TWI843762B - 連接體之製造方法 - Google Patents

連接體之製造方法 Download PDF

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Publication number
TWI843762B
TWI843762B TW108139034A TW108139034A TWI843762B TW I843762 B TWI843762 B TW I843762B TW 108139034 A TW108139034 A TW 108139034A TW 108139034 A TW108139034 A TW 108139034A TW I843762 B TWI843762 B TW I843762B
Authority
TW
Taiwan
Prior art keywords
resin
anisotropic bonding
solder particles
bonding film
electrode
Prior art date
Application number
TW108139034A
Other languages
English (en)
Chinese (zh)
Other versions
TW202035636A (zh
Inventor
石松朋之
阿部智幸
青木正治
Original Assignee
日商迪睿合股份有限公司
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Publication date
Application filed by 日商迪睿合股份有限公司 filed Critical 日商迪睿合股份有限公司
Publication of TW202035636A publication Critical patent/TW202035636A/zh
Application granted granted Critical
Publication of TWI843762B publication Critical patent/TWI843762B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Led Device Packages (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
TW108139034A 2018-10-31 2019-10-29 連接體之製造方法 TWI843762B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP2018-206058 2018-10-31
JP2018206058 2018-10-31
JPJP2019-194479 2019-10-25
JP2019194479A JP6898413B2 (ja) 2018-10-31 2019-10-25 接続体の製造方法、異方性接合フィルム、接続体

Publications (2)

Publication Number Publication Date
TW202035636A TW202035636A (zh) 2020-10-01
TWI843762B true TWI843762B (zh) 2024-06-01

Family

ID=70724443

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108139034A TWI843762B (zh) 2018-10-31 2019-10-29 連接體之製造方法

Country Status (4)

Country Link
JP (2) JP6898413B2 (enExample)
KR (1) KR102568476B1 (enExample)
CN (1) CN112823448B (enExample)
TW (1) TWI843762B (enExample)

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* Cited by examiner, † Cited by third party
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EP3975049B1 (en) 2020-06-05 2025-09-03 Dexerials Corporation Production method for smart card, smart card, and conductive particle-containing hot-melt adhesive sheet
JP6966659B1 (ja) * 2020-06-05 2021-11-17 デクセリアルズ株式会社 スマートカードの製造方法、スマートカード、及び導電粒子含有ホットメルト接着シート
KR20250117484A (ko) 2020-10-29 2025-08-04 데쿠세리아루즈 가부시키가이샤 도전성 접착제, 이방성 도전 필름, 접속 구조체, 및 접속 구조체의 제조 방법
CN113555473B (zh) * 2021-07-27 2022-10-11 深圳市思坦科技有限公司 Micro-LED芯片巨量转移方法与系统、以及显示装置
JP2023143317A (ja) * 2022-03-25 2023-10-06 味の素株式会社 樹脂組成物および熱硬化型接着シート
KR102883043B1 (ko) 2023-03-26 2025-11-07 삼성에스디아이 주식회사 배터리 팩
WO2025070621A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法
WO2025070619A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、接合シート、導電性樹脂組成物の製造方法、接合体の製造方法、および、接合体
WO2025070620A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140366A (ja) * 2003-10-15 2004-05-13 Hitachi Chem Co Ltd 電極の接続方法
TW200735741A (en) * 2005-08-17 2007-09-16 Sumitomo Chemical Co Laminate to be used in flexible printed wiring boards and wiring boards made by using the same

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JPS6433808A (en) * 1986-10-18 1989-02-03 Japan Synthetic Rubber Co Ltd Conductive particle and conductive adhesive including it
JP4699189B2 (ja) * 2005-12-01 2011-06-08 日東電工株式会社 半導体装置の製造方法及び電子部品
JP4890053B2 (ja) * 2006-03-02 2012-03-07 旭化成イーマテリアルズ株式会社 微細回路検査用異方導電性フィルム
CN101501154B (zh) 2006-08-25 2013-05-15 住友电木株式会社 粘合带、接合体和半导体封装件
WO2009031472A1 (ja) 2007-09-05 2009-03-12 Hitachi Chemical Company, Ltd. 接着剤及びそれを用いた接続構造体
JP5032938B2 (ja) 2007-10-24 2012-09-26 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
US20100277885A1 (en) * 2007-12-17 2010-11-04 Hitachi Chemical Comoany, Ltd. Circuit connecting material and structure for connecting circuit member
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP2011231146A (ja) * 2010-04-23 2011-11-17 Asahi Kasei E-Materials Corp 異方導電性フィルム
JP5297418B2 (ja) * 2010-06-21 2013-09-25 デクセリアルズ株式会社 異方性導電材料及びその製造方法、並びに実装体及びその製造方法
JP2015167106A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 異方導電性フィルム及び接続構造体
JP2017097974A (ja) * 2015-11-18 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、電子部品の接続方法、及び接続構造体の製造方法
WO2017191774A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004140366A (ja) * 2003-10-15 2004-05-13 Hitachi Chem Co Ltd 電極の接続方法
TW200735741A (en) * 2005-08-17 2007-09-16 Sumitomo Chemical Co Laminate to be used in flexible printed wiring boards and wiring boards made by using the same

Also Published As

Publication number Publication date
JP2020077870A (ja) 2020-05-21
CN112823448A (zh) 2021-05-18
KR20210043655A (ko) 2021-04-21
JP6898413B2 (ja) 2021-07-07
JP2021180311A (ja) 2021-11-18
TW202035636A (zh) 2020-10-01
JP7420764B2 (ja) 2024-01-23
KR102568476B1 (ko) 2023-08-18
CN112823448B (zh) 2023-05-23

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