USD836573S1 - Ring for a plasma processing apparatus - Google Patents

Ring for a plasma processing apparatus Download PDF

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Publication number
USD836573S1
USD836573S1 US29/610,998 US201729610998F USD836573S US D836573 S1 USD836573 S1 US D836573S1 US 201729610998 F US201729610998 F US 201729610998F US D836573 S USD836573 S US D836573S
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Prior art keywords
processing apparatus
plasma processing
ring
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entitled
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US29/610,998
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English (en)
Inventor
Takamasa ICHINO
Kohei Sato
Kazunori Nakamoto
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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Assigned to HITACHI HIGH-TECHNOLOGIES CORPORATION reassignment HITACHI HIGH-TECHNOLOGIES CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ICHINO, TAKAMASA, NAKAMOTO, KAZUNORI, SATO, KOHEI
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Assigned to HITACHI HIGH-TECH CORPORATION reassignment HITACHI HIGH-TECH CORPORATION CHANGE OF NAME AND ADDRESS Assignors: HITACHI HIGH-TECHNOLOGIES CORPORATION
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US29/610,998 2017-01-31 2017-07-18 Ring for a plasma processing apparatus Active USD836573S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-001754 2017-01-10
JPD2017-1754F JP1584784S (cs) 2017-01-31 2017-01-31

Publications (1)

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USD836573S1 true USD836573S1 (en) 2018-12-25

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US29/610,998 Active USD836573S1 (en) 2017-01-31 2017-07-18 Ring for a plasma processing apparatus

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US (1) USD836573S1 (cs)
JP (1) JP1584784S (cs)
TW (1) TWD186396S (cs)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1096675S1 (en) * 2022-06-03 2025-10-07 Ap Systems Inc. Rotor for semiconductor manufacturing device

Citations (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6602116B1 (en) * 1997-12-30 2003-08-05 Applied Materials Inc. Substrate retaining ring
US20040025788A1 (en) * 2000-11-10 2004-02-12 Masahiro Ogasawara Plasma processing device and exhaust ring
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050277375A1 (en) * 2004-06-10 2005-12-15 Young Richard T Retaining ring assembly for use in chemical mechanical polishing
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20080308230A1 (en) * 2007-03-30 2008-12-18 Tokyo Electron Limited Plasma processing apparatus
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
US20160158910A1 (en) * 2013-07-11 2016-06-09 Will Be S & T Co., Ltd. Retainer ring for chemical-mechanical polishing device
JP1551512S (cs) 2015-06-12 2016-06-13
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition

Patent Citations (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5310453A (en) * 1992-02-13 1994-05-10 Tokyo Electron Yamanashi Limited Plasma process method using an electrostatic chuck
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
US6068548A (en) * 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6602116B1 (en) * 1997-12-30 2003-08-05 Applied Materials Inc. Substrate retaining ring
US20040025788A1 (en) * 2000-11-10 2004-02-12 Masahiro Ogasawara Plasma processing device and exhaust ring
USD490450S1 (en) * 2002-05-20 2004-05-25 Tokyo Electron Limited Exhaust ring for semiconductor equipment
USD494551S1 (en) 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD494552S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
USD496008S1 (en) * 2002-12-12 2004-09-14 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
US20050277375A1 (en) * 2004-06-10 2005-12-15 Young Richard T Retaining ring assembly for use in chemical mechanical polishing
USD559994S1 (en) 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD552565S1 (en) * 2005-09-08 2007-10-09 Tokyo Ohka Kogyo Co., Ltd. Supporting plate
US20080308230A1 (en) * 2007-03-30 2008-12-18 Tokyo Electron Limited Plasma processing apparatus
USD606952S1 (en) * 2009-01-16 2009-12-29 Asm Genitech Korea Ltd. Plasma inducing plate for semiconductor deposition apparatus
USD694790S1 (en) * 2011-09-20 2013-12-03 Tokyo Electron Limited Baffle plate for manufacturing semiconductor
USD697038S1 (en) * 2011-09-20 2014-01-07 Tokyo Electron Limited Baffle plate
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD793976S1 (en) * 2013-05-15 2017-08-08 Ebara Corporation Substrate retaining ring
USD766849S1 (en) * 2013-05-15 2016-09-20 Ebara Corporation Substrate retaining ring
US20160158910A1 (en) * 2013-07-11 2016-06-09 Will Be S & T Co., Ltd. Retainer ring for chemical-mechanical polishing device
JP1551512S (cs) 2015-06-12 2016-06-13
USD770992S1 (en) 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD799437S1 (en) * 2015-08-25 2017-10-10 Ebara Corporation Substrate retaining ring
USD794585S1 (en) * 2015-10-06 2017-08-15 Ebara Corporation Retainer ring for substrate
USD810705S1 (en) * 2016-04-01 2018-02-20 Veeco Instruments Inc. Self-centering wafer carrier for chemical vapor deposition
USD797691S1 (en) * 2016-04-14 2017-09-19 Applied Materials, Inc. Composite edge ring

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
Ichino et al., Design U.S. Appl. No. 29/610,995, filed Jul. 18, 2017.
Ichino et al., Design U.S. Appl. No. 29/610,996, filed Jul. 18, 2017.
Ichino et al., Design U.S. Appl. No. 29/610,999, filed Jul. 18, 2017.
Nunomura et al., Design U.S. Appl. No. 29/611,001, filed Jul. 18, 2017.

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD873782S1 (en) * 2016-05-17 2020-01-28 Electro Scientific Industries, Inc Component carrier plate
USD920935S1 (en) * 2018-09-20 2021-06-01 Kokusai Electric Corporation Boat for substrate processing apparatus
USD891636S1 (en) * 2018-10-25 2020-07-28 Hitachi High-Tech Corporation Ring for a plasma processing apparatus
US11859915B1 (en) 2019-01-31 2024-01-02 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD896767S1 (en) * 2019-12-02 2020-09-22 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD969760S1 (en) 2019-12-02 2022-11-15 Advanced Thermal Solutions, Inc. Fluid mover enclosure
USD943539S1 (en) * 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD986190S1 (en) 2020-03-19 2023-05-16 Applied Materials, Inc. Confinement plate for a substrate processing chamber
USD1092423S1 (en) * 2022-05-19 2025-09-09 Asm Ip Holding B.V. Electrode plate for semiconductor manufacturing apparatus
USD1096675S1 (en) * 2022-06-03 2025-10-07 Ap Systems Inc. Rotor for semiconductor manufacturing device

Also Published As

Publication number Publication date
TWD186396S (zh) 2017-11-01
JP1584784S (cs) 2017-08-28

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