JP6898413B2 - 接続体の製造方法、異方性接合フィルム、接続体 - Google Patents

接続体の製造方法、異方性接合フィルム、接続体 Download PDF

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Publication number
JP6898413B2
JP6898413B2 JP2019194479A JP2019194479A JP6898413B2 JP 6898413 B2 JP6898413 B2 JP 6898413B2 JP 2019194479 A JP2019194479 A JP 2019194479A JP 2019194479 A JP2019194479 A JP 2019194479A JP 6898413 B2 JP6898413 B2 JP 6898413B2
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Japan
Prior art keywords
solder particles
anisotropic
resin
solid
film
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JP2019194479A
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English (en)
Japanese (ja)
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JP2020077870A (ja
JP2020077870A5 (enExample
Inventor
朋之 石松
朋之 石松
智幸 阿部
智幸 阿部
青木　正治
正治 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
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Dexerials Corp
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Publication date
Priority to PCT/JP2019/042035 priority Critical patent/WO2020090684A1/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020217007724A priority patent/KR102568476B1/ko
Priority to TW113104045A priority patent/TW202428831A/zh
Priority to TW113116528A priority patent/TWI902241B/zh
Priority to TW108139034A priority patent/TWI843762B/zh
Publication of JP2020077870A publication Critical patent/JP2020077870A/ja
Publication of JP2020077870A5 publication Critical patent/JP2020077870A5/ja
Priority to JP2021097132A priority patent/JP7420764B2/ja
Application granted granted Critical
Publication of JP6898413B2 publication Critical patent/JP6898413B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Led Device Packages (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
JP2019194479A 2018-10-31 2019-10-25 接続体の製造方法、異方性接合フィルム、接続体 Active JP6898413B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020217007724A KR102568476B1 (ko) 2018-10-31 2019-10-25 접속체의 제조 방법, 이방성 접합 필름, 접속체
PCT/JP2019/042035 WO2020090684A1 (ja) 2018-10-31 2019-10-25 接続体の製造方法、異方性接合フィルム、接続体
TW113116528A TWI902241B (zh) 2018-10-31 2019-10-29 連接體之製造方法
TW108139034A TWI843762B (zh) 2018-10-31 2019-10-29 連接體之製造方法
TW113104045A TW202428831A (zh) 2018-10-31 2019-10-29 異向性接合材料、異向性接合膜、及連接體
JP2021097132A JP7420764B2 (ja) 2018-10-31 2021-06-10 接続体の製造方法、異方性接合フィルム、接続体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018206058 2018-10-31
JP2018206058 2018-10-31

Related Child Applications (1)

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JP2021097132A Division JP7420764B2 (ja) 2018-10-31 2021-06-10 接続体の製造方法、異方性接合フィルム、接続体

Publications (3)

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JP2020077870A JP2020077870A (ja) 2020-05-21
JP2020077870A5 JP2020077870A5 (enExample) 2021-04-22
JP6898413B2 true JP6898413B2 (ja) 2021-07-07

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JP2021097132A Active JP7420764B2 (ja) 2018-10-31 2021-06-10 接続体の製造方法、異方性接合フィルム、接続体

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JP (2) JP6898413B2 (enExample)
KR (1) KR102568476B1 (enExample)
CN (1) CN112823448B (enExample)
TW (1) TWI843762B (enExample)

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CN114096336B (zh) * 2020-06-05 2024-05-10 迪睿合株式会社 智能卡的制备方法、智能卡及含有导电粒子的热熔粘接片
JP6966659B1 (ja) * 2020-06-05 2021-11-17 デクセリアルズ株式会社 スマートカードの製造方法、スマートカード、及び導電粒子含有ホットメルト接着シート
WO2022092047A1 (ja) 2020-10-29 2022-05-05 デクセリアルズ株式会社 導電性接着剤、異方性導電フィルム、接続構造体、及び接続構造体の製造方法
CN113555473B (zh) * 2021-07-27 2022-10-11 深圳市思坦科技有限公司 Micro-LED芯片巨量转移方法与系统、以及显示装置
JP2023143317A (ja) * 2022-03-25 2023-10-06 味の素株式会社 樹脂組成物および熱硬化型接着シート
KR102883043B1 (ko) 2023-03-26 2025-11-07 삼성에스디아이 주식회사 배터리 팩
WO2025070620A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法
WO2025070619A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、接合シート、導電性樹脂組成物の製造方法、接合体の製造方法、および、接合体
WO2025070621A1 (ja) * 2023-09-28 2025-04-03 日東電工株式会社 導電性樹脂組成物、導電性樹脂シート、接続構造体、および、接続構造体の製造方法

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JPS6433808A (en) * 1986-10-18 1989-02-03 Japan Synthetic Rubber Co Ltd Conductive particle and conductive adhesive including it
JP3856233B2 (ja) * 2003-10-15 2006-12-13 日立化成工業株式会社 電極の接続方法
JP2007053187A (ja) * 2005-08-17 2007-03-01 Sumitomo Chemical Co Ltd フレキシブルプリント配線板用金属張積層板及びフレキシブルプリント配線基板
JP4699189B2 (ja) * 2005-12-01 2011-06-08 日東電工株式会社 半導体装置の製造方法及び電子部品
JP4890053B2 (ja) * 2006-03-02 2012-03-07 旭化成イーマテリアルズ株式会社 微細回路検査用異方導電性フィルム
WO2008023452A1 (en) * 2006-08-25 2008-02-28 Sumitomo Bakelite Co., Ltd. Adhesive tape, joint structure, and semiconductor package
KR101187092B1 (ko) * 2007-09-05 2012-09-28 히다치 가세고교 가부시끼가이샤 접착제 및 그것을 이용한 접속 구조체
JP5032938B2 (ja) 2007-10-24 2012-09-26 パナソニック株式会社 熱硬化性樹脂組成物及びその製造方法
US20100277885A1 (en) * 2007-12-17 2010-11-04 Hitachi Chemical Comoany, Ltd. Circuit connecting material and structure for connecting circuit member
JP2010040893A (ja) * 2008-08-07 2010-02-18 Sumitomo Bakelite Co Ltd 端子間の接続方法、それを用いた半導体装置の製造方法、および導電性粒子の凝集方法
JP2011231146A (ja) * 2010-04-23 2011-11-17 Asahi Kasei E-Materials Corp 異方導電性フィルム
JP5297418B2 (ja) * 2010-06-21 2013-09-25 デクセリアルズ株式会社 異方性導電材料及びその製造方法、並びに実装体及びその製造方法
JP2015167106A (ja) * 2014-03-04 2015-09-24 日立化成株式会社 異方導電性フィルム及び接続構造体
JP2017097974A (ja) * 2015-11-18 2017-06-01 デクセリアルズ株式会社 異方性導電フィルム、電子部品の接続方法、及び接続構造体の製造方法
WO2017191774A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 異方性導電フィルム

Also Published As

Publication number Publication date
JP2021180311A (ja) 2021-11-18
JP2020077870A (ja) 2020-05-21
TWI843762B (zh) 2024-06-01
KR102568476B1 (ko) 2023-08-18
CN112823448A (zh) 2021-05-18
JP7420764B2 (ja) 2024-01-23
KR20210043655A (ko) 2021-04-21
CN112823448B (zh) 2023-05-23
TW202035636A (zh) 2020-10-01

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