US9310200B2 - Sensor device regulation and related systems and methods - Google Patents

Sensor device regulation and related systems and methods Download PDF

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Publication number
US9310200B2
US9310200B2 US13/927,299 US201313927299A US9310200B2 US 9310200 B2 US9310200 B2 US 9310200B2 US 201313927299 A US201313927299 A US 201313927299A US 9310200 B2 US9310200 B2 US 9310200B2
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sensor element
joint surface
sensor device
substrate body
base material
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US20140007682A1 (en
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Hidetoshi Kabasawa
Shigeto Watanabe
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Sony Semiconductor Solutions Corp
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Sony Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733—Structural details or topology
    • G01C19/574—Structural details or topology the devices having two sensing masses in anti-phase motion
    • G01C19/5747—Structural details or topology the devices having two sensing masses in anti-phase motion each sensing mass being connected to a driving mass, e.g. driving frames
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5642—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams
    • G01C19/5656—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating bars or beams the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/023—Housings for acceleration measuring devices

Definitions

  • the present technology relates to a sensor device on which a sensor element such as a vibrating gyrosensor is mounted.
  • a vibrating gyrosensor As an angular velocity sensor, for example, a vibrating gyrosensor is well known.
  • a vibrating gyrosensor detects, while vibrating a vibrator at a predetermined frequency, a Coriolis force generated on the vibrator with a piezoelectric element to detect an angular velocity.
  • a vibrating gyrosensor (hereinafter, referred to as sensor device) is typically mounted in parallel with an integrated circuit (IC) that detects an oscillation or an angular velocity of a vibrator as a package component on the same substrate (refer to Japanese Patent Application Laid-open No. 2010-230691).
  • Japanese Unexamined Patent Application Publication No. 2011-164091 describes a sensor device having a structure where a housing part for housing a controller (IC) is formed in a multi-layered wiring substrate configured of ceramics and a gyrosensor is disposed on the housing part.
  • the gyrosensor is formed into a rectangular triaxial gyrosensor as a whole and mounted in the housing part while stepping over a mounted controller.
  • a footprint can be reduced.
  • the housing part is a recess part formed on a surface of a wiring substrate
  • a rectangular gyrosensor that is mounted by stepping over the recess part has to be formed with a length longer than that of the housing part in either one of horizontal and vertical lengths. Therefore, there was a problem that a gyrosensor may not be sufficiently miniaturized. Further, in the case where many pieces of the gyrosensors are formed from one wafer by a MEMS process, since miniaturization of the gyrosensor is limited, the number of pieces may not be increased, resulting in limiting also the cost reduction.
  • a sensor device includes a sensor element and a wiring substrate.
  • the wiring substrate includes a first joint surface that is electrically joined with the sensor element, a substrate body that contains an organic insulator and in which an electronic component is embedded, and a regulation part that regulates the first joint surface from deforming.
  • the regulation part regulates a first joint surface that is joined with a sensor element from deforming. Thereby, even when an organic insulator of a substrate body is deformed by heat or vibration, a structure of a first joint surface is hardly affected by these influences. Thus, a sensor element can stably maintain desired sensor characteristics.
  • the first joint surface is disposed on the substrate body, and the regulation part may contain a core part embedded in the substrate body.
  • the first joint surface can be regulated from deforming.
  • the core part may have a specific structure where the core part is annularly disposed around the electronic component.
  • the core part can be disposed space-savingly and can isotropically suppress the substrate body from thermally expanding and elastically deforming.
  • the wiring substrate further includes a second joint surface that faces the first joint surface
  • the substrate body may further include a first wiring layer disposed on a side of the first joint surface, and a second wiring layer that is disposed on a side of the second joint surface and faces the first wiring layer with the core part and the electronic component interposed therebetween.
  • a substrate body can be formed into a multi-layer substrate and a degree of freedom of wiring design can be improved.
  • the sensor device may further include a shield part that is disposed on the first joint surface and covers the sensor element.
  • a sensor element can be protected from intrusion of an external electromagnetic wave and irregularity of sensor characteristics can be suppressed. Further, a sensor element has a light-shielding function and also thereby an operation of a sensor element can be stabilized. Still further, a shield part has a function as a cover of a sensor device and can improve a handling property.
  • the regulation part may further include a first junction part that joins the shield part and the core part.
  • an absolute value of a difference of a linear expansion coefficient thereof and that of the sensor element may be smaller than an absolute value of a difference of linear expansion coefficients of the organic insulator and the sensor element.
  • a shield part, a joint part and a core part as a whole form a large electromagnetic shield and can shield external intrusion of an electromagnetic wave. Further, on a side of a first joint surface of a substrate body, thermal expansion can be more suppressed and a first joint surface can be effectively regulated from deforming.
  • an absolute value of a difference of a linear expansion coefficient thereof and that of the sensor element may be smaller than an absolute value of a difference of linear expansion coefficients of the organic insulator and the sensor element.
  • a core part can be formed with a material having a value of a linear expansion coefficient closer to that of a sensor element than an organic insulator.
  • the regulation part includes a base material configured of an inorganic insulator, which is disposed between the sensor element and the substrate body, and the first joint surface may be disposed on the base material.
  • the base material is configured of an inorganic insulator such as ceramics
  • the first joint surface is regulated from deforming.
  • a sensor element can stably maintain its sensor characteristics.
  • the inorganic insulator other than ceramics, for example, Si and MgO can be applied.
  • the regulation part may further include a core part that is embedded in the substrate body.
  • a base material and a core part can regulate an entire wiring substrate from deforming. Accordingly, also when a sensor device is mounted on other regulation substrate via a wiring substrate, sensor characteristics can be more stably maintained.
  • the regulation part may further include a second joint part that joins the base material and the core part.
  • the base material is mounted on the substrate body, and the wiring substrate may further have an adhesion layer that is filled in between the base material and the substrate body.
  • a joint region of a base material and a substrate body can be protected from intrusion of external humidity and moisture or from external stress.
  • joint reliability between a base material and a substrate body can be increased.
  • the base material is disposed to face the first joint surface and may further have a third joint surface that is electrically joined with the electronic component.
  • rigidity of a base material can be increased and a thickness of a substrate body can be formed thinner.
  • the sensor device may further include a shield part that is disposed on the wiring substrate and covers the sensor element.
  • the shield part may be disposed on the first joint surface.
  • the substrate body has a fourth joint surface that faces the base material, and the shield part is disposed on the fourth joint surface and may cover the base material and the sensor element.
  • a shield effect can be imparted to a sensor element and wiring in a base material. Further, a shield part can protect a joint region of a sensor element and a base material from intrusion of external humidity and moisture and external stress. Thus, operational reliability as a sensor device can be more increased.
  • the substrate body may be formed with a longitudinal elastic modulus smaller than that of the base material.
  • the sensor element may face the electronic component with the first joint surface interposed therebetween.
  • mounting areas of a sensor element and an electronic component can be overlapped to be able to contribute to miniaturize a sensor device.
  • the sensor element may be a gyrosensor, for example.
  • a sensor element is disposed on a first joint surface, even when a sensor element is a gyrosensor, a vibrator is not disturbed from vibrating. Further, even when, in order to correct vibration characteristics caused by shape asymmetry of a vibrator, a laser process is performed to adjust a shape while confirming an output signal after mounting, there is nothing that disturbs laser irradiation, that is, a laser process can be readily performed.
  • a sensor device that is capable of realizing miniaturization and cost reduction can be provided.
  • FIG. 1 is a schematic sectional view of a sensor device according to a first embodiment of the present technology
  • FIG. 2 is a schematic plan view of a main part of the sensor device
  • FIG. 3 is an entire perspective view of a sensor element according to a first embodiment of the present technology
  • FIG. 4 is a plan view schematically showing a main part of the sensor element
  • FIG. 5 is a diagram for explaining a vibration mode of the sensor element
  • FIG. 6 is a diagram for explaining an operation of the sensor element
  • FIGS. 7A and 7B each is a diagram for explaining another operation of the sensor element
  • FIG. 8 is a schematic sectional view of a sensor device according to a second embodiment of the present technology.
  • FIG. 9 is a schematic sectional view of a sensor device according to a second embodiment of the present technology.
  • FIG. 10 is a schematic sectional view of a sensor device according to a third embodiment of the present technology.
  • FIG. 11 is a schematic sectional view of a sensor device according to a fourth embodiment of the present technology.
  • FIG. 12 is a schematic sectional view of a sensor device according to a fifth embodiment of the present technology.
  • FIG. 13 is a schematic sectional view of a sensor device according to a sixth embodiment of the present technology.
  • FIG. 14 is a schematic sectional view of a sensor device according to a seventh embodiment of the present technology.
  • FIG. 15 is a schematic sectional view of a sensor device according to an eighth embodiment of the present technology.
  • FIG. 16 is a schematic sectional view of a sensor device according to a ninth embodiment of the present technology.
  • FIG. 17 is a schematic sectional view of a sensor device according to a tenth embodiment of the present technology.
  • FIG. 18 is a schematic sectional view of a sensor device according to an eleventh embodiment of the present technology.
  • FIGS. 19A to 19D are each a schematic sectional view showing a manufacturing process of a sensor device according to an eleventh embodiment of the present technology.
  • FIG. 20 is a schematic sectional view of a sensor device according to a modification example of an eleventh embodiment of the present technology.
  • FIG. 1 is a schematic sectional view showing a sensor device according to a first embodiment of the present technology.
  • a sensor device 1 of the present embodiment includes a sensor element 100 , a wiring substrate 200 and a shield part 400 .
  • the sensor element 100 is formed as a gyrosensor element in the present embodiment.
  • FIG. 2 is a schematic plan view of the sensor device 1 seen by removing the shield part 400 .
  • an X-axis direction shows a vertical direction of the sensor device 1
  • a Y-axis direction shows a horizontal direction thereof
  • a Z-axis direction shows a thickness direction thereof, and each thereof is orthogonal with each other.
  • the sensor device 1 shown in FIG. 1 is formed as a single package component that is formed into a nearly rectangular parallelepiped as a whole. That is, the sensor element 100 is surface mounted on a first joint surface 201 on the wiring substrate 200 by a flip-chip process, for example, and is covered with a cap-like shield part 400 that was similarly joined on to the first joint surface 201 .
  • the sensor device 1 has a structure, in the present embodiment, with a dimension of a width and a depth each of about 3 mm and a thickness of about 1 mm.
  • the wiring substrate 200 is formed as a component-incorporated substrate and has an electronic component 300 disposed inside thereof.
  • the electronic component 300 is a controller 300 that controls the sensor element 100 and is configured of an integrated circuit (IC), for example.
  • the sensor element 100 is disposed to face a controller 300 with the first joint surface 201 interposed therebetween.
  • the sensor element 100 includes, as will be described below, a vibrator part 101 having a plurality of vibration parts, and a frame body 102 that supports the vibrator part 101 .
  • the sensor element 100 is formed as a gyrosensor element that generates signals corresponding to an angular velocity about each of axes along predetermined two directions in the X-Y plane and an angular velocity about a Z-axis along a direction vertical to the X-Y plane.
  • the sensor element 100 is configured of a material containing silicon (Si).
  • the sensor element 100 is formed by microprocessing an SOI (Silicon On Insulator) substrate that is obtained by adhering two sheets of silicon (Si) substrates and includes a first layer 111 , a second layer 112 and a joining layer 113 that joins first and second layers 111 and 112 .
  • SOI Silicon On Insulator
  • first and second layers 111 and 112 are formed of a silicon substrate, and a joining layer 113 is formed from a silicon oxide film.
  • a first layer 111 forms the vibrator part 101 and the frame body 102 respectively, a second layer 112 is formed in frame along a periphery of a first layer 111 .
  • First and second layers 111 and 112 each is formed into a near rectangle having a square or rectangular plane shape and with the same or nearly the same magnitude. In the present embodiment, first and second layers 111 and 112 are formed into a square shape having a side of about 1.7 mm.
  • the first layer 111 has a front surface to which a second layer 112 is joined and a back surface that faces the wiring substrate 200 .
  • a plurality of terminal parts 114 that is electrically joined with the wiring substrate 200 is formed.
  • the terminal part 114 has, in the present embodiment, an electrode pad and a solder bump formed thereon, and every six pieces the terminal parts 114 are arranged on each of sides, for example, along a periphery of the first layer 111 . Further, a terminal part 114 may contain, without limiting a configuration that contains a solder bump, instead of a solder bump, a plating bump.
  • Each of the terminal parts 114 is formed, for example, on a not-shown insulating film that covers a back surface of the first layer 111 .
  • each of the terminal parts 114 is prevented from short-circuiting via the first layer 111 that is formed from single crystal silicon.
  • the insulating film is typically formed of a silicon oxide film without limiting thereto.
  • each of the first and second layers 111 and 112 by setting a length of a diagonal line to 10 mm or less, further 5 mm or less (in the present embodiment, for example, about 2.4 mm), also the maximum dimension between a plurality of terminal parts 114 can be set to 10 mm or less.
  • stress such as strain stress or thermal strain stress is loaded on a joint part including the terminal parts 114 , an amount of strain of a substrate body 210 with respect to that of the sensor element 100 can be suppressed to a relatively minor degree.
  • the frame body 102 has a base part 81 and a coupling part 82 .
  • the base part 81 has the terminal part 114 and is formed in a nearly rectangular frame that surrounds an outer side of the vibrator part 101 .
  • the coupling part 82 couples between the base part 81 and the vibrator part 101 and has a shape deformable in the X-Y plane. Thereby, without disturbing a vibration of the vibrator part 101 described below, the vibrator part 101 can be supported.
  • the base part 81 of the sensor element 100 is surface mounted with respect to the substrate body 210 of the wiring substrate 200 by a flip-chip process. Since, in the present embodiment, a frame-shaped second layer 112 is formed corresponding to a region for forming the terminal part 114 , a second layer 112 works as a reinforcement layer during mounting. Thereby, the sensor element 100 can be prevented from being broken during mounting. Further, the sensor element 100 can be easily handled during manufacture.
  • the wiring substrate 200 includes the first joint surface 201 , the substrate body 210 , and a regulation part 220 .
  • the substrate body 210 is, as a whole, formed into a multi-layered wiring substrate having a rectangular plane shape, and on a front surface and a back surface and inside of the substrate body 210 , a wiring layer 230 having a predetermined pattern is formed.
  • the first joint surface 201 is disposed to form a top surface of the substrate body 210 and includes a plurality of lands for electrically joined with the terminal parts 114 of the sensor element 100 . Such land part forms a part of a wiring layer 230 .
  • a joining material such as a conductive adhesive may be used, and a joining technology such as an ultrasonic joining process may be used.
  • the first joint surface 201 and the sensor element 100 are electromechanically joined by a flip-chip process.
  • the first joint surface 201 may have, for example, a rectangular recess part formed in a region that faces the vibrator part 101 of the sensor element 100 (not shown in the drawing).
  • the recess part is formed into, for example, a square plane shape having a side of about 0.9 mm and has a depth of about 50 ⁇ m. Further, since a height of the terminal part 114 after joining the sensor element 100 and the wiring substrate 200 is about 20 to 30 ⁇ m, as a whole, between the vibrator part 101 of the sensor element 100 and the first joint surface 201 , a gap of about 80 ⁇ m is formed. Thus, without disturbing distortion modification due to resonance vibration or Coriolis force of the sensor element 100 , which will be described below, the sensor element 100 can be stably supported.
  • a depth of the recess part can be formed at about 10 to 100 ⁇ m without limiting to the above.
  • the substrate body 210 has the second joint surface 202 that faces the first joint surface 201 in a thickness direction.
  • the second joint surface 202 forms a bottom surface of the substrate body 210 that is joined with a regulation substrate and is provided with an external connection terminal 232 a .
  • a joining method with the regulation substrate is not particularly limited. However, for example, by face down bonding according to a flip-chip process via a solder bump, space-saving mounting can be performed.
  • the regulation substrate is a wiring substrate (mother board) of an electronic instrument (for example, video camera, and car-navigation system) on which the sensor device 1 is mounted, and, other than the sensor device 1 , other electronic components may be mounted.
  • the external connection terminal 232 a forms a part of a wiring layer 230 and is formed into a pad part for connecting 25 bumps, for example.
  • the substrate body 210 may be formed into a component-incorporated substrate, and, on the second joint surface 202 , a pad part can be formed over an entire surface. Thereby, a degree of freedom of disposition of external connection terminals 232 a on the second joint surface 202 is increased. Therefore, depending on a configuration of a regulation substrate on which the sensor device 1 is mounted, disposition of external connection terminals 232 a can be determined.
  • the substrate body 210 includes an organic insulator as an insulation layer.
  • an epoxy resin containing an additive of filler such as glass fiber is adopted as an organic insulator.
  • an additive such as glass fiber is added, in some cases, only an “epoxy resin” is used.
  • the wiring layer 230 includes an upper wiring layer (first wiring layer) 231 and a lower wiring layer (second wiring layer) 232 .
  • These wiring layers 230 are typically formed of a copper foil, and each of wiring layers is electrically connected with each other via a via.
  • the number of layers of the top wiring layer 231 and bottom wiring layer 232 can be arbitrarily set without limiting to that of an illustrated example.
  • the substrate body 210 has three regions different in its internal structure. That is, the substrate body 210 includes a first region 211 that contains the first joint surface 201 , a second region 212 that contains the second joint surface 202 , and a third region 213 that is disposed between the first and second regions 211 , 212 and where a controller 300 is embedded.
  • Each of the first and second regions 211 and 212 has a structure where a wiring layer 230 and an organic insulating layer are alternately laminated into many layers.
  • the top wiring layer 231 is formed in the first region 211 .
  • the top wiring layer 231 includes a land part formed on the first joint surface 201 .
  • the lower wiring layer 232 is formed in the second region 212 .
  • the lower wiring layer 232 is disposed to face the top wiring layer 231 with the controller 300 and a core part 221 interposed therebetween and includes a pad part on the second joint surface 202 .
  • the wiring layer 230 includes a grounded circuit
  • the top wiring layer 231 may include a grounding terminal connected to the grounded circuit.
  • a part of the terminal parts 114 on a side of the sensor element 100 can be joined with the grounding terminal.
  • the grounding terminal may be connected to a predetermined direct current potential without limiting to the case of connecting to a ground potential.
  • the third region 213 does not have, for example, a wiring layer, but has only an organic insulating layer.
  • the controller 300 and the core part 221 disposed around the controller are buried.
  • the third region 213 may have a wiring layer.
  • the controller 300 has, as will be described below, a self-oscillation circuit that outputs a driving signal that excites the vibrator part 101 , an arithmetic circuit that outputs angular velocities about the X-, Y- and Z-axes based on signals corresponding to the respective angular velocities about the respective axes, a detector circuit and a smoothing circuit.
  • the controller 300 may include a single IC chip, a semiconductor bare chip, or a semiconductor package component such as CSP (Chip Size Package).
  • the controller 300 is, for example, a near rectangular parallelepiped having a near square shape having a side of about 1.9 mm.
  • a plurality of terminal parts 310 may be formed on a back surface (surface joined with lower wiring layer 232 ) of the controller 300 .
  • the terminal part 310 includes, in the present embodiment, an electrode pad and a solder bump formed thereon, and is joined with a land part formed on the lower wiring layer 232 by a flip-chip process. Disposition of the terminal parts 310 is not particularly limited. However, for example, along a periphery of a back surface of the controller 300 , for example, every 5 to 10 pieces thereof are arranged on each of sides.
  • a method for manufacturing the substrate body 210 includes a step of forming a second region 212 , a step of forming a third region 213 , and a step of forming a first region 211 .
  • the second region 212 is formed.
  • a build-up process where an organic insulating layer and a wiring layer are alternately laminated may be adopted, or a process where both-sided substrates are laminated via an adhesive layer may be adopted.
  • the organic insulating layer a glass-epoxy substrate or a resin sheet with a copper foil can be used.
  • a method for forming a wiring layer without particularly limiting, a process for forming a pattern according to, for example, an additive process or a subtractive process, or a transfer process of a copper foil with a releasing film, a screen printing process can be adopted.
  • an inter-layer via may be formed according to laser process.
  • the third region 213 is formed on the second region 212 .
  • the controller 300 and the core part 221 are mounted on the upper-most layer of the lower wiring layer 232 .
  • the controller 300 is mounted as described above according to a flip-chip process.
  • a method for mounting the core part 221 is not particularly limited. However, a reflow method that uses a solder or an ultrasonic welding method may be adopted.
  • a semi-cured resin layer such as prepreg is formed.
  • the resin layer may be formed by directly coating an epoxy resin on the second region 212 or may be formed by molding the controller 300 and the core part 221 from an adhesive resin layer having a predetermined thickness. These resin layers are cured by heating after molding. Thereby, the third region 213 including an organic insulating layer is formed.
  • a first region 211 is formed on a substrate where up to second and third regions 212 and 213 have been laminated, according to a process the same as that of the second region 212 .
  • a process such as a laser process or a plating process, a through via that penetrates through the wiring layer 230 is formed on a predetermined position, thus, the substrate body 210 having the configuration is manufactured.
  • the controller 300 can be readily embedded.
  • a recess part for housing the controller 300 has to be formed with a metal mold, that is, after firing/molding, deflection tends to be caused. Further, in order to bury the controller 300 , a top layer for covering the recess part has to be separately prepared, this is disadvantageous from the viewpoint of cost.
  • thermosetting resin material such as an epoxy resin or a phenol resin
  • the controller 300 can be embedded in a semi-cured state. Thereby, a step of manufacturing a recess part that houses the controller 300 in an insulating layer becomes unnecessary and the number of steps can be largely reduced. Further, in comparison with a material such as ceramics, manufacture at a lower cost can be realized.
  • a thermoplastic resin material such as PET (polyethylene terephthalate) or hot-melt may be used.
  • a process for forming from the third region 213 may be adopted.
  • a resin layer is formed.
  • These upper and lower resin layers respectively form a part of the first region 211 and the second region 212 .
  • a thickness is adjusted by compression pressing in a vertical direction (Z-axis direction)
  • a pattern for a wiring layer is formed on each of surfaces of the upper and lower resin layers.
  • the wiring layer can be formed by etching after, for example, a plating process was conducted. Further, on each of the wiring layers, a resin layer is formed.
  • the substrate body 210 By repeating a step of laminating, in a direction separating along a Z-axis direction from the third region 213 , the first and second regions 211 and 212 can be formed, respectively.
  • the substrate body 210 having the above-described structure can be manufactured.
  • the regulation part 220 has the core part 221 .
  • the regulation part 220 is disposed to regulate the first joint surface 201 of the substrate body 210 from deforming.
  • “regulation” indicates that by setting a linear expansion coefficient and a longitudinal elastic modulus to values close to those of the sensor element 100 , the first joint surface 201 is regulated from thermally expanding and elastically deforming.
  • the core part 221 is, in the present embodiment, embedded in the third region 213 of the substrate body 210 and disposed rectangular annularly around the controller 300 .
  • the core part 221 may be, without limiting thereto, formed into, for example, two bar-like bodies that face with, for example, the controller 300 interposed therebetween. Further, the core part 221 may have electrical conduction with the lower wiring layer 232 via a solder.
  • the substrate body 210 contains, in the present embodiment, an organic insulating material including an epoxy resin as a main raw material to which a slight amount of glass fiber is added. Thereby, the controller 300 can be readily incorporated and the substrate body 210 can be readily multilayered.
  • a linear expansion coefficient is high and a longitudinal elastic modulus is low.
  • Table 1 shows typical examples of values of linear expansion coefficient and longitudinal elastic modulus of some materials including Si and an epoxy resin.
  • a value of a linear expansion coefficient of an epoxy resin has a width. This is because a value of an epoxy resin varies depending on an additive. For example, an epoxy resin used in the present embodiment, in which a sight amount of glass fiber is added, has a value of about 40 ⁇ 10 ⁇ 6 /° C. In this case, linear expansion coefficients of Si and the epoxy resin have a difference of about 17 times.
  • a wiring layer 230 is formed on the substrate body 210 . However, since the organic insulating material predominates in volume, characteristics of the joint surface 201 of the substrate body 210 and the first joint surface 201 are affected by a linear expansion coefficient and a longitudinal elastic modulus of the organic insulating material.
  • the sensor device 1 adopts, as a material of the core part 221 , a material having a value of a linear expansion coefficient close to that of the sensor element 100 . That is, all of core parts 221 are formed from a material that has an absolute value of a difference of a linear expansion coefficient with that of the sensor element 100 containing Si smaller than an absolute value of a difference of linear expansion coefficients of an organic insulating material (epoxy resin) and the sensor element 100 .
  • an organic insulating material epoxy resin
  • a material having a value of a linear expansion coefficient “close to that of the sensor element 100 ” is specifically defined as follows. That is, a material where an absolute value of a difference of a linear expansion coefficient thereof with that of the sensor element 100 (in the case of Si is used to form, about 2.4 ⁇ 10 ⁇ 6 /° C.) is 20 ⁇ 10 ⁇ 6 /° C. or less is taken.
  • the materials by referencing to Table 1, for example, iron (Fe), tungsten (W), 42 alloy (alloy containing nickel (Ni): 42%, Fe: 57%: and slight amount of additives such as copper), and ceramics can be cited.
  • a 42 alloy is adopted as the material of the core part 221 .
  • an entirety of the wiring substrate 200 is formed so that an absolute value of a difference of a linear expansion coefficient thereof with that of the sensor element 100 is smaller than an absolute value of a difference of linear expansion coefficients of an organic insulating material and the sensor element 100 , and can be formed with a value of a linear expansion coefficient close to that of the sensor element 100 . Therefore, an entire wiring substrate 200 containing the substrate body 210 is regulated from thermally expanding in a plane (X-Y plane) direction and strain stress of the sensor element 100 can be regulated from occurring. Accordingly, inconveniences such as sensitivity change accompanying a change of a resonant frequency of the sensor element 100 and breakdown of an electrical connection in the first joint surface 201 can be suppressed from occurring.
  • ⁇ dif L max ⁇ 105 is a practically allowable range that satisfies 200 times in the cycle test
  • ⁇ dif L max ⁇ 84 is a range that satisfies 1000 cycles in the cycle test and can ensure high reliability.
  • a length of a diagonal line L max is about 2 mm or less. Therefore, it was confirmed that when a difference ⁇ dif of linear expansion coefficients of the core part 221 and the sensor element 100 is 20 ⁇ 10 ⁇ 6 /° C. or less, ⁇ dif L max ⁇ 84 is satisfied and high reliability can be ensured.
  • a longitudinal elastic modulus values of the respective materials are largely different.
  • the longitudinal elastic modulus is small, that is, the rigidity is low, for example, it is likely that a vibration owing to a resonant frequency of the sensor element 100 is propagated to the first joint surface 201 and the substrate body 210 vibrates at a phase different from that of the sensor element 100 . Further, when a vibration of the substrate body 210 is propagated to the sensor element 100 , the sensor element 100 vibrates differently from intrinsic characteristics. Therefore, the sensitivity of the sensor element 100 is affected.
  • a metal material having the longitudinal elastic modulus of, for example, 100 GPa or more can be adopted as a material of the core part 221 .
  • a metal material having the longitudinal elastic modulus of, for example, 100 GPa or more can be adopted as a material of the core part 221 .
  • high rigidity of the core part 221 is ensured, and also an entire wiring substrate 200 including the substrate body 210 can be suppressed from elastically deforming. Therefore, the substrate body 210 is suppressed from vibrating accompanying a resonant vibration of the sensor element 100 , and the sensitivity characteristics of the sensor element 100 can be suppressed from varying.
  • the 42 alloy has the longitudinal elastic modulus of 195 GPa and can sufficiently exert a function as the core part 221 .
  • a material of the core part 221 is a metal material such as a 42 alloy, also heat dissipation property of the controller 300 can be ensured.
  • L represents a length of a material
  • ⁇ L represents an amount of change in a length of a material when a temperature is changed by ⁇ t(K) from t 1 (K) to t 2 (K).
  • L represents a length of a material
  • ⁇ represents stress
  • ⁇ L represents an amount of distortion when stress is applied on a material.
  • the longitudinal elastic modulus of a wiring substrate 200 may well be calculated by measuring a difference before and after application of stress of lengths of the inside of the core part 221 , preferably lengths between a plurality of lands on which the sensor element 100 is mounted along a Y-axis direction.
  • the shield part 400 is formed by covering the sensor element 100 disposed on the first joint surface 201 .
  • the shield part 400 is formed into a near cuboid cap-like shape. Specifically, the shield part 400 has side surfaces and a top surface and is formed by squeezing a metal plate.
  • a joining position with the first joint surface 201 is not particularly limited. However, by joining at two or more positions, a shield effect described below can be more effectively exerted. Without particularly limiting a joining method as well, other than adhesion with an adhesive, solder joining, and seam welding, fixing by mechanical caulking may be used.
  • a groove part or a step part for engaging with an end part of the shield part 400 may be formed on the first joint surface 201 of the substrate body 210 .
  • the shield part 400 may be formed of a conductive material having a value of a linear expansion coefficient close to that of the sensor element 100 .
  • a 42 alloy that is an alloy, or W, Cu can be adopted.
  • the rigidity of the first joint surface 201 can be more increased.
  • the sensor device 1 since the sensor device 1 is generally mounted on a regulation substrate together with other electronic components, the sensor device 1 may be affected by an electromagnetic wave generated from the other electronic components. Further, since the sensor element 100 has to detect a slight displacement of a vibrator vibrated by a piezoelectric effect, sensor characteristics may be largely disturbed by intrusion of an external electromagnetic wave.
  • the shield part 400 including a conductor when the shield part 400 including a conductor is disposed to cover the sensor element 100 , the sensor element 100 can be shielded from such the external noise. Further, the shield part 400 may be electrically connected to a ground potential via an earth terminal disposed on the first joint surface 201 . Herewith, a more stable shield effect can be obtained.
  • the shield part 400 exerts a light shielding function with respect to the sensor element 100 .
  • piezoelectric characteristics of a piezoelectric film is used in order to drive the sensor element 100 and to detect an angular velocity.
  • this kind of piezoelectric film has not only a piezoelectric effect but also a pyroelectric effect.
  • the shield part 400 prevents driving characteristics of the sensor element 100 and detection characteristics of angular velocity from fluctuating owing to a change of polarization characteristics caused by irradiation of ambient light.
  • the shield part 400 exerts also a function as a cover of the sensor device 1 , and, by covering the sensor element 100 , a handling property as an electronic component can be increased.
  • FIG. 3 is an entire perspective view showing an example of a structure of the sensor element 100 , and shows a back surface side of an element that faces a wiring substrate 200 .
  • FIG. 4 is a plan view schematically showing a structure of a main part (vibrator part 101 ) of the sensor element.
  • the sensor element 100 has the vibrator part 101 and the frame body 102 .
  • the vibrator part 101 has an annular frame 10 that includes a pair of first beams, a pair of second beams and a connection part and has four sides, and pendulum parts 21 a , 21 b , 22 a and 22 b
  • the frame body 102 has a base part 81 and a coupling part 82 .
  • the frame 10 has a horizontal direction in an a-axis direction, a vertical direction in a b-axis direction and a thickness direction in a c-axis direction.
  • a Y-axis is set, and in a direction in parallel with the b-axis, an X-axis is set.
  • a Z-axis direction is an axis direction in parallel with the c-axis direction.
  • Each of sides of a frame 10 works as a vibrating beam and includes a pair of first beams 11 a and 11 b , which extend in parallel with each other in the a-axis direction, and a pair of second beams 12 a and 12 b , which extend in parallel with each other in the b-axis direction orthogonal to the a-axis direction.
  • Each of beams 11 a , 11 b , 12 a and 12 b has the same length, width and thickness, and an external appearance of the frame 10 has a hollow square shape.
  • connection parts 13 a , 13 b , 13 c and 13 d that connect between a pair of first beams 11 a an 11 b and a pair of second beams 12 a and 12 b are respectively formed. Both ends of the pair of first beams 11 a and 11 b and the pair of second beams 12 a and 12 b are supported respectively by the connection parts 13 a to 13 d.
  • the frame 10 further has first pendulum parts 21 a and 21 b , and second pendulum parts 22 a and 22 b .
  • the first pendulum parts 21 a and 21 b respectively are formed on a pair of the connection parts 13 a and 13 c , which are mutually in a diagonal relationship and extend inward of the frame 10 along its diagonal line direction.
  • the second pendulum parts 22 a and 22 b respectively are formed on the other pair of connection parts 13 b and 13 d , which are mutually in a diagonal relationship and extend inward of the frame 10 along its diagonal line direction.
  • connection parts 13 a to 13 d One end of each of the first and second pendulum parts 21 a , 21 b , 22 a , and 22 b is fixed to the connection parts 13 a to 13 d , and the other end of each thereof is set free and works as an oscillating weight disposed in the neighborhood of the frame 10 . Further, a part between one end fixed to each of the connection parts 13 a to 13 d and the other end is taken as an arm part L.
  • the sensor element 100 has, as a drive part that vibrates the frame 10 , first driving electrodes 131 respectively disposed along the pair of first beams 11 a and 11 b on top surfaces thereof, and second driving electrodes 132 respectively disposed along the pair of second beams 12 a and 12 b on top surfaces thereof.
  • the driving electrodes 131 and 132 mechanically deform corresponding to an input voltage, and a driving force of the deformation vibrates the beams 11 a , 11 b , 12 a and 12 b .
  • a direction of deformation is regulated by a polarity of an input voltage.
  • each of the driving electrodes 131 and 132 is shown with a different kind of hatching.
  • the driving electrodes 131 and 132 each has the same structure, and, though omitted from showing in the drawing, has a laminate structure of upper and lower electrode layers and a layer of piezoelectric material formed between these electrode layers.
  • the layer of piezoelectric material is formed from, for example, lead titanate zirconate (PZT) and polarized and oriented to expand and shrink corresponding to a potential difference between the upper electrode layer and the lower electrode layer. Therefore, when a lower electrode layer of each of the driving electrodes 131 and 132 is connected to a common reference potential to apply an AC current to the upper electrode layer of each thereof, a piezoelectric material layer can be expanded and shrunk.
  • PZT lead titanate zirconate
  • first driving electrode 131 and a second driving electrode 132 voltages of mutually opposite phases are applied to expand one and shrink the other.
  • beams 11 a and 11 b and beams 12 a and 12 b are flexurally deformed in b-axis and a-axis directions with both ends thereof supported by the connection parts 13 a to 13 d and vibrate in the X-Y plane alternately between a direction where both separate from each other and a direction where both come near with each other.
  • a pair of first beams 11 a and 11 b vibrates in a direction where these mutually come near
  • a pair of second beams 12 a and 12 b vibrate in a direction where the beams separate from each other
  • a pair of first beams 11 a and 11 b vibrates in a direction where these separate from each other
  • a pair of second beams 12 a and 12 b vibrates in a direction where these come near with each other.
  • a center part of each of the beams 11 a , 11 b , 12 a , and 12 b forms an antinode of vibration
  • both end parts thereof form nodes of vibration.
  • Such the vibration mode will be referred to, hereinafter, as a fundamental vibration of the frame 10 .
  • Each of the beams 11 a , 11 b , 12 a , and 12 b is driven at a resonant frequency thereof.
  • a resonant frequency of each of beams 11 a , 11 b , 12 a , and 12 b is determined by a shape and a length thereof.
  • a resonant frequency of each of beams 11 a , 11 b , 12 a , and 12 b is set in the range of 1 to 100 kHz.
  • FIG. 5 is a schematic diagram showing a temporal change of a fundamental vibration of the frame 10 .
  • a driving signal 1 shows a temporal change of an input voltage that is input to a first driving electrode 131
  • a driving signal 2 shows a temporal change of an input voltage that is input to a second driving electrode 132 .
  • each of the driving signal 1 and driving signal 2 has an AC wave shape changing in an opposite phase from each other.
  • the frame 10 changes in an order of (a), (b), (c), (d), (a), . . .
  • first pendulum parts 21 a and 21 b and second pendulum parts 22 a and 22 b synchronize with a vibration of the frame 10 and vibrate respectively in the X-Y plane with the connection parts 13 a to 13 d as a center. Vibrations of pendulum parts 21 a , 21 b , 22 a , and 22 b are excited by vibrations of the beams 11 a , 11 b , 12 a , and 12 b .
  • first pendulum parts 21 a and 21 b and second pendulum parts 22 a and 22 b vibrate (fluctuate) in an opposite phase from each other in a left and right fluctuation direction from a fulcrum part of a pendulum part in the X-Y plane, that is, the connection parts 13 a to 13 d.
  • first pendulum part 21 b and the second pendulum part 22 b vibrate alternately between a direction where these separate from each other and a direction where these come near with each other depending on a vibration direction of the pair of second beams 12 a and 12 b .
  • the first pendulum parts 21 a and 21 b and the second pendulum parts 22 a and 22 b vibrate in an opposite phase from each other in synchronizing with a fundamental vibration of the frame 10 .
  • each of beams 11 a , 11 b , 12 a , and 12 b of the frame 10 vibrates in a vibration mode shown in FIG. 5 .
  • an angular velocity about a Z-axis is applied to the frame 10 that continues such the fundamental vibration, since a Coriolis force due to the angular velocity is operated at the respective points of the frame 10 , the frame 10 is strained and deformed in the X-Y plane as was shown in FIG. 6 . Therefore, when an amount of deformation of the frame 10 in the X-Y plane is detected, a magnitude and a direction of an angular velocity operated on the frame 10 can be detected.
  • FIG. 6 is a plan view schematically showing a situation of deformation of the frame 10 at an instant of the frame 10 on which an angular velocity about a Z-axis is operated.
  • a shape and a situation of deformation of the frame 10 are shown by slightly exaggerating.
  • FIG. 6 shows a situation when a predetermined angular velocity operates clockwise with a Z-axis as a center.
  • a direction of an angular velocity is opposite (anticlockwise)
  • a direction of a Coriolis force that works on each of points becomes opposite.
  • a piezoelectric type detection layer formed on the frame 10 is used to measure the angular velocity.
  • the sensor element 100 has, as shown in FIG. 4 , four detecting electrodes 51 as a piezoelectric type detection layer that detects an angular velocity about a Z-axis.
  • Each of detecting electrodes 51 a , 51 b , 51 c , and 51 d is formed respectively on the periphery of each of the connection parts 13 a to 13 d .
  • Each of the detecting electrodes 51 a to 51 d extends in two directions along the beams from connection parts 13 a to 13 d .
  • the detecting electrode 51 has a structure the same as those of the driving electrodes 131 and 132 , includes a laminate body of a lower electrode layer, a piezoelectric material layer and an upper electrode layer, and has a function of converting a mechanical deformation of each of the beams into an electrical signal.
  • the sensor element 100 of the present embodiment has detecting electrodes 71 a , 71 b , 72 a , and 72 b respectively formed on the pendulum parts 21 a , 21 b , 22 a and 22 b.
  • Each of the detecting electrodes 71 a , 71 b , 72 a and 72 b is linearly formed on a shaft center of an arm part L of each of pendulum parts 21 a , 21 b , 22 a and 22 b .
  • Each of the detecting electrodes 71 a , 71 b , 72 a , and 72 b has a structure the same as those of the first and second driving electrodes 131 and 132 , includes a laminate body of a lower electrode layer, a piezoelectric material layer and an upper electrode layer, and has a function of converting a mechanical deformation of an arm part L into an electrical signal.
  • each of the detecting electrodes 71 a , 71 b , 72 a and 72 b has a function of detecting a deformation in a Z-axis direction of an arm part L.
  • one angular velocity detecting axis (Y-axis) is set on an axis direction in parallel with an a-axis
  • the other angular velocity detecting axis (X-axis) is set on an axis direction in parallel with a b-axis.
  • each of the detecting electrodes 71 a , 71 b , 72 a , and 72 b formed on the pendulum parts 21 a , 21 b , 22 a and 22 b functions as a detection part for detecting an angular velocity about an X-axis and an angular velocity about a Y-axis.
  • FIG. 7A is a schematic perspective view for describing vibration modes of the pendulum parts 21 a , 21 b , 22 a and 22 b when an angular velocity about an X-axis is applied to the frame 10 .
  • FIG. 7B is a schematic perspective view for describing vibration modes of the pendulum parts 21 a , 21 b , 22 a and 22 b when an angular velocity about a Y-axis is applied to the frame 10 .
  • the other pair of pendulum parts 22 a and 21 b that are adjacent in an X-axis direction is deformed in a negative direction of a Z-axis owing to a Coriolis force F 1 , and amounts of deformation thereof are detected respectively by detecting electrodes 72 a and 71 b.
  • the other pair of pendulum parts 21 b and 22 b that are adjacent in a Y-axis direction is deformed in a positive direction of a Z-axis owing to a Coriolis force F 2 , and amounts of deformation thereof are detected respectively by detecting electrodes 71 b and 72 b.
  • each of the pendulum parts 21 a , 21 b , 22 a and 22 b is deformed by a Coriolis force corresponding to a X-direction component and a Y-direction component of the angular velocity and amounts of deformation thereof are detected respectively by the detecting electrodes 71 a , 71 b , 72 a and 72 b .
  • a driver of a sensor element respectively extracts, based on outputs of these detecting electrodes, an angular velocity about an X-axis and an angular velocity about a Y-axis.
  • an angular velocity about an optional axis in parallel with the X-Y plane can be detected.
  • controller 300 Next, the controller 300 will be described.
  • the controller 300 is used, as was described above, as a controller of the sensor element 100 .
  • the controller 300 has a plurality of terminal parts 310 electrically connected with each of electrodes of the sensor element 100 .
  • the terminal part 310 is, as was described above, directly connected with a land of the lower wiring layer 232 and electrically connected with the sensor element 100 via a via formed inside of the substrate body 210 .
  • the controller 300 has a self-excited oscillation circuit, a detector circuit, and a smoothing circuit.
  • the self-excited oscillation circuit is connected to driving electrodes 131 and 132 and generates driving signals (AC signal) for driving these. Further, when on a side of a terminal connected to one of the driving electrodes 131 and 132 , an inverting amplifier is disposed, the driving electrodes 131 and 132 can be expanded and shrunk respectively in opposite phases. Further, the controller 300 may have a terminal connected to a reference potential.
  • each of the detecting electrodes 51 a to 51 d , 71 a , 71 b , 72 a and 72 b is connected to an arithmetic circuit to detect an electric signal according to a deformation of each of detecting electrodes.
  • Each of the arithmetic circuit is disposed to generate an angular velocity signal about an X-axis, a Y-axis or a Z-axis, and, when a predetermined arithmetic operation (operation such as differencing operation) is performed with respect to electric signals outputted from the detecting electrodes 51 a to 51 d , 71 a , 71 b , 72 a and 72 b , a new arithmetic signal containing a signal concerning an angular velocity is generated.
  • a predetermined arithmetic operation operation such as differencing operation
  • these arithmetic signals are outputted to a detector circuit.
  • the detector circuit full-wave rectifies these arithmetic signals synchronized with an output of driving signal from the self-excited oscillation circuit to convert into a direct current. Further, a signal converted into the direct current is outputted to a smoothing circuit to smooth.
  • a smoothing circuit to smooth.
  • magnitudes and directions of angular velocities about an X-axis, a Y-axis and a Z-axis are contained.
  • These DC voltage signals can be outputted from the terminal part 310 of the controller 300 via the lower wiring layer 232 and the external connection terminal 232 a to other regulation substrate.
  • the controller 300 embedded in the substrate body 210 and the sensor element 100 are disposed to face in a Z-axis direction.
  • a device structure can be more miniaturized.
  • the substrate body 210 is formed of a ceramic substrate, for example, it is not practical from the view point of cost to take a structure where a component is incorporated. Therefore, when the sensor element 100 and the controller 300 are mounted by superposing (that is, laminating) mounting areas thereof, it is necessary to form, in the substrate body 210 , a recess part for housing either one of the sensor element 100 and the controller 300 .
  • the controller 300 is disposed on a recess part, since the sensor element 100 has to be disposed on the recess part and a size of the sensor element 100 has to be formed larger than those of the controller 300 and the recess part, it is difficult to correspond to miniaturization.
  • the sensor element 100 is housed in the recess part, it is difficult to conduct laser trimming after mounting. That is, in the case where the sensor element 100 is formed from a gyrosensor, in order to correct vibration characteristics caused by shape asymmetry of a vibrator, in some cases, after mounting, a shape is adjusted by laser processing while confirming an output signal. In this case, when the sensor element 100 is housed in the recess part, since a circumference of the sensor element 100 is covered with the substrate body 210 and the controller 300 , it is difficult to irradiate laser onto the sensor element 100 .
  • the controller 300 can be readily embedded.
  • a nearly flat first joint surface 201 can be ensured on the substrate body 210 , and a degree of freedom of a size of the sensor element 100 mounted thereon can be increased. Therefore, the sensor element 100 can be miniaturized and the number of sensor elements obtained from 1 wafer during manufacture can be increased to contribute also to reduce the cost.
  • the sensor element 100 can be typically disposed on the first joint surface 201 .
  • a structure that allows to conduct laser trimming after mounting can be obtained.
  • thus formed sensor device 1 has the regulation part 220 containing the core part 221 configured of a 42 alloy.
  • a linear expansion coefficient in a plane direction of the substrate body 210 containing an epoxy resin can be approximated to a linear expansion coefficient of the sensor element 100 . Therefore, inconveniences such as characteristics change of the sensor element 100 and breakdown of a joint part, which are caused by thermal expansion can be suppressed.
  • the longitudinal elastic modulus in a plane direction of the substrate body 210 including an epoxy resin can be approximated to a longitudinal elastic modulus of the sensor element 100 .
  • the rigidity of the substrate body 210 can be increased, and the first joint surface 201 can be suppressed from elastically deforming accompanying a vibration of the sensor element 100 . Therefore, a resonant frequency of the sensor element 100 can be stabilized and desired vibration characteristics of the sensor element 100 can be maintained.
  • FIGS. 8 and 9 are diagrams showing a structure of a sensor device according to a second embodiment of the present technology
  • FIG. 8 is a schematic sectional view
  • FIG. 9 is a schematic side view seen from a Y-axis direction.
  • like members corresponding to those of the first embodiment have the like numbers, and detailed description thereof will be omitted.
  • a sensor device 1 A according to the present embodiment is different from the first embodiment in that a core part 221 A of a regulation part 220 A and a shield part 400 A are joined by a joint part (first joint part) 223 A. Since other members have structures the same as those of the sensor device 1 according to first embodiment, a structure of the regulation part 220 A will be mainly described.
  • the regulation part 220 A has, in addition to the core part 221 A having a structure the same as that of the first embodiment, a joint part 223 A.
  • the joint part 223 A joins the core part 221 A and a shield part 400 A and is embedded in the substrate body 210 .
  • the joint part 223 A according to the present embodiment is disposed at two positions that face in a Y-axis direction. However, the number thereof to be disposed is not particularly limited.
  • the joint part 223 A is formed of a columnar body obtained by filling a metal in a hole formed inside of the substrate body 210 A.
  • the joint part 223 A is formed in such a manner that one end thereof is joined with the core part 221 A, and the other end thereof protrudes from a first joint surface 201 A to come into contact with the shield part 400 A.
  • a material that constitutes the joint part 223 A is not particularly limited. However, for example, Cu can be adopted.
  • the following first to third processes are adopted.
  • a hole is formed in a region for forming the joint part 223 A.
  • the hole is formed on the core part 221 A so that the core part 221 A is exposed from a bottom part.
  • a post columnumnar body of metal such as Cu is buried in the hole.
  • An end surface of the metal post may well be formed to be the same plane with the first joint surface 201 A, and when the end surface protrudes, a height may be adjusted by polishing.
  • the core part 221 A can be handled as a seed, or a seed layer may be separately formed at a bottom part of the hole.
  • the joint part 223 A having the above structure can be formed.
  • the joint part 223 A may be formed.
  • any one of the first to third processes by coating a joining material of a conductive paste on an end surface of the columnar body that forms the joint part 223 A and by bringing into contact with the shield part 400 A, the joint part 223 A and the shield part 400 A can be electrically joined.
  • the core part 221 A is formed from a material that has a value of a linear expansion coefficient close to that of the sensor element 100 such as a 42 alloy. Further, a material having the longitudinal elastic modulus of, for example, 100 GPa or more and high rigidity can be adopted.
  • the shield part 400 A is formed from a material having a value of the linear expansion coefficient close to that of the sensor element 100 .
  • a 42 alloy that is an alloy, W and Cu can be adopted, and these materials can sufficiently ensure the rigidity as well.
  • the shield part 400 A, the joint part 223 A and the core part 221 A as a whole form a large electromagnetic shield and can shield an external intrusion of an electromagnetic wave. Therefore, also with respect to an upper wiring layer 231 A and the controller 300 , of which circumference is covered with the joint part 223 A and the core part 221 A, a shield effect can be exerted and operational reliability as the sensor device 1 as a whole can be more increased. Further, when at least any one of the joint part 223 A, the core part 221 A and the shield part 400 A is connected to a grounding circuit, a more stable shield effect can be exerted.
  • the shield part 400 A and the core part 221 A are joined with the joint part 223 A, thermal expansion in a first region 211 A of the substrate body 230 A can be suppressed, thus stress between the first joint surface 201 A and the terminal part 114 can be suppressed. Further, since the rigidity of the first region 211 A is increased, desired sensor characteristics of the sensor element 100 can be stably maintained.
  • FIG. 10 is a schematic sectional view of a sensor device according to a third embodiment of the present technology.
  • like members corresponding to those of the first embodiment have the like numbers, and a detailed description thereof will be omitted.
  • a sensor device 1 B according to the present embodiment has a structure of a regulation part 220 B in a wiring substrate 200 B different from that of the first embodiment. That is, the regulation part 220 B according to the present embodiment includes, in place of a core part, a base material 224 B of an inorganic insulating material. The base material 224 B is disposed between the sensor element 100 and a substrate body 210 B, and is laminated with the substrate body 210 B.
  • the base material 224 B includes a multilayered wiring substrate made of an inorganic insulating material such as ceramics, Si, or MgO.
  • an inorganic insulating material such as ceramics, Si, or MgO.
  • a linear expansion coefficient of ceramics is 7.0 ⁇ 10 ⁇ 6 /° C. That is, the base material 224 B is formed of a material having a linear expansion coefficient close to that of the sensor element 100 .
  • a first joint surface 201 B and a third joint surface 203 B which face with each other in a thickness direction are formed.
  • a surface wiring is formed on each of the first and third joint surfaces 201 B and 203 B.
  • the first joint surface 201 B forms a top surface in a manner the same as that of the first embodiment and is electrically joined with the sensor element 100 .
  • the third joint surface 203 B forms a bottom surface and is disposed on a side opposite to the substrate body 210 B. Between the first joint surface 201 B and the third joint surface 203 B, vias are formed (omitted from illustrating) and electrical connections with the respective wiring layers are ensured.
  • the base material 224 B may be, without limiting to a multilayered wiring substrate, a double-sided substrate, for example.
  • a surface wiring containing a plurality of land parts for electrically connecting with terminal parts 114 of the sensor element 100 is formed.
  • These surface wirings form a part of a wiring layer (omitted from illustrating) disposed on the base material 224 B.
  • a recess part may be formed in a region that faces the vibrator part 101 of the sensor element 100 of the first joint surface 201 B.
  • the sensor element 100 can be stably supported.
  • a terminal part 225 B for electrically connecting with the substrate body 210 B may be formed on the third joint surface 203 B.
  • the terminal part 225 B includes, for example, an electrode pad and a solder bump formed thereon, and forms a part of a surface wiring of the base material 224 B.
  • the base material 224 B is mounted on the substrate body 210 B via the terminal part 225 B by a flip-chip process.
  • a shield part 400 B is, in the present embodiment, disposed on the base material 224 B and formed by covering the sensor element 100 .
  • a rough structure of the shield part 400 B has, in a manner the same as that of the first embodiment, side surfaces and a top surface, and is formed squeezing a metal plate. Also as a joining method with the first joint surface 201 B, in a manner the same as that of the first embodiment, other than adhesion with an adhesive, mechanical caulking, or engagement with a groove part or a step part can be used.
  • the shield part 400 B may be formed from a material having a value of a linear expansion coefficient close to that of the sensor element 100 .
  • a 42 alloy that is an alloy, or W or Cu can be adopted.
  • stress in a joint region with the first joint surface 201 can be suppressed.
  • characteristics change of the sensor element 100 can be suppressed.
  • a rough structure of the substrate body 210 B is the same as that of the first embodiment. That is, the substrate body 210 B is a multilayered wiring substrate of an epoxy resin, inside of which the controller 300 is embedded.
  • the second embodiment is different from the first embodiment in that the core part is not embedded, and a fourth joint surface 204 B that is electrically connected with the third joint surface 203 B of the base material 224 B is included.
  • the fourth joint surface 204 B is disposed to face the third joint surface 203 B and a land part electrically connected with a terminal part 225 B of the base material 224 B is disposed.
  • the land part forms, in a manner the same as that of the first embodiment, a part of a wiring layer 230 B of the substrate body 210 B.
  • a second joint surface 202 B has a structure the same as that of the first embodiment. That is, an external connection terminal 232 Ba connected with a not-shown regulation substrate is formed.
  • the base material 224 B that is a multilayered substrate and the substrate body 210 B are electrically joined by a flip-chip process and have a laminated structure.
  • the respective wiring layers of the base material 224 B and the substrate body 210 B are electrically connected via a plurality of joint parts 225 B and appropriately disposed vias, and can function as one multi-layered wiring substrate.
  • the regulation part 220 B has the base material 224 B formed from a material having a longitudinal elastic modulus and a linear expansion coefficient close to those of the sensor element 100 .
  • a first joint surface 201 B on the base material 224 B can suppress deformation with respect to the sensor element 100 . Therefore, strain stress in a plane (XY plane) direction of the sensor element 100 can be suppressed from occurring, and characteristics change owing to a change of a resonant frequency can be suppressed. Further, a vibration of the base material 224 B accompanying a resonant vibration of the sensor element 100 is suppressed, and the vibration characteristics of the sensor element 100 can be maintained.
  • FIG. 11 is a schematic sectional view of a sensor device according to a fourth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a rough structure of a sensor device 1 C according to the present embodiment is the same as that of the sensor device 1 B according to the third embodiment.
  • a different point is that the regulation part 220 C has the base material 224 C and a core part 221 C.
  • the core part 221 C has a structure the same as that of the core part 221 C according to the first embodiment. That is, the core part 221 C is embedded in a third region 213 C of a substrate body 210 C and is annually disposed around the controller 300 . Further, as a material of the core part 221 C, for example, a 42 alloy is adopted. Herewith, the core part 221 C can be formed at a value of a linear expansion coefficient close to that of the sensor element 100 .
  • the substrate body 210 C can be set to a value of a linear expansion coefficient close to that of the sensor element 100 .
  • thermal expansion in a plane direction of the substrate body 210 C is suppressed, and inconvenience such as breakdown in the first joint surface 201 C can be suppressed.
  • a 42 alloy is adopted as a material of the core part 221 C, since a longitudinal elastic modulus thereof is 100 GPa or more, the rigidity of the substrate body 210 C as a whole can be increased. Therefore, a sensitivity change accompanying a resonant frequency change of the sensor element 100 can be suppressed.
  • FIG. 12 is a schematic sectional view of a sensor device according to a fifth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a rough structure of a sensor device 1 D according to the present embodiment is the same as those of the sensor devices 1 B and 1 C according to the third and fourth embodiments.
  • a regulation part 220 D further includes, in addition to a base material 224 D and a core part 221 D, a joint part (second joint part) 226 D that connects the base material 224 D and the core part 221 D.
  • the joint part 226 D is formed into a columnar body where, in a hole formed inside of a substrate body 210 D, a metal is filled.
  • the joint part 226 D is formed in such a manner that one end thereof abuts on the core part 221 A and protrudes from a fourth joint surface 204 D, and the other end abuts on a third joint surface 203 D of the base material 224 D.
  • a material that forms the joint part 226 D is not particularly limited. However, for example, Cu can be adopted.
  • the joint part 226 D may be formed to be connected with a wiring layer of the third joint surface 203 D.
  • a shield part 400 D, the base material 224 D, the joint part 226 D and the core part 221 D can ensure electrical conduction and can be functioned as a large electromagnetic shield that covers up to a third region 213 D of the substrate body 210 D.
  • the joint part 226 D can function as a via that connects a wiring layer of the base material 224 D and the lower wiring layer 232 D.
  • the joint part 226 D can be formed according to a process the same as that of the joint part 223 A in the second embodiment, for example. Therefore, description of parts different from the first to third processes described in the second embodiment will be added.
  • a metal post is polished to a height where the metal post protrudes by a predetermined amount from the fourth joint surface 204 D.
  • the height is determined by considering a height of a terminal part 225 D of the base material 224 D. Then, when mounting the substrate body 210 D and the base material 224 D, an end surface of the metal post abuts on a surface wiring of the base material 224 D to form the joint part 226 D.
  • the joint part 226 D is formed by plating.
  • a predetermined amount of plating is protruded from the fourth joint surface 204 D, a predetermined thickness of resist is formed on the fourth joint surface 204 D.
  • the joint part 226 D having the configuration can be formed.
  • the joint part 226 D is formed with a conductive paste.
  • the joint part 226 D protruded on the fourth joint surface 204 D can be formed.
  • any of the first to third processes when a joining material of a conductive paste is coated on an end surface of a columnar body that forms the joint part 226 D and brought into contact with the base material 224 D, mechanical strength at a joint region of the joint part 226 D and the base material 224 D can be more increased.
  • the joint part 226 D can fix the base material 224 D and the core part 221 D, the rigidity of the base material 224 D can be increased. Therefore, a resonant frequency of the sensor element 100 can be more stabilized and desired vibration characteristics of the sensor element 100 can be maintained.
  • the joint part 226 D can be used as a via that electrically connects wiring layers of the base material 224 D and the substrate body 210 D, and can more increase freedom of wiring design. Further, the joint part 226 D can be functioned as a part of an electromagnetic shield that covers the shield part 400 D, the wiring layer and the controller 300 . Therefore, the sensor device 1 D having higher operational reliability can be provided.
  • the base material 224 D can be fixed to the core part 221 D, by further suppressing an elastic deformation of the first joint surface 201 D accompanying a vibration of the sensor element 100 , the rigidity can be more increased. Therefore, a resonant frequency of the sensor element 100 can be more stabilized and desired vibration characteristics of the sensor element 100 can be maintained.
  • FIG. 13 is a schematic sectional view of a sensor device according to a sixth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a rough structure of a sensor device 1 E according to the present embodiment is the same as that of the fourth embodiment. That is, a regulation part 220 C includes a base material 224 E and a core part 221 E embedded in a substrate body 210 E. On the other hand, a shield part 400 E is formed to cover the base material 224 E.
  • the base material 224 E according to the present embodiment is formed in such a manner that a first joint surface 201 E has an area nearly the same as an surface area of the sensor element 100 .
  • the first joint surface 201 E is formed smaller than an area that covers the shield part 400 E.
  • the shield part 400 E is disposed, in the present embodiment, not on the first joint surface 201 E, but on a fourth joint surface 204 E of the substrate body 210 E.
  • the shield part 400 E can cover not only the sensor element 100 but also the base material 224 E. Therefore, a shielding effect of a sensor device 1 E can be further increased. Further, owing to the shield part 400 E, a joint region between the sensor element 100 and the base material 224 E can be protected from intrusion of external humidity and moisture and external stress. Thus, the operational reliability as the sensor device 1 E can be more increased.
  • the sensor element 100 and the base material 224 E are disposed inside the shield part 400 E, even when an external force is applied on the shield part 400 E, an influence of the external force can be less transmitted. Therefore, the sensor device 1 E is excellent in a handling property and, even when mounted on an electronic instrument as a package component, sensor characteristics can be stably maintained.
  • FIG. 14 is a schematic sectional view of a sensor device according to a seventh embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a regulation part 220 F according to the present embodiment is the same as the regulation part 220 D according to the fifth embodiment, and has a base material 224 F, a core part 221 F and a joint part 226 F.
  • a wiring substrate 200 F has an adhesive layer 250 F that is filled between the base material 224 F and a substrate body 210 F.
  • the base material 224 F and the substrate body 210 F are, as was described above, joined by flip-chip mounting via a terminal part 225 F, and an adhesive layer 250 F is formed as an underfill material that covers a joint region including a terminal part 225 F.
  • an adhesive layer 250 F is formed as an underfill material that covers a joint region including a terminal part 225 F.
  • a resin material such as an epoxy resin can be used.
  • the adhesive layer 250 F for example, after mounting the base material 224 F and the substrate body 210 F by a flip-chip process, in a gap thereof, a resin material such as an epoxy resin is dropped from a needle. Then, according to a capillary tube phenomenon, the resin material is permeated into a gap between the base material 224 F and the substrate body 210 F and cured by heating, thus, the adhesive layer 250 F is formed.
  • a resin material such as an epoxy resin is dropped from a needle.
  • a joint region including the terminal part 225 can be protected from intrusion of external humidity and moisture or external stress.
  • joint reliability between the base material 224 F and the substrate body 210 F can be increased.
  • the base material 224 F can be more strongly adhered to the substrate body 210 F.
  • the rigidity of the base material 224 F can be more increased, and desired vibration characteristics of the sensor element 100 can be maintained.
  • a sensor device 1 F according to the present embodiment may have, without limiting the above structure, structures where an adhesive layer 250 E is provided to sensor devices having structures the same as those of the sensor devices 1 B and 1 C according to the third and fourth embodiments. Also by this, the above-described function effect can be obtained.
  • FIG. 15 is a schematic sectional view of a sensor device according to an eighth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a regulation part 220 G according to the present embodiment is the same as the regulation part 220 F according to the seventh embodiment, and has a base material 224 G, a core part 221 G and a joint part 226 G. Further, a wiring substrate 200 G has an adhesive layer 250 G. Still further, a sensor device 1 G according to the present embodiment has a third joint surface 203 G of a substrate body 210 G that is electrically joined with the controller 300 .
  • the controller 300 according to the present embodiment is disposed inside the substrate body 210 G in a state where front and back are reversed from that of the controller 300 according to the seventh embodiment.
  • a mounting surface of the controller 300 provided with the terminal part 310 is disposed opposite not to the lower wiring layer 232 but to the base material 224 G and joined with the third joint surface 203 G of the base material 224 G.
  • a joining process for example, a flip-chip process can be adopted.
  • the substrate body 210 G has second and third regions 212 G and 213 G but does not have a first region.
  • a wiring layer 230 G does not have an upper wiring layer but has only a lower wiring layer 232 G. Therefore, the substrate body 210 G can be formed with a thinner thickness.
  • the process for manufacturing the wiring substrate 200 G includes the step of forming the second region 212 G, the step of forming the third region 213 G, and the step of joining the base material 224 G, the controller 300 and the joint part 226 G.
  • the step of forming the second region 212 G is the same as that of the second region 212 according to the first embodiment, description thereof will be omitted. That is, by forming a wiring layer on an organic insulator layer, a single-sided or double-sided wiring substrate is manufactured and these are laminated.
  • a core part 221 G is joined with a part of the lower wiring layer 232 G on the second region 212 G.
  • the joining is performed by a reflow process that uses a solder, for example.
  • an epoxy resin is coated in a semi-cured state.
  • the controller 300 and a joint part 226 G are joined.
  • the controller 300 is mounted by a flip-chip process via the terminal part 310 .
  • the joint part 226 G is joined with the base material 224 G, as a columnar body molded into a predetermined length, by a process such as surface mounting or throughhole mounting.
  • the base material 224 G where the controller 300 and the joint part 226 G are joined on the third joint surface 203 G is joined on a resin layer in a semi-cured state.
  • the third joint surface 203 G and a resin layer are joined to face with each other, and the controller 300 and the joint part 226 G are embedded in a resin layer.
  • the controller 300 and the joint part 226 G can be simultaneously formed, that is, the step of manufacturing can be simplified.
  • an adhesive layer 250 G is formed in a gap between the base material 224 G and the substrate body 210 G.
  • a joint region can be protected from intrusion of external humidity or moisture or external stress, and joint reliability between the base material 224 G and the substrate body 210 F can be more increased.
  • the rigidity of the base material 224 G can be increased and desired vibration characteristics of the sensor element 100 may be maintained.
  • a sensor device 1 G according to the present embodiment has the joint part 226 G. Therefore, in a manner the same as the fifth embodiment, the rigidity of the base material 224 G can be increased. Further, since a structure having a shielding function of covering the sensor element 100 and the controller 300 can be adopted, the sensor device 1 G high in the operational reliability can be provided.
  • FIG. 16 is a schematic sectional view of a sensor device according to a ninth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a regulation part 220 H according to the present embodiment has, the same as the regulation part 220 B according to the third embodiment, a base material 224 H. Further, the controller 300 is, the same as the eighth embodiment, joined with the base material 224 H.
  • a substrate body 210 H according to the present embodiment has a longitudinal elastic modulus smaller than that of the base material 224 H. That is, the substrate body 210 H is formed flexible.
  • a so-called damper effect can be exerted to alleviate a stress owing to mounting distortion.
  • the wiring substrate 200 H is joined with a regulation substrate, a mounting distortion owing to a temperature difference during bonding and operation is generated, and a stress may be imparted to the sensor element 100 via the substrate body 210 H.
  • the vibration characteristics of the sensor element 100 may be affected.
  • the substrate body 210 H is formed in such a manner that a longitudinal elastic modulus thereof is smaller than that of the base material 224 H configured of an inorganic insulating material such as ceramics or Si.
  • the stress from the regulation substrate is absorbed by the substrate body 210 H, and an influence on the sensor element 100 can be suppressed.
  • the substrate body 210 H is formed at a value of a longitudinal elastic modulus thereof smaller by 100 GPa or more than that of the base material 224 H.
  • the substrate body 210 H may well be formed to have a value of 210 GPa or less.
  • an organic insulating material an epoxy resin that contains a very small amount of hard additive such as glass fiber is adopted.
  • a longitudinal elastic modulus of an organic insulating material can be further reduced.
  • the base material 224 H to which the sensor element 100 is joined has a strong structure also when seen from a linear expansion coefficient and a longitudinal elastic modulus, even when a value of the longitudinal elastic modulus of the substrate body 210 H is small, the vibration characteristics of the sensor element 100 can be maintained.
  • the substrate body 210 H has, the same as the eighth embodiment, a second region 212 H and a third region 213 H.
  • the second region 212 H is formed from a multilayered wiring substrate on which a lower wiring layer 232 H is formed.
  • a core part is not disposed in the neighborhood of a region where the controller 300 is embedded.
  • a third wiring layer 233 H may be formed in the third region 213 H.
  • the substrate body 210 H having the structure can be manufactured as shown below, for example.
  • the second region 212 H is formed in a manner the same as that of the first embodiment. That is, the second region 212 H is manufactured by alternately laminating an organic insulating layer and a wiring layer by a build-up process.
  • the third region 213 H is manufactured in the same manner.
  • a recess part for housing the controller 300 is formed by polishing or a laser process.
  • the controller 300 is housed in the recess part.
  • the controller 300 may have been joined with the base material 224 H by a flip-chip process, or, simultaneously, the base material 224 H and the fourth joint surface 204 H may be joined by a flip-chip process.
  • an insulating layer is formed of an epoxy resin and softer compared with ceramics for example, a recess part can be readily formed. Further, since the sensor element 100 is disposed on the base material 224 H, a magnitude thereof is not limited by a shape of the recess part.
  • a sensor device 1 H according to the present embodiment can effectively alleviate stress imparted after mounting on a regulation substrate and the vibration characteristics of the sensor element 100 can be controlled. Therefore, the sensor device 1 H having high operational reliability can be provided.
  • FIG. 17 is a schematic sectional view of a sensor device according to a tenth embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a regulation part 220 J according to the present embodiment has, the same as the regulation part 220 B according to the third embodiment, a base material 224 J.
  • the controller 300 is, the same as the eighth and ninth embodiments, joined with the base material 224 J.
  • both the sensor element 100 and controller 300 are joined with a base material 224 J by a conductive joining material such as solder, and the base material 224 J and a substrate body 210 J are electrically joined by a wire bonding process.
  • the sensor element 100 is joined via a conductive joining material with a first joint surface 201 J of the base material 224 J and the controller 300 is joined via a conductive joining material with a third joint surface 203 J of the base material 224 J.
  • the first joint surface 201 J of the base material 224 J has a terminal part 225 J formed in the neighborhood of the sensor element 100 .
  • the terminal part 225 J is electrically connected via a wire W formed from gold (Au) with a terminal on a side of a fourth joint surface 204 J of the substrate body 210 J.
  • Au gold
  • the substrate body 210 J has a second region 212 J and a third region 213 J.
  • the second region 212 J has, the same as the respective embodiments, a multilayered wiring substrate on which a lower wiring layer 232 J is formed.
  • the third region 213 J has a third wiring layer 233 J in the neighborhood of a region where the controller 300 is buried. That is, a terminal of the fourth joint surface 204 J partly forms the third wiring layer 233 J.
  • a shield part 400 J according to the present embodiment is disposed in the present embodiment on the fourth joint surface 204 J of the substrate body 210 J. Further, the base material 224 J is formed larger than a surface area of the sensor element 100 and smaller than an area that the shield part 400 J covers.
  • the shield part 400 J since all of the first joint surface 201 J, the third joint surface 203 J and a joint region containing a terminal part 225 that is joined by a wire bonding process is covered with the shield part 400 J, a joint region can be protected from external stress, or intrusion of external humidity and moisture.
  • FIG. 18 is a schematic sectional view of a sensor device according to an eleventh embodiment of the present technology.
  • like members corresponding to those of the third embodiment have like numbers, and detailed description thereof will be omitted.
  • a regulation part 220 K of a sensor device 1 K according to the present embodiment has, the same as the regulation part 220 B according to the third embodiment, a base material 224 K. Further, the controller 300 is, the same as the eighth embodiment, joined with the base material 224 K via the terminal part 310 .
  • a substrate body 210 K has an external connection terminal 232 Ka configured of a solder ball S such as a copper (Cu) core solder ball or a resin core solder ball.
  • the external connection terminal 232 Ka is formed to electrically connect the base material 224 K and a not-shown regulation substrate. That is, the external connection terminal 232 Ka is disposed on a land part 231 K formed on a third joint surface 203 K of the base material 224 K and can be mounted on a regulation substrate by a reflow process.
  • the land part 231 K forms a wiring layer of the substrate body 210 K.
  • the substrate body 210 K is formed directly on the base material 224 K. That is, the third joint surface of the base material 224 K and the fourth joint surface 204 K of the substrate body 210 K are disposed in immediate proximity. From the viewpoint of the joinability of the land part 231 K with the base material 224 K, these may be joined via an adhesion layer containing gold (Au) or nickel (Ni).
  • the substrate body 210 K contains an underfill resin U configured of an electromagnetic wave absorber as an organic insulator. Owing to such the underfill resin U, the electronic component 300 can be suppressed from being directly exposed to electrostatic noise from the regulation substrate.
  • FIGS. 19A to 19D are sectional views for describing the step of manufacturing the substrate body 210 K of the sensor device 1 K according to the present embodiment.
  • FIG. 19A shows the base material 224 K in a state where the sensor element 100 is mounted on a first joint surface 201 K.
  • a terminal part 225 K that forms a part of a wiring layer of the base material 224 K is formed.
  • the terminal part 225 K includes a plurality of terminals 225 Ka for electrically connecting with a regulation substrate via the substrate body 210 K and a plurality of terminals 225 Kb for electrically connecting with the controller 300 .
  • the plurality of terminals 225 Ka is disposed at a predetermined distance in a periphery part of the third joint surface 203 K, for example.
  • the plurality of terminals 225 Kb is disposed, for example, at a center part of the third joint surface 203 K separated by a predetermined distance from each other. In FIG. 18 , the terminal part 225 K is omitted from showing.
  • the controller 300 is mounted via the terminal part 225 Kb by a flip-chip process ( FIG. 19B ). Then, the land part 231 K is formed on the terminal part 225 Kb.
  • a process for manufacturing the land part 231 K is not particularly limited. For example, a process for manufacturing a pattern by an additive process or a subtractive process, a transfer process of a copper foil with a releasing film, or a screen printing process can be adopted.
  • solder balls S are formed on these land parts 231 K ( FIG. 19C ). Then, the underfill resin U is filled so as to cover the controller 300 to form the substrate body 210 K ( FIG. 19D ). At this time, a thickness of the underfill resin U is adjusted to an extent where an end part of the solder ball S is exposed. The end part forms an external connection terminal 232 Ka that is connected with a regulation substrate.
  • the external connection terminal 232 Ka configured of the solder ball S can ensure electrical conduction between the base material 224 K and a regulation substrate and, by using the solder ball S, the substrate body 210 K can be manufactured at a low cost. Further, the substrate body 210 K can be manufactured by the smaller number of processes. Further, when an underfill resin U for antistatic use is used, noise from the regulation substrate can be suppressed from directly intruding into the controller 300 .
  • FIG. 20 is a sectional view showing a structure of a sensor device 1 Ka according to a modified example the present embodiment.
  • a through via V is used as the external connection terminal 232 Ka. Also with this, electrical conduction between the base material 224 K and a regulation substrate can be ensured, and manufacture can be easily conducted.
  • an underfill resin U is filled to cover the controller 300 .
  • a throughhole is formed by a laser process, for example.
  • the throughhole is formed at a position corresponding to the terminal 225 Ka of the third junction surface 203 K so that a bottom surface of the terminal 225 Ka is exposed.
  • the throughhole is plated.
  • any one of an electrolytic deposition process and an electroless deposition process can be used, and a tin-based plating process can be appropriately adopted.
  • a power feeding layer (seed layer) may be formed inside the throughhole.
  • seed layer a power feeding layer
  • a through via V is formed inside the throughhole, and the through via V can ensure electric conduction between the base material 224 K and the regulation substrate.
  • the controller 300 may be formed from a material having a value of a linear expansion coefficient close to that of the sensor element 100 .
  • the controller 300 may be formed from a semiconductor bare chip including Si or may be formed with a cover configured of a material such as a 42 alloy, ceramics, Fe or Cu.
  • the controller 300 is buried inside the substrate body 210 , the first joint surface 201 can be more suppressed from deforming and vibration characteristics of the sensor element 100 can be more securely maintained.
  • the first joint surface 201 can be more suppressed from deforming. That is, when the controller 300 and the sensor element 100 are brought into proximity and disposed by facing with each other, an organic insulating layer formed therebetween becomes thinner and the first joint surface 201 becomes difficult to be affected by a linear expansion coefficient and a longitudinal elastic modulus of the organic insulating layer. Therefore, stress between the terminal part 114 of the sensor element 100 and the first joint surface 201 is more alleviated. Further in this case, as was described above, the controller 300 may be formed from a material having values of a linear expansion coefficient and a longitudinal elastic modulus close to those of the sensor element 100 .
  • the regulation part is not limited thereto.
  • the regulation part may have an epoxy resin (organic insulating material) to which a predetermined amount of hard filler such as glass fiber is added. Also thereby, both values of a linear expansion coefficient and a longitudinal elastic modulus can be adjusted to values close to those of the sensor element.
  • a regulation part may have a wiring layer. Also by disposing many of wiring layers formed of a copper foil, both values of a linear expansion coefficient and a longitudinal elastic modulus of a substrate body can be set to values close to those of the sensor element.
  • the sensor element 100 has been described as a gyrosensor.
  • a sensor element obtained by a MEMS process of silicon or quartz may be adopted.
  • the element for example, a pressure sensor element, an acceleration sensor element or an audio sensor element (MEMS microphone) can be adopted as a sensor element.
  • a stress such as strain stress between a first joint surface
  • factors such as an offset voltage, linearity and hysteresis are affected and sensor characteristics may change. Accordingly, such the pressure sensor as well, when applied as a sensor element related to the above embodiments, can suppress a stress at a first joint surface and stabilized sensor characteristics can be maintained.
  • the terminal part of the controller is disposed toward the external connection terminal side (the regulation substrate side), the terminal part may be disposed in an inverted direction, that is, toward the sensor element.
  • the controller 300 was cited.
  • the electronic component is not limited thereto. As long as an electronic component can avoid adjustment after mounting such as laser trimming and an operation thereof is not disturbed by embedding, it can be adopted, that is, a capacitor, a resistor or an earth magnetism sensor can be appropriately adopted.
  • the present technology can also take the following structures.
  • a wiring substrate having a first joint surface electrically joined with the sensor element, a substrate body that contains an organic insulating material and in which an electronic component is embedded, and a regulation part that regulates the first joint surface from deforming.
  • the first joint surface is disposed on the substrate body
  • the regulation part contains a core part embedded in the substrate body.
  • the core part is annually disposed around the electronic component.
  • the wiring substrate further has a second joint surface that faces the first joint surface
  • the substrate body further has
  • the regulation part further includes a first joint part that joins the shield part and the core part.
  • an absolute value of a difference of linear expansion coefficients of the shield part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.
  • an absolute value of a difference of linear expansion coefficients of the core part and the sensor element is smaller than an absolute value of a difference of linear expansion coefficients of the organic insulating material and the sensor element.
  • the regulation part includes a base material of an inorganic insulating material disposed between the sensor element and the substrate body, and
  • the first joint surface is disposed on the base material.
  • the regulation part further includes a core part embedded in the substrate body.
  • the regulation part further includes a second joint part that joins the base material and the core part.
  • the base material is mounted on the substrate body, and
  • the wiring substrate further includes an adhesive layer that is filled in between the base material and the substrate body.
  • the base material is disposed opposite to the first joint surface and further includes a third joint surface that is electrically joined with the electronic component.
  • the shield part is disposed on the first joint surface.
  • the substrate body includes a fourth joint surface that faces the base material
  • the shield part is disposed on the fourth joint surface and covers the base material and the sensor element.

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