US20170313795A1 - Photocurable resin composition, ink and coating material - Google Patents

Photocurable resin composition, ink and coating material Download PDF

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Publication number
US20170313795A1
US20170313795A1 US15/517,850 US201615517850A US2017313795A1 US 20170313795 A1 US20170313795 A1 US 20170313795A1 US 201615517850 A US201615517850 A US 201615517850A US 2017313795 A1 US2017313795 A1 US 2017313795A1
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Prior art keywords
photocurable resin
resin composition
polymer
allylic
weight
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US15/517,850
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Inventor
Katsutoshi Yokoyama
Shinichiro Ohashi
Satoshi Inoue
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Osaka Soda Co Ltd
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Osaka Soda Co Ltd
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Assigned to OSAKA SODA CO., LTD. reassignment OSAKA SODA CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INOUE, SATOSHI, OHASHI, SHINICHIRO, YOKOYAMA, KATSUTOSHI
Publication of US20170313795A1 publication Critical patent/US20170313795A1/en
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/40Esters of unsaturated alcohols, e.g. allyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F118/00Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F118/14Esters of polycarboxylic acids
    • C08F118/16Esters of polycarboxylic acids with alcohols containing three or more carbon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F120/00Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F120/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F120/10Esters
    • C08F120/40Esters of unsaturated alcohols, e.g. allyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F122/00Homopolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F122/10Esters
    • C08F122/26Esters of unsaturated alcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/44Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/101Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00Inks
    • C09D11/02Printing inks
    • C09D11/10Printing inks based on artificial resins
    • C09D11/106Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D129/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
    • C09D129/02Homopolymers or copolymers of unsaturated alcohols
    • C09D129/06Copolymers of allyl alcohol
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D131/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Coating compositions based on derivatives of such polymers
    • C09D131/06Homopolymers or copolymers of esters of polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00

Definitions

  • the present invention relates to a photocurable resin composition containing an allylic polymer (A) and also relates to an ink and a coating material including the resin composition. Specifically, the present invention relates to a photocurable resin composition having excellent adhesion to plastic substrates.
  • UV curable printing inks are highly valued because, e.g., they have a high cure rate so that they can be cured in a short time;
  • diallyl phthalate resins derived from diallyl phthalate diallyl orthophthalate, diallyl isophthalate, or diallyl terephthalate are used as UV offset inks for paper.
  • Patent Literature 1 describes an active energy ray-curable resin composition that contains a diallyl hydrogenated phthalate prepolymer with an alkyl group on the benzene ring, methyl (meth) acrylate, and other additives, but does not mention anything about adhesion to plastic substrates.
  • PET polyethylene terephthalate
  • PP polypropylene
  • Patent Literature 1 JP S52-4310 A
  • Patent Literature 2 JP H02-77414 A
  • the present invention aims to provide a photocurable resin composition containing an allylic polymer (A) which has excellent adhesion to plastic substrates.
  • the photocurable resin composition of the present invention contains an allylic polymer (A), the allylic polymer (A) being produced by polymerization of an allylic compound represented by the following formula (I):
  • R 1 and R 2 each represent H or CH 3 ;
  • X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.
  • a photocurable resin composition containing an allylic polymer (A) produced by polymerization of an allylic compound of formula (I) has excellent adhesion to plastic substrates and excellent drying properties.
  • Such a photocurable resin composition shows excellent adhesion particularly to polypropylene (PP) resin.
  • PP polypropylene
  • it is suitable as a component of inks or coating materials for PP resin, to which conventional diallyl phthalate resin compositions are difficult to closely adhere.
  • the X in formula (I) preferably has any of the following cyclic structures:
  • the photocurable resin composition of the present invention further contains an ethylenically unsaturated compound (B).
  • an ethylenically unsaturated compound improves the drying properties of the photocurable resin composition and can adjust the viscosity to a level appropriate for printing, thereby allowing the composition to have excellent coating workability.
  • the photocurable resin composition of the present invention further contains a photopolymerization initiator.
  • composition containing a photopolymerization initiator can be smoothly polymerized by exposure to light, so that a higher molecular weight polymer can be produced in a short time.
  • the ink of the present invention includes the photocurable resin composition of the present invention.
  • This ink is suitable for printing on plastic substrates, and especially on PP resin substrates (e.g. sheets or films).
  • the coating material of the present invention includes the photocurable resin composition of the present invention.
  • This coating material is suitable for painting on plastic substrates, and especially on PP resin substrates (e.g. sheets or films).
  • the coating material of the present invention is preferably an overprint varnish.
  • the present invention provides a photocurable resin composition which has excellent adhesion to synthetic polymer substrates, particularly plastic substrates, when it is used as a component of inks, coating materials, adhesives, or photoresists.
  • the photocurable resin composition of the present invention contains an allylic polymer (A) produced by polymerization of an allylic compound represented by the following formula (I):
  • R 1 and R 2 each represent H or CH 3 ;
  • X represents an a-valent group having an unsubstituted saturated or partially unsaturated four- to eight-membered cyclic structure; and a represents 2 or 3.
  • Preferred examples of X in formula (I) include those having the following cyclic structures:
  • X in formula (I) include those having the following cyclic structures:
  • the X may be of various types and may have a cyclic structure other than those mentioned above.
  • the number of double bonds in the cyclic structure is not limited to one, and may be two or more. However, X does not have an aromatic six-membered cyclic structure.
  • the X may be intramolecularly crosslinked.
  • Examples of the intramolecularly crosslinked X include adamantane, norbornene, and norbornane.
  • X is an a-valent group where a is 2 or 3
  • X is a bivalent or trivalent group.
  • a number “a (2 or 3)” of allyl ester groups [—CO—O—CH 2 —CR 2 ⁇ CHR 1 ] shown in formula (I) are bound to the cyclic structure of X.
  • the allylic compound may be a mixture of compounds that differ in the combination of substitution positions. Particularly when two allyl ester groups are bound to a six-membered X, the two allyl ester groups may be in the ortho, meta, or para orientation, preferably in the ortho or para orientation.
  • allylic compound of formula (I) examples include diallyl 1,2-cyclohexanedicarboxylate, diallyl 1,3-cyclohexanedicarboxylate, diallyl 1,4-cyclohexanedicarboxylate, diallyl 4-cyclohexene-1,2-dicarboxylate, and diallyl 2-cyclohexene-1,2-dicarboxylate.
  • diallyl 1,2-cyclohexanedicarboxylate diallyl 4-cyclohexene-1,2-dicarboxylate
  • diallyl 1,4-cyclohexanedicarboxylate diallyl 1,2-cyclohexanedicarboxylate being more preferred.
  • An allylic polymer (A) produced by polymerization of at least one compound selected from the group consisting of the aforementioned allylic compounds may be used in the photocurable resin composition.
  • copolymers produced by copolymerization of the allylic compound of formula (I) and other polymerizable compounds may be used in the photocurable resin composition.
  • the specific exemplary allylic compounds of formula (I) may be produced, for example, by an esterification reaction between cyclohexanedicarboxylic acid or cyclohexanedicarboxylic anhydride and allyl alcohol or allyl chloride, or an esterification reaction between cyclohexenedicarboxylic acid or cyclohexenedicarboxylic anhydride and allyl alcohol or allyl chloride.
  • the allylic compound of formula (I) may be polymerized by any method, including usual polymerization reactions.
  • An appropriate polymerization initiator if needed, may be added in the polymerization reaction.
  • the use of a polymerization initiator allows for production of a higher molecular weight polymer in a short time.
  • polymerization initiator used in the polymerization reaction of the allylic compound examples include azo initiators such as azobisisobutyronitrile and dimethyl 2,2′-azobisisobutyrate; peroxide initiators such as ketone peroxides, peroxy ketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxy dicarbonates, peroxy esters, and benzoyl peroxide; and photopolymerization initiators, including: acetophenone initiators such as 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one and 1-hydroxycyclohexyl phenyl ketone; benzoin initiators such as benzoin and benzoin ethyl ether; benzophenone initiators such as benzophenone; phosphorus initiators such as acylphosphine oxide; sulfur initiators such as thioxanthone; and benzil initiators such as benzil
  • the amount of the polymerization initiator relative to 100 parts by weight of the allylic compound of formula (I) as a monomer is preferably 5.0 parts by weight or less, more preferably 3.0 parts by weight or less. Moreover, the amount is particularly preferably 0.001 to 3.0 parts by weight.
  • the reaction temperature during the polymerization is preferably 60 to 240° C., e.g. 80 to 220° C.
  • the reaction time is preferably 0.1 to 100 hours, e.g. 1 to 30 hours.
  • An allylic polymer (A) having a monomer unit based on the allylic compound of formula (I) can be prepared by polymerization of the allylic compound of formula (I) as described above or by other methods.
  • the amount of the monomer unit based on the allylic compound of formula (I), based on 100% by weight of the allylic polymer (A), is preferably 20% by weight or more, more preferably 50% by weight or more, further more preferably 80% by weight or more, particularly preferably 98% by weight or more, and may be 100% by weight.
  • the allylic polymer (A) preferably has a weight average molecular weight of 300,000 or less, more preferably 200,000 or less.
  • the weight average molecular weight is further more preferably 2,000 to 150,000, particularly preferably 5,000 to 140,000.
  • the amount of the allylic polymer (A) in the photocurable resin composition of the present invention is preferably 1% to 60% by weight, more preferably 1% to 55% by weight, further more preferably 1% to 50% by weight of the total amount of the photocurable resin composition.
  • the lower limit of the amount is particularly preferably 20% by weight.
  • the allylic polymer (A) in an amount of more than 60% by weight may have a lower solubility in an ethylenically unsaturated compound (B) and a higher viscosity leading to poor handleability.
  • the allylic polymer (A) in an amount of less than 1% by weight may not allow the resulting photocurable resin composition to have sufficient drying properties.
  • the photocurable resin composition of the present invention preferably contains an ethylenically unsaturated compound (B) that can be cured by exposure to light.
  • the ethylenically unsaturated compound (B) preferably has 1 to 20, more preferably 1 to 10, further more preferably 2 to 6 carbon-carbon double bonds.
  • the ethylenically unsaturated compound (B) may be, for example, a (meth) acrylic acid ester compound, a (meth) allyl compound, or a vinyl compound.
  • the ethylenically unsaturated compound may be a mixture of two or more compounds.
  • Examples of the (meth) acrylic acid ester compound include (meth) acrylic acid ester compounds of alcohols such as pentaerythritol, dipentaerythritol, trimethylolpropane, ditrimethylolpropane, neopentyl glycol, 1,6-hexanediol, glycerol, polyethylene glycol, or polypropylene glycol, and alkylene oxide (e.g. ethylene oxide, propylene oxide) adducts of these (meth) acrylic acid ester compounds; (meth) acrylic acid ester compounds of alkylene oxide (e.g.
  • ethylene oxide, propylene oxide) adducts of bisphenols such as bisphenol A or bisphenol F; (meth) acrylic acid ester compounds such as epoxy (meth) acrylate, urethane (meth) acrylate, and alkyd (meth) acrylate; and (meth) acrylic acid ester compounds such as epoxidized soybean oil acrylate.
  • (meth) acrylic acid ester compounds of alcohols such as pentaerythritol, dipentaerythritol, trimethylolpropane, ditrimethylolpropane, neopentyl glycol, 1,6-hexanediol, glycerol, polyethylene glycol, or polypropylene glycol, and alkylene oxide (e.g. ethylene oxide, propylene oxide) adducts of these (meth) acrylic acid ester compounds.
  • alcohols such as pentaerythritol, dipentaerythritol, trimethylolpropane, ditrimethylolpropane, neopentyl glycol, 1,6-hexanediol, glycerol, polyethylene glycol, or polypropylene glycol, and alkylene oxide (e.g. ethylene oxide, propylene oxide) adducts of these (meth) acrylic acid ester compounds.
  • alkylene oxide
  • (meth) acrylic acid ester compounds of alcohols such as pentaerythritol, dipentaerythritol, trimethylolpropane, or ditrimethylolpropane, and alkylene oxide (e.g. ethylene oxide, propylene oxide) adducts of these (meth) acrylic acid ester compounds.
  • alcohols such as pentaerythritol, dipentaerythritol, trimethylolpropane, or ditrimethylolpropane
  • alkylene oxide e.g. ethylene oxide, propylene oxide
  • Examples of the (meth) allyl compound include di (meth) allyl phthalate and tri (meth) allyl isocyanurate.
  • vinyl compound examples include styrene, divinylbenzene, N-vinylpyrrolidone, and vinyl acetate.
  • ditrimethylolpropane tetraacrylate or trimethylolpropane triacrylate is preferred among these, with ditrimethylolpropane tetraacrylate being more preferred.
  • the amount of the ethylenically unsaturated compound (B) contained in the photocurable resin composition of the present invention is preferably 50 to 400 parts by weight, more preferably 50 to 300 parts by weight, furthermore preferably 50 to 250 parts by weight, relative to 100 parts by weight of the allylic polymer (A) in the photocurable resin composition.
  • the ratio by weight of the allylic polymer (A) to the ethylenically unsaturated compound (B) (allylic polymer:ethylenically unsaturated compound) in the photocurable resin composition of the present invention may be in the range of 10:90 to 90:10, preferably 20:80 to 80:20, more preferably 30:70 to 50:50.
  • the ratio is within the range indicated above, the photocurable resin composition can easily show sufficient adhesion to plastic substrates.
  • the photocurable resin composition of the present invention may contain a polymerization initiator, and in particular preferably a photopolymerization initiator.
  • photopolymerization initiators that may be contained in the photocurable resin composition include acetophenone initiators such as 2-methyl-1-[4-(methylthio) phenyl]-2-morpholinopropane-1-one and 1-hydroxycyclohexyl phenyl ketone; benzoin initiators such as benzoin and benzoin ethyl ether; benzophenone initiators such as benzophenone; phosphorus initiators such as acylphosphine oxide; sulfur initiators such as thioxanthone; and benzil initiators such as benzil and 9,10-phenanthrenequinone.
  • acetophenone initiators such as 2-methyl-1-[4-(methylthio) phenyl]-2-morpholinopropane-1-one and 1-hydroxycyclohexyl phenyl ketone
  • the amount of the photopolymerization initiator contained in the photocurable resin composition is preferably in the range of 0.1% to 15% by weight, more preferably 0.5% to 12% by weight, further more preferably 1% to 10% by weight of the total photocurable resin composition.
  • a photoinitiation aid e.g. an amine photoinitiation aid such as triethanolamine
  • an amine photoinitiation aid such as triethanolamine
  • the amount of the photoinitiation aid is preferably in the range of 0.1% to 5% by weight, more preferably 0.5% to 3% by weight of the total photocurable resin composition.
  • the photocurable resin composition of the present invention may contain various additives depending on the purpose, and examples of the additives include stabilizers (e.g. polymerization inhibitors such as hydroquinone and methoquinone), coloring agents such as pigments (e.g. cyanine blue, disazo yellow, carmine 6b, lake red C, carbon black, titanium white), fillers, and viscosity modifiers.
  • stabilizers e.g. polymerization inhibitors such as hydroquinone and methoquinone
  • coloring agents such as pigments (e.g. cyanine blue, disazo yellow, carmine 6b, lake red C, carbon black, titanium white)
  • fillers e.g. cyanine blue, disazo yellow, carmine 6b, lake red C, carbon black, titanium white
  • viscosity modifiers e.g. cyanine blue, disazo yellow, carmine 6b, lake red C, carbon black, titanium white
  • the amount of the stabilizer contained in the photocurable resin composition is preferably in the
  • the amount of the coloring agent is preferably in the range of 1% to 50% by weight, more preferably 1% to 45% by weight of the total photocurable resin composition.
  • the photocurable resin composition of the present invention can be prepared by mixing an allylic polymer (A) and optionally an ethylenically unsaturated compound (B) as well as a photopolymerization initiator, a photoinitiation aid, and additives (e.g. a stabilizer, a pigment).
  • the photocurable resin composition of the present invention is cured by exposure to light.
  • the light used in the curing is typically ultraviolet rays.
  • the curing reaction of the photocurable resin composition may be carried out with any curing apparatus under any curing condition, and methods commonly used for photocuring reactions may be used.
  • the photocurable resin composition of the present invention can be used in any application. It may be used in various technical fields, such as inks (e.g. printing inks such as photocurable printing inks for lithography, silk screen printing inks, and gravure inks), coating materials (e.g. coating materials for paper, plastics, metals, wood, or other substrates, such as overprint varnishes), adhesives, and photoresists.
  • inks e.g. printing inks such as photocurable printing inks for lithography, silk screen printing inks, and gravure inks
  • coating materials e.g. coating materials for paper, plastics, metals, wood, or other substrates, such as overprint varnishes
  • adhesives e.g. adhesives, and photoresists.
  • An ink including the photocurable resin composition of the present invention is the ink of the present invention.
  • a coating material including the photocurable resin composition of the present invention is the coating material of the present invention.
  • the coating material of the present invention is preferably an overprint varnish.
  • the ink may typically be produced as follows.
  • An allylic polymer (A) and a stabilizer or the like are dissolved in an ethylenically unsaturated compound (B) with stirring at 60° C. to 100° C. to prepare a varnish.
  • the varnish is mixed with a pigment, a photopolymerization initiator, and other additives with stirring in a butterfly mixer and then milled using, for example, a three-roll mill to obtain an ink.
  • An overprint varnish can be produced in the same manner as described for the ink with the exception of not using any pigment.
  • Mw Weight average molecular weight
  • Mw/Mn molecular weight distribution
  • Diallyl 1,2-cyclohexanedicarboxylate was prepared by an esterification reaction between cyclohexanedicarboxylic anhydride and allyl alcohol.
  • Diallyl 1,2-cyclohexanedicarboxylate polymers were synthesized under the same polymerization conditions as in Production Example 1, except that the polymerization time was changed.
  • Photocurable resin compositions with the formulations described in Table 1 were prepared and evaluated for their properties.
  • Polymers 1 to 5 produced in Production Examples 1 to 5 or DAP resin, ethylenic compounds, and polymerization initiators were added in the formulation amounts indicated in Table 1 and mixed with heat at 100° C. to prepare photocurable resin compositions.
  • the photocurable resin compositions were cooled to room temperature and then allowed to stand overnight. Thereafter, the appearance of each composition was evaluated for transparency to determine the solubility.
  • the compositions having a transparent appearance after cooling were rated as “Good”, and those having a cloudy appearance were rated as “Poor”. Table 2 shows the results.
  • Example 3 Example 4 Example 5 Example 1 Example 2 Example 3 Polymer 1 40 — — — — — — — Polymer 2 — 40 — — 30 — — — Polymer 3 — — 40 — — — — — Polymer 4 — — — 40 — — — — — Polymer 5 — — — — — — — 15 30 DAP resin — — — — — 30 15 — DTMPA 60 60 60 60 70 70 — — DPHA — — — — — — 70 — 3EO-TMPTA — — — — — — — — 70 Irgacure 907 10 10 10 10 10 10 10 10 10 10 Irganox 1076 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3
  • DAP resin diallyl phthalate resin available from Osaka Soda Co., Ltd.
  • DTMPTA SR355, ditrimethylolpropane tetraacrylate, available from Sartomer DPHA: ARONIX M-404, dipentaerythritol hexaacrylate, available from Toagosei Co., Ltd.
  • 3EO-TMPTA NK ester A-TMPT-3EO, ethylene oxide-modified trimethylolpropane triacrylate, available from Shin-Nakamura Chemical Co., Ltd.
  • Irgacure 907 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one available from BASF Japan
  • Irganox 1076 octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate available from BASF Japan
  • the viscosity of the photocurable resin compositions was measured at 30° C. using a Brookfield viscometer DV-II+Pro. Table 2 shows the results.
  • the photocurable resin compositions were each applied to two types of plastic substrates, i.e., a polypropylene substrate (highly transparent cast PP sheet available from Tatsuta Chemical Co., Ltd., trade name: High P Crystal ST-500, thickness: 0.3 mm) and a polypropylene substrate (highly transparent cast PP sheet available from Idemitsu Unitech Co., Ltd., trade name: SUPERPURELAY SG-140TC, thickness: 0.3 mm), using a No.2 bar coater. Then, each of the coated films was cured using a metal halide lamp with an output of 60 W/cm (irradiation distance: 10 cm) at a conveyor speed at which the coated film became tack-free.
  • a polypropylene substrate highly transparent cast PP sheet available from Tatsuta Chemical Co., Ltd., trade name: High P Crystal ST-500, thickness: 0.3 mm
  • a polypropylene substrate highly transparent cast PP sheet available from Idemitsu Unitech Co
  • the UV curing apparatus used was a conveyor-type UV curing apparatus available from Eye Graphics Co., Ltd.
  • An 18 mm width strip of Cellotape (registered trademark) (Nichiban Co., Ltd., product No. LP-18, adhesive force: 4.01 N/10 mm) was attached to the resulting coated films. After strong rubbing with a thumb for 30 seconds or longer, the Cellotape (registered trademark) strip was peeled gradually and then rapidly to evaluate the degree of detachment of the coated films. The evaluation criteria are described below. Table 2 shows the results.
  • the photocurable resin compositions were coated on a slide glass (Matsunami Glass Ind., Ltd., S9213, standard large soda-lime glass, ground edges, t1.3) and then cured using a metal halide lamp with an output of 60 W/cm (irradiation distance: 10 cm).
  • the pencil hardness of the cured products was measured using a hand push pencil scratch hardness tester available from Yasuda Seiki Seisakusho, Ltd. in accordance with JIS K 5600. Table 2 shows the results.
  • the photocurable resin compositions prepared from Polymers 1 to 4 each of which corresponds to an allylic polymer (A) produced by polymerization of an allylic compound of formula (I), had drying properties equivalent to a photocurable resin composition prepared from a diallyl phthalate resin, such as Comparative Example 1. They also exhibited excellent adhesion to polypropylene sheets to which the photocurable resin composition of Comparative Example 1 prepared from a diallyl phthalate resin was difficult to adhere.
  • the photocurable resin composition of Comparative Example 2 prepared from a combination of a diallyl phthalate resin and Polymer 5 could not be applied to a polypropylene sheet.
  • the photocurable resin composition of the present invention can be used in inks (e.g. offset inks), coating materials, adhesives, photoresists, and other applications for plastic substrates.
  • inks e.g. offset inks
  • coating materials e.g. adhesives, photoresists, and other applications for plastic substrates.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Paints Or Removers (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
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CN115244146A (zh) * 2020-03-30 2022-10-25 株式会社大阪曹达 活性能量射线固化型墨组合物

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EP3674329A4 (en) * 2017-08-24 2021-05-05 Osaka Soda Co., Ltd. LIGHT CURABLE RESIN COMPOSITION, INK AND VARNISH
JP6725079B2 (ja) * 2017-08-24 2020-07-15 株式会社大阪ソーダ 不飽和ポリエステル樹脂組成物
JP2020050735A (ja) * 2018-09-26 2020-04-02 岡本化学工業株式会社 光学的立体造形用組成物、並びに立体造形物、及びその製造方法
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CN106715498A (zh) 2017-05-24
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EP3199562B1 (en) 2024-04-03
EP3199562A4 (en) 2018-04-11
EP3199562A1 (en) 2017-08-02
TW201629139A (zh) 2016-08-16
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JP6690554B2 (ja) 2020-04-28
US11084891B2 (en) 2021-08-10
US20190135955A1 (en) 2019-05-09
JPWO2016125661A1 (ja) 2017-11-09
WO2016125661A1 (ja) 2016-08-11
TWI703184B (zh) 2020-09-01

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