TWM504245U - 高頻探針之接點結構 - Google Patents
高頻探針之接點結構 Download PDFInfo
- Publication number
- TWM504245U TWM504245U TW104203134U TW104203134U TWM504245U TW M504245 U TWM504245 U TW M504245U TW 104203134 U TW104203134 U TW 104203134U TW 104203134 U TW104203134 U TW 104203134U TW M504245 U TWM504245 U TW M504245U
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- conductor
- high frequency
- impedance
- carrier
- Prior art date
Links
- 238000005259 measurement Methods 0.000 title description 6
- 239000004020 conductor Substances 0.000 claims description 132
- 239000000523 sample Substances 0.000 claims description 29
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 10
- 230000005540 biological transmission Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 241000270295 Serpentes Species 0.000 description 1
- 210000003323 beak Anatomy 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000000742 single-metal deposition Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06766—Input circuits therefor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE202014002841.9U DE202014002841U1 (de) | 2014-04-01 | 2014-04-01 | Kontaktieranordnung, insbesondere HF-Messspitze |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM504245U true TWM504245U (zh) | 2015-07-01 |
Family
ID=51163835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104203134U TWM504245U (zh) | 2014-04-01 | 2015-03-03 | 高頻探針之接點結構 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US9804195B2 (https=) |
| EP (1) | EP3126852B1 (https=) |
| JP (1) | JP2017516084A (https=) |
| KR (1) | KR20160140606A (https=) |
| CN (1) | CN106133531B (https=) |
| CA (1) | CA2940904C (https=) |
| DE (1) | DE202014002841U1 (https=) |
| TW (1) | TWM504245U (https=) |
| WO (1) | WO2015149893A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665448B (zh) * | 2018-07-13 | 2019-07-11 | 中華精測科技股份有限公司 | 高頻探針卡裝置及其信號傳輸模組 |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202014106223U1 (de) * | 2014-12-22 | 2016-03-23 | Ingun Prüfmittelbau Gmbh | Hochfrequenz-Prüfstift |
| GB2546794B (en) * | 2016-01-29 | 2020-01-08 | Teraview Ltd | A transmission line |
| CN110297110B (zh) * | 2018-03-21 | 2022-02-15 | 科磊股份有限公司 | 探针结构、夹具、容置盒、自动化探针替换系统及方法 |
| US11101215B2 (en) * | 2018-09-19 | 2021-08-24 | PsiQuantum Corp. | Tapered connectors for superconductor circuits |
| KR102577446B1 (ko) | 2019-02-12 | 2023-09-11 | 삼성전자주식회사 | 테스트 보드 및 이의 제조 방법, 테스트 보드를 이용한 소자 검사 장비, 및 테스트 보드를 이용한 반도체 장치의 제조 방법 |
| DE102020102302A1 (de) * | 2020-01-30 | 2021-08-05 | Ingun Prüfmittelbau Gmbh | Hochfrequenz-Prüfkontaktelement und Prüfstiftvorrichtung |
| DE102020119282B4 (de) * | 2020-07-22 | 2022-06-09 | Md Elektronik Gmbh | Kontaktvorrichtung |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58136108A (ja) * | 1982-02-08 | 1983-08-13 | Nec Corp | メアンダ型伝送線路 |
| US4697143A (en) * | 1984-04-30 | 1987-09-29 | Cascade Microtech, Inc. | Wafer probe |
| DD278041A3 (de) * | 1987-11-06 | 1990-04-25 | Akad Wissenschaften Ddr | Anordnung zur Messung kleinster Kapazitätsänderungen |
| US5005932A (en) * | 1989-11-06 | 1991-04-09 | Hughes Aircraft Company | Electro-optic modulator |
| JPH04155261A (ja) * | 1990-10-18 | 1992-05-28 | Mitsubishi Electric Corp | 超高周波プローブ針 |
| US5457399A (en) * | 1992-12-14 | 1995-10-10 | Hughes Aircraft Company | Microwave monolithic integrated circuit fabrication, test method and test probes |
| US5561378A (en) * | 1994-07-05 | 1996-10-01 | Motorola, Inc. | Circuit probe for measuring a differential circuit |
| US5506515A (en) * | 1994-07-20 | 1996-04-09 | Cascade Microtech, Inc. | High-frequency probe tip assembly |
| US6229327B1 (en) * | 1997-05-30 | 2001-05-08 | Gregory G. Boll | Broadband impedance matching probe |
| DE19945178C2 (de) * | 1999-09-21 | 2003-05-28 | Rosenberger Hochfrequenztech | Meßspitze zur Hochfrequenzmessung und Verfahren zu deren Herstellung |
| JP3356736B2 (ja) * | 1999-11-01 | 2002-12-16 | エヌイーシーワイヤレスネットワークス株式会社 | 高周波プローブ |
| JP2001244308A (ja) * | 2000-02-25 | 2001-09-07 | Mitsubishi Electric Corp | 高周波信号用のプローブ |
| JP2003087011A (ja) * | 2001-06-27 | 2003-03-20 | Murata Mfg Co Ltd | 誘電体デュプレクサおよび通信装置 |
| DE10136726A1 (de) * | 2001-07-27 | 2003-04-03 | Connexion Rosenberger Gmbh | Meßanordnung für Hochfrequenzmessungen mit mehreren Meßsonden und ein Verfahren zur Herstellung derselben |
| US6930497B2 (en) * | 2001-12-19 | 2005-08-16 | Chung Shan Institute Of Science And Technology Armaments Bureau, M.N.D. | Flexible multi-layered probe for measuring a signal from an object |
| DE10217387B4 (de) * | 2002-04-18 | 2018-04-12 | Snaptrack, Inc. | Elektrisches Anpassungsnetzwerk mit einer Transformationsleitung |
| US6956445B2 (en) * | 2003-02-19 | 2005-10-18 | Electro-Tec Corp. | Broadband high-frequency slip ring system |
| DE202004021093U1 (de) * | 2003-12-24 | 2006-09-28 | Cascade Microtech, Inc., Beaverton | Aktiver Halbleiterscheibenmessfühler |
| DE102004059960A1 (de) * | 2004-12-13 | 2006-06-22 | Bourns, Inc., Riverside | Schaltungsanordnung zur Messung eines elektrischen Stromes |
| DE202004019636U1 (de) * | 2004-12-20 | 2005-03-03 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Meßspitze für HF-Messung |
| CN2779421Y (zh) * | 2005-01-14 | 2006-05-10 | 廊坊市万科石油天然气技术工程有限公司 | 用于低磁场核磁共振有源发射接收探头 |
| JP2006317156A (ja) * | 2005-05-10 | 2006-11-24 | Matsushita Electric Ind Co Ltd | ベクトルネットワークアナライザ、ベクトルネットワークアナライザの校正方法、計算機及び標準器基板 |
| JP2007010522A (ja) * | 2005-06-30 | 2007-01-18 | Matsushita Electric Ind Co Ltd | スルー標準器基板及びライン標準器基板 |
| EP1982432B1 (en) * | 2006-01-31 | 2016-08-10 | Telefonaktiebolaget LM Ericsson (publ) | A method and a system for cable or subscriber loop investigation performing loop topology identification |
| JP2007205995A (ja) * | 2006-02-03 | 2007-08-16 | Advanced Systems Japan Inc | 高周波プローブ |
| EP1818672B1 (de) * | 2006-02-14 | 2012-08-29 | Mettler-Toledo AG | Messvorrichtung und Verfahren für den Betrieb der Messvorrichtung |
| US7612733B2 (en) * | 2007-03-12 | 2009-11-03 | The Regents Of The University Of Colorado | Transition region for use with an antenna-integrated electron tunneling device and method |
| US8212580B2 (en) * | 2007-04-02 | 2012-07-03 | Google Inc. | Scalable wideband probes, fixtures, and sockets for high speed IC testing and interconnects |
| JP2009014385A (ja) * | 2007-07-02 | 2009-01-22 | Si Gijutsu Kenkyusho:Kk | 誤差基準値検出装置 |
| US8134380B2 (en) * | 2008-11-26 | 2012-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test probe structure |
| DE202009003966U1 (de) * | 2009-03-20 | 2009-06-04 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messspitzen |
| US8928429B2 (en) * | 2011-05-17 | 2015-01-06 | City University Of Hong Kong | Multiple-way ring cavity power combiner and divider |
| CN102411074B (zh) * | 2011-08-03 | 2014-10-08 | 广东威特真空电子制造有限公司 | 一种高功率波导阻抗变换器 |
| JP5713197B2 (ja) * | 2011-09-28 | 2015-05-07 | 株式会社Wave Technology | バラン |
| JP5788767B2 (ja) * | 2011-11-07 | 2015-10-07 | 株式会社日本マイクロニクス | プローブブロックとそれを備えるプローブカード並びにプローブ装置 |
| CN102735887B (zh) * | 2012-07-16 | 2014-08-27 | 电子科技大学 | 一种数字示波器单端有源探头电路 |
| CN202975125U (zh) * | 2012-11-19 | 2013-06-05 | 廊坊霸州供电有限公司 | 接地线辅助验电装置 |
| CN103235190B (zh) * | 2013-04-19 | 2015-10-28 | 重庆金山科技(集团)有限公司 | 一种电阻抗测试方法 |
-
2014
- 2014-04-01 DE DE202014002841.9U patent/DE202014002841U1/de not_active Expired - Lifetime
-
2015
- 2015-01-13 CN CN201580017295.6A patent/CN106133531B/zh active Active
- 2015-01-13 EP EP15700416.9A patent/EP3126852B1/de active Active
- 2015-01-13 JP JP2016559930A patent/JP2017516084A/ja active Pending
- 2015-01-13 US US15/126,897 patent/US9804195B2/en active Active
- 2015-01-13 CA CA2940904A patent/CA2940904C/en active Active
- 2015-01-13 KR KR1020167024063A patent/KR20160140606A/ko not_active Ceased
- 2015-01-13 WO PCT/EP2015/000044 patent/WO2015149893A1/de not_active Ceased
- 2015-03-03 TW TW104203134U patent/TWM504245U/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI665448B (zh) * | 2018-07-13 | 2019-07-11 | 中華精測科技股份有限公司 | 高頻探針卡裝置及其信號傳輸模組 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2940904A1 (en) | 2015-10-08 |
| EP3126852A1 (de) | 2017-02-08 |
| WO2015149893A1 (de) | 2015-10-08 |
| CN106133531A (zh) | 2016-11-16 |
| CA2940904C (en) | 2020-08-18 |
| US20170153274A1 (en) | 2017-06-01 |
| EP3126852B1 (de) | 2019-11-27 |
| DE202014002841U1 (de) | 2014-06-25 |
| CN106133531B (zh) | 2020-10-20 |
| KR20160140606A (ko) | 2016-12-07 |
| JP2017516084A (ja) | 2017-06-15 |
| US9804195B2 (en) | 2017-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4K | Annulment or lapse of a utility model due to non-payment of fees |