US20180258297A1 - Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article - Google Patents
Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article Download PDFInfo
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- US20180258297A1 US20180258297A1 US15/759,807 US201615759807A US2018258297A1 US 20180258297 A1 US20180258297 A1 US 20180258297A1 US 201615759807 A US201615759807 A US 201615759807A US 2018258297 A1 US2018258297 A1 US 2018258297A1
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- United States
- Prior art keywords
- resin composition
- modeling material
- weight
- parts
- supporting material
- Prior art date
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- 239000000463 material Substances 0.000 title claims abstract description 316
- 239000011342 resin composition Substances 0.000 title claims abstract description 286
- 238000000465 moulding Methods 0.000 title claims abstract description 43
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 32
- 239000000178 monomer Substances 0.000 claims abstract description 49
- 238000001723 curing Methods 0.000 claims abstract description 43
- 238000000016 photochemical curing Methods 0.000 claims abstract description 35
- 238000007493 shaping process Methods 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 239000003999 initiator Substances 0.000 claims abstract description 16
- -1 oxypropylene group Chemical group 0.000 claims description 20
- 238000007599 discharging Methods 0.000 claims description 8
- 125000006353 oxyethylene group Chemical group 0.000 claims description 6
- 229920001515 polyalkylene glycol Polymers 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 49
- 230000000740 bleeding effect Effects 0.000 description 27
- 239000003086 colorant Substances 0.000 description 25
- 239000000049 pigment Substances 0.000 description 18
- 125000004432 carbon atom Chemical group C* 0.000 description 16
- 210000003041 ligament Anatomy 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 150000001875 compounds Chemical class 0.000 description 13
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 13
- 239000000654 additive Substances 0.000 description 12
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 10
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 239000002270 dispersing agent Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 238000004321 preservation Methods 0.000 description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 230000001678 irradiating effect Effects 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000003381 stabilizer Substances 0.000 description 6
- 229920001451 polypropylene glycol Polymers 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 5
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 4
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical class C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 230000000977 initiatory effect Effects 0.000 description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 3
- 229920001223 polyethylene glycol Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 3
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 3
- GIMQKKFOOYOQGB-UHFFFAOYSA-N 2,2-diethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)(OCC)C(=O)C1=CC=CC=C1 GIMQKKFOOYOQGB-UHFFFAOYSA-N 0.000 description 2
- DRLRGHZJOQGQEC-UHFFFAOYSA-N 2-(2-methoxypropoxy)propyl acetate Chemical compound COC(C)COC(C)COC(C)=O DRLRGHZJOQGQEC-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- SXNRWWNGEQMQCB-UHFFFAOYSA-N 2-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]ethanol Chemical compound CCCOCCOCCOCCOCCO SXNRWWNGEQMQCB-UHFFFAOYSA-N 0.000 description 2
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 description 2
- BRRVXFOKWJKTGG-UHFFFAOYSA-N 3,3,5-trimethylcyclohexanol Chemical compound CC1CC(O)CC(C)(C)C1 BRRVXFOKWJKTGG-UHFFFAOYSA-N 0.000 description 2
- CCOQPGVQAWPUPE-UHFFFAOYSA-N 4-tert-butylcyclohexan-1-ol Chemical compound CC(C)(C)C1CCC(O)CC1 CCOQPGVQAWPUPE-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000012986 chain transfer agent Substances 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- ZMTBGVBNTHTBEC-UHFFFAOYSA-N (3,3,5-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1CC(OC(=O)C=C)CC(C)(C)C1 ZMTBGVBNTHTBEC-UHFFFAOYSA-N 0.000 description 1
- LAIJAUHBAWLPCO-UHFFFAOYSA-N (4-tert-butylcyclohexyl) prop-2-enoate Chemical compound CC(C)(C)C1CCC(OC(=O)C=C)CC1 LAIJAUHBAWLPCO-UHFFFAOYSA-N 0.000 description 1
- XKSUVRWJZCEYQQ-UHFFFAOYSA-N 1,1-dimethoxyethylbenzene Chemical compound COC(C)(OC)C1=CC=CC=C1 XKSUVRWJZCEYQQ-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- QWQFVUQPHUKAMY-UHFFFAOYSA-N 1,2-diphenyl-2-propoxyethanone Chemical compound C=1C=CC=CC=1C(OCCC)C(=O)C1=CC=CC=C1 QWQFVUQPHUKAMY-UHFFFAOYSA-N 0.000 description 1
- PVMMVWNXKOSPRB-UHFFFAOYSA-N 1,2-dipropoxypropane Chemical compound CCCOCC(C)OCCC PVMMVWNXKOSPRB-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- CUVLMZNMSPJDON-UHFFFAOYSA-N 1-(1-butoxypropan-2-yloxy)propan-2-ol Chemical compound CCCCOCC(C)OCC(C)O CUVLMZNMSPJDON-UHFFFAOYSA-N 0.000 description 1
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 description 1
- QMGJMGFZLXYHCR-UHFFFAOYSA-N 1-(2-butoxypropoxy)butane Chemical compound CCCCOCC(C)OCCCC QMGJMGFZLXYHCR-UHFFFAOYSA-N 0.000 description 1
- QWOZZTWBWQMEPD-UHFFFAOYSA-N 1-(2-ethoxypropoxy)propan-2-ol Chemical compound CCOC(C)COCC(C)O QWOZZTWBWQMEPD-UHFFFAOYSA-N 0.000 description 1
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 1
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 1
- VBVHNUMQFSVYGE-UHFFFAOYSA-N 1-[1-(1-methoxypropan-2-yloxy)propan-2-yloxy]propan-2-yl acetate Chemical compound COCC(C)OCC(C)OCC(C)OC(C)=O VBVHNUMQFSVYGE-UHFFFAOYSA-N 0.000 description 1
- JKEHLQXXZMANPK-UHFFFAOYSA-N 1-[1-(1-propoxypropan-2-yloxy)propan-2-yloxy]propan-2-ol Chemical compound CCCOCC(C)OCC(C)OCC(C)O JKEHLQXXZMANPK-UHFFFAOYSA-N 0.000 description 1
- UOWSVNMPHMJCBZ-UHFFFAOYSA-N 1-[2-(2-butoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCCCC UOWSVNMPHMJCBZ-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- OHRSSDYDJRJIMN-UHFFFAOYSA-N 1-[2-[2-(2-butoxypropoxy)propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCCCC OHRSSDYDJRJIMN-UHFFFAOYSA-N 0.000 description 1
- DSPIZZQMSHIZLS-UHFFFAOYSA-N 1-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]propane Chemical compound CCCOCCOCCOCCOCCC DSPIZZQMSHIZLS-UHFFFAOYSA-N 0.000 description 1
- MQGIBEAIDUOVOH-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCOCCCC MQGIBEAIDUOVOH-UHFFFAOYSA-N 0.000 description 1
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- POPQOOKGONERGS-UHFFFAOYSA-N 1-[2-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]ethoxy]propane Chemical compound CCCOCCOCCOCCOCCOCCC POPQOOKGONERGS-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
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- ZIKLJUUTSQYGQI-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OCC ZIKLJUUTSQYGQI-UHFFFAOYSA-N 0.000 description 1
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- ORRRIJVZQZKAKQ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-ethoxypropoxy)propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OCC ORRRIJVZQZKAKQ-UHFFFAOYSA-N 0.000 description 1
- FXAFMVDJGZBDEP-UHFFFAOYSA-N 1-ethoxy-2-[2-[2-(2-ethoxypropoxy)propoxy]propoxy]propane Chemical compound CCOCC(C)OCC(C)OCC(C)OCC(C)OCC FXAFMVDJGZBDEP-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
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- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
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- CKCGJBFTCUCBAJ-UHFFFAOYSA-N 2-(2-ethoxypropoxy)propyl acetate Chemical compound CCOC(C)COC(C)COC(C)=O CKCGJBFTCUCBAJ-UHFFFAOYSA-N 0.000 description 1
- XXXFZKQPYACQLD-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl acetate Chemical compound CC(=O)OCCOCCO XXXFZKQPYACQLD-UHFFFAOYSA-N 0.000 description 1
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- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
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- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 description 1
- VAPILSUCBNPFBS-UHFFFAOYSA-L disodium 2-oxido-5-[[4-[(4-sulfophenyl)diazenyl]phenyl]diazenyl]benzoate Chemical compound [Na+].[Na+].Oc1ccc(cc1C([O-])=O)N=Nc1ccc(cc1)N=Nc1ccc(cc1)S([O-])(=O)=O VAPILSUCBNPFBS-UHFFFAOYSA-L 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- TUEYHEWXYWCDHA-UHFFFAOYSA-N ethyl 5-methylthiadiazole-4-carboxylate Chemical compound CCOC(=O)C=1N=NSC=1C TUEYHEWXYWCDHA-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- UCNNJGDEJXIUCC-UHFFFAOYSA-L hydroxy(oxo)iron;iron Chemical compound [Fe].O[Fe]=O.O[Fe]=O UCNNJGDEJXIUCC-UHFFFAOYSA-L 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002563 ionic surfactant Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- PXZQEOJJUGGUIB-UHFFFAOYSA-N isoindolin-1-one Chemical compound C1=CC=C2C(=O)NCC2=C1 PXZQEOJJUGGUIB-UHFFFAOYSA-N 0.000 description 1
- MOUPNEIJQCETIW-UHFFFAOYSA-N lead chromate Chemical compound [Pb+2].[O-][Cr]([O-])(=O)=O MOUPNEIJQCETIW-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229940116423 propylene glycol diacetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000007348 radical reaction Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 239000002349 well water Substances 0.000 description 1
- 235000020681 well water Nutrition 0.000 description 1
Images
Classifications
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- C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
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- C08F290/06—Polymers provided for in subclass C08G
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- C09D11/30—Inkjet printing inks
- C09D11/32—Inkjet printing inks characterised by colouring agents
- C09D11/322—Pigment inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
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- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0005—Condition, form or state of moulded material or of the material to be shaped containing compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
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- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
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Definitions
- a shaping method using a photocurable resin composition which cures by irradiating ultraviolet rays or the like has widely been known.
- a cured layer having a predetermined shape is formed by irradiating the photocurable resin composition with ultraviolet rays or the like to cure it.
- a new cured layer is formed by further feeding the photocurable resin composition on the cured layer to cure it.
- a shaping apparatus can be miniaturized as compared with the conventional method.
- the manufacturing method for light curing molding using an ink-jet scheme has been paid attention as a shaping method which is realized by a 3D printer that can freely make a stereoscopically shaped product, based on CAD (Computer Aided Design) data.
- the modeling material and a supporting material are formed in combination (JP-A-2004-255839, JP-A-2010-155889 and JP-A-2012-111226).
- the supporting material is made by irradiating the photocurable resin composition with ultraviolet rays or the like to cure it, like the modeling material. After the modeling material has been made, the supporting material can be removed by physically peeling the supporting material, or dissolving the supporting material in an organic solvent or water.
- the cured layer is formed, for example, by the following method.
- a roller is used to remove the extra resin composition for a modeling material and resin composition for a supporting material.
- the resin compositions are cured. Thereby, a cured layer composed of the modeling material and the supporting material is formed.
- the conventional light cured article which is obtained by using the resin composition for a modeling material and the resin composition for a supporting material had a problem that the dimensional accuracy is reduced.
- the present invention was made in view of the above-mentioned present situation, and an object thereof is to provide a resin composition for a modeling material by which a light cured article having the good dimensional accuracy can be obtained, a light curing molding ink set comprising the resin composition for a modeling material, and a method for manufacturing a light cured article using the light curing molding ink set.
- the present inventors intensively studied the cause for reduction in the dimensional accuracy of the light cured article.
- the present inventors obtained the finding that in the light cured article having the reduced dimensional accuracy, by movement of one of the resin composition for a modeling material and the resin composition for a supporting material to the other side at an interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material, blur (bleeding) is generated at the interface. That is, the present inventors obtained the finding that bleeding which is generated at the interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material is one of the causes for reduction in the dimensional accuracy of the light cured article.
- the present invention was made based on the above-mentioned finding, and the gist thereof is as follows:
- a resin composition for a modeling material used for shaping a modeling material by a manufacturing method for light curing molding using an inkjet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more.
- a resin composition for a modeling material by which a light cured article having the good dimensional accuracy can be obtained by suppressing generation of bleeding at an interface between a layer composed of a resin composition for a modeling material and a layer composed of a resin composition for a supporting material, a light curing molding ink set comprising the resin composition for a modeling material, and a method for manufacturing a light cured article using the light curing molding ink set.
- FIG. 1 is a view schematically showing a step (I) in the method for manufacturing a light cured article of the present embodiment.
- FIG. 2 is a view schematically showing a step (II) in the method for manufacturing a light cured article of the present embodiment.
- FIG. 3 is a view schematically showing a cured product 6 composed of a modeling material 4 and a supporting material 5 , which was obtained by repeatedly performing steps (I) and (II) in the method for manufacturing a light cured article of the present embodiment.
- FIG. 4 is a view schematically showing a step (III) in the method for manufacturing a light cured article of the present embodiment.
- FIG. 5 ( a ) is a top view of a cured product which is obtained using each resin composition for a modeling material and each resin composition for a supporting material shown in Table 1.
- FIG. 5 ( b ) is a line A-A cross-sectional view of FIG. 5 ( a ) .
- (meth)acrylate is a generic name of acrylate and methacrylate, and means one or both of acrylate and methacrylate. This also applies to “(meth)acryloyl” and “(meth)acryl”.
- the resin composition for a modeling material of the present embodiment is a resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more.
- the (A) component comprises 70 parts by weight or less of a monofunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material.
- the content of the monofunctional ethylenic unsaturated monomer is 5 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
- the (A) component comprises 70 parts by weight or less of a polyfunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material.
- the content of the polyfunctional ethylenic unsaturated monomer is 20 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
- the content of the (A) component is 80 to 99 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
- the resin composition for a modeling material further contains an oligomer as (D) a photocuring component.
- the content of the (D) component is 10 to 45 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.
- the resin composition for a modeling material has the surface tension Mst of 33.0 to 40.0 mN/m.
- the light curing molding ink set of the present embodiment is a light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of the resin composition for a modeling material as defined in any one of [ 1 ] to [ 9 ], and a resin composition for a supporting material used for shaping the supporting material, wherein the resin composition for a supporting material contains (E) a water-soluble monofunctional ethylenic unsaturated monomer, (F) polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group, (B) a photopolymerization initiator, and (C) a surface adjusting agent.
- E a water-soluble monofunctional ethylenic unsaturated monomer
- F polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group
- B a photopolymerization initiator
- C a surface adjusting agent
- the content of the (E) component is 20 to 50 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
- the content of the (F) component is 20 to 49 parts by weight, based on 100 parts by weight of the whole resin composition for a supporting material.
- a number average molecular weight Mn of the (F) component is 100 to 5,000.
- surface tension St of the resin composition for a supporting material is 24.0 to 33.0 mN/m.
- the method for manufacturing a light cured article of the present embodiment is a method for manufacturing a light cured article using the light curing molding ink set as defined in any one of [10] to [14] by a manufacturing method for light curing molding using an ink-jet scheme, comprising a step (I) of discharging a resin composition for a modeling material and a resin composition for a supporting material from an ink-jet head, so that a resin composition layer in which a layer composed of the resin composition for a modeling material and a layer composed of the resin composition for a supporting material are arranged contiguously, a step (II) of photocuring the resin composition for a modeling material and the resin composition for a supporting material constituting the resin composition layer, respectively, thereby, obtaining a modeling material and a supporting material, and a step (III) of removing the supporting material, thereby, obtaining a light cured article.
- the resin composition for a modeling material contains (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent.
- the (A) ethylenic unsaturated monomer is a photocuring component having property that it cures by energy rays.
- the (A) component comprises at least one of a monofunctional ethylenic unsaturated monomer having one ethylenic double bond in a molecule, and a polyfunctional ethylenic unsaturated monomer having two or more ethylenic double bonds in a molecule.
- the monofunctional ethylenic unsaturated monomer comprises at least one of a water-insoluble monofunctional ethylenic unsaturated monomer, and a water-soluble monofunctional ethylenic unsaturated monomer.
- water-insoluble monofunctional ethylenic unsaturated monomer examples include, for example, linear or branched alkyl (meth)acrylates having 4 to 30 carbon atoms [e.g. methyl (meth)acrylate, ethyl (meth)acrylate, isobutyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, t-butyl (meth)acrylate etc.], alicycle-containing (meth)acrylates having 6 to 20 carbon atoms [e.g.
- cyclohexyl (meth)acrylate 4-t-cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, 4-t-butylcyclohexanol (meth)acrylate, 3,3,5-trimethylcyclohexanol (meth)acrylate, phenoxyethyl (meth)acrylate etc.], heterocycle-containing (meth)acrylates having 5 to 20 carbon atoms [e.g.
- tetrahydrofurfuryl (meth)acrylate 4-(meth)acryloyloxymethyl-2-methyl-2-ethyl-1,3-dioxolane, 4-(meth)acryloyloxymethyl-2-cyclohexyl-1,3-dioxolane, adamantyl (meth)acrylate, cyclic trimethylolpropaneformal (meth)acrylate etc.] and the like. These may be used alone, or two or more may be used concurrently.
- the water-insoluble monofunctional ethylenic unsaturated monomer is preferably 4-t-butylcyclohexanol (meth)acrylate, 3,3,5-trimethylcyclohexanol (meth)acrylate, or phenoxyethyl (meth)acrylate.
- water-soluble monofunctional ethylenic unsaturated monomer examples include, for example, hydoxy group-containing (meth)acrylates having 5 to 15 carbon atoms [e.g. hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate etc.], hydroxy group-containing (meth)acrylates having Mn of 200 to 1,000 [polyethylene glycol mono(meth)acrylate, monoalkoxy (having 1 to 4 carbon atoms) polyethylene glycol mono(meth)acrylate, polypropylene glycol mono(meth)acrylate, monoalkoxy (having 1 to 4 carbon atoms) polypropylene glycol mono(meth)acrylate, mono(meth)acrylate of PEG-PPG block polymer etc.], (meth)acrylamide derivatives having 3 to 15 carbon atoms [(meth)acrylamide, N-methyl(meth)acrylamide, N-ethyl(meth)
- the water-soluble monofunctional ethylenic unsaturated monomer is preferably (meth)acryloylmorpholine.
- the total content of the water-insoluble monofunctional ethylenic unsaturated monomer and the water-soluble monofunctional ethylenic unsaturated monomer is preferably 5 parts by weight or more, more preferably 30 parts by weight or more, and particularly preferably 50 parts by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material.
- the content of the monofunctional ethylenic unsaturated monomer is preferably 70 parts by weight or less, and more preferably 69 parts by weight or less, based on 100 parts by weight of the whole resin composition for a modeling material.
- the content is a total of the contents of respective monofunctional ethylenic unsaturated monomers.
- polyfunctional ethylenic unsaturated monomer examples include, for example, Tinier or branched alkylene glycol di(meth)acrylates or alkylene glycol tri(meth)acrylates having 10 to 25 carbon atoms [e.g., Tinier or branched alkylene glycol di(meth)acrylates or alkylene glycol tri(meth)acrylates having 10 to 25 carbon atoms [e.g., Tinier or branched alkylene glycol di(meth)acrylates or alkylene glycol tri(meth)acrylates having 10 to 25 carbon atoms [e.g.
- the polyfunctional ethylenic unsaturated monomer is preferably diethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, or modified bisphenol A di(meth)acrylate.
- the content of the polyfunctional ethylenic unsaturated monomer is preferably 70 parts by weight or less, and more preferably 60 parts by weight or less, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the polyfunctional ethylenic unsaturated monomer is preferably 20 parts by weight or more, and more preferably 30 parts by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. In addition, when two or more of the polyfunctional ethylenic unsaturated monomers are contained, the content is a total of the contents of respective polyfunctional ethylenic unsaturated monomers.
- the content of the (A) component is preferably 80 parts by weight or more, and more preferably 90 parts by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the (A) component is preferably 99 parts by weight or less, and more preferably 95 parts by weight or less. In addition, when two or more of the (A) components are contained, the content is a total of the contents of respective (A) components.
- the photopolymerization initiator (B) is not particularly limited, as far as it is a compound which promotes a radical reaction when light of a wavelength in an ultraviolet ray, near ultraviolet ray or visible light region is irradiated.
- the (B) component include, for example, benzoin compounds having 14 to 18 carbon atoms [e.g. benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether etc.], acetophenone compounds having 8 to 18 carbon atoms [e.g.
- acetophenone 2,2-diethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 2-hydroxy-2-methyl-phenylpropane-1-one, diethoxyacetophenone, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one etc.], anthraquinone compounds having 14 to 19 carbon atoms [e.g.
- acylphosphine oxide compounds having 22 to 28 carbon atoms e.g. 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, bis-(2,6-dimethoxybenzoyl)-2,4,4-trimethylpentylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide], a mixture of these compounds and the like. These may be used alone, or two or more may be used concurrently.
- the (B) component is preferably 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.
- examples of an acylphosphine oxide compound which is available in the market include, for example, DAROCURE TPO manufactured by BASF company and the like.
- the content of the (B) component is preferably 1 part by weight or more, and more preferably 3 parts by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the (B) component is preferably 15 parts by weight or less, and more preferably 13 parts by weight or less. In addition, when two or more of the (B) components are contained, the content is a total of the contents of respective (B) components.
- the surface adjusting agent (C) is a component which adjusts the surface tension of the resin composition at an appropriate range.
- the (C) component include, for example, a silicone-based compound and the like.
- the silicone-based compound include, for example, a silicone-based compound having a polydimethylsiloxane structure, and the like. Specifically, examples thereof include polyether-modified polydimethylsiloxane, polyester-modified polydimethylsiloxane, polyaralkyl-modified polydimethylsiloxane and the like.
- the content of the (C) component is preferably 0.005 part by weight or more, and more preferably 0.01 part by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the (C) component is preferably 3.0 parts by weight or less, and more preferably 1.5 parts by weight or less. In addition, when two or more of the (C) components are contained, the content is a total of the contents of respective (C) components.
- the resin composition for a modeling material of the present embodiment further contains (D) an oligomer.
- the (D) component is a photocuring component having property that it cures by energy rays.
- Examples of the (D) component include, for example, a urethane (meth)acrylate oligomer, an epoxy (meth)acrylate oligomer, a polyester (meth)acrylate oligomer, a polyether (meth)acrylate oligomer and the like. These may be used alone, or two or more may be used concurrently. Among them, from a view point that curability of the resin composition for a modeling material is improved, the (D) component is preferably a urethane (meth)acrylate oligomer.
- the content of the (D) component is preferably 10 parts by weight or more, and more preferably 15 parts by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the (D) component is preferably 45 parts by weight or less, and more preferably 40 parts by weight or less. In addition, when two or more of the (D) components are contained, the content is a total of the contents of respective (D) components.
- oligomer refers to one having a weight average molecular weight of 800 to 10,000.
- a weight average molecular weight means a weight average molecular weight in terms of polystyrene, which is measured by GPC (Gel Permeation Chromatography).
- the resin composition for a modeling material can contain, as necessary, other additives in such a range that the effect of the present invention is not impaired.
- other additives include, for example, an antioxidant, a coloring agent, a pigment dispersant, a preservation stabilizer, an ultraviolet absorbing agent, a light stabilizer, a polymerization inhibitor, a chain transfer agent, a filler and the like.
- the previously known coloring agents such as a diarylide-based coloring agent, a condensed azo-based coloring agent, a quinacridone-based coloring agent, a vat-based coloring agent, an isoindolinone-based coloring agent, a phthalocyanine-based coloring agent, an aniline-based coloring agent, titanium oxide, nickel titanium, yellow iron oxide, red iron oxide, ultramarine, cobalt blue, chromium oxide, iron black, chrome yellow, chrome orange, molybdenum red, a cadmium-based coloring agent, carbon black and the like can be used. These may be used alone, or two or more may be used concurrently.
- the coloring agent is preferably, for example, carbon black, Nickel Azo which is a condensed azo-based coloring agent, Quinacridone which is a quinacridone-based coloring agent, copper phthalocyanine which is a phthalocyanine-based coloring agent, titanium oxide or the like.
- the content of the coloring agent is preferably 0.01 part by weight or more, and more preferably 0.1 part by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the coloring agent is preferably 5.0 parts by weight or less, and more preferably 3.0 parts by weight or less.
- the pigment dispersant may be contained in order to improve dispersibility of the pigment.
- the pigment dispersant include, for example, an ionic or nonionic surfactant, an anionic, cationic or nonionic polymer compound and the like. These may be used alone, or two more may be used concurrently.
- the pigment dispersant is preferably a polymer compound comprising a cationic group or an anionic group.
- the pigment dispersant which is available in the market include Solsperse manufactured by Avecia company, DISPERBYK manufactured by BYK-Chemie company, EFKA manufactured by EFKA ADDITIVES B.V., and the like.
- the content of the pigment dispersant is preferably 0.05 part by weight or more, based on 100 parts by weight of the whole resin composition for a modeling material. Additionally, the content of the pigment dispersant is preferably 5 parts by weight or less.
- the preservation stabilizer may be contained in order to enhance preservation stability of the resin composition.
- the preservation stabilizer include, for example, a hindered amine-based compound (HALS), a phenol-based antioxidant, a phosphorus-based antioxidant and the like.
- HALS hindered amine-based compound
- examples of the preservation stabilizer include specifically hydroquinone, methoquinone, benzoquinone, p-methoxyphenol, hydroquinone monomethyl ether, hydroquinone monobutyl ether, TEMPO, 4-hydroxy-TEMPO, TEMPOL, Cupherron AI, IRGASTAB UV-10, IRGASTAB UV-22, FIRSTCURE ST-1 (manufactured by ALBEMARLE company), t-butylcatechol, pyrogallol, TINUVIN 111 FDL, TINUVIN 144, TINUVIN 292, TINUVIN XP40, TINUVIN XP60, TINUVIN 400 manufactured by BASF company, and the like
- the resin composition for a modeling material can be manufactured, for example, by uniformly mixing the (A) to (C) components, and as necessary (D) oligomer and other additives using a mixing and stirring device or the like, without particular limitation.
- the thus manufactured resin composition for a modeling material has preferably the viscosity at 25° C. of 70 mPa ⁇ s or less, from a view point that dischargeability from an ink-jet head is improved.
- measurement of the viscosity of the resin composition for a modeling material is performed using a R100-type viscometer in accordance with JIS Z 8803.
- the resin composition for a modeling material has the surface tension Mt of 26.0 to 33.0 mN/m, from a view point that dischargeability from an ink-jet head is improved.
- the surface tension refers to a value of the surface tension after 20 seconds from measurement initiation at 25° C. Measurement of the surface tension is performed, for example, using Full Automatic Equilibrium Electro Surface Tension Meter ESB-V (manufactured by Kyowa Interface Science Co., Ltd.).
- the resin composition for a modeling material has surface tension (also referred to as equivalence surface tension) Mst represented by the (i) expression, of 33.0 mN/m or more.
- surface tension Mst also referred to as equivalence surface tension
- generation of bleeding at an interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material can be suppressed. That is, by movement of the resin composition for a modeling material to a side of the resin composition for a supporting material, or by movement of the resin composition for a supporting material to a side of the resin composition for a modeling material, phenomenon of generation of blur becomes difficult to be generated.
- a light cured article having the good dimensional accuracy can be obtained using a light curing molding ink set comprising a combination of such resin composition for a modeling material and resin composition for a supporting material.
- the surface tension Mst is preferably 40.0 mN/m or less, and more preferably 39.0 mN/m or less.
- the photocuring component in the expression is a component having property that it cures by energy rays.
- the (A) ethylenic unsaturated monomer, and the (D) oligomer which is an optional component are the photocuring component.
- the resin composition for a modeling material of the present embodiment may comprise other photocuring components.
- the resin composition for a supporting material contains a water-soluble monofunctional ethylenic unsaturated monomer (E), polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group (F), a photopolymerization initiator (B), and a surface adjusting agent (C).
- E water-soluble monofunctional ethylenic unsaturated monomer
- F polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group
- B photopolymerization initiator
- C surface adjusting agent
- the same components as those of the resin composition for a modeling material can be used.
- the content of the (E) component is preferably 20 parts by weight or more, and more preferably 25 parts by weight or more, based on 100 parts by weight of the whole resin composition for a supporting material. Additionally, the content of the (E) component is preferably 50 parts by weight or less, and more preferably 45 parts by weight or less. In addition, when two or more of the (E) components are contained, the content is a total of the contents of respective (E) components.
- the polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group (F) is such that at least ethylene oxide and/or propylene oxide are (is) added to an active hydrogen compound.
- the (F) component include, for example, polyethylene glycol, polypropylene glycol and the like. These may be used alone, or two or more may be used concurrently.
- the active hydrogen compound include monohydric to tetrahydric alcohols, amine compounds and the like. Among them, the active hydrogen compound is preferably a dihydric alcohol or water.
- the content of the (F) component is preferably 20 parts by weight or more, and more preferably 25 parts by weight or more, based on 100 parts by weight of the whole resin composition for a supporting material. Additionally, the content of the (F) component is preferably 49 parts by weight or less, and more preferably 45 parts by weight or less. In addition, when two or more of the (F) components are contained, the content is a total of the contents of respective (F) components.
- a number average molecular weight Mn of the (F) component is preferably 100 to 5,000.
- Mn of the (F) component is in the range, the resin composition is compatible with the (F) component before photocuring, and is not compatible with the (F) component after photocuring.
- Mn of the (F) component is more preferably 200 to 3,000, and further preferably 400 to 2,000.
- the same components as those of the resin composition for a modeling material can be used at the same contents.
- the resin composition for a supporting material can contain other additives, as necessary, in such a range that the effect of the present invention is not impaired.
- other additives include, for example, a water-soluble organic solvent, an antioxidant, a coloring agent, a pigment dispersant, a preservation stabilizer, an ultraviolet absorbing agent, a light stabilizer, a polymerization inhibitor, a chain transfer agent, a filler and the like.
- water-soluble organic solvent examples include, for example, ethylene glycol monoacetate, propylene glycol monoacetate, diethylene glycol monoacetate, dipropylene glycol monoacetate, triethylene glycol monoacetate, tripropylene glycol monoacetate, tetraethylene glycol monoacetate, tetrapropylene glycol monoacetate, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, dipropylene glycol monomethyl ether, triethylene glycol monomethyl ether, tripropylene glycol monomethyl ether, tetraethylene glycol monomethyl ether, tetrapropylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, diethylene glycol monoethyl ether, dipropylene glycol monoethyl ether, triethylene glycol monoethyl ether, tripropylene glycol monoethyl ether, tetra
- the water-soluble organic solvent is more preferably triethylene glycol monomethyl ether, or dipropylene glycol monomethyl ether acetate.
- the content of the water-soluble organic solvent is preferably 5 parts by weight or more, and more preferably 10 parts by weight or more, based on 100 parts by weight of the whole resin composition for a supporting material. Additionally, the content of the water-soluble organic solvent is preferably 35 parts by weight or less, and more preferably 30 parts by weight or less. In addition, when two or more of the water-soluble organic solvents are contained, the content is a total of the contents of respective water-soluble organic solvents.
- the same components as those of the resin-composition for a modeling material can be used at the same contents.
- a method for manufacturing the resin composition for a supporting material is not particularly limited.
- the resin composition for a supporting material can be manufactured, for example, by uniformly mixing the (B), (C), (E), and (F) components, and as necessary, other additives using a mixing and stirring device or the like.
- the thus manufactured resin composition for a supporting material has preferably the viscosity at 25° C. of 70 mPa ⁇ s or less.
- measurement of the viscosity of the resin composition for a supporting material is performed using a R100-type viscometer in accordance with JIS Z 8803.
- the resin composition for a supporting material has preferably the surface tension of 24.0 to 33.0 mN/m.
- the surface tension refers to a value of the surface tension after 20 seconds from measurement initiation at 25° C. Measurement of the surface tension is performed, for example, using Full Automatic Equilibrium Electro Surface Tension Meter ESB-V (manufactured by Kyowa Interface Science Co., Ltd.).
- the light cured article is manufactured using the resin composition for a modeling material and the light curing molding ink set comprising the resin composition for a modeling material, of the present embodiment by a manufacturing method for light curing molding using an ink-jet scheme.
- the light cured article is manufactured by passing through a step (I) of discharging a resin composition for a modeling material and a resin composition for a supporting material from an ink-jet head so that a resin composition layer in which a layer composed of the resin composition for a modeling material and a layer composed of the resin composition for a supporting material are arranged contiguously is formed, a step (II) of photocuring the resin composition for a modeling material and the resin composition for a supporting material constituting the resin composition layer, respectively, thereby, obtaining a modeling material and a supporting material, and a step (III) of removing the supporting material, thereby, obtaining a light cured article.
- the steps (I) to (III) are not particularly limited, but are performed, for example, by
- FIG. 1 is a view schematically showing a step (I) in the method for manufacturing a light cured article of the present embodiment.
- a three-dimensional shaping apparatus 1 comprises an ink-jet head module 2 and a shaping table 3 .
- the ink-jet head module 2 has a light curing molding ink unit 25 , a roller 23 , and a light source 24 .
- the light curing molding ink unit 25 has an ink-jet head 21 for a modeling material, which is filled with a resin composition 4 a for a modeling material, and an ink-jet head 22 for a supporting material, which is filled with a resin composition 5 a for, a supporting material.
- the light curing molding ink set 20 of the present embodiment is constructed of a combination of the resin composition 4 a for a modeling material and the resin composition 5 a for a supporting material.
- the ink-jet head module 2 is made to perform scanning in an X direction and a Y direction, and at the same time, discharge the resin composition 4 a for a modeling material from the ink-jet head 21 for a modeling material, and discharge the resin composition 5 a for a supporting material from the ink-jet head 22 for a supporting material, relatively to the shaping table 3 in FIG. 1 .
- a resin composition layer in which interfaces between a layer composed of the resin composition 4 a for a modeling material and a layer composed of the resin composition 5 a for a supporting material are arranged contiguously so as to come into contact with each other is formed on the shaping table 3 .
- the extra resin composition 4 a for a modeling material and resin composition 5 a for a supporting material are removed using the roller 23 .
- FIG. 2 is a view schematically showing a step (II) in the method for manufacturing a light cured article of the present embodiment.
- a step (II) in the method for manufacturing a light cured article of the present embodiment.
- a cured layer composed of a modeling material 4 and a supporting material 5 is formed.
- FIG. 3 is a view schematically showing a cured product 6 composed of a modeling material 4 and a supporting material 5 , which has been obtained by repeatedly performing steps (I) and (II) in the method for manufacturing a light cured article of the present embodiment.
- Examples of light which cures the resin composition include, for example, far infrared rays, infrared rays, visible rays, near ultraviolet rays, ultraviolet rays and the like. Among them, from a view point of easiness and the efficiency of curing work, near ultraviolet rays or ultraviolet rays are preferable.
- the light source 24 examples include a mercury lamp, a metal halide lamp, an ultraviolet. LED, an ultraviolet laser and the like. Among them, from a view point of miniaturization of facilities and electric power saving, the light source 24 is preferably an ultraviolet LED. In addition, when the ultraviolet LED is used as the light source 24 , the integrated light quantity of ultraviolet rays is preferably around 500 mJ/cm 2 .
- FIG. 4 is a view schematically showing a step (III) in the method for manufacturing a light cured article of the present embodiment.
- the cured product 6 composed of the modeling material 4 and the supporting material 5 , which has been made in a step (III), is immersed in a solvent 8 contained in a container 7 .
- the supporting material 5 can be removed by dissolving it in the solvent 8 .
- the solvent 8 which dissolves the supporting material 5 examples include, for example, ion-exchanged water, distilled water, tap water, well water and the like. Among them, from a view point of relatively few impurities and availability at a low price, the solvent 8 is preferably ion-exchanged water.
- a light cured article having the good dimensional accuracy can be obtained using the resin composition for a modeling material and the light curing molding ink set of the present embodiment.
- each resin composition for a modeling material and each resin composition for a supporting material of test Nos. A1 to A4 shown in Table 1 a cured product was made. A shape and a target dimension of the cured product are shown in FIGS. 5 ( a ) and ( b ) .
- a step of discharging each resin composition for a modeling material and each resin composition for a supporting material from an ink-jet head was performed so that the resolution became 600 ⁇ 600 dpi, and a thickness of one resin composition layer became 48 ⁇ m.
- each resin composition for a modeling material and each resin composition for a supporting material, respectively was performed using a LED light source of a wavelength 385 nm, which had been installed on a rear side of an ink-jet head in a scanning direction, under the conditions of the illuminance of 580 mW/cm 2 , and the integrated light quantity per one resin composition layer of 600 mJ/cm 2 . Then, by immersing the cured product in ion-exchanged water, the supporting material was removed to obtain a light cured article. Thereafter, the resulting light cured article was allowed to stand in a desiccator for 24 hours, and was sufficiently dried.
- each five of light cured articles of test Nos. A1 to A4 were manufactured.
- Concerning the light cured articles after drying dimensions in an x direction and a y direction in FIG. 5 ( a ) were measured using a slide caliper, and a change rate from the target dimension was calculated.
- For the dimensional accuracy an average of a dimensional change rate in respective light cured articles of test Nos. A1 to A4 was obtained, and assessment was performed using the average based on the following criteria. The assessment results are shown in Table 1.
- An average dimensional change rate is less than ⁇ 1.0%.
- An average dimensional change rate is ⁇ 1.0% or more.
- each 0.02 mL of each resin composition for a modeling material and each resin composition for a supporting material shown in Table 1 were added dropwise on a film composed of polyethylene terephthalate (A4300, manufactured by TOYOBO CO., LTD., 100 mm ⁇ 150 mm ⁇ thickness 188 ⁇ m) using a micropipette.
- a distance between central parts of respective liquid droplets was 10 mm, and respective liquid droplets were independent.
- respective liquid droplets were gradually wettedly spread, and respective liquid droplets were unified after about 10 seconds.
- the state of an interface of respective liquid droplets was observed visually from an upper side, and bleeding was assessed based on the following criteria.
- the assessment results are shown in Table 1.
- bleeding which is generated at an interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material is one of the causes for reduction in the dimensional accuracy of the light cured article. Then, bleeding which is generated at an interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material was assessed below.
- TMCHA 3,3,5-Trimethylcyclohexanol acrylate [SR420 (ethylenic double bond/one molecule: one), manufactured by Arkema S.A.]
- ACMO Acryloylmorpholine
- PEA Phenoxyethyl acrylate [SR339 (ethylenic double bond/one molecule: one), manufactured by Arkema S.A.]
- DEGDA Diethylene glycol diacrylate [SR230 (ethylenic double bond/one molecule: 2), manufactured by Arkema S.A.]
- A-NPA Alkoxylated neopentyl glycol diacrylate [SR9003 (ethylenic double bond/one molecule: 2), manufactured by Arkema S.A.]
- Ebe150 Modified bisphenol A diacrylate [Ebacryl150 (ethylenic double bond/one molecule: 2), manufactured by DAICEL-ALLNEX LTD.]
- DAROCURE TPO 2,4,6-Trimethylbenzoyl-diphenyl-phosphine oxide
- IRGACURE907 2-Methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one [IRGACURE 907, manufactured by Ciba company]
- CN996 Urethane acrylate oligomer [CN996 (ethylenic double bond/one molecule: 2), manufactured by Arkema S.A.]
- MA-8 Acidic carbon black pigment [MA-8, manufactured by Mitsubishi Chemical Corporation]
- RT355D Quinacridone pigment [CINQUASIA Magenda RT-355-D, manufactured by Ciba company]
- BT-617-D Copper phthalocyanine pigment [HOSTAPERM BLUE BT-617-D, manufactured by Clariant company]
- CR-60 Titanium oxide [CR-60, manufactured by ISHIHARA SANGYO KAISHA, LTD.]
- ACMO Acryloylmorpholine
- PPG-1000 Polypropylene glycol [UNIOL D1000 (molecular weight 1000), manufactured by NOF CORPORATION]
- DAROCURE TPO 2,4,6-Trimethylbenzoyl-diphenyl-phosphine oxide [DEROCURE TPO, manufactured by BASF company]
- IRGACURE907 2-Methyl-1-[4-(methylthio)phenyl]-2-morpholinopro pane-1-one [IRGACURE 907, manufactured by Ciba company]
- Chivacure ITX Isopropylthioxanthone [Chivacure ITX, manufactured by Double Bond Chemical Ind., Co., Ltd.]
- BYK-307 Silicone-based compound having a polydimethylcyclohexane structure [BYK-307, manufactured by BYK-Chemie company]
- MTG Triethylene glycol monomethyl ether [MPG, manufactured by NIPPON NYUKAZAI CO., LTD.]
- each resin composition for a modeling material of M1 to M23 and each photocuring component contained in the resin composition for a modeling material shown in Table 2 as well as each resin composition for a supporting material of S1 to S6 and each photocuring component contained in the resin composition for a supporting material shown in Table 3, a value after 20 seconds from measurement initiation, at 25° C. was measured using Full Automatic Equilibrium Electro Surface Tension Meter ESB-V (manufactured by Kyowa Interface Science Co., Ltd.). The measurement results are shown in Table 2 and Table 3.
- Discharge stability of each composition for a modeling material of M1 to M23 shown in Table 2 and each resin composition for a supporting material of S1 to S6 shown in Table 3 was assessed by calculating the ratio of generation of nozzle slip-out, and the ligament length.
- nozzle slip-out refers to the state where an ink is not discharged due to clogging of a nozzle.
- Discharge was performed under the conditions of a nozzle diameter: 20 ⁇ m, a flying speed: 7 m/sec. and a discharge frequency: 1 kHz, the time from passing of the head of liquid droplets until passing of the tail end of liquid droplets was measured at a position of 1 mm distance from the nozzle, and thereafter, the ligament length was calculated by integrating the time and the flying speed. And, the ligament length was assessed based on the following criteria. The assessment results are shown in Table 2 and Table 3. In addition, the ligament length refers to the length of a liquid droplet which is discharged from a nozzle. When the ligament length is great, ink mist becomes easy to be generated.
- the resin composition in which assessment of the ratio of generation of nozzle slip-out was “O”, and assessment of the ligament length was “O” was determined to be excellent in discharge stability. Additionally, the resin composition having another assessment was determined to be inferior in discharge stability.
- resin compositions for a modeling material of M3 to M7, and M11 to M21 in which the surface tension Mt is 26.0 to 33.0 mN/m are excellent in discharge stability. Additionally, as seen from Table 3, resin compositions for a supporting material of S3 to S5 in which the surface tension St is 24.0 to 33.0 mN/m are excellent in discharge stability.
- the surface tension Mt of which does not satisfy the requirement of the present invention at an interface between the layer composed of the resin composition for a modeling material and the layer composed of the resin composition for a supporting material, slight blur was generated.
- the method for manufacturing a light cured article of the above-mentioned embodiment may further comprise a step of discharging only a resin composition for a modeling material from an ink-jet head so that only a layer composed of the resin composition for a modeling material is formed, thereafter, photocuring the resin composition for a modeling material constituting the layer, thereby, obtaining a modeling material and/or a step of discharging only a resin composition for a supporting material from an ink-jet head so that only a layer composed of the resin composition for a supporting material is formed, thereafter, photocuring the resin composition for a supporting material constituting the layer, thereby, obtaining a supporting material.
- the resin composition for a modeling material, and the light curing molding ink set comprising the resin composition for a modeling material of the present invention can afford a light cured article having the good dimensional accuracy.
- the resin composition for a modeling material and the light curing molding ink set of the present invention can be suitably used in manufacturing a light cured article by a manufacturing method for light curing molding using an ink-jet scheme.
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- Chemical & Material Sciences (AREA)
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- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
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JP2015181574 | 2015-09-15 | ||
PCT/JP2016/077256 WO2017047693A1 (ja) | 2015-09-15 | 2016-09-15 | モデル材用樹脂組成物、光造形用インクセット、および、光造形品の製造方法 |
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US17/701,322 Continuation US11795335B2 (en) | 2015-09-15 | 2022-03-22 | Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article |
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US15/759,807 Abandoned US20180258297A1 (en) | 2015-09-15 | 2016-09-15 | Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article |
US17/701,322 Active US11795335B2 (en) | 2015-09-15 | 2022-03-22 | Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article |
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US (2) | US20180258297A1 (ja) |
EP (1) | EP3351367B1 (ja) |
JP (1) | JP6751096B2 (ja) |
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US11384186B2 (en) | 2016-12-12 | 2022-07-12 | Clariant International Ltd | Polymer comprising certain level of bio-based carbon |
US11401362B2 (en) | 2016-12-15 | 2022-08-02 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
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Family Cites Families (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3372076B2 (ja) | 1993-01-22 | 2003-01-27 | 日本化薬株式会社 | 放射線硬化性樹脂組成物、光学材料用樹脂組成物及びその硬化物 |
US7300619B2 (en) * | 2000-03-13 | 2007-11-27 | Objet Geometries Ltd. | Compositions and methods for use in three dimensional model printing |
EP1456307B1 (en) | 2001-10-03 | 2011-12-07 | 3D Systems, Inc. | Phase change support material composition |
JP2004002616A (ja) * | 2002-03-22 | 2004-01-08 | Konica Minolta Holdings Inc | 活性エネルギー線硬化性組成物、インクジェット用インク組成物、それを用いたインクジェット記録方法及び平版印刷版 |
JP2004255839A (ja) | 2003-02-28 | 2004-09-16 | Hitachi Printing Solutions Ltd | インクジェット方式の三次元造形装置及びその造形法 |
US7104773B2 (en) | 2003-03-07 | 2006-09-12 | Ricoh Printing Systems, Ltd. | Three-dimensional laminating molding device |
JP4403384B2 (ja) * | 2003-03-07 | 2010-01-27 | リコープリンティングシステムズ株式会社 | 三次元積層造形方法 |
JP4411386B2 (ja) | 2004-01-30 | 2010-02-10 | Dic株式会社 | 光ディスク用紫外線硬化型組成物及びそれを用いた光ディスク |
JP4906334B2 (ja) | 2005-12-09 | 2012-03-28 | シーメット株式会社 | 光硬化性樹脂組成物 |
GB0705878D0 (en) | 2007-03-27 | 2007-05-02 | Fujifilm Sericol Ltd | A printing ink |
JP5254632B2 (ja) * | 2008-02-07 | 2013-08-07 | 富士フイルム株式会社 | インク組成物、インクジェット記録方法、印刷物、及び、成形印刷物 |
JP5336746B2 (ja) * | 2008-02-22 | 2013-11-06 | キヤノン株式会社 | インクジェット記録方法及びインクジェット記録装置 |
JP2010155926A (ja) | 2008-12-26 | 2010-07-15 | Jsr Corp | 光硬化性液状樹脂組成物およびインクジェット光造形法による立体造形物の製造方法 |
JP2010155889A (ja) | 2008-12-26 | 2010-07-15 | Jsr Corp | 光硬化性液状樹脂組成物およびインクジェット光造形法による支持体の製造方法 |
EP2228080A1 (en) * | 2009-03-03 | 2010-09-15 | Graftys | Galliated calcium phosphate biomaterials |
US8541072B2 (en) | 2009-11-24 | 2013-09-24 | Xerox Corporation | UV cured heterogeneous intermediate transfer belts (ITB) |
JP2011173981A (ja) | 2010-02-24 | 2011-09-08 | Nippon Shokubai Co Ltd | 光記録媒体用硬化性樹脂組成物、硬化物及び光記録媒体 |
JP2011208088A (ja) * | 2010-03-30 | 2011-10-20 | Fujifilm Corp | 活性エネルギー線硬化型組成物、活性エネルギー線硬化型インク組成物、インクジェット記録方法、印刷物 |
JP5890990B2 (ja) | 2010-11-01 | 2016-03-22 | 株式会社キーエンス | インクジェット光造形法における、光造形品形成用モデル材、光造形品の光造形時の形状支持用サポート材および光造形品の製造方法 |
JP5945902B2 (ja) * | 2010-12-27 | 2016-07-05 | セイコーエプソン株式会社 | インクジェット用インク組成物 |
JP2012250493A (ja) | 2011-06-06 | 2012-12-20 | Seiko Epson Corp | インクセット、印刷物および成形体 |
JP5930646B2 (ja) | 2011-09-30 | 2016-06-08 | 日立マクセル株式会社 | エネルギー線硬化型非水系インクジェットインク組成物 |
JP2014169379A (ja) | 2013-03-04 | 2014-09-18 | Fujifilm Corp | 加飾シートの製造方法、加飾シート、加飾シート成形物、インモールド成形品の製造方法、及び、インモールド成形品 |
JP6183006B2 (ja) | 2013-06-28 | 2017-08-23 | 東洋インキScホールディングス株式会社 | 光学的立体造形用樹脂組成物、及び立体造形物 |
JP6275413B2 (ja) | 2013-08-19 | 2018-02-07 | デンカ株式会社 | 光造形用(メタ)アクリル系樹脂組成物及び支持体の製造方法 |
JP2015078255A (ja) | 2013-10-15 | 2015-04-23 | コニカミノルタ株式会社 | 三次元造形用インクジェットインク組成物および三次元造形物の製造方法 |
WO2015056614A1 (ja) | 2013-10-15 | 2015-04-23 | コニカミノルタ株式会社 | 三次元造形用インクジェットインク組成物および三次元造形物の製造方法 |
JP6346746B2 (ja) * | 2013-12-26 | 2018-06-20 | 株式会社ミマキエンジニアリング | 三次元造形物の製造方法、三次元造形物を製造するためのキット及び三次元造形物 |
JP2015208904A (ja) * | 2014-04-25 | 2015-11-24 | コニカミノルタ株式会社 | 三次元造形装置 |
US10066082B2 (en) | 2014-10-16 | 2018-09-04 | Ricoh Company, Ltd. | Three-dimensional object producing method |
JP6334000B2 (ja) | 2014-12-16 | 2018-05-30 | 富士フイルム株式会社 | 3d印刷用活性光線硬化型インクジェットインク組成物、3次元造形方法、及び、3d印刷用活性光線硬化型インクジェットインクセット |
JP6613659B2 (ja) * | 2014-12-18 | 2019-12-04 | 株式会社リコー | 立体造形物及びその製造方法 |
DE102015015865A1 (de) | 2014-12-22 | 2016-06-23 | Heidelberger Druckmaschinen Ag | Schnell aushärtende UV Inkjet Tinten auf Basis von hochverzweigten Polyesteracrylaten |
CN107107461B (zh) | 2015-01-26 | 2022-03-29 | 科巨希化学股份公司 | 三维造型支撑件用活性能量射线固化性树脂组合物 |
JP2016141113A (ja) * | 2015-02-04 | 2016-08-08 | 富士ゼロックス株式会社 | 積層造形装置及び積層造形プログラム |
WO2016199611A1 (ja) | 2015-06-08 | 2016-12-15 | 富士フイルム株式会社 | 3次元印刷用活性光線硬化型インクジェットインクセット、3次元印刷方法、及び、3次元印刷システム |
JP6679234B2 (ja) | 2015-07-29 | 2020-04-15 | マクセルホールディングス株式会社 | モデル材用樹脂組成物、サポート材用樹脂組成物、光造形品、および、光造形品の製造方法 |
WO2018143293A1 (ja) | 2017-01-31 | 2018-08-09 | マクセルホールディングス株式会社 | 光造形用インクセット、光造形品、及び、光造形品の製造方法 |
US20190358892A1 (en) | 2017-01-31 | 2019-11-28 | Maxell Holdings, Ltd. | Optical shaping ink set, optically shaped article, and method for producing optically shaped article |
US20200407581A1 (en) | 2017-01-31 | 2020-12-31 | Maxell Holdings, Ltd. | Optical shaping ink set, optically shaped article, and method for producing optically shaped article |
-
2016
- 2016-09-15 JP JP2017539967A patent/JP6751096B2/ja active Active
- 2016-09-15 EP EP16846564.9A patent/EP3351367B1/en active Active
- 2016-09-15 CN CN201680053265.5A patent/CN108025486B/zh active Active
- 2016-09-15 WO PCT/JP2016/077256 patent/WO2017047693A1/ja active Application Filing
- 2016-09-15 US US15/759,807 patent/US20180258297A1/en not_active Abandoned
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2022
- 2022-03-22 US US17/701,322 patent/US11795335B2/en active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11447682B2 (en) | 2015-06-17 | 2022-09-20 | Clariant International Ltd | Water-soluble or water-swellable polymers as water loss reducers in cement slurries |
US11311473B2 (en) | 2016-12-12 | 2022-04-26 | Clariant International Ltd | Use of a bio-based polymer in a cosmetic, dermatological or pharmaceutical composition |
US11384186B2 (en) | 2016-12-12 | 2022-07-12 | Clariant International Ltd | Polymer comprising certain level of bio-based carbon |
US11306170B2 (en) | 2016-12-15 | 2022-04-19 | Clariant International Ltd. | Water-soluble and/or water-swellable hybrid polymer |
US11339241B2 (en) | 2016-12-15 | 2022-05-24 | Clariant International Ltd. | Water-soluble and/or water-swellable hybrid polymer |
US11401362B2 (en) | 2016-12-15 | 2022-08-02 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
US11542343B2 (en) | 2016-12-15 | 2023-01-03 | Clariant International Ltd | Water-soluble and/or water-swellable hybrid polymer |
US11597786B2 (en) | 2017-11-22 | 2023-03-07 | Maxell, Ltd. | Composition for model material |
CN115431376A (zh) * | 2022-08-16 | 2022-12-06 | 华中科技大学 | 高强度大型复杂陶瓷素坯及其三维喷印成形方法和装备 |
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EP3351367A1 (en) | 2018-07-25 |
EP3351367B1 (en) | 2022-06-15 |
CN108025486A (zh) | 2018-05-11 |
US20220213335A1 (en) | 2022-07-07 |
JP6751096B2 (ja) | 2020-09-02 |
WO2017047693A1 (ja) | 2017-03-23 |
JPWO2017047693A1 (ja) | 2018-06-28 |
EP3351367A4 (en) | 2019-05-22 |
US11795335B2 (en) | 2023-10-24 |
CN108025486B (zh) | 2021-05-04 |
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