thomson Microelectronics, Inc. Surface mountable integrated circuit package with detachable module
USD359028S (en) 1993-09-02 1995-06-06 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD358806S (en) 1993-09-24 1995-05-30 Sgs-Thomson Microelectronics, Inc. Socketed integrated circuit package
USD357901S (en) 1993-09-27 1995-05-02 Telefonaktiebolaget Lm Ericsson Power supply unit
USD394244S (en) 1995-11-27 1998-05-12 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5798570A (en) 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396211S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396213S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396212S (en) 1996-09-09 1998-07-21 Fuji Electric Co., Ltd. Integrated circuit device
USD396847S (en) 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
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USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD717256S1 (en) 2012-09-20 2014-11-11 Samsung Electro-Mechanics Co., Ltd. Semiconductor device
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USD783550S1 (en) 2014-04-02 2017-04-11 Mitsubishi Electric Corporation Power semiconductor device
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module
USD824866S1 (en) 2016-09-30 2018-08-07 Rohm Co., Ltd. Semiconductor device

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD978809S1 (en) * 2018-04-13 2023-02-21 Rohm Co., Ltd. Semiconductor module
USD888673S1 (en) * 2018-06-26 2020-06-30 Rohm Co., Ltd. Semiconductor module
USD903613S1 (en) 2018-06-26 2020-12-01 Rohm Co., Ltd. Semiconductor module
USD913978S1 (en) 2018-06-26 2021-03-23 Rohm Co., Ltd. Semiconductor module
USD953565S1 (en) * 2019-08-30 2022-05-31 Kyocera Corporation Analysis chip for biochemical testing machine
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD934187S1 (en) * 2020-01-21 2021-10-26 Lang Cheng Integrated circuit package
USD972516S1 (en) * 2020-01-28 2022-12-13 Rohm Co., Ltd. Semiconductor module
USD971863S1 (en) * 2020-01-28 2022-12-06 Rohm Co., Ltd. Semiconductor module
USD981356S1 (en) * 2020-01-28 2023-03-21 Rohm Co., Ltd. Semiconductor module
USD969762S1 (en) * 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD973029S1 (en) * 2020-12-15 2022-12-20 Rohm Co., Ltd. Semiconductor device
USD1011300S1 (en) * 2021-09-01 2024-01-16 Dexerials Corporation Fuse
USD1009819S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1009818S1 (en) * 2021-10-13 2024-01-02 Rohm Co., Ltd. Semiconductor device
USD1037187S1 (en) * 2022-05-12 2024-07-30 Alpha And Omega Semiconductor International Lp Power semiconductor module
USD1042375S1 (en) * 2022-05-12 2024-09-17 Alpha And Omega Semiconductor International Lp Power semiconductor module

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