US20050140023A1 - Method of manufacturing a semiconductor device - Google Patents

Method of manufacturing a semiconductor device Download PDF

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Publication number
US20050140023A1
US20050140023A1 US11/017,077 US1707704A US2005140023A1 US 20050140023 A1 US20050140023 A1 US 20050140023A1 US 1707704 A US1707704 A US 1707704A US 2005140023 A1 US2005140023 A1 US 2005140023A1
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United States
Prior art keywords
semiconductor
chip
semiconductor chip
wiring substrate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
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US11/017,077
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English (en)
Inventor
Nobuhiro Kinoshita
Jumpei Konno
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Renesas Electronics Corp
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Renesas Technology Corp
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Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Assigned to RENASAS TECHNOLOGY CORP. reassignment RENASAS TECHNOLOGY CORP. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: KINOSHITA, NOBUHIRO, Konno, Jumpei
Publication of US20050140023A1 publication Critical patent/US20050140023A1/en
Priority to US11/648,646 priority Critical patent/US7598121B2/en
Assigned to RENESAS ELECTRONICS CORPORATION reassignment RENESAS ELECTRONICS CORPORATION MERGER (SEE DOCUMENT FOR DETAILS). Assignors: RENESAS TECHNOLOGY CORP.
Abandoned legal-status Critical Current

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Definitions

  • the present invention relates in general to a semiconductor device and to a method of manufacturing the same. Specifically, it relates to a technology that may be effectively used for flip-chip bonding.
  • a semiconductor device having multi-stepped flanks is bonded to a circuit board.
  • the semiconductor device and the circuit board are thermally bonded together through a detection member or an interposed member having a multi-layered structure, and the interposed member is broken or separated so as to be removed as required after bonding (refer to, for example, patent document 1).
  • Patent document 1 Japanese Unexamined Patent Publication No. 2000-216193 ( FIG. 1 )
  • a multi-chip semiconductor device comprising multiple layers of semiconductor chips, in which the semiconductor chip of the lowest layer is flip-chip bonded to a wiring substrate.
  • the above-described multi-chip semiconductor device will desirably have a narrower pitch of pads (electrodes) from the point of view of size reduction of the semiconductor device and an increase in the number of pins.
  • pads electrodes
  • the inventors of the present invention have conducted studies on the technology used for grinding the rear surface of the semiconductor chip of the lowermost layer and pre-coating an adhesive in a multi-chip semiconductor device and have found the following problem.
  • the adhesive is, for example, an epoxy-based non-conductive (insulating) resin adhesive, mainly a thermosetting resin.
  • the semiconductor chip separates from a sealing resin, or from a die bonding agent (resin adhesive) for the second layer of the semiconductor chip, because the resin adhesive has poor adhesion to the other resin, and water collects at the site of this separation.
  • a high-temperature treatment such as solder reflow or the mounting of a substrate
  • a semiconductor device comprising: a wiring substrate having a front surface and a rear surface; a first semiconductor chip, having a main surface and a back surface, which is flip-chip bonded to the front surface of the wiring substrate through projecting electrodes; a second semiconductor chip having a main surface and a back surface, which is mounted over the first semiconductor chip by bonding it's the back surface thereof to the back surface of the first semiconductor chip with an adhesive; a non-conductive resin adhesive interposed between the wiring substrate and the first semiconductor chip; and a sealing body, formed over the front surface of the wiring substrate, for resin sealing the first and second semiconductor chips, wherein the first semiconductor chip is made thin by grinding its back surface, and the back surface is made flat by polishing after grinding.
  • a method of manufacturing a semiconductor device comprising the steps of:
  • a method of manufacturing a semiconductor device comprising the steps of:
  • a method of manufacturing a semiconductor device comprising the steps of:
  • the rear surface of the semiconductor wafer is ground to reduce the thickness, and, further, irregularities on the rear surface of the semiconductor wafer are removed by flattening the rear surface.
  • FIG. 1 is a sectional view of a semiconductor device according to an embodiment of the present invention.
  • FIG. 2 is an assembly flow diagram showing a method of manufacturing the semiconductor device shown in FIG. 1 ;
  • FIG. 3 is a flow diagram showing in sectional view the assembly states corresponding to steps S 1 to S 5 of the assembly flow shown in FIG. 2 ;
  • FIG. 4 is a flow diagram showing in sectional view the assembly states corresponding to steps S 6 to S 9 of the assembly flow shown in FIG. 2 ;
  • FIG. 5 is a flow diagram showing in sectional view the assembly states corresponding to steps S 10 and S 11 of the assembly flow shown in FIG. 2 ;
  • FIG. 6 is a flow diagram showing in sectional view the assembly states corresponding to steps S 12 and S 13 of the assembly flow shown in FIG. 2 ;
  • FIG. 7 is a flow diagram showing in perspective view the states of a wafer corresponding to steps S 1 to S 4 of the assembly flow shown in FIG. 2 ;
  • FIG. 8 is a sectional view showing an NCP application method in the NCP application step of the assembly flow shown in FIG. 2 ;
  • FIG. 9 is a sectional view showing a temporary mounting method in the FC mounting step of the assembly flow shown in FIG. 2 ;
  • FIG. 10 is a sectional view showing a main contact bonding method in the FC mounting step of the assembly flow shown in FIG. 2 ;
  • FIG. 11 is a partially enlarged sectional view showing the structure of portion A shown in FIG. 10 ;
  • FIG. 12 is a partially enlarged sectional view showing a contact bonding method according to a modification of the embodiment of the present invention.
  • FIG. 13 is a partial sectional view showing the mounting of the semiconductor device shown in FIG. 1 to a packaging board;
  • FIG. 14 is a partially enlarged sectional view showing the contact bonding method of a Comparative Example, in contrast to the main contact bonding method shown in FIG. 10 ;
  • FIG. 15 is a plan view showing the adhesion of a resin adhesive to a back surface of a chip by the contact bonding method of the Comparative Example shown in FIG. 14 .
  • the semiconductor device of the embodiment shown in FIG. 1 has a structure in which a semiconductor chip is flip-chip bonded to a wiring substrate.
  • an SIP (System In Package) 16 having four semiconductor chips and which is sealed with a resin will be described as an example of the above-mentioned semiconductor device.
  • the SIP 16 comprises a first semiconductor chip 1 for control, a second semiconductor chip 2 , a third semiconductor chip 3 and a fourth semiconductor chip 4 , each having a memory circuit.
  • the first semiconductor chip 1 of these semiconductor chips is flip-chip bonded to a packaging board 5 , which serves as a wiring substrate, through projecting electrodes, and the second semiconductor chip 2 is formed over the first semiconductor chip 1 .
  • the third semiconductor chip 3 is mounted over the packaging board 5
  • the fourth semiconductor chip 4 is mounted over the third semiconductor chip 3 in such a manner that their main surfaces 3 a and 4 a face up.
  • the first semiconductor chip 1 is flip-chip bonded to the packaging board 5 .
  • the second semiconductor chip 2 , the third semiconductor chip 3 and the fourth semiconductor chip 4 are wired to the packaging board 5 .
  • the SIP 16 comprises the packaging board 5 , which serves as a wiring substrate having a front surface 5 a and a rear surface 5 b; the first semiconductor chip 1 which has a main surface 1 a and a back surface 1 b and is flip-chip bonded to the front surface 5 a of the packaging board 5 through projecting electrodes; the second semiconductor chip 2 , which has a main surface 2 a and a back surface 2 b and is formed over the first semiconductor chip 1 in such a manner that its back surface 2 b is connected to the back surface 1 b of the first semiconductor chip 1 by a die bonding agent (adhesive) 12 ; the third semiconductor chip 3 , which is formed over the front surface 5 a of the packaging board 5 in such a manner that its main surface 3 a faces up; the fourth semiconductor chip 4 , which is formed over the main surface 3 a of the third semiconductor chip 3 in such a manner that its main surface 4 a faces up; a NCP
  • the back surface 1 b of the first semiconductor chip 1 of the SIP 16 is made thin by grinding and flat by polishing after grinding. That is, the back surface 1 b is planished.
  • the back surface 1 b of the first semiconductor chip 1 is ground to reduce the thickness of the semiconductor chip 1 to about 140 ⁇ m.
  • the other three semiconductor chips may be made thin likewise, as required.
  • the first semiconductor chip 1 is flip-chip bonded to the packaging board 5 by gold bumps (projecting electrodes) 1 d, which are soldered to the packaging board 5 for flip-chip bonding.
  • the NCP 7 which is a resin adhesive, is interposed between the packaging board 5 and the first semiconductor chip 1 to harden and protect the flip-chip bonded portions.
  • the NCP 7 is, for example, an epoxy-based non-conductive (insulating) thermosetting resin adhesive.
  • the second semiconductor chip 2 , the third semiconductor chip 3 and the fourth semiconductor chip 4 are fixed by the die bonding agent 12 . That is, as the second semiconductor chip 2 is formed over the first semiconductor chip 1 , the back surface 1 b of the first semiconductor chip 1 is bonded to the back surface 2 b of the second semiconductor chip 2 by the die bonding agent 12 . Further, as the back surface 3 b of the third semiconductor chip 3 is bonded to the packaging board 5 by the die bonding agent 12 , and the fourth semiconductor chip 4 is formed over the main surface 3 a of the third semiconductor chip 3 , the main surface 3 a of the third semiconductor chip 3 and the back surface 4 b of the fourth semiconductor chip 3 are bonded together by the die bonding agent 12 .
  • the main surface 2 a of the second semiconductor chip 2 , the main surface 3 a of the third semiconductor chip 3 and the main surface 4 a of the fourth semiconductor chip 4 face up and can be wired.
  • the die bonding agent 12 is, for example, an epoxy-based non-conductive (insulating) thermosetting resin adhesive as well.
  • the sealing resin for forming the sealing body 10 is, for example, an epoxy-based insulating thermosetting resin.
  • the wire 6 is a conductive wire, for example, a gold wire.
  • the plurality of external terminals on the rear surface 5 b of the packaging board 5 are solder balls 11 , and they are arranged in a lattice on the rear surface 5 b of the packaging board 5 . That is, the SIP 16 of this embodiment is also a BGA (Ball Grid Array) type semiconductor device.
  • BGA All Grid Array
  • a plurality of leads (electrodes) 5 c and a plurality of wire connection leads 5 f are formed on the front surface 5 a of the packaging board 5 , and the areas of the front surface 5 a, excluding these exposed portions are covered with a solder resist film 5 i, which is an insulating film.
  • Bump lands 5 h, on which the solder bumps 11 are formed, are provided on the rear surface 5 b.
  • the leads 5 c and the wire connection leads 5 f on the front surface 5 a are electrically connected to the bump lands 5 h on the rear surface 5 b by internal wires 5 e and through hole wires 5 g.
  • the electrodes of the semiconductor chips are electrically connected to the solder balls 11 , which constitute external terminals formed on the rear surface 5 b of the packaging board 5 .
  • the leads 5 c, the wire connection leads 5 f and the through hole wires 5 g are made of copper alloy.
  • the first semiconductor chip 1 which is flip-chip bonded to the packaging board 5 , is made thin by grinding (also called “back-grinding”) the back surface 1 b before the wafer is divided into chips and flattened by polishing or wet-etching after grinding. Therefore, the back surface 1 b has a high flatness. Consequently, since the irregularities 9 c in the Comparative Example shown in FIG. 14 are not formed on the back surface 1 b of the first semiconductor chip 1 , as shown in FIG.
  • the flip-chip bonded first semiconductor chip 1 is flattened by polishing or wet-etching after grinding is applied to its back surface, and more of the irregularities 9 c shown in FIG. 14 remain on the back surface 1 b, the bending strength of the first semiconductor chip 1 can be improved.
  • the breakage of the chip which occurs when it is pressed by the pressure block 13 for flip-chip bonding, can be prevented, and the second semiconductor chip 2 can be formed over the first semiconductor chip 1 , which has been reduced in thickness. That is, since a thin chip can be used for flip-chip bonding, a multi-chip semiconductor device, such as the SIP 16 , can be is reduced in thickness and size.
  • the above-described back-grinding step is characterized in that the grinding speed is faster, but the surface roughness of the back surface after the end of the step is higher than that produced by the above-referenced polishing step or wet-etching step. It is possible to employ only back-grinding to reduce the thickness of a wafer. In this case, however, as described above, the rising of the adhesive caused by pressure applied thereto and a flowing of the adhesive onto the back surface of the chip due to the high roughness of the back surface of the chip becomes a problem to be solved. It is also possible to employ only polishing or wet-etching for obtaining a very flat surface reduce the thickness of the wafer.
  • the polishing or wet-etching step since the polishing or wet-etching step has a lower thickness reducing speed than the back-grinding step, the time required for the step becomes long the and productivity is reduced.
  • a step of reducing the thickness at a high speed for example, by back-grinding, should be first carried out to reduce the thickness of the wafer to a certain degree, followed by the step of increasing the flatness of the rear surface, for example, by polishing or wet-etching, to further reduce the thickness of the wafer.
  • the step of reducing the thickness of the wafer at a high speed is preferably employed so as to reduce the thickness by more than half to achieve a thickness close to the final thickness of the wafer.
  • a method of manufacturing a semiconductor device according to this embodiment will be described with reference to the assembly processing flow shown in FIG. 2 .
  • step S 1 The processing of the wafer is first carried out in step S 1 shown in FIG. 2 . That is, as shown in step S 1 in FIG. 3 and FIG. 7 , a semiconductor wafer 9 , having a pattern formed on the front surface 9 a, is prepared.
  • step S 2 of FIG. 2 back grinding
  • step S 2 of FIG. 3 irregularities 9 c are formed on the rear surface 9 b of the semiconductor wafer 9 by such grinding.
  • the irregularities 9 c are as large as about 0.05 to 0.1 ⁇ m, but they are not limited to this range.
  • grinding marks 9 d are formed radially on the rear surface 9 b of the semiconductor wafer 9 .
  • step S 3 of FIG. 2 dry polishing, as shown in step S 3 of FIG. 2 is carried out to flatten the rear surface 9 b of the semiconductor wafer 9 .
  • the rear surface 9 b of the semiconductor wafer 9 is planished by such dry polishing, as shown in step S 3 of FIG. 7 .
  • Dry polishing is employed to grind (polish) the surface with a polishing cloth formed by compressing fibers impregnated with silica to about 2 ⁇ m.
  • the irregularities 9 c on the rear surface 9 b of the semiconductor wafer 9 are as large as about 0.0015 ⁇ m after dry polishing.
  • the semiconductor wafer 9 is made thin, as shown in step S 3 of FIG. 3 .
  • the thickness of the semiconductor wafer 9 which has been reduced in thickness is, for example, 140 ⁇ m and is set to this value as required (for example, the wafer can be made as thin as about 90 ⁇ m by back-grinding and dry polishing).
  • the wet etching is in the form of spin etching, which is carried out by supplying fluoronitric acid while turning the semiconductor wafer 9 with a spinner, and it can make the irregularities 9 c smaller than dry polishing.
  • step S 4 of FIG. 2 chip dicing, as shown in step S 4 of FIG. 2 , is carried out. That is, the semiconductor wafer 9 , which has been reduced in thickness, is cut so as to be divided into a plurality of semiconductor chips (first semiconductor chips 1 ), as shown in step S 4 of FIG. 3 . At this point, as shown in step S 4 of FIG. 7 , the semiconductor wafer 9 is diced along dicing lines 9 e.
  • the irregularities 9 c as seen in the Comparative Example shown in FIG. 14 are not formed on the back surface 1 b of the first semiconductor chip 1 , the bending strength of the first semiconductor chip 1 can be improved.
  • stud bumps are formed, as shown in step S 5 of FIG. 2 . That is, projecting electrodes are formed on a plurality of electrodes of the semiconductor chips.
  • a gold bump 1 d is formed as the projecting electrode on the pads 1 c, which are electrodes of the first semiconductor chip 1 .
  • Wire bonding technology is used to form the gold bumps 1 d (the formed bumps are called “stud bumps”) on the pads 1 d of the first semiconductor chip 1 .
  • the areas around the sites where the pad 1 c is formed of the main surface 1 a of the first semiconductor chip 1 are covered with a surface protective film 1 e.
  • a packaging board 5 which constitutes the wiring substrate shown in step S 6 of FIG. 4 , is prepared.
  • a plurality of leads 5 c are formed on the front surface 5 a of the packaging board 5 , and a solder resist film 5 i, which is an insulating film, is formed around the leads 5 c.
  • Assembly of parts in step S 6 and seq. of FIG. 2 may be carried out by using a multi-cavity substrate having a plurality of wiring substrates.
  • the assembly of one SIP 16 using the packaging board 5 will be described.
  • solder pre-coating in step S 7 of FIG. 2 is carried out. That is, as shown in step S 7 of FIG. 4 , a solder pre-coat 5 d is formed on the leads 5 c to be flip-chip bonded on the front surface 5 a of the packaging board 5 .
  • This solder pre-coat 5 d is provided to enhance the solder bonding strength between the gold bumps 1 d, which are projecting electrodes, and the leads 5 c for flip-chip bonding.
  • NCP coating as shown in step S 8 of FIG. 2 , is carried out. That is, as shown in step S 8 of FIG. 4 , an NCP 7 , which is a non-conductive resin adhesive, is applied to the front surface 5 a of the packaging board 5 .
  • the NCP 7 is, for example, a thermosetting resin.
  • the NCP 7 is arranged at portions of the packaging board 5 to be flip-chip bonded.
  • the gold bumps 1 d become small when the pad pitch is narrowed to increase the number of pins, whereby the space between the semiconductor chip and the packaging board 5 becomes small (for example, 5 to 10 ⁇ m), thereby making it extremely difficult to inject a resin by under-fill sealing after the flip-chip bonding. Therefore, the NCP 7 is arranged on the packaging board 5 . Even if the resin can be injected, since the above-mentioned space is narrow, it takes very long for the resin to flow between the chip and the substrate. Therefore, the NCP 7 is arranged on the packaging board 5 in advance.
  • the NCP 7 which is a non-conductive resin adhesive, can be inserted between the semiconductor chip and the packaging board 5 .
  • NCP 7 in the form of a paste is dropped on the front surface 5 a of the packaging board 5 from a nozzle 8 so as to be applied to the front surface 5 a.
  • the non-conductive resin adhesive is not limited to a paste resin adhesive, but a film-like resin adhesive (for example, NCF (Non-Conductive Film)) may be used.
  • the NCP 7 is applied as much as possible to cover the areas around the sides of the semiconductor chip to protect it.
  • FC (flip chip) mounting that is, flip-chip bonding, as shown in step S 9 of FIG. 2 and FIG. 4 , is carried out.
  • the first semiconductor chip 1 which has been adsorbed and carried by an adsorption block 13 b, is temporarily mounted over the front surface 5 a of the packaging board 5 the NCP 7 layer.
  • the planished back surface 1 b of the first semiconductor chip 1 is pressed by the pressure block 13 and heated so that the first semiconductor chip 1 is flip-chip bonded to the packaging board 5 through the gold bumps 1 d.
  • the temperature of the pressure block 13 is set to 300° C. and the first semiconductor chip 1 is pressed by a load of 500 g. Heat applied from the pressure block 13 is transmitted to the first semiconductor chip 1 to melt the NCP 7 and the solder pre-coat 5 d. That is, this is flip-chip bonding by thermal contact.
  • solder pre-coat 5 d is heated to a molten state to bond the gold bumps 1 d to the leads 5 c by way of the solder 17 , as shown in step S 9 of FIG. 4 .
  • a sheet member 14 is interposed between the first semiconductor chip 1 and the pressure block 13 , as shown in FIG. 11 , to press the back surface 1 b of the first semiconductor chip 1 by means of the pressure block 13 , through the sheet member 14 .
  • the sheet member 14 has a thickness of about 50 ⁇ m, for example, and it is made of a fluororesin, for example. Since the fluororesin has high heat resistance and high releasability from a resin, a sheet member 14 made of a fluororesin is preferably used.
  • the back surface 1 b of the first semiconductor chip 1 to be flip-chip bonded is ground and then polished or wet etched so as to be flattened. Therefore, since the back surface 1 b is very flat and has no large irregularities 9 c of the type shown in the Comparative Example of FIG. 14 , it is possible to prevent the NCP 7 from rising up and flowing onto the back surface 1 b when the back surface 1 b is pressed by the pressure block 13 , as shown in FIG. 11 .
  • the back surface 1 b of the first semiconductor chip 1 is a planished flat surface, when the first semiconductor chip 1 is pressed by the pressure block 13 , it is possible to prevent the NCP 7 that is rising along the side surfaces of the chip from flowing onto and adhering to the back surface 1 b of the first semiconductor chip 1 in a space between the back surface 1 b of the first semiconductor chip 1 and the sheet member 14 , unlike the case where the NCP 7 flows onto and adheres to the back surface 18 a of the chip 18 , as seen shown in the Comparative Example of FIG. 15 .
  • the pressing surface 13 a of the pressure block 13 is covered with the sheet member 14 , when the NCP 7 rises up, it is possible to prevent the NCP 7 from flowing onto and adhering to the pressure block 13 and the pressure block 13 from being stained by the NCP 7 .
  • the first semiconductor chip 1 is made as thin as about 140 ⁇ m, and so the pressure load of the pressure block 13 cannot be made larger than required in consideration of the bending strength of the semiconductor chip 1 . Therefore, as a means of preventing the NPC 7 from flowing onto and adhering to the back surface 1 b of the first semiconductor chip 1 with more certainty, a sheet member 14 that is formed as a thick sheet, as shown in the modification of FIG. 12 , may be used.
  • a sheet member 14 as thick as about 100 ⁇ m is used, and the back surface 1 b of the first semiconductor chip 1 is pressed to such an extent that it bites the sheet member 14 , whereby the sheet member 14 and the back surface 1 b of the first semiconductor chip 1 can adhere closely to each other. Therefore, it is possible to surely prevent the NCP 7 from flowing onto and adhering to the back surface 1 b of the first semiconductor chip 1 .
  • the sheet member 14 does not always need to be interposed between them. That is, when the adhesion of the NCP 7 to the back surface 1 b of the first semiconductor chip 1 can be prevented without interposing the sheet member 14 , due to close contact between the pressing surface 13 a of the pressure block 13 and the back surface 1 b of the first semiconductor chip 1 resulting from the back surface 1 b of the first semiconductor chip 1 being a planished flat surface, the back surface 1 b of the first semiconductor chip 1 may be pressed by the pressure block 13 without interposing the sheet member 14 therebetween.
  • step S 9 of FIG. 4 The flip-chip bonding of the first semiconductor chip 1 is thus completed as shown in step S 9 of FIG. 4 .
  • the die bonding of the third semiconductor chip 3 in the SIP 16 is then carried out.
  • the third semiconductor chip 3 is bonded to the front surface 5 a of the packaging board 5 by the die bonding agent 12 while the semiconductor chip is arranged in such a manner that the main surface 3 a faces up.
  • the die bonding agent 12 is, for example, a thermosetting resin adhesive.
  • step S 10 of FIG. 2 a second chip bonding is carried out, as shown in step S 10 of FIG. 2 .
  • the second semiconductor chip 2 is fixed on the first semiconductor chip 1 and the fourth semiconductor chip 4 is fixed on the third semiconductor chip 3 by the die bonding agent 12 , which is an adhesive.
  • the semiconductor chip 2 is mounted over the back surface 1 b of the first semiconductor chip 1 through the die bonding agent 12 while the semiconductor chip 2 is arranged in such a manner that its main surface 2 a faces up, and the back surface 1 b of the first semiconductor chip 1 and the back surface 2 b of the second semiconductor chip 2 are bonded together by the die bonding agent 12 .
  • the fourth semiconductor chip 4 is mounted over the main surface 3 a of the third semiconductor chip 3 through the die bonding agent 12 while the semiconductor chip 3 is arranged in such a manner that its main surface 4 a faces up, and the main surface 3 a of the third semiconductor chip 3 and the back surface 4 b of the fourth semiconductor chip 4 are bonded together by the die bonding agent 12 .
  • the above-mentioned die bonding agents 12 are, for example, a thermosetting resin adhesive.
  • wire bonding (W/B), as shown in step S 11 of FIG. 2 , is carried out.
  • the second semiconductor chip 2 , the third semiconductor chip 3 and the fourth semiconductor chip 4 are electrically connected to the wire connection leads 5 f of the packaging board 5 by wires 6 , such as gold wires.
  • step S 12 of FIG. 2 Molding as shown in step S 12 of FIG. 2 is then carried out.
  • the first semiconductor chip 1 , the second semiconductor chip 2 , the third semiconductor chip 3 , the fourth semiconductor chip 4 and a plurality of wires 6 are sealed with a resin to form a sealing body 10 .
  • the sealing resin used for resin sealing is, for example, an epoxy-based thermosetting resin.
  • solder ball fixing as shown in step S 13 of FIG. 2 , is carried out.
  • a plurality of solder balls 11 which serve as external terminals, are formed on the bump lands 5 h of the rear surface 5 b of the packaging board 5 .
  • the solder balls 11 are heated to a molten state by a high-temperature treatment with a reflow so as to be fixed on the bump lands 5 h.
  • the substrate is cut into individual SIP's 16 , as shown in step S 14 of FIG. 2 .
  • a method of manufacturing a semiconductor device according to this embodiment has been described above for a case in which the step of reducing the thickness of the semiconductor wafer 9 by grinding the rear surface 9 b is first carried out.
  • a plurality of semiconductor chips which are made thin by grinding the back surfaces 1 b and made flat by flattening the back surfaces 1 b after grinding are prepared, stud bumps are formed on these semiconductor chips, as shown in step S 5 of FIG. 2 , and the semiconductor chips having gold bumps 1 d are flip-chip bonded to assemble the semiconductor devices. That is, semiconductor chips which have been subjected to the steps S 1 to S 4 in FIG. 2 are fed, and steps S 5 to S 14 of FIG. 2 are carried out on these semiconductor chips to assemble the semiconductor devices.
  • the gold bumps 1 d are thermally contact bonded to the leads 5 c of the packaging board 5 by solder bonding.
  • the flip-chip bonding may be carried out by plating the surface of the leads 5 c of the packaging board 5 with gold to contact-bond the gold bumps 1 d to the gold plating of the leads 5 c.
  • the semiconductor device may be another type of device than the SIP 16 , such as a BGA or LGA (Land Grid Array), and the advantages of the present invention will be attained if it is manufactured by flip-chip bonding at least one semiconductor chip, which has been made thin by a grinding and flattening of its rear surface, to a wiring substrate with a non-conductive resin adhesive.
  • the present invention is suitably used for electronic devices and semiconductor manufacturing technologies.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
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US20200027855A1 (en) * 2018-07-17 2020-01-23 Samsung Electronics Co., Ltd. Bonding head and method for bonding semiconductor package, and semiconductor package
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CN1638122A (zh) 2005-07-13
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KR20050065318A (ko) 2005-06-29
TW200522231A (en) 2005-07-01

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