US20120168219A1 - Active resin composition, surface mounting method and printed wiring board - Google Patents

Active resin composition, surface mounting method and printed wiring board Download PDF

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Publication number
US20120168219A1
US20120168219A1 US13/339,981 US201113339981A US2012168219A1 US 20120168219 A1 US20120168219 A1 US 20120168219A1 US 201113339981 A US201113339981 A US 201113339981A US 2012168219 A1 US2012168219 A1 US 2012168219A1
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United States
Prior art keywords
printed wiring
resin composition
resin
mounting method
temperature
Prior art date
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Abandoned
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US13/339,981
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English (en)
Inventor
Kazunori Kitamura
Yasuhiro Takase
Kazuki HANADA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
San Ei Kagaku Co Ltd
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San Ei Kagaku Co Ltd
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Filing date
Publication date
Application filed by San Ei Kagaku Co Ltd filed Critical San Ei Kagaku Co Ltd
Assigned to SAN-EI KAGAKU CO., LTD reassignment SAN-EI KAGAKU CO., LTD ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HANADA, KAZUKI, KITAMURA, KAZUNORI, TAKASE, YASUHIRO
Publication of US20120168219A1 publication Critical patent/US20120168219A1/en
Priority to US14/612,310 priority Critical patent/US9072205B1/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1305—Bipolar Junction Transistor [BJT]
    • H01L2924/13055—Insulated gate bipolar transistor [IGBT]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to an active resin composition suitably employed in flip-chip mounting, to a surface mounting method, and to a printed wiring board produced through the surface mounting method.
  • a flux known in the art contains, as an activating agent, a compound having a carboxylic acid group (e.g., rosin).
  • a BGA part includes a plurality of mounted chips for enhancing device performance.
  • the dimensions of such a BGA part have gradually over the years.
  • a wash-less flux which contains a less-corrosive activating agent having low activity and which requires no washing step.
  • the wash-less flux generates decomposition gas during thermal curing of the under-filling resin, resulting in destruction of BGA parts, which is also problematic.
  • connection portions between BGA parts impedes filling the space with under-filling resin.
  • the surface of a printed wiring substrate has dents and protrusions (circuits, solder resist, etc.)
  • the dents cannot be completely filled with the under-filling resin, in some cases, providing voids and unfilled portions.
  • quality and reliability of products are considerably impaired. If such voids or the like are not found, when a subsequent step of thermally curing the under-filling resin is performed, the products cannot be repaired and must be discarded, thereby lowering product yield.
  • the present invention provides an active resin composition and a surface mounting method employing the resin composition, exhibiting the below-described meritorious effects.
  • the present invention provides:
  • the present inventors have carried out extensive studies in order to attain the aforementioned objects.
  • an active resin composition comprising an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1 to 50 parts by weight and/or a carboxylic acid compound in an amount of 1 to 10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1 to 30 parts by weight.
  • a surface mounting method comprising:
  • a surface mounting method comprising:
  • the active resin composition may be applied to at least a part of a metallic surface of the printed wiring substrate.
  • drying the applied resin composition and/or heating at a temperature which is equal to or higher than softening temperature of the applied resin composition and which is lower than the curing reaction-initiating temperature.
  • a printed wiring board produced through any of the aforementioned surface mounting methods.
  • the present invention provides an active resin composition and a surface mounting method employing the resin composition, exhibiting the below-described effects.
  • FIG. 1 is a sketch with cross-sections showing an embodiment of the mounting method of the present invention
  • FIG. 2 is a sketch with cross-sections showing another embodiment of the mounting method of the present invention.
  • FIG. 3A is a plan view of a printed wiring substrate employed in Examples 1 to 5;
  • FIG. 3B is a cross-section of the printed wiring substrate shown in FIG. 3A , cut along a-a′;
  • FIG. 4 is a sketch with cross-sections showing an embodiment of the mounting method employed in the Examples
  • FIG. 5A is a bottom plan view of a semiconductor chip employed in Examples 1 to 5;
  • FIG. 5B is a cross-section of the semiconductor chip shown in FIG. 5A , cut along a-a′;
  • FIG. 6A is a plan view of another printed wiring substrate employed in Examples 1 to 5;
  • FIG. 6B is a cross-section of the printed wiring substrate shown in FIG. 6A , cut along a-a′;
  • FIG. 7A is a bottom plan view of a BGA part employed in Examples 1 to 5;
  • FIG. 7B is a cross-section of the BGA part shown in FIG. 7A , cut along a-a′.
  • the active resin composition employed in the surface mounting method of the present invention contains an epoxy resin, which also serves a matrix resin.
  • the epoxy resin reacts with the below-described activating agent during the curing reaction, to thereby deactivate the activating agent.
  • the cured active resin composition has very high thermal stability, and therefore, corrosion and generation of decomposition gas during heating (e.g., thermal curing of the under-filling resin) are prevented.
  • the epoxy resin examples include epoxy resins which assume solid at room temperature.
  • the epoxy resin preferably has a softening temperature of, for example, 70 to 150° C., particularly preferably 80 to 100° C.
  • Specific examples of the solid epoxy resin include cresol-novolak epoxy resin, dicyclopentadienyl-type epoxy resin, biphenyl-type epoxy resin, bisphenol A-type solid epoxy resin, and solid alicyclic epoxy resin.
  • the epoxy resin may be an epoxy resin which assumes liquid at room temperature.
  • the liquid epoxy resin is an epoxy resin which is liquid or semi-solid at ambient temperature, for example, an epoxy resin having fluidity at ambient temperature.
  • Such liquid epoxy resin preferably has a viscosity (room temperature) of, for example, 20,000 mPa ⁇ s or lower, particularly preferably 1,000 to 10,000 mPa ⁇ s.
  • liquid epoxy resin examples include liquid bisphenol A-type epoxy resins represented by the following formula:
  • epoxy resins may be used singly or in combination. Specific examples further include liquid bisphenol F-type epoxy resins represented by the following formula:
  • epoxy resins (wherein n is 0 or 1, and G represents glycidyl group). These epoxy resins may be used singly or in combination.
  • liquid epoxy resin further include naphthalene-type epoxy resin, diphenyl thioether (sulfide)-type epoxy resin, trityl-type epoxy resin, alicyclic epoxy resin, alcohol-derived epoxy resin, diallyl bis-A-type epoxy resin, methylresorcinol-type epoxy resin, bisphenol AD-type epoxy resin, and N,N,O-tris(glycidyl)-p-aminophenol.
  • naphthalene-type epoxy resin diphenyl thioether (sulfide)-type epoxy resin
  • trityl-type epoxy resin alicyclic epoxy resin
  • alcohol-derived epoxy resin diallyl bis-A-type epoxy resin
  • methylresorcinol-type epoxy resin methylresorcinol-type epoxy resin
  • bisphenol AD-type epoxy resin bisphenol AD-type epoxy resin
  • N,N,O-tris(glycidyl)-p-aminophenol N,N,O-tris(glycidy
  • liquid epoxy resins examples include bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, N,N,O-tris(glycidyl)-p-aminophenol, and bisphenol AD-type epoxy resin. These epoxy resins may be used singly or in combination.
  • the active resin composition of the invention contains a blocked carboxylic acid compound and/or a carboxylic acid compound.
  • the carboxylic acid species serves as an activating agent.
  • the blocked carboxylic acid compound is synthesized through reaction between a carboxylic acid compound with a blocking agent.
  • a carboxylic acid compound with a blocking agent When the blocked carboxylic acid compound is used, side reaction at low temperature can be inhibited, to thereby enhance storage stability of the active resin composition.
  • the carboxylic acid compound serving as a starting material for synthesizing the blocked carboxylic acid compound, may be a monocarboxylic acid compound.
  • the starting carboxylic acid compound include aromatic monocarboxylic acids (e.g., (hydroxy)benzoic acid, dihydroxybenzoic acid, phenylacetic acid, benzoic acid, toluic acid, and naphthoic acid); saturated monocarboxylic acids (e.g., acetic acid, propionic acid, butyric acid, 2-methylpropanoic acid (isobutyric acid), 2-ethylhexanoic acid, lauric acid, and cyclohexanecarboxylic acid); unsaturated monocarboxylic acids (e.g., acrylic acid, methacrylic acid, crotonic acid, and oleic acid); and abietic acid.
  • aromatic monocarboxylic acids e.g., (hydroxy)benzoic acid, dihydroxybenzoic acid, phenylacetic acid,
  • the starting carboxylic acid compound further include polycarboxylic acid compounds. More specific examples include aliphatic polyvalent carboxylic acids (e.g., oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, azelaic acid, sebacic acid, decamethylenedicarboxylic acid, butanetetracarboxylic acid, and 1,2,3,4-butanetetracarboxylic acid); aromatic polyvalent carboxylic acids (e.g., phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, and benzenecarboxylic acid (in particular, having 3 to 4 carboxylic groups)); alicyclic polyvalent carboxylic acids (e.g., tetrahydrocarboxylic acid, hexahydrocarboxylic acid, tetrahydrophthalic acid, and hexahydrophthal
  • the blocking agent serving as the other starting material for synthesizing the blocked carboxylic acid compound, is preferably a compound whose carboxyl-blocking (protecting) group is removed at the curing reaction-initiating temperature of the active resin composition.
  • the starting blocking agent include compounds having one vinyl ether moiety in the molecules thereof, more specifically, aliphatic vinyl ethers (e.g., methyl vinyl ether, ethyl vinyl ether, isopropyl vinyl ether, n-propyl vinyl ether, isobutyl vinyl ether, n-butyl vinyl ether, cyclohexyl vinyl ether, propyl vinyl ether, butyl vinyl ether, 2-ethylcyclohexyl vinyl ether, t-butyl vinyl ether, and 2-ethylhexyl vinyl ether); cyclic vinyl ethers (e.g., 2,3-dihydrofuran, 2,3-dihydro-2H-pyran, 3,4-
  • the starting blocking agent further include compounds having two or more vinyl ether moieties in the molecules thereof, more specifically, divinyl ether compounds (e.g., ethylene glycol divinyl ether, 1,2-propylene glycol divinyl ether, 1,3-propylene glycol divinyl ether, 1,3-butanediol divinyl ether, 1,4-butanediol divinyl ether, 2,3-butanediol divinyl ether, 1,6-hexanediol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, pentanediol divinyl ether, dimethylbutanediol divinyl ether, 3-methyl-1,5-pentanediol divinyl ether, hydrogenated bisphenol A divinyl ether, neopentyl glycol divinyl ether, 1,8-octanediol divinyl ether, hydrogenated
  • blocked carboxylic acid compound examples include bisalkyl esters of cyclohexanedicarboxylic acid, 1-isopropoxyethyl (meth)acrylate, 1-ethoxyethyl (meth)acrylate, 1-t-butoxyethyl (meth)acrylate, 1-(1-methylhexyloxy)ethyl (meth)acrylate, 1-(1,1-dimethylpropoxy)ethyl (meth)acrylate, 1-isopropoxyethyl(meth)acrylamide, 1-ethoxyethyl(meth)acrylamide, 1-t-butoxyethyl(meth)acrylamide, 1-(1-methylhexyloxy)ethyl(meth)acrylamide, 1-(1,1-dimethylpropoxy)ethyl(meth)acrylamide, 1,2,4-benzenetricarboxylic acid 2,4-bis(propoxyethyl)-1-((meth)acryloxyethyl)ester
  • Specific examples of commercial products of the blocked carboxylic acid compound include Santacid G, Santacid FK-03, Santacid FK-05, Santacid FK-16, Santacid KM-01, Nofcure-TN-2, Nofcure-OP, and Nofcure-TY501 (products of NOF Corporation). These compounds may be used singly or in combination.
  • the carboxylic acid compound itself may be used.
  • the carboxylic acid compound may be the same as those exemplified as the aforementioned starting material for synthesizing the blocked carboxylic acid compound. These compounds may be used singly or in combination.
  • the active resin composition of the invention contains a curing agent.
  • the curing agent can initiate curing reaction at 150° C. or higher (preferably 160 to 200° C.) Through employment of the curing agent that acts at high temperature, no curing reaction occurs by heating for a short period of time. Thus, curing of the active resin composition during reflow soldering can be prevented.
  • Specific examples of the curing agent include dicyandiamide.
  • the active resin composition may further contain a solvent. Particularly when the composition contains a solid material (solid epoxy resin or the like), incorporation of a solvent is preferred.
  • the solvent preferably has a boiling point lower than the curing reaction-initiating temperature, particularly preferably 150 to 200° C. Specific examples of the solvent include glycol ethers, ethylene glycol ether esters, propylene glycol ether esters, and N-methylpyrrolidone.
  • the active resin composition may contain other additives such as a defoaming agent (e.g., polydimethylsiloxane), a silane coupling agent, and Aerosil.
  • a defoaming agent e.g., polydimethylsiloxane
  • silane coupling agent e.g., silane-based silane-based silane-based silane-based silane-based silane-based silane, and Aerosil.
  • the active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1 to 50 (preferably 10 to 40) parts by weight and/or a carboxylic acid compound in an amount of 1 to 10 (preferably 2 to 5) parts by weight, and a curing agent in an amount of 1 to 30 (preferably 2 to 7) parts by weight.
  • the amount of solvent is preferably 10 to 300 (preferably 30 to 100) parts by weight.
  • the active resin composition may or may not contain a solvent and may assume solid or liquid form. However, in a preferred embodiment, the active resin composition assumes in the form of a solid having a softening temperature of 50 to 150 (particularly 80 to 120)° C., after removal of solvent (or drying of resin). In the case where the softening temperature is excessively low, the composition exhibits a tacky property even at room temperature, possibly resulting in deposition of dust (i.e., migration of foreign matter into the device), whereas when the softening temperature is excessively high, defoaming during the vacuum treatment performed after reflow-mounting may be insufficient. In addition, the active resin composition is preferably re-softened by heating after solidification by cooling.
  • an active resin composition 3 ( FIG. 1 ) (See step B) falling within the scope of the invention is applied to at least a part of the surface (or the entire surface) of a printed wiring substrate 1 ( FIG. 1 ) (See step A).
  • the thus-applied active resin composition may be referred to as “applied resin.”
  • the active resin composition may be applied to at least a part of a metallic surface of the printed wiring substrate.
  • the metallic surface may be formed of, for example, at least one species selected from among pure metals (e.g., copper) and alloys (e.g., solder).
  • the resin composition may be applied onto at least a part of a circuit and/or at least a part of a pad 2 ( FIG. 1 ) (See step A). Furthermore, the resin composition may be applied to at least a solder portion of a surface mount device 4 ( FIG. 1 ) (See step C) serving as a member to be bonded. More specifically, the resin composition may be applied to the entire bottom surface of the surface mount device or to a bump 9 ( FIG. 1 ) (See step C) of the surface mount device.
  • the applied resin generally has a thickness of 10 to 50 ⁇ m.
  • the applied resin may be dried for removal of the solvent.
  • the applied resin generally assumes the form of a tack-free coating film.
  • the drying conditions may be 80 to 120° C. for 10 to 30 minutes.
  • the applied resin may be heated at a temperature which is equal to or higher than the softening temperature of the applied resin and which is lower than the curing reaction-initiating temperature (hereinafter this heating process may be referred to as “heating A”).
  • heating A the applied resin generally exhibits tacky property, whereby mounting of a surface mount device is facilitated.
  • the heating conditions may be 80 to 180° C. for 10 seconds to 10 minutes.
  • Drying and heating A of the applied resin may be performed singly or in combination, and sequentially in any order or simultaneously.
  • the surface mount device 4 ( FIG. 1 ) (See step C) is mounted on the printed wiring substrate 1 ( FIG. 1 ) (See step C).
  • the surface mount device may be a package device or a semiconductor chip. Examples of the package device include BGA parts, CSP parts, MCM parts, IPM parts, and IGBT parts.
  • reflow soldering is performed ( FIG. 1 ) (See step D).
  • the reflow conditions may be 240 to 300° C. for 10 seconds to 10 minutes.
  • the applied resin may undergo curing reaction, which is not preferred.
  • heating B there is performed a vacuum treatment and/or heating of the applied resin at a temperature lower than the curing reaction-initiating temperature
  • the vacuum treatment is performed for the following reasons. Specifically, during reflow soldering, oxides or the like present on the surface of molten solder undergo chemical reaction (including reduction) by the applied resin (active resin composition), to thereby possibly form water or other substances. In the case where the formed water or other substances remain in the applied resin, they are evaporated with volume expansion during thermal curing of the resin, whereby the cured applied resin may have bubbles, voids, etc. Therefore, the vacuum treatment is performed for the purpose of removing water or the like in advance. In addition, through the vacuum treatment, defoaming of the applied resin or the like is completed. Preferred vacuum treatment conditions include a vacuum degree of 10 to 80,000 (particularly 100 to 50,000) Pa for 1 to 60 (particularly 5 to 30) minutes.
  • Heating B is performed at a temperature lower than the curing reaction-initiating temperature of the applied resin.
  • heating B is preferably performed at a temperature equal to or higher than the softening temperature of the applied resin.
  • the applied resin is softened through heating B, and the thus-softened applied resin buries the irregularities of the surface of the printed wiring substrate (i.e., planarization).
  • Preferred specific heating conditions include 60 to 150 (particularly 80 to 120)° C. for 0.1 to 60 (particularly 1 to 10) minutes.
  • the vacuum treatment and heating B may be performed singly or in combination, and sequentially in any order or simultaneously. Preferably, at least the vacuum treatment is performed.
  • the applied resin 10 is thermally cured ( FIG. 1 ) (See step E).
  • the thermal curing temperature is equal to or higher than the curing reaction-initiating temperature provided by the curing agent.
  • Specific thermal curing conditions include 150 to 200° C. for 1 to 4 hours.
  • the blocked carboxylic acid compound and/or carboxylic acid compound react(s) with the epoxy resin, thereby losing the activity as the activating agent.
  • impairment of reliability which would otherwise be caused by corrosion or the like, can be prevented.
  • the printed wiring board of the present invention is produced.
  • the above-described steps; from application of active resin to reflow soldering are performed.
  • the aforementioned active resin composition 3 ( FIG. 2 ) (See step B) is applied to at least a part of the surface of a printed wiring substrate 1 ( FIG. 2 ) (See step A).
  • a surface mount device 4 ( FIG. 2 ) (See step C) is mounted on the printed wiring substrate 1 ( FIG. 2 ) (See step C).
  • reflow soldering is performed ( FIG. 2 ) (See step D).
  • a space of interest is filled with an under-filling resin 11 ( FIG. 2 ) (See step E).
  • the under-filling resin preferably has a curing reaction-initiating temperature of 100 to 250 (particular 150 to 200)° C.
  • Specific examples of the under-filling resin include epoxy resin, silicone resin, polyimide resin, polyolefin resin, cyanate ester resin, phenolic resin, and naphthalene resin. At least one of these resins may be employed.
  • heating C Before and/or after putting in the under-filling resin, there is performed the vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied resin and the under-filling resin (hereinafter this heating process may be referred to as “heating C”).
  • this heating process may be referred to as “heating C”.
  • reflow soldering, and sequentially any one of i)-iii) as follows are performed, and then thermally curing of the resins (applied resin and under-filling resin) is performed:
  • the vacuum treatment and heating C may be performed singly or in combination, and sequentially in any order or simultaneously.
  • at least the vacuum treatment is preformed, and heating C is performed before putting in the under-filling resin.
  • the vacuum treatment may be performed through the same procedure as described above. Through the vacuum treatment, dehydration and defoaming of the resins (e.g., applied resin and filled resin) may be completed.
  • Heating C may be performed through the same procedure as that of heating B. Through heating C, dehydration/defoaming and putting in the under-filling resin are facilitated. However, in the case where heating C is performed after putting in the under-filling resin, the heating temperature is adjusted to be lower than the curing reaction-initiating temperature of any of the applied resin and the under-filling resin so as not to cause curing reaction of the applied resin and the under-filling resin.
  • the applied resin 10 and the under-filling resin 6 are thermally cured ( FIG. 2 ) (See step F).
  • the thermal curing temperature is equal to or higher than the curing reaction-initiating temperature provided by the curing agent and equal to or higher than the curing temperature of the under-filling resin.
  • Specific thermal curing conditions include 150 to 200° C. for 1 to 12 hours.
  • the printed wiring board of the present invention including the under-filling resin is produced.
  • compositions shown in Table 1 Ingredients (compositions shown in Table 1) were uniformly mixed together, to thereby prepare active resin compositions (Preparation Examples 1 to 5).
  • Each of the above-prepared active resin compositions (Preparation Examples 1 to 5) 3 ( FIG. 4 ) (See step B) was applied, through screen printing, to the entire surface of a printed wiring substrate 1 ( FIG. 3A , 3 B, FIG. 4 (See step A)) (10 mm ⁇ 10 mm) having pads 2 ( FIG. 4 ) (See step A) (pitch: 0.6 mm, pad diameter: 0.3 mm, number of pads: 25) ( FIG. 4 ) (See step B).
  • the printed wiring substrate was heated at 100° C. for 20 minutes, to thereby dry the applied resin.
  • the applied resin coated on the printed wiring substrate assumed the form of non-tacky solid and was found to have a pencil hardness of HB.
  • a semiconductor chip 4 (4 mm ⁇ 4 mm) ( FIG. 5A , 5 B, FIG. 4 (See step C)) having bumps 9 ( FIG. 4 ) (See step C) (pitch: 0.6 mm, bump diameter: 0.3 mm, number of bumps: 25) was mounted by means of a mounter onto the printed wiring substrate ( FIG. 4 ) (See step C).
  • the printed wiring substrate 1 ( FIG. 4 ) (See step C) on which the semiconductor chip 4 ( FIG. 4 ) (See step C) was mounted was reflow-soldered by means of a reflow apparatus (preliminary heating: 150 to 180° C. for 60 seconds, reflow heating: 220 to 260° C. for 30 seconds) ( FIG. 4 ) (See step D).
  • the applied resin surface assumed the form of solid having a pencil hardness of HB.
  • the printed wiring substrate was heated again to 120° C.
  • the applied resin was softened again and exhibited tacky property. While the temperature was maintained at 120° C., the printed wiring substrate was subjected to vacuum treatment (vacuum degree: 100 Pa, 2 minutes).
  • the printed wiring substrate was heated (190° C. for 2 hours), to thereby cure the active resin composition, to thereby produce each of the printed wiring boards (Examples 1 to 5). After curing, the applied resin surface exhibited a pencil hardness of 8H, indicating that the resin was completely cured ( FIG. 4 ) (See Step E).
  • the semiconductor chip was physically peeled from each of the printed wiring boards (Examples 1 to 5).
  • the active resin composition was observed under a magnifying glass ( ⁇ 20), no forms or voids were observed.
  • Example 1 production of a printed wiring board
  • Example 1 production of a printed wiring board
  • no heating at 120° C. or vacuum treatment was performed before thermal curing of the active resin composition, to thereby produce a printed wiring board (Comparative Example 1).
  • the semiconductor chip was physically peeled from the printed wiring board (Comparative Example 1).
  • the cured active resin composition was observed under a magnifying glass ( ⁇ 20), 17 bubbles and voids were observed.
  • the sizes of the bubbles and voids were found to be 0.5 to 2 mm.
  • cresol novolak-type epoxy resin softening temperature: 94° C.
  • p-hydroxybenzoic acid 4 parts by weight
  • dicyan diamide 5 parts by weight
  • propylene glycol methyl ether acetate 50 parts by weight
  • the above paste-like active resin composition (Preparation Example 6) was applied, through screen printing, to the entire surface of a printed wiring substrate 1 (FIG. 6 ) (100 mm ⁇ 100 mm) having pads (pad pitch: 0.6 mm, pad diameter: 0.3 mm, number of pads: 1,010).
  • the printed wiring substrate was heated at 100° C. for 20 minutes, to thereby dry the applied resin.
  • the applied resin coated on the printed wiring substrate assumed non-tacky solid and was found to have a pencil hardness of HB.
  • a BGA part 4 (70 mm ⁇ 70 mm) ( FIG. 7 ) (bump pitch: 0.6 mm, bump diameter: 0.3 mm, number of bumps: 1,010) were mounted by means of a mounter onto the printed wiring substrate.
  • the printed wiring substrate on which the BGA part was mounted was reflow-soldered by means of a reflow apparatus (peak temperature: 260° C.)
  • the applied resin surface assumed the form of solid having a pencil hardness of HB.
  • the printed wiring substrate was heated again to 120° C.
  • the applied resin was softened again and exhibited tacky property. While the temperature was maintained at 120° C., the printed wiring substrate was subjected to vacuum treatment (vacuum degree: 150 Pa, 60 minutes).
  • the printed wiring substrate was heated (190° C. for 2 hours), to thereby cure the active resin composition, to thereby produce a printed wiring boards (Example 6). After curing, the applied resin surface exhibited a pencil hardness of 8H, indicating that the resin was completely cured.
  • the BGA part was physically peeled from the printed wiring board (Example 6).
  • the cured active resin composition was observed under a magnifying glass ( ⁇ 20), no bubbles or voids were observed.
  • the applied resin surface assumed the form of solid having a pencil hardness of HB.
  • the printed wiring substrate was subjected to vacuum treatment (vacuum degree: 150 Pa, 30 minutes).
  • the printed wiring substrate was heated (190° C. for 2 hours), to thereby cure the active resin composition and under-filling resin, to thereby produce a printed wiring boards (Example 7).
  • Example 7 The thus-produced printed wiring board (Example 7) was subjected to X-ray observation. Either the cured active resin composition or the cured under-filling resin was found to contain no bubbles or voids. The cavities unfilled with the cured under-filling resin were no found.
  • Example 7 production of a printed wiring board
  • an active resin composition of any of Preparation Examples 1 to 5 was used instead of the active resin composition of Preparation Example 6, to thereby produce each of the printed wiring boards (Examples 8 to 12).
  • Example 8 to 12 The thus-produced printed wiring boards (Examples 8 to 12) were subjected to X-ray observation. In each case, either the cured active resin composition or the cured under-filling resin was found to contain no bubbles or voids. The cavities unfilled with the cured under-filling resin were no found.
  • Example 8 production of a printed wiring board
  • Example 8 production of a printed wiring board
  • no heating at 120° C. or vacuum treatment was performed before thermal curing of the active resin composition and the under-filling resin, to thereby produce a printed wiring board (Comparative Example 2).
  • the thus-produced printed wiring board (Comparative Example 2) was subjected to X-ray observation.
  • 22 bubbles and voids were observed.
  • the sizes of the bubbles and voids were found to be 0.5 to 2 mm.
  • Two cavities unfilled with the cured under-filling resin were observed, and the sizes of the cavities were 4 mm and 7 mm, respectively.
  • Each active resin composition (storage period: 0 day) was used, and the steps from application of active resin to reflow soldering were performed in a manner similar to that employed in the method of producing the printed wiring board (any of Examples 1 to 5). Thereafter, the printed wiring substrate was cooled, and a BGA part was forcedly peeled from the printed wiring board. Among 25 solder bumps, the number of bumps bonded to the land of the printed wiring substrate was counted. Table 1 shows the ratio of bonded solder bump (percent solder bonding).
  • solder bonding test was repeated, except that an active resin composition of a different storage period was used instead of the active resin composition (storage period: 0 day). There was determined the period of time when the percent solder bonding attained by the composition (storage period: 0 day) was maintained. Table 1 shows the data (storage limit).

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
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US9828327B2 (en) 2014-05-01 2017-11-28 Henkel IP & Holding GmbH Anaerobic curable compositions containing blocked dicarboxylic acid compounds
US20190157518A1 (en) * 2016-03-24 2019-05-23 Nichia Corporation Method of manufacturing light emitting device
US10870725B2 (en) 2016-04-21 2020-12-22 San-Ei Kagaku Co., Ltd. Heat curable resin composition, and circuit board with electronic component mounted thereon
CN113798734A (zh) * 2021-10-15 2021-12-17 浙江亚通焊材有限公司 一种锡基焊膏用助焊剂、电子封装用激光软钎焊膏
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US9831207B2 (en) * 2012-02-02 2017-11-28 Taiwan Semiconductor Manufacturing Company, Ltd. No-flow underfill for package with interposer frame
US20130200513A1 (en) * 2012-02-02 2013-08-08 Taiwan Semiconductor Manufacturing Company, Ltd. No-flow underfill for package with interposer frame
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US20190157518A1 (en) * 2016-03-24 2019-05-23 Nichia Corporation Method of manufacturing light emitting device
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US10870725B2 (en) 2016-04-21 2020-12-22 San-Ei Kagaku Co., Ltd. Heat curable resin composition, and circuit board with electronic component mounted thereon
CN113798734A (zh) * 2021-10-15 2021-12-17 浙江亚通焊材有限公司 一种锡基焊膏用助焊剂、电子封装用激光软钎焊膏
EP4270504A1 (de) * 2022-04-26 2023-11-01 Terra Quantum AG Kontaktschicht für geschichtete materialien

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DE102011122672B4 (de) 2021-07-08
CN102585166B (zh) 2016-06-01
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US9072205B1 (en) 2015-06-30
KR20120079448A (ko) 2012-07-12
CN102585166A (zh) 2012-07-18
US20150158103A1 (en) 2015-06-11
JP5467469B2 (ja) 2014-04-09
KR101432620B1 (ko) 2014-08-21
TW201237095A (en) 2012-09-16
TWI490267B (zh) 2015-07-01

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