USD832227S1 - Semiconductor module - Google Patents

Semiconductor module Download PDF

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Publication number
USD832227S1
USD832227S1 US29/602,605 US201729602605F USD832227S US D832227 S1 USD832227 S1 US D832227S1 US 201729602605 F US201729602605 F US 201729602605F US D832227 S USD832227 S US D832227S
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United States
Prior art keywords
semiconductor module
view
semiconductor
module
ornamental design
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US29/602,605
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English (en)
Inventor
Kentaro Chikamatsu
Koshun SAITO
Kenichi Yoshimochi
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Rohm Co Ltd
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Rohm Co Ltd
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Assigned to ROHM CO., LTD. reassignment ROHM CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHIKAMATSU, KENTARO, SAITO, KOSHUN, YOSHIMOCHI, KENICHI
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US29/602,605 2016-11-15 2017-05-02 Semiconductor module Active USD832227S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPD2016-24833F JP1580899S (ja) 2016-11-15 2016-11-15
JP2016-024833 2016-11-15

Publications (1)

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USD832227S1 true USD832227S1 (en) 2018-10-30

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JP (1) JP1580899S (ja)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD980810S1 (en) * 2020-02-27 2023-03-14 Kioxia Corporation Integrated circuit card
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP1695980S (ja) 2021-03-09 2021-09-27

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USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
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USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module

Patent Citations (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD259560S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259559S (en) * 1978-07-28 1981-06-16 Hitachi, Ltd. Semiconductor
USD259782S (en) * 1978-07-28 1981-07-07 Hitachi, Ltd. Semiconductor
USD259783S (en) * 1978-08-25 1981-07-07 Hitachi, Ltd. Semiconductor
USD260091S (en) * 1978-08-25 1981-08-04 Hitachi, Ltd. Semiconductor
USD260986S (en) * 1978-08-25 1981-09-29 Hitachi, Ltd. Semiconductor
US4663833A (en) * 1984-05-14 1987-05-12 Oki Electric Industry Co. Ltd. Method for manufacturing IC plastic package with window
US5105257A (en) * 1990-08-08 1992-04-14 Mitsubishi Denki Kabushiki Kaisha Packaged semiconductor device and semiconductor device packaging element
US5347160A (en) * 1992-09-28 1994-09-13 Sundstrand Corporation Power semiconductor integrated circuit package
US5798570A (en) * 1996-06-28 1998-08-25 Kabushiki Kaisha Gotoh Seisakusho Plastic molded semiconductor package with thermal dissipation means
USD396847S (en) * 1996-10-17 1998-08-11 Matsushita Electronics Corporation Semiconductor device
USD397092S (en) * 1997-01-03 1998-08-18 Fujitsu Limited Integrated circuit package
USD396846S (en) * 1997-04-16 1998-08-11 Matsushita Electronics Corporation Semiconductor device
US6093957A (en) * 1997-04-18 2000-07-25 Lg Semicon Co., Ltd. Multilayer lead frame structure that reduces cross-talk and semiconductor package using same and fabrication method thereof
US20010038143A1 (en) * 1997-06-12 2001-11-08 Yukio Sonobe Power semiconductor module
US6330165B1 (en) * 1998-07-06 2001-12-11 Hitachi, Ltd. Semiconductor device
USD416236S (en) * 1998-09-02 1999-11-09 Citizen Electronics Co., Ltd. Integrated circuit package
US6238953B1 (en) * 1999-01-12 2001-05-29 Sony Corporation Lead frame, resin-encapsulated semiconductor device and fabrication process for the device
US6555899B1 (en) * 1999-10-15 2003-04-29 Amkor Technology, Inc. Semiconductor package leadframe assembly and method of manufacture
USD444132S1 (en) * 2000-08-23 2001-06-26 Kabushiki Kaisha Toshiba Semiconductor element
US6521983B1 (en) * 2000-08-29 2003-02-18 Mitsubishi Denki Kabushiki Kaisha Semiconductor device for electric power
USD466485S1 (en) * 2001-05-23 2002-12-03 Shindengen Electric Manufactuturing Co., Ltd. Semiconductor package
USD466873S1 (en) * 2001-10-31 2002-12-10 Siliconix Incorporated Semiconductor chip package
USD472528S1 (en) * 2001-10-31 2003-04-01 Siliconix Incorporated Semiconductor chip package
USD480371S1 (en) * 2001-11-30 2003-10-07 Kabushiki Kaisha Toshiba Semiconductor device
USD475982S1 (en) * 2002-03-11 2003-06-17 Kabushiki Kaisha Toshiba Semiconductor device
USD475355S1 (en) * 2002-03-11 2003-06-03 Kabushiki Kaisha Toshiba Semiconductor device
USD475028S1 (en) * 2002-03-11 2003-05-27 Kabushiki Kaisha Toshiba Semiconductor device
USD476962S1 (en) * 2002-03-29 2003-07-08 Kabushiki Kaisha Toshiba Semiconductor device
USD489338S1 (en) * 2003-07-28 2004-05-04 Semiconductor Components Industries, L.L.C. Packaged semiconductor device
USD509810S1 (en) * 2003-07-30 2005-09-20 Delta Electronics Inc. Molding structure of electric element
US6992386B2 (en) * 2003-07-31 2006-01-31 Renesas Technology Corp. Semiconductor device and a method of manufacturing the same
USD504874S1 (en) * 2004-08-11 2005-05-10 Semiconductor Components Industries, Llc Semiconductor device package
USD510728S1 (en) * 2004-08-11 2005-10-18 Semiconductor Components Industries Llc Semiconductor device package
USD587662S1 (en) * 2007-12-20 2009-03-03 Fuji Electric Device Technology Co., Ltd. Semiconductor device
USD648290S1 (en) * 2010-06-08 2011-11-08 Miyoshi Electronics Corporation Semiconductor device
USD762597S1 (en) * 2014-08-07 2016-08-02 Infineon Technologies Ag Power semiconductor module
USD796459S1 (en) * 2016-04-11 2017-09-05 Rohm Co., Ltd. Packaged semiconductor circuit module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD845921S1 (en) * 2017-05-02 2019-04-16 Rohm Co., Ltd. Semiconductor device
USD852765S1 (en) * 2017-10-19 2019-07-02 Rohm Co., Ltd. Semiconductor device
USD853343S1 (en) * 2017-10-19 2019-07-09 Rohm Co., Ltd. Semiconductor device
USD904325S1 (en) 2019-03-20 2020-12-08 Sansha Electric Manufacturing Company, Limited Semiconductor module
USD945384S1 (en) * 2019-09-26 2022-03-08 Lapis Semiconductor Co., Ltd. Semiconductor module
USD980810S1 (en) * 2020-02-27 2023-03-14 Kioxia Corporation Integrated circuit card
USD937231S1 (en) * 2020-04-06 2021-11-30 Wolfspeed, Inc. Power semiconductor package
USD969762S1 (en) 2020-04-06 2022-11-15 Wolfspeed, Inc. Power semiconductor package
USD994624S1 (en) * 2021-03-23 2023-08-08 Rohm Co., Ltd. Power semiconductor module
USD1021831S1 (en) * 2021-03-23 2024-04-09 Rohm Co., Ltd. Power semiconductor module

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