KR20230129430A - 열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈 - Google Patents

열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈 Download PDF

Info

Publication number
KR20230129430A
KR20230129430A KR1020237022944A KR20237022944A KR20230129430A KR 20230129430 A KR20230129430 A KR 20230129430A KR 1020237022944 A KR1020237022944 A KR 1020237022944A KR 20237022944 A KR20237022944 A KR 20237022944A KR 20230129430 A KR20230129430 A KR 20230129430A
Authority
KR
South Korea
Prior art keywords
group
component
thermosetting resin
resin composition
maleimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237022944A
Other languages
English (en)
Korean (ko)
Inventor
고지 모리타
료 시모카와
신지 츠치카와
게이이치 가스가
치히로 하야시
도미오 이와사키
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20230129430A publication Critical patent/KR20230129430A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/04—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polycarbonamides, polyesteramides or polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/12—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020237022944A 2021-01-06 2021-12-17 열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈 Pending KR20230129430A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2021001049 2021-01-06
JP2021001044 2021-01-06
JP2021001039 2021-01-06
JPJP-P-2021-001039 2021-01-06
JPJP-P-2021-001044 2021-01-06
JPJP-P-2021-001049 2021-01-06
PCT/JP2021/046797 WO2022149440A1 (ja) 2021-01-06 2021-12-17 熱硬化性樹脂組成物、プリプレグ、積層板、金属張り積層板、プリント配線板及び高速通信対応モジュール

Publications (1)

Publication Number Publication Date
KR20230129430A true KR20230129430A (ko) 2023-09-08

Family

ID=82357286

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237022944A Pending KR20230129430A (ko) 2021-01-06 2021-12-17 열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈

Country Status (5)

Country Link
US (1) US12168709B2 (https=)
JP (1) JPWO2022149440A1 (https=)
KR (1) KR20230129430A (https=)
TW (1) TWI904308B (https=)
WO (1) WO2022149440A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192651B2 (en) * 2003-08-20 2007-03-20 Mitsubishi Gas Chemical Company, Inc. Resin composition and prepreg for laminate and metal-clad laminate
KR101398731B1 (ko) * 2006-09-29 2014-05-27 히타치가세이가부시끼가이샤 열경화성 수지 조성물 및 이것을 이용한 프리프레그 및 적층판
EP2518115B1 (en) * 2009-12-25 2017-10-18 Hitachi Chemical Company, Ltd. Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate
TWI586777B (zh) * 2012-10-24 2017-06-11 Toagosei Co Production method of active energy ray hardening type adhesive preparation and laminate
WO2016139989A1 (ja) * 2015-03-04 2016-09-09 エア・ウォーター株式会社 熱膨張性調整剤、熱膨張性調整剤としての使用、熱硬化性樹脂組成物、当該熱硬化性樹脂組成物を含有する絶縁材、封止剤および導電ペースト、当該熱硬化性樹脂組成物を硬化させた硬化物、当該熱硬化性樹脂組成物を有する基板材料、当該熱硬化性樹脂組成物を基材に含浸させたプリプレグ、当該プリプレグの熱硬化性樹脂組成物を硬化させた部材、熱膨張率の調整方法、ならびに当該調整方法を用いて製造された部材
JP6705446B2 (ja) * 2015-04-30 2020-06-03 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP6701630B2 (ja) * 2015-06-02 2020-05-27 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
JP6589623B2 (ja) * 2015-12-24 2019-10-16 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、銅張積層板及びプリント配線板
US9926435B2 (en) * 2016-03-10 2018-03-27 Elite Material Co., Ltd. Resin composition, copper-clad laminate using the same, and printed circuit board using the same
JP2020169274A (ja) * 2019-04-03 2020-10-15 日立化成株式会社 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5869046A (ja) 1981-10-21 1983-04-25 旭化成株式会社 積層板及びその成形法
JPS6118937A (ja) 1984-07-06 1986-01-27 Mitsubishi Electric Corp 工業用テレビカメラの照明装置

Also Published As

Publication number Publication date
US20240092958A1 (en) 2024-03-21
WO2022149440A8 (ja) 2022-08-25
TWI904308B (zh) 2025-11-11
WO2022149440A1 (ja) 2022-07-14
JPWO2022149440A1 (https=) 2022-07-14
US12168709B2 (en) 2024-12-17
TW202235536A (zh) 2022-09-16

Similar Documents

Publication Publication Date Title
JP6969843B2 (ja) 樹脂組成物、及びこれを用いたプリプレグ、積層板、プリント配線板
JP6160675B2 (ja) 樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板
JP6896993B2 (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
US20180127547A1 (en) Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
JP7272068B2 (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
CN112313281B (zh) 热固化性树脂组合物、预浸渍体、层叠板、印刷线路板、半导体封装体以及热固化性树脂组合物的制造方法
WO2021132495A1 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2021080459A (ja) 樹脂組成物、プリプレグ、積層板及び多層プリント配線板
JP2021187889A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169276A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
WO2023224021A1 (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ
WO2024111380A1 (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2023168111A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、金属張り積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置
KR20230129430A (ko) 열경화성 수지 조성물, 프리프레그, 적층판, 금속 피복적층판, 프린트 배선판 및 고속 통신 대응 모듈
WO2021149698A1 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2019099711A (ja) 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
JP7670048B2 (ja) プリント配線板用熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2020169277A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
JP2020169275A (ja) 樹脂組成物、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
CN116669958A (zh) 热固性树脂组合物、预浸渍体、层叠板、覆金属层叠板、印刷电路板及高速通信兼容模块
JP2024087484A (ja) 熱硬化性樹脂組成物、樹脂フィルム、プリプレグ、積層板、金属張り積層板、プリント配線板、アンテナ装置、アンテナモジュール及び通信装置
JP2021187888A (ja) 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板、半導体パッケージ、樹脂組成物の製造方法及びプリント配線板用プレポリマー
JP2025094409A (ja) 樹脂組成物、樹脂フィルム、プリプレグ、積層板、プリント配線板及び半導体パッケージ
JP2026016525A (ja) 樹脂組成物、樹脂フィルム、樹脂付き金属箔、プリプレグ、積層板、多層プリント配線板及び半導体パッケージ
KR20260008086A (ko) 수지 조성물, 수지 필름, 프리프레그, 적층판, 프린트 배선판 및 반도체 패키지

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902