JP2017516084A - 接触アセンブリ、特にｈｆ測定チップ - Google Patents

接触アセンブリ、特にｈｆ測定チップ Download PDF

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Publication number
JP2017516084A
JP2017516084A JP2016559930A JP2016559930A JP2017516084A JP 2017516084 A JP2017516084 A JP 2017516084A JP 2016559930 A JP2016559930 A JP 2016559930A JP 2016559930 A JP2016559930 A JP 2016559930A JP 2017516084 A JP2017516084 A JP 2017516084A
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conductor
contact
contact assembly
impedance
carrier
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JP2017516084A5 (https=
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ノイハウザー ロラント
ノイハウザー ロラント
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ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー
ローゼンベルガー ホーフフレクベンツテクニーク ゲーエムベーハー ウント ツェーオー カーゲー
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Publication of JP2017516084A publication Critical patent/JP2017516084A/ja
Publication of JP2017516084A5 publication Critical patent/JP2017516084A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06766—Input circuits therefor

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2016559930A 2014-04-01 2015-01-13 接触アセンブリ、特にｈｆ測定チップ Pending JP2017516084A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202014002841.9U DE202014002841U1 (de) 2014-04-01 2014-04-01 Kontaktieranordnung, insbesondere HF-Messspitze
DE202014002841.9 2014-04-01
PCT/EP2015/000044 WO2015149893A1 (de) 2014-04-01 2015-01-13 Kontaktieranordnung, insbesondere hf-messspitze

Publications (2)

Publication Number Publication Date
JP2017516084A true JP2017516084A (ja) 2017-06-15
JP2017516084A5 JP2017516084A5 (https=) 2018-02-22

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ID=51163835

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JP2016559930A Pending JP2017516084A (ja) 2014-04-01 2015-01-13 接触アセンブリ、特にｈｆ測定チップ

Country Status (9)

Country Link
US (1) US9804195B2 (https=)
EP (1) EP3126852B1 (https=)
JP (1) JP2017516084A (https=)
KR (1) KR20160140606A (https=)
CN (1) CN106133531B (https=)
CA (1) CA2940904C (https=)
DE (1) DE202014002841U1 (https=)
TW (1) TWM504245U (https=)
WO (1) WO2015149893A1 (https=)

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DE202014106223U1 (de) * 2014-12-22 2016-03-23 Ingun Prüfmittelbau Gmbh Hochfrequenz-Prüfstift
GB2546794B (en) * 2016-01-29 2020-01-08 Teraview Ltd A transmission line
CN110297110B (zh) * 2018-03-21 2022-02-15 科磊股份有限公司 探针结构、夹具、容置盒、自动化探针替换系统及方法
TWI665448B (zh) * 2018-07-13 2019-07-11 中華精測科技股份有限公司 高頻探針卡裝置及其信號傳輸模組
US11101215B2 (en) * 2018-09-19 2021-08-24 PsiQuantum Corp. Tapered connectors for superconductor circuits
KR102577446B1 (ko) 2019-02-12 2023-09-11 삼성전자주식회사 테스트 보드 및 이의 제조 방법, 테스트 보드를 이용한 소자 검사 장비, 및 테스트 보드를 이용한 반도체 장치의 제조 방법
DE102020102302A1 (de) * 2020-01-30 2021-08-05 Ingun Prüfmittelbau Gmbh Hochfrequenz-Prüfkontaktelement und Prüfstiftvorrichtung
DE102020119282B4 (de) * 2020-07-22 2022-06-09 Md Elektronik Gmbh Kontaktvorrichtung

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JPH03203716A (ja) * 1989-11-06 1991-09-05 Hughes Aircraft Co 電気光学変調器
JPH04155261A (ja) * 1990-10-18 1992-05-28 Mitsubishi Electric Corp 超高周波プローブ針
JPH06244263A (ja) * 1992-12-14 1994-09-02 Hughes Aircraft Co マイクロ波モノリシック集積回路の試験方法及び回路
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
JP2001133482A (ja) * 1999-11-01 2001-05-18 Nec Wireless Networks Ltd 高周波プローブ
JP2001244308A (ja) * 2000-02-25 2001-09-07 Mitsubishi Electric Corp 高周波信号用のプローブ
JP2002504995A (ja) * 1997-05-30 2002-02-12 ジージービー インダストリーズ，インコーポレーテッド 広域インピーダンス整合プローブ
US7042236B1 (en) * 1999-09-21 2006-05-09 Rosenberger Hochfrequenztechnik Gmbh & Co. Measuring probe for measuring high frequencies
JP2006519467A (ja) * 2003-02-19 2006-08-24 エレクトロ−テック コーポレイション 広帯域高周波スリップリングシステム
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JP2007010522A (ja) * 2005-06-30 2007-01-18 Matsushita Electric Ind Co Ltd スルー標準器基板及びライン標準器基板
JP2007205995A (ja) * 2006-02-03 2007-08-16 Advanced Systems Japan Inc 高周波プローブ
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JP2009014385A (ja) * 2007-07-02 2009-01-22 Si Gijutsu Kenkyusho:Kk 誤差基準値検出装置
US20120038381A1 (en) * 2009-03-20 2012-02-16 Rosenberger Hochfrequenztechnik Gmbh & Co Kg Test prod for high-frequency measurement
US20120293274A1 (en) * 2011-05-17 2012-11-22 City University Of Hong Kong Multiple-way ring cavity power combiner and divider
US20120306598A1 (en) * 2007-04-02 2012-12-06 Google Inc Scalable wideband probes, fixtures, and sockets for high speed ic testing and interconnects
JP2013074540A (ja) * 2011-09-28 2013-04-22 Wave Technology Inc バラン
JP2013101001A (ja) * 2011-11-07 2013-05-23 Micronics Japan Co Ltd プローブブロックとそれを備えるプローブカード並びにプローブ装置

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DE10136726A1 (de) * 2001-07-27 2003-04-03 Connexion Rosenberger Gmbh Meßanordnung für Hochfrequenzmessungen mit mehreren Meßsonden und ein Verfahren zur Herstellung derselben
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DE202004021093U1 (de) * 2003-12-24 2006-09-28 Cascade Microtech, Inc., Beaverton Aktiver Halbleiterscheibenmessfühler
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Patent Citations (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58136108A (ja) * 1982-02-08 1983-08-13 Nec Corp メアンダ型伝送線路
JPH03203716A (ja) * 1989-11-06 1991-09-05 Hughes Aircraft Co 電気光学変調器
JPH04155261A (ja) * 1990-10-18 1992-05-28 Mitsubishi Electric Corp 超高周波プローブ針
JPH06244263A (ja) * 1992-12-14 1994-09-02 Hughes Aircraft Co マイクロ波モノリシック集積回路の試験方法及び回路
US5506515A (en) * 1994-07-20 1996-04-09 Cascade Microtech, Inc. High-frequency probe tip assembly
JP2002504995A (ja) * 1997-05-30 2002-02-12 ジージービー インダストリーズ，インコーポレーテッド 広域インピーダンス整合プローブ
US7042236B1 (en) * 1999-09-21 2006-05-09 Rosenberger Hochfrequenztechnik Gmbh & Co. Measuring probe for measuring high frequencies
JP2001133482A (ja) * 1999-11-01 2001-05-18 Nec Wireless Networks Ltd 高周波プローブ
JP2001244308A (ja) * 2000-02-25 2001-09-07 Mitsubishi Electric Corp 高周波信号用のプローブ
JP2006519467A (ja) * 2003-02-19 2006-08-24 エレクトロ−テック コーポレイション 広帯域高周波スリップリングシステム
JP2006317156A (ja) * 2005-05-10 2006-11-24 Matsushita Electric Ind Co Ltd ベクトルネットワークアナライザ、ベクトルネットワークアナライザの校正方法、計算機及び標準器基板
JP2007010522A (ja) * 2005-06-30 2007-01-18 Matsushita Electric Ind Co Ltd スルー標準器基板及びライン標準器基板
JP2007205995A (ja) * 2006-02-03 2007-08-16 Advanced Systems Japan Inc 高周波プローブ
US20080224931A1 (en) * 2007-03-12 2008-09-18 Weiss Manoja D Transition Region for use with an Antenna-Integrated Electron Tunneling Device and Method
US20120306598A1 (en) * 2007-04-02 2012-12-06 Google Inc Scalable wideband probes, fixtures, and sockets for high speed ic testing and interconnects
JP2009014385A (ja) * 2007-07-02 2009-01-22 Si Gijutsu Kenkyusho:Kk 誤差基準値検出装置
US20120038381A1 (en) * 2009-03-20 2012-02-16 Rosenberger Hochfrequenztechnik Gmbh & Co Kg Test prod for high-frequency measurement
US20120293274A1 (en) * 2011-05-17 2012-11-22 City University Of Hong Kong Multiple-way ring cavity power combiner and divider
JP2013074540A (ja) * 2011-09-28 2013-04-22 Wave Technology Inc バラン
JP2013101001A (ja) * 2011-11-07 2013-05-23 Micronics Japan Co Ltd プローブブロックとそれを備えるプローブカード並びにプローブ装置

Also Published As

Publication number Publication date
CA2940904A1 (en) 2015-10-08
EP3126852A1 (de) 2017-02-08
WO2015149893A1 (de) 2015-10-08
CN106133531A (zh) 2016-11-16
CA2940904C (en) 2020-08-18
US20170153274A1 (en) 2017-06-01
EP3126852B1 (de) 2019-11-27
TWM504245U (zh) 2015-07-01
DE202014002841U1 (de) 2014-06-25
CN106133531B (zh) 2020-10-20
KR20160140606A (ko) 2016-12-07
US9804195B2 (en) 2017-10-31

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