TWI904308B - 熱硬化性樹脂組成物、預浸體、積層板、覆金屬積層板、印刷線路板及高速通訊對應模組 - Google Patents

熱硬化性樹脂組成物、預浸體、積層板、覆金屬積層板、印刷線路板及高速通訊對應模組

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Publication number
TWI904308B
TWI904308B TW110147849A TW110147849A TWI904308B TW I904308 B TWI904308 B TW I904308B TW 110147849 A TW110147849 A TW 110147849A TW 110147849 A TW110147849 A TW 110147849A TW I904308 B TWI904308 B TW I904308B
Authority
TW
Taiwan
Prior art keywords
thermosetting resin
component
resin composition
group
aforementioned
Prior art date
Application number
TW110147849A
Other languages
English (en)
Chinese (zh)
Other versions
TW202235536A (zh
Inventor
森田高示
下川諒
土川信次
春日圭一
林千尋
岩崎富生
Original Assignee
日商力森諾科股份有限公司
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Publication date
Application filed by 日商力森諾科股份有限公司 filed Critical 日商力森諾科股份有限公司
Publication of TW202235536A publication Critical patent/TW202235536A/zh
Application granted granted Critical
Publication of TWI904308B publication Critical patent/TWI904308B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW110147849A 2021-01-06 2021-12-21 熱硬化性樹脂組成物、預浸體、積層板、覆金屬積層板、印刷線路板及高速通訊對應模組 TWI904308B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2021001049 2021-01-06
JP2021-001039 2021-01-06
JP2021001044 2021-01-06
JP2021001039 2021-01-06
JP2021-001049 2021-01-06
JP2021-001044 2021-01-06

Publications (2)

Publication Number Publication Date
TW202235536A TW202235536A (zh) 2022-09-16
TWI904308B true TWI904308B (zh) 2025-11-11

Family

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Family Applications (1)

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TW110147849A TWI904308B (zh) 2021-01-06 2021-12-21 熱硬化性樹脂組成物、預浸體、積層板、覆金屬積層板、印刷線路板及高速通訊對應模組

Country Status (5)

Country Link
US (1) US12168709B2 (https=)
JP (1) JPWO2022149440A1 (https=)
KR (1) KR20230129430A (https=)
TW (1) TWI904308B (https=)
WO (1) WO2022149440A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102656234A (zh) * 2009-12-25 2012-09-05 日立化成工业株式会社 热固化性树脂组合物、树脂组合物清漆的制造方法、预浸料及层叠板
CN103756315A (zh) * 2013-12-19 2014-04-30 华为技术有限公司 一种热固性树脂组合物及其应用
JP2020169274A (ja) * 2019-04-03 2020-10-15 日立化成株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

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Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置
US7192651B2 (en) * 2003-08-20 2007-03-20 Mitsubishi Gas Chemical Company, Inc. Resin composition and prepreg for laminate and metal-clad laminate
KR101398731B1 (ko) * 2006-09-29 2014-05-27 히타치가세이가부시끼가이샤 열경화성 수지 조성물 및 이것을 이용한 프리프레그 및 적층판
TWI586777B (zh) * 2012-10-24 2017-06-11 Toagosei Co Production method of active energy ray hardening type adhesive preparation and laminate
WO2016139989A1 (ja) * 2015-03-04 2016-09-09 エア・ウォーター株式会社 熱膨張性調整剤、熱膨張性調整剤としての使用、熱硬化性樹脂組成物、当該熱硬化性樹脂組成物を含有する絶縁材、封止剤および導電ペースト、当該熱硬化性樹脂組成物を硬化させた硬化物、当該熱硬化性樹脂組成物を有する基板材料、当該熱硬化性樹脂組成物を基材に含浸させたプリプレグ、当該プリプレグの熱硬化性樹脂組成物を硬化させた部材、熱膨張率の調整方法、ならびに当該調整方法を用いて製造された部材
JP6705446B2 (ja) * 2015-04-30 2020-06-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP6701630B2 (ja) * 2015-06-02 2020-05-27 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
JP6589623B2 (ja) * 2015-12-24 2019-10-16 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、銅張積層板及びプリント配線板
US9926435B2 (en) * 2016-03-10 2018-03-27 Elite Material Co., Ltd. Resin composition, copper-clad laminate using the same, and printed circuit board using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102656234A (zh) * 2009-12-25 2012-09-05 日立化成工业株式会社 热固化性树脂组合物、树脂组合物清漆的制造方法、预浸料及层叠板
CN103756315A (zh) * 2013-12-19 2014-04-30 华为技术有限公司 一种热固性树脂组合物及其应用
JP2020169274A (ja) * 2019-04-03 2020-10-15 日立化成株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Also Published As

Publication number Publication date
US20240092958A1 (en) 2024-03-21
WO2022149440A8 (ja) 2022-08-25
KR20230129430A (ko) 2023-09-08
WO2022149440A1 (ja) 2022-07-14
JPWO2022149440A1 (https=) 2022-07-14
US12168709B2 (en) 2024-12-17
TW202235536A (zh) 2022-09-16

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