US20110023966A1 - Fluid supply apparatus, fluid applying apparatus, and fluid supply method - Google Patents

Fluid supply apparatus, fluid applying apparatus, and fluid supply method Download PDF

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Publication number
US20110023966A1
US20110023966A1 US12/841,710 US84171010A US2011023966A1 US 20110023966 A1 US20110023966 A1 US 20110023966A1 US 84171010 A US84171010 A US 84171010A US 2011023966 A1 US2011023966 A1 US 2011023966A1
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US
United States
Prior art keywords
piston
container
fluid
support portion
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/841,710
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English (en)
Inventor
Akihiko Watanabe
Tsutomu Noda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Automation Systems Corp
Original Assignee
Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Assigned to SONY CORPORATION reassignment SONY CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: NODA, TSUTOMU, WATANABE, AKIHIKO
Publication of US20110023966A1 publication Critical patent/US20110023966A1/en
Assigned to JUKI AUTOMATION SYSTEMS CORPORATION reassignment JUKI AUTOMATION SYSTEMS CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SONY CORPORATION
Abandoned legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/14—Details
    • B41F15/40—Inking units
    • B41F15/42—Inking units comprising squeegees or doctors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump

Definitions

  • the present invention relates to a fluid supply apparatus, a fluid applying apparatus, and a fluid supply method for supplying a fluid such as solder that is to be applied to a printed circuit board.
  • Patent Document 1 Japanese Patent Application Laid-open No. 2004-306102
  • a supply assembly is used.
  • the supply assembly is constituted of a supply container that contains solder, a supply container member that stores and fixes the supply container in position, and a discharge adaptor that is inserted in an opening portion of the supply container.
  • a drive mechanism for pressing the supply container member is provided.
  • the supply assembly is mounted on the solder supply apparatus so that the opening portion side of the supply container is faced downward.
  • the supply container member is pressed and moved to the discharge adaptor inserted.
  • the discharge adaptor is fixed in position, so when the supply container member is moved, the discharge adaptor is caused to enter the supply container fixed by the supply container member, resulting in application of a pressure to the solder in the supply container.
  • the discharge adaptor has a discharge opening. Therefore, the solder subjected to the pressure is supplied to a printed circuit board and the like through the discharge opening.
  • a fluid supply apparatus including a piston, a piston support portion, a container support portion, and a drive mechanism.
  • the piston has a through hole.
  • the piston support portion supports the piston.
  • the container support portion is capable of supporting a container in which a fluid is contained.
  • the drive mechanism drives at least one of the container support portion and the piston support portion so that the piston is inserted into the container while the container and the piston are relatively rotated to discharge the fluid from the container through the through hole of the piston.
  • the piston is inserted into the container with the container and the piston being relatively rotated, resulting in reduction in resistance of the piston with respect to the container at the time when the piston is inserted.
  • the piston can be reliably inserted into the container, with the result that the fluid can be positively supplied.
  • the drive mechanism may drive at least one of the container support portion and the piston support portion so that the piston is relatively moved in a direction in which the piston is removed from the container to adjust a discharge amount of the fluid.
  • the piston When the piston is relatively moved in the direction in which the container is removed from the container, the pressure applied to the fluid in the container becomes small. Therefore, the piston is moved during the discharge of the fluid, and the discharge of the fluid is stopped as described above, which can adjust the discharge amount of the fluid. Since the resistance of the piston with respect to the container at the time when the piston is moved is small, the piston can be easily moved as described above.
  • the piston may include a seal member provided at an end portion of the piston.
  • the seal member has a tapered outer circumferential surface whose outer circumference is increased in diameter in a direction in which the piston is inserted.
  • the seal member can be provided at the end portion of the piston. With the seal member, the fluid in the container can be sufficiently scraped off and discharged.
  • the fluid supply apparatus may further include a nozzle and an opening and closing mechanism.
  • the nozzle has an inside flow path that is communicated with the through hole.
  • the opening and closing mechanism is capable of opening and closing the inside flow path.
  • the fluid is discharged through the inside flow path of the nozzle.
  • the inside flow path is closed by the opening and closing mechanism when the fluid is discharged, thereby making it easier to remove the fluid from the nozzle.
  • the supply amount of the fluid can be adjusted.
  • the nozzle may include a discharge end portion including a tapered surface whose outer circumference is decreased in diameter in a direction in which the fluid is discharged.
  • the opening and closing mechanism may close the inside flow path by pressing the discharge end portion.
  • the discharge end portion from which the fluid is discharged has the tapered surface, the fluid is easily separated from the nozzle when the inside flow path is closed by the opening and closing mechanism.
  • the opening and closing mechanism may include a pair of opening and closing members.
  • the pair of opening and closing members presses the nozzle with the nozzle being sandwiched therebetween.
  • the pair of opening and closing members each has a pressing end portion and a cutout. The pressing end portion presses the nozzle, and the cutout is formed at the pressing end portion.
  • the nozzle is pressed by the pair of opening and closing members while being sandwiched therebetween, thereby closing the inside flow path of the nozzle.
  • the cutout is formed.
  • the size of the cutout may be set as appropriate within the range in which the inside flow path is closed.
  • a fluid applying apparatus including a fluid supply apparatus and a squeegee mechanism.
  • the fluid supply apparatus includes a piston, a piston support portion, a container support portion, and a drive mechanism.
  • the piston has a through hole.
  • the piston support portion supports the piston.
  • the container support portion is capable of supporting a container in which a fluid is contained.
  • the drive mechanism drives at least one of the container support portion and the piston support portion so that the piston is inserted into the container while the container and the piston are relatively rotated to discharge the fluid from the container through the through hole of the piston.
  • the squeegee mechanism is capable of applying, to a supply target, the fluid supplied on the supply target by the fluid supply apparatus.
  • the fluid applying apparatus may further include a movement mechanism.
  • the movement mechanism causes the fluid supply apparatus and the squeegee mechanism to integrally move.
  • the reduction in size of the fluid supply apparatus can be realized. Therefore, the movement mechanism that causes the fluid supply apparatus and the squeegee mechanism to integrally move can be easily realized.
  • the integral movement of the fluid supply apparatus and the squeegee mechanism can effectively supply the fluid at the time when the fluid is applied.
  • a fluid supply method including supporting a piston and a container by a piston support portion and a container support portion, respectively.
  • the piston has a through hole.
  • the container contains a fluid.
  • the fluid is discharged from the container through the through hole by driving at least one of the container support portion and the piston support portion so that the piston is inserted into the container while the container and the piston are relatively rotated.
  • a fluid supply apparatus including a piston, a piston support portion, a container support portion, and a drive mechanism.
  • the piston support portion supports the piston.
  • the container support portion is capable of supporting a container in which a fluid is contained.
  • the drive mechanism drives at least one of the container support portion and the piston support portion in a direction in which the piston is inserted into the container at a time when supply of the fluid is performed and drives at least one of the container support portion and the piston support portion in a direction in which the piston is relatively removed from the container at a time when the supply of the fluid is stopped.
  • the piston by relatively moving the piston in the direction in which the piston is removed from the container, the pressure applied to the fluid in the container is reduced. Accordingly, for example, the piston is moved during the discharge of the fluid to stop the discharge of the fluid, thereby making it possible to adjust the discharge amount of the fluid.
  • a fluid supply method including discharging, with a use of a fluid supply apparatus including a piston, a piston support portion, a container support portion, and a drive mechanism, a fluid by relatively inserting the piston into a container with the drive mechanism so that an insertion distance of the piston into the container is longer than a set insertion distance that is an insertion distance corresponding to a preset amount of supply of the fluid.
  • the piston has a through hole.
  • the piston support portion supports the piston.
  • the container support portion is capable of supporting the container in which the fluid is contained.
  • the drive mechanism is capable of driving at least one of the container support portion and the piston support portion so that the piston is inserted into the container to discharge the fluid from the container through the through hole of the piston.
  • At least one of the container support portion and the piston support portion is driven by using the fluid supply apparatus in a direction in which the piston is relatively removed from the container with the drive mechanism prior to stop of discharge of the fluid so that the discharge of the fluid is stopped when an amount of supply corresponding to the set insertion distance is obtained.
  • a fluid supply method including discharging, with a use of a fluid supply apparatus including a piston having a through hole, a piston support portion, a container support portion, and a drive mechanism, a fluid from the container through the through hole of the piston by driving at least one of the container support portion and the piston support portion in a direction in which the piston is inserted into the container.
  • the piston support portion supports the piston.
  • the container support portion is capable of supporting the container in which the fluid is contained.
  • the drive mechanism is capable of driving at least one of the container support portion and the piston support portion to discharge the fluid from the container.
  • At least one of the container support portion and the piston support portion is driven in a direction in which the piston is relatively removed from the container prior to stop of discharge of the fluid.
  • the fluid supply apparatus, the fluid applying apparatus, and the fluid supply method capable of realizing the miniaturization and capable of reliably supplying the fluid can be provided.
  • FIG. 1 is a schematic diagram showing a structure of a fluid applying apparatus according to an embodiment of the present invention
  • FIG. 2 is a schematic diagram showing a structure of a substrate support mechanism shown in FIG. 1 ;
  • FIG. 3 is a schematic perspective view showing a fluid supply apparatus and a squeegee mechanism according to the embodiment
  • FIG. 4 is a schematic front view showing the fluid supply apparatus and the squeegee mechanism shown in FIG. 3 ;
  • FIG. 5 is a schematic side view showing the fluid supply apparatus and the squeegee mechanism shown in FIG. 3 ;
  • FIG. 6 is a schematic side view showing the fluid supply apparatus and the squeegee mechanism shown in FIG. 3 ;
  • FIG. 7 is a schematic top view showing the fluid supply apparatus and the squeegee mechanism shown in FIG. 3 ;
  • FIG. 8 is a schematic cross-sectional view showing a piston according to the embodiment.
  • FIG. 9 are schematic cross-sectional views each showing an end portion of the piston fixed by a piston support portion, that is opposite to an end portion on the side of the container;
  • FIG. 10 are enlarged schematic views each showing a nozzle and opening and closing members shown in FIG. 9 ;
  • FIG. 11 is a schematic perspective view showing a squeegee according to the embodiment.
  • FIG. 12 is a schematic top view of the squeegee shown in FIG. 11 when viewed from above;
  • FIG. 13 is a block diagram showing a structure of a control system of a fluid applying apparatus according to the embodiment.
  • FIG. 14 is a block diagram showing a control system of the fluid supply apparatus and the squeegee mechanism in the block diagram shown in FIG. 13 ;
  • FIG. 15 is a flowchart showing an operation of the fluid applying apparatus according to the embodiment.
  • FIG. 16 is a schematic cross-sectional view showing a seal member and the piston inserted into the container
  • FIG. 17 is a top view schematically showing a motion of solder when the solder is applied with the squeegee.
  • FIG. 18 is a perspective view showing a modified example of the drive mechanism of the fluid applying apparatus according to the embodiment.
  • FIG. 1 is a schematic diagram showing a structure of a fluid applying apparatus according to an embodiment of the present invention.
  • a fluid applying apparatus 150 is an apparatus for supplying solder as a fluid to a substrate 2 through a screen 1 .
  • the fluid applying apparatus 150 includes a fluid supply apparatus 100 , a squeegee mechanism 170 , a fixation mechanism 10 that fixes the screen 1 in position, and a substrate support mechanism 20 that supports the substrate 2 .
  • the fixation mechanism 10 includes a plurality of clamps 11 that hold end portions 3 of the screen 1 .
  • the screen 1 is fixed in position with the plurality of clamps 11 .
  • the screen 1 is fixed below the fluid supply apparatus 100 and the squeegee mechanism 170 so as to be opposed thereto. Further, the screen 1 has a pattern hole (not shown).
  • FIG. 2 is a schematic diagram showing a structure of the substrate support mechanism 20 .
  • the support mechanism 20 includes a stage mechanism 21 and a stage movement mechanism 22 that moves the stage mechanism 21 .
  • the stage mechanism 21 includes a conveyor belt 23 and an adsorption block mechanism 24 capable of being moved up and down.
  • the adsorption block mechanism 24 supports the substrate 2 that is conveyed by the conveyor belt 23 and causes the substrate 2 to move above the conveyor belt 23 .
  • the stage movement mechanism 22 includes a movement unit 25 that moves the stage mechanism 21 in a surface direction of the substrate 2 (X direction and Y direction in FIG. 2 ) and rotates the stage mechanism 21 about the Z axis in FIG. 2 .
  • the stage movement mechanism 22 includes an air cylinder 26 .
  • the air cylinder 26 moves the stage mechanism 21 in a vertical direction (Z direction).
  • the stage movement mechanism 22 includes a plurality of stoppers 27 provided in the perimeter of the movement unit 25 .
  • the fluid applying apparatus 150 includes a camera portion 4 and a cleaning unit 5 .
  • the camera portion 4 and the cleaning unit 5 are capable of being moved along guide rails 6 .
  • the camera portion 4 recognizes an alignment mark (not shown) given on the substrate 2 in order to position the substrate 2 .
  • the cleaning unit 5 is provided with cleaning paper 7 , with which a lower surface (surface on the substrate 2 side) of the screen 1 is subjected to cleaning.
  • FIG. 3 is a schematic perspective view showing the fluid supply apparatus 100 and the squeegee mechanism 170 according to this embodiment.
  • FIGS. 4 to 7 are a front view ( FIG. 4 ), side views ( FIGS. 5 and 6 ), and a top view ( FIG. 7 ) schematically showing the fluid supply apparatus 100 and the squeegee mechanism 170 shown in FIG. 3 .
  • the fluid supply apparatus 100 includes a container support portion 104 , a piston support portion 102 , and a drive mechanism 103 that drives the container support portion 104 and the piston support portion 102 .
  • the container support portion 104 is capable of holding commercially available solder and a container (see, container 30 shown in FIG. 16 ) in which the solder is contained.
  • the container support portion 104 is formed to have a shape that covers the bottom surface (surface of an upper portion in the figure) and the side surface of the container.
  • the container support portion 104 is disposed below a support block 101 so as to be rotatable with respect to the support block 101 .
  • the container and the container support portion 104 each have an opening on one side.
  • the container is fixed in position by a ring-shaped fixation member 105 provided at the opening of the container support portion 104 .
  • the container is integrally rotated with the container support portion 104 .
  • the container support portion 104 is supported by the support block 101 so that the opening of the container is faced downward (toward the side on which the substrate 2 is disposed).
  • the container support portion 104 is formed so as to fit to the shape of the container, and is made of metal such as aluminum, stainless steel, and iron.
  • the piston support portion 102 is fixed on a piston support block 112 that is opposed to the support block 101 from below. To the piston support portion 102 , a piston 106 capable of being inserted into the container is fixed.
  • FIG. 8 is a schematic cross-sectional view showing the piston 106 .
  • the piston 106 has a through hole 106 d that is extended in a direction in which the piston 106 is inserted (Z direction in FIG. 8 ).
  • the through hole 106 d serves as a flow path of the solder.
  • the through hole 106 d is formed to be positioned at approximately the center of an end surface 109 of the piston 106 that is inserted into the container.
  • a seal member 107 is provided so as to surround the end portion 106 a .
  • the seal member 107 is fitted in the container.
  • the end portion 106 a of the piston 106 is capable of being detached from a piston main body 106 b and is screwed with a screw 108 provided to a screw hole 106 c in the piston main body 106 b .
  • the seal member 107 is fixed by being sandwiched between the piston main body 106 b and the end portion 106 a.
  • the seal member 107 has a tapered outer circumferential surface 110 whose outer circumference is increased in diameter in a direction in which the piston 106 is fitted (Z direction).
  • a material having elasticity such as urethane and silicon is used.
  • the piston 106 a metal such as aluminum, stainless steel, and iron is used.
  • the piston 106 and the seal member 107 are formed so as to fit to the shape of the container. It should be noted that an O ring or the like may be used as the seal member 107 .
  • the end surface 109 of the piston 106 is flat, the end surface 109 may have a concave shape inclined toward the through hole 106 d that is formed at approximately the center of the end surface 109 .
  • FIGS. 9A and 9B are schematic cross-sectional views each showing an end portion 111 on the side opposite to the end portion 106 a of the piston 106 fixed to the piston support portion 102 .
  • the end portion 111 on the side opposite to the end portion 106 a has a tube shape.
  • the inside of the tube-shaped end portion 111 functions as a part of the through hole 106 d .
  • the piston support portion 102 has a through hole (not shown) through which the end portion 111 passes.
  • a nozzle 113 made of silicon rubber or the like is attached to the end portion 111 .
  • the inside flow path of the nozzle 113 is communicated with the through hole 106 d.
  • an opening and closing mechanism 114 that sandwiches the nozzle 113 is provided below the piston support block 112 .
  • the opening and closing mechanism 114 is constituted of a pair of opening and closing members 115 a and 115 b and air cylinders 120 a and 120 b connected to the opening and closing members 115 a and 115 b , respectively.
  • the opening and closing members 115 a and 115 b are closed by the air cylinders 120 a and 120 b , and the nozzle 113 is pressed as shown in FIG. 9B . As a result, the inside flow path of the nozzle 113 is closed.
  • the solder discharged is easily removed from the nozzle 113 .
  • the amount of supply of the solder can be adjusted. Further, for example, the inside flow path is closed during a time period when the solder is not discharged, thereby making it possible to prevent air from getting into the container. Thus, it is possible to prevent the solder from being oxidized. It is also possible to prevent a foreign matter from getting into the container.
  • FIGS. 10A and 10B are enlarged schematic views each showing the nozzle 113 and the opening and closing members 115 a and 115 b .
  • a discharge end portion 116 of the nozzle 113 portion surrounded by a dashed-dotted line of FIG. 10A ) from which the solder is discharged has a tapered surface 116 a whose outer circumference has a diameter decreased in a direction in which the solder is discharged (in the negative Z direction).
  • the opening and closing members 115 a and 115 b press a part P (outer circumferential side surface) immediately above the tapered surface 116 a , thereby making it easier to remove the solder from the nozzle 113 .
  • FIG. 10B shows the pair of the opening and closing members 115 a and 115 b when viewed from below.
  • the nozzle 113 and the inside flow path 116 b are shown between the opening and closing members 115 a and 115 b .
  • cutouts 120 a and 120 b are formed, respectively.
  • the pressing end portions 119 a and 119 b press the nozzle 113 .
  • the nozzle 113 can be suppressed from being deformed by the sizes of the cutouts 120 a and 120 b .
  • this structure it is possible to prevent the nozzle 113 from being deteriorated and damaged.
  • plastic deformation of the nozzle 113 pressed repeatedly by the opening and closing members 115 a and 115 b which can avoid the case where the inside flow path 116 b is not secured even in a state where the opening and closing members 115 a and 115 b are opened.
  • the sizes of the cutouts 120 a and 120 b may be arbitrarily set within a range in which the inside flow path 116 b is closed when the nozzle 113 is pressed.
  • the shape of the cutouts 120 a and 120 b is set to be rectangle, but is not limited thereto.
  • the shape of the cutouts may be set to a circular arc or an ellipsoidal arc.
  • a planar portion 106 e is formed on the side surface of the piston 106 .
  • the planner portion has a planner surface.
  • the planar portion 106 e is irradiated with laser light or the like, and reflected light is detected. As a result, whether the piston 106 is properly disposed can be checked. Further, the planar portion 106 e makes it easier to carry the piston 106 .
  • FIGS. 3 to 6 the state where the piston 106 and the seal member 107 are not fitted into the container is shown in order to make the piston 106 and the seal member 107 more visible.
  • the container support portion 104 and the piston support portion 102 are driven, and the piston 106 may be fitted into the container.
  • the piston 106 is fitted into the container stored in the container support portion 104 , and in this state, the container support portion 104 and the piston 106 may be disposed on the support block 101 and the piston support portion 102 , respectively.
  • the drive mechanism 103 includes a motor 122 , a driving pulley 123 , and two driven pulleys.
  • the driving pulley 123 is provided to a rotation shaft of the motor 122 .
  • the two driven pulleys are connected to the driving pulley 123 through a belt 124 .
  • the two driven pulleys are constituted of a rotary drive pulley 125 and a vertical drive pulley 126 .
  • the motor 122 is disposed below a support plate 132 and supported by the supported plate 132 .
  • the support plate 132 is fixed to the support block 101 directly or indirectly.
  • a drive shaft (not shown) of the motor 122 is connected to the driving pulley 123 while penetrating the support plate 132 .
  • the driving pulley 123 is disposed on the support plate 132 .
  • the rotary drive pulley 125 and the vertical drive pulley 126 are disposed on the support block 101 .
  • the rotary drive pulley 125 is disposed above the container support portion 104 , and a rotation shaft 127 of the rotary drive pulley 125 is connected to the container support portion 104 .
  • the vertical drive pulley 126 is disposed behind the rotary drive pulley 125 .
  • the cogs of the vertical drive pulley 126 and the cogs of the rotary drive pulley 125 are engaged with each other.
  • a tension member 128 that prevents the slack of the belt 124 is provided between the driving pulley 123 and the rotary drive pulley 125 .
  • a lead screw 129 is mounted as the rotation shaft of the vertical drive pulley 126 .
  • the upper end of the lead screw 129 is fixed to a frame 130 .
  • two guide shafts 131 are connected in a vertical direction.
  • the drive mechanism 103 , the support plate 132 , the support block 101 , and the container are integrally provided through an attachment portion so as to be vertically movable. That is, when the vertical drive pulley 126 is rotated, the drive mechanism 103 , the support plate 132 , the support block 101 , and the container are integrally moved with respect to the frame 130 in the vertical direction.
  • the drive mechanism 103 , the support plate 132 , the support block 101 , and the container are integrally moved with respect to the piston 106 in the vertical direction.
  • the lead screw 129 for example, a trapezoidal screw or a ball screw may be used.
  • the squeegee mechanism 170 in this embodiment is provided to the lower portion of the fluid supply apparatus 100 and is capable of being moved integrally with the fluid supply apparatus 100 along guide rails 28 shown in FIG. 1 .
  • the fluid supply apparatus 100 and the squeegee mechanism 170 are connected to the guide rails 28 by a connection member 121 provided on the back surface side thereof.
  • the squeegee mechanism 170 includes a pair of squeegees 171 and 172 .
  • air cylinders 173 and 174 are connected, respectively.
  • the air cylinders 173 and 174 the squeegees 171 and 172 are movable in the vertical direction.
  • the squeegees 171 and 172 have the similar structure, so the squeegee 171 will be described as a representative.
  • FIG. 11 is a schematic perspective view showing the squeegee 171 .
  • the squeegee 171 includes an attachment portion 175 , a main squeegee 171 a , and a pair of sub-squeegees 171 b .
  • the attachment portion 175 is attached to the squeegee mechanism 170 .
  • the pair of the sub-squeegees 171 b is provided on both ends of the main squeegee 171 a .
  • the main squeegee 171 a and the sub-squeegees 171 b are connected through spring members 176 .
  • the sub-squeegees 171 b are movable vertically with respect to the main squeegee 171 a .
  • a squeegee surface 177 a of the main squeegee 171 a that is brought into contact with the screen 1 is inclined with respect to the screen 1 by a predetermined angle. Further, squeegee surfaces 177 b of the pair of sub-squeegees 171 b are also inclined with respect to the screen 1 by a predetermined angle.
  • FIG. 12 is a schematic top view showing the squeegee 171 viewed from above.
  • the squeegee surfaces 177 a and 177 b are shown as the main squeegee 171 a and the sub-squeegees 171 b as a matter of convenience for explanation.
  • the pair of sub-squeegees 171 b is inclined by a predetermined angle ⁇ with respect to the extending direction of the main squeegee 171 a .
  • outer ends 178 b of the sub-squeegees 171 b are positioned outside both ends 178 a of the main squeegee 171 a .
  • inner ends 179 b of the sub-squeegees 171 b are positioned inside the both ends 178 a of the main squeegees 171 a.
  • a rolling diameter detection sensor (not shown) is provided.
  • the rolling diameter detection sensor measures a rolling diameter at the time when the solder supplied to the screen is applied.
  • the rolling diameter detection sensor irradiates the solder with, for example, laser light or an ultrasonic wave, and detects the light or the ultrasonic wave reflected on the surface of the solder, thereby determining a curvature radius of the surface of the solder that is subjected to the rolling.
  • the rolling diameter detection sensor may be disposed at any position, as long as the rolling diameter detection sensor is capable of measuring the rolling diameter.
  • the rolling diameter detection sensor may be provided integrally with the squeegee 171 , thereby measuring the rolling diameter of the solder applied with the squeegee 172 .
  • a solder temperature detection sensor (not shown) is provided.
  • the solder temperature detection sensor measures the temperature of the surface of the solder that is subjected to the rolling.
  • the solder temperature detection sensor detects an infrared ray radiated from the surface of the solder that is subjected to the rolling, thereby measuring the temperature of the surface of the solder.
  • a non-contact thermistor, a non-contact thermopile that is constituted of a plurality of thermocouples, or the like is used.
  • the solder temperature detection sensor may be disposed at any position, as long as the solder temperature detection sensor can detect the temperature of the surface of the solder.
  • the solder temperature detection sensor may be provided at the same position as the rolling diameter detection sensor.
  • FIG. 13 is a block diagram showing the structure of a control system of the fluid applying apparatus 150 .
  • FIG. 14 is a block diagram showing a control system of the fluid supply apparatus 100 and the squeegee mechanism 170 in the block diagram shown in FIG. 13 .
  • the drives of the stage mechanism 21 , the stage movement mechanism 22 , the camera portion 4 , the fluid supply apparatus 100 , and the squeegee mechanism 170 are controlled by a controller 133 .
  • the controller 133 also controls a temperature adjustment unit 134 that adjusts the room temperature in which the fluid applying apparatus 150 is installed.
  • FIG. 14 shows a temperature adjustor 135 that is provided to the temperature adjustment unit 134 .
  • the temperature adjustor 135 is controlled by the controller 133 , and thus the room temperature is adjusted.
  • the controller 133 and drivers of the respective portions may be implemented by hardware or by both of software and hardware.
  • the hardware include a CPU (central processing unit), an MPU (micro processing unit), a RAM (random access memory), a ROM (read only memory), a DSP (digital signal processor), an FPGA (field programmable gate array), an ASIC (application specific integrated circuit), an NIC (network interface card), and a WNIC (wireless NIC).
  • Various programs that constitute the software are stored in a ROM or another storage device.
  • the controller 133 may be provided in the fluid applying apparatus 150 or may be provided in an apparatus different from the fluid applying apparatus 150 . In the case where the controller 133 is provided in another apparatus, the apparatus may be caused to output a control signal to the fluid applying apparatus 150 through wired or wireless connection.
  • a control signal to supply the solder is output to the driver of the motor 122 shown in FIGS. 3 to 7 , and the motor 122 is rotated.
  • the driving pulley 123 is rotated, and the vertical drive pulley 126 is also rotated in conjunction with the rotation of the driving pulley 123 , thereby moving the container downward.
  • the piston 106 is relatively moved upward in the container.
  • the rotary drive pulley 125 is also rotated. Therefore, the container moved downward is moved downward while being rotated by the rotary drive pulley 125 . Accordingly, the piston 106 is moved upward while relatively rotating in the container.
  • the solder in the container is subjected to the pressure, and the solder is supplied through the through hole 106 d of the piston 106 .
  • the solder is supplied between the squeegees 171 and 172 of the squeegee mechanism 170 shown in FIG. 2 .
  • the piston 106 is inserted into the container while the container and the piston 106 are relatively rotated, which reduces a resistance of the piston 106 with respect to the container. Therefore, for example, even when a small motor whose output is small is used as the motor 122 , the piston 106 can be reliably inserted into the container. As a result, the drive mechanism 103 can be miniaturized, and the solder can be reliably supplied.
  • the container it is possible to use the container as it is without transferring the solder to another container.
  • the workability at the time of applying the fluid is improved.
  • the solder if the solder is transferred, the solder adhered to a paddle or the like that is used for the transfer is discarded.
  • the discarding of the solder is not caused, which can reduce the amount of waste of the solder.
  • FIG. 16 is a schematic cross-sectional view showing the piston 106 and the seal member 107 that are inserted into the container.
  • the inner shape of the container 30 is structured so that an opening area thereof is made to be smaller toward the bottom thereof. That is, as the piston 106 is inserted, the diameter of the inside of the container 30 is gradually made to be smaller.
  • the seal member 107 provided on the end portion 106 a of the piston 106 has the outer circumferential surface 110 having a tapered shape.
  • the outer circumferential surface 110 has elasticity, and is therefore deformed so as to fit to the inner shape of the container 30 whose diameter becomes smaller. With this structure, a solder 31 in the container 30 can be sufficiently scraped off and discharged.
  • the resistance of the piston 106 with respect to the container 30 may be increased in some cases.
  • the seal member 107 as described above can be provided on the end portion 106 a of the piston 106 , because the resistance of the piston 106 with respect to the container 30 is small.
  • the driver of the motor 122 drives the motor 122 to rotate in a direction reverse to the above-mentioned direction.
  • the driving pulley 123 is also rotated in the reverse direction.
  • the vertical drive pulley 126 and the rotary drive pulley 125 are also rotated.
  • the piston 106 is moved in the direction of being removed from the container while the piston 106 and the container are relatively rotated in the direction reverse to the above-mentioned direction.
  • the pressure applied to the solder in the container becomes smaller.
  • the time period necessary for the discharge of the solder can be reduced.
  • the motor 122 is driven to move the piston 106 in the vertical direction, thereby making it possible to adjust the amount of the discharge of the solder.
  • the piston 106 since the resistance of the piston 106 with respect to the container at the time when the piston 106 is moved is small, the piston 106 can be easily moved in the above-mentioned manner.
  • the controller 133 when the controller 133 outputs the control signal for stopping the supply of the solder to the driver of the opening and closing mechanism 114 , the opening and closing mechanism 114 is driven. Then, the nozzle 113 is sandwiched between the pair of opening and closing members 115 a and 115 b (see, FIGS. 9A and 9B ) at a desired timing, thereby closing the inside flow path of the nozzle 113 . As a result, the solder discharged is removed from the nozzle 113 .
  • FIG. 15 is a flowchart showing the operation of the fluid applying apparatus 150 .
  • the stage movement mechanism 22 is driven, and the stage movement mechanism 22 moves the stage mechanism 21 to a substrate conveying portion 29 that is provided on the camera portion 4 side shown in FIG. 2 .
  • the conveyor belt 23 of the stage mechanism 21 is driven, thereby conveying the substrate 2 from the substrate conveying portion 29 to the conveyor belt 23 .
  • the stage movement mechanism 22 moves the stage mechanism 21 up to a predetermined position, and the substrate 2 is moved to a position above the adsorption block mechanism 24 with the conveyor belt 23 (Step 101 ).
  • the adsorption block mechanism 24 is moved upward to hold the substrate 2 .
  • the adsorption block mechanism 24 is connected to a vacuum pump (not shown).
  • the vacuum pump When the vacuum pump is operated, the adsorption block mechanism 24 adsorbs and holds the substrate 2 .
  • the substrate 2 is held up by the adsorption block mechanism 24 to an upper level as compared to the conveyor belt 23 .
  • the substrate 2 is fixed in position by a substrate fixation portion (not shown) and is pressed by the adsorption block mechanism 24 , with the result that the flexure or deflection of the substrate 2 may be corrected.
  • the camera portion 4 is moved above the substrate 2 held by the adsorption block mechanism 24 and recognizes an alignment mark of the substrate 2 (Step 102 ).
  • the positional information of the alignment mark is transmitted to the controller 133 , and the stage movement mechanism 22 corrects the position of the stage mechanism 21 based on the positional information.
  • the air cylinder 26 of the stage movement mechanism 22 is caused to operate, thereby moving the stage mechanism 21 upward.
  • the stoppers 27 of the stage movement mechanism 22 are brought into contact with the stage mechanism 21 , and the stage mechanism 21 is stopped at the position where the substrate 2 is in contact with the lower surface of the screen 1 (Step 103 ).
  • the stage mechanism 21 is moved so that the substrate 2 is in contact with the lower surface of the screen 1 .
  • the stage mechanism 21 may be moved so that the substrate 2 is disposed to be apart from the screen 1 .
  • the solder can be supplied onto the substrate on which parts are mounted through the needle nozzle.
  • the controller 133 drives the air cylinders 173 and 174 , to move one of the squeegees 171 and 172 upward and bring the other one into contact with the screen 1 . Subsequently, the fluid supply apparatus 100 and the squeegee mechanism 170 , the drives of which are controlled by the controller 133 , are integrally moved. As a result, the solder is applied to the screen 1 , and a predetermined solder pattern is printed on the substrate 2 (Step 104 ).
  • the squeegee mechanism 170 is moved from the right side to the left side in FIG. 2 , the squeegee 172 is moved upward, and the squeegee 171 is brought into contact with the screen 1 . Then, the solder is applied with the squeegee 171 .
  • the squeegee mechanism 170 is moved from the left side to the right side in FIG. 2 , the squeegee 171 is moved upward, and the squeegee 172 is moved downward and brought into contact with the screen 1 .
  • the solder is applied with the squeegee 172 .
  • FIG. 17 is a top view schematically showing the motion of the solder when the solder is applied with the squeegee 171 .
  • the solder is moved on the screen 1 with the main squeegee 171 a .
  • the solder may get outside of the both ends 178 a of the main squeegee 171 a (in the direction indicated by the solid-line arrow of FIG. 17 ).
  • the pair of sub-squeegees 171 b is provided to the both ends 178 a of the main squeegee 171 a.
  • the sub-squeegees 171 b collect the solder that has got outside of the both ends 178 a toward the center of the back surface side of the main squeegee 171 a .
  • the solder collected is applied on the screen 1 with the squeegee 172 opposite to the squeegee 171 when the movement direction of the squeegee mechanism 170 is reversed, for example.
  • the solder that has got outside of the main squeegee 171 a can be effectively reused, which can reduce the waste of the solder.
  • the fluid supply apparatus 100 can be miniaturized. Therefore, as described above, it is possible to easily realize the movement mechanism that causes the fluid supply apparatus 100 and the squeegee mechanism 170 to be integrally moved.
  • the integral movement of the fluid supply apparatus 100 and the squeegee mechanism 170 can cause the solder to be effectively supplied at the time of applying the solder.
  • the solder can be supplied between the squeegees 171 and 172 , and thus can be effectively applied without setting the stroke of the squeegee mechanism 170 to be large.
  • the temperature of the room in which the fluid applying apparatus 150 is provided is adjusted by the temperature adjustment unit 134 (Step 105 ).
  • the solder temperature detection sensor 136 measures the temperature of the surface of the solder, and transmits the temperature information to the controller 133 .
  • the controller 133 judges that the room temperature is high based on the temperature information received, the controller 133 outputs an air-cooling command to the temperature adjustor 135 , thereby lowering the room temperature (Step 106 ).
  • the room temperature is not adjusted. In this way, the temperature of the surface of the solder is monitored, to adjust the room temperature depending on the temperature of the surface of the solder, which is raised due to the rolling. As a result, more precise control on the temperature of the solder can be carried out.
  • the rolling diameter detection sensor 137 measures the rolling diameter (Step 107 ).
  • the information is transmitted to the controller 133 as the rolling diameter information.
  • the rolling diameter detection sensor 137 may measure the rolling diameter of the solder at all times or at a predetermined timing.
  • the stage movement mechanism 22 moves the stage mechanism 21 downward, and the substrate 2 is placed on the conveyor belt 23 of the stage mechanism 21 .
  • the substrate 2 is moved with the conveyor belt 23 , and the stage mechanism 21 is moved toward a substrate discharging portion 32 provided on the cleaning portion 5 side shown in FIG. 2 with the stage movement mechanism 22 .
  • the substrate 2 is moved from the conveyor belt 23 to the substrate discharging portion 32 , and the substrate discharging portion 32 discharges the substrate 2 to the outside of the fluid applying apparatus 150 (Step 108 ).
  • the solder is supplied based on the rolling diameter information transmitted to the controller 133 (Step 109 ).
  • the controller 133 that has received the rolling diameter information judges that the amount of the solder on the screen 1 is insufficient, and issues a solder supply command to the motor 122 , to cause the solder to be supplied (Step 110 ).
  • the rolling diameter information is not transmitted from the rolling diameter detection sensor 137 , it is judged that the necessary amount of the solder is supplied on the screen 1 , and the solder is not additionally supplied.
  • the rolling diameter of the solder is monitored, and the necessary amount of the solder is supplied on the screen 1 , thereby keeping the rolling diameter of the solder constant. As a result, the amount of the solder filled in a pattern hole in the screen 1 is stabilized, improving the printing quality of the solder. Further, in this embodiment, since the solder is supplied not when the solder is being printed on the substrate 2 but when the substrate is discharged, the operation time can be saved.
  • the motor 122 detects the amount of the solder in the container (Step 111 ). Since the amount of the solder in the container is determined in accordance with the amount of insertion of the piston 106 into the container, the amount of the insertion of the piston 106 is detected as the solder amount information. The amount of the insertion of the piston 106 is detected using the motor 122 such as a servomotor, on the basis of information of an encoder value or a pulse number of the motor 122 . Based on the solder amount information, the motor 122 transmits a container exchange signal to the controller 133 as shown in FIG. 14 .
  • Step 112 in the case where the controller 133 receives the container exchange signal and judges that the amount of the solder in the container is insufficient, the fact is notified by using a buzzer, a display, or the like. As a result, after the substrate 2 is conveyed, the container is manually exchanged (Step 113 ). In the case where the container exchange signal is not transmitted from the motor 122 , it is judged that the sufficient amount of the solder remains in the container, and thus the notification using the buzzer, the display, or the like is not performed.
  • Steps 101 to 109 are performed on the program for operating the fluid applying apparatus 150 , and after the rolling diameter is judged to be insufficient in Step 109 , the fluid supply apparatus 100 supplies the solder for the first time.
  • the supply of the solder is automatically performed by the drive mechanism 103 , and the exchange of the container is manually performed. Therefore, the fluid applying apparatus 150 is stopped mainly when the container is exchanged, and is not stopped when the solder is supplied. Thus, the operation time of the fluid applying apparatus 150 is saved. In addition, the inside of the fluid applying apparatus 150 is exposed to the outside mainly only when the container is exchanged, so it is possible to suppress foreign matters from adhering to the screen 1 or the substrate 2 .
  • the solder is used as the fluid.
  • flux ACP (anisotropic conductive paste), NCP (non-conductive paste), or conductive paste made of copper or the like may be used as the fluid.
  • the present invention is not limited to the above embodiment, and can be variously changed without departing from the gist of the present invention.
  • FIG. 18 is a perspective view showing a modified example of the drive mechanism 103 of the fluid applying apparatus 150 .
  • the rotary drive pulley 125 and the driving pulley 123 provided to the rotary shaft of the motor are connected with each other through the belt 124 .
  • the rotary drive pulley 125 is constituted of a first pulley 125 a and a second pulley 125 b .
  • the first pulley 125 a and the driving pulley 123 are connected with each other through the belt 124 .
  • the driving pulley 123 and the rotary drive pulley 125 are rotated in conjunction with each other.
  • the first pulley 125 a and the second pulley 125 b share a rotary shaft 127 , and the rotary shaft 127 is connected to the container support portion 104 .
  • the cogs of the second pulley 125 b and the cogs of the vertical drive pulley 126 are engaged with each other, so the rotary drive pulley 125 and the vertical drive pulley 126 are rotated in conjunction with each other.
  • the vertical drive pulley 126 is rotated about the lead screw 129 as the rotation shaft.
  • the structures of the pulleys 123 , 125 , and 126 may be arbitrarily set, as long as the pulleys 123 , 125 , and 126 are rotated by the motor in conjunction with one another as described above. Further, the numbers of pulleys and motors used as the drive mechanism 103 are not limited. In this embodiment, only one motor rotates the pulleys 123 , 125 , and 126 , which is advantageous for the miniaturization of the drive mechanism 103 .
  • a plurality of gears may be used instead of the belt drive as described above.
  • the container support portion and the container are rotated.
  • the container support portion may be fixed to the support block so as not to rotate, and the piston supported by the piston support portion may be rotated.
  • a discharge sensor that detects the discharge of the solder from the container may be provided to the fluid supply apparatus and the squeegee mechanism.
  • a laser emitting portion is provided to the squeegee 171 shown in FIG. 4
  • a laser entering portion is provided to the squeegee 172 . Then, the laser light irradiation is performed between the squeegees 171 and 172 , thereby detecting the discharge of the solder.
  • air may be contained, for example.
  • the motor is rotated at a predetermined position on the screen, and the discharge sensor confirms the discharge of the solder. Accordingly, when the fluid supply apparatus is operated, the solder is reliably supplied.
  • the structure including a squeegee block may be used.
  • the solder is supplied to the squeegee block.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
US12/841,710 2009-07-29 2010-07-22 Fluid supply apparatus, fluid applying apparatus, and fluid supply method Abandoned US20110023966A1 (en)

Applications Claiming Priority (2)

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JP2009-176216 2009-07-29
JP2009176216A JP5458727B2 (ja) 2009-07-29 2009-07-29 流動体供給装置、流動体塗布装置及び流動体供給方法

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EP (1) EP2279821B1 (fr)
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CN107215084A (zh) * 2017-06-13 2017-09-29 芜湖桑乐金电子科技有限公司 碳晶板用丝网印刷机
US20190240757A1 (en) * 2017-12-05 2019-08-08 Illinois Tool Works Inc. Ir non-contact temperature sensing in a dispenser
CN111390318A (zh) * 2020-04-14 2020-07-10 江西省晶能半导体有限公司 Smd器件焊接控制系统及焊接控制方法
US11448432B2 (en) 2013-03-14 2022-09-20 Rolls-Royce Corporation Adaptive trans-critical CO2 cooling system

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JP6043964B2 (ja) * 2013-07-04 2016-12-14 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷機
JP6101937B2 (ja) * 2014-03-17 2017-03-29 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷装置
JP6194481B2 (ja) * 2014-03-17 2017-09-13 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及びスクリーン印刷方法
JP6101938B2 (ja) * 2014-03-17 2017-03-29 パナソニックＩｐマネジメント株式会社 ペースト供給装置及びスクリーン印刷装置
JP6221063B2 (ja) * 2014-03-17 2017-11-01 パナソニックＩｐマネジメント株式会社 スクリーン印刷装置及びスクリーン印刷方法
JP6167336B2 (ja) * 2014-03-19 2017-07-26 パナソニックＩｐマネジメント株式会社 ペースト供給装置、スクリーン印刷装置、ペースト供給方法及びスクリーン印刷方法
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US20150289426A1 (en) * 2012-11-19 2015-10-08 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system
US9332681B2 (en) * 2012-11-19 2016-05-03 Panasonic Intellectual Property Management Co., Ltd. Electronic component mounting system
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CN111390318A (zh) * 2020-04-14 2020-07-10 江西省晶能半导体有限公司 Smd器件焊接控制系统及焊接控制方法

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JP5458727B2 (ja) 2014-04-02
EP2279821A2 (fr) 2011-02-02
JP2011025300A (ja) 2011-02-10
CN101987389A (zh) 2011-03-23
EP2279821A3 (fr) 2011-04-27
EP2279821B1 (fr) 2018-05-16
CN101987389B (zh) 2014-10-29

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