TWI833889B - 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 - Google Patents

遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 Download PDF

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Publication number
TWI833889B
TWI833889B TW109103203A TW109103203A TWI833889B TW I833889 B TWI833889 B TW I833889B TW 109103203 A TW109103203 A TW 109103203A TW 109103203 A TW109103203 A TW 109103203A TW I833889 B TWI833889 B TW I833889B
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TW
Taiwan
Prior art keywords
mask
adapter
information
detected
mask adapter
Prior art date
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TW109103203A
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English (en)
Chinese (zh)
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TW202102945A (zh
Inventor
小宮山弘樹
八田澄夫
長野智和
寺西瀬名
浅海博圭
高橋大輔
大川智之
Original Assignee
日商尼康股份有限公司
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Publication of TW202102945A publication Critical patent/TW202102945A/zh
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Publication of TWI833889B publication Critical patent/TWI833889B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/17—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] specially adapted for supporting large square shaped substrates

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109103203A 2019-02-06 2020-02-03 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 TWI833889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019020167 2019-02-06
JP2019-020167 2019-02-06

Publications (2)

Publication Number Publication Date
TW202102945A TW202102945A (zh) 2021-01-16
TWI833889B true TWI833889B (zh) 2024-03-01

Family

ID=71947346

Family Applications (1)

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TW109103203A TWI833889B (zh) 2019-02-06 2020-02-03 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法

Country Status (5)

Country Link
JP (1) JP7517155B2 (https=)
KR (1) KR20210122240A (https=)
CN (2) CN113330370B (https=)
TW (1) TWI833889B (https=)
WO (1) WO2020162396A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230109818A (ko) * 2022-01-13 2023-07-21 삼성디스플레이 주식회사 마스크, 이를 포함하는 마스크 조립체, 및 기판 이송 설비
TWI868646B (zh) * 2023-03-30 2025-01-01 家碩科技股份有限公司 降低粉塵汙染的光罩內盒承載裝置及光罩內盒的光學檢查設備
JP2025164347A (ja) 2024-04-19 2025-10-30 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
TWI894069B (zh) * 2024-12-10 2025-08-11 華洋精機股份有限公司 光罩圖樣面朝下之光罩移載裝置
CN120044767A (zh) * 2025-04-23 2025-05-27 新毅东(北京)科技有限公司 掩模板预对准装置及晶圆曝光设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433927A (en) * 1987-07-30 1989-02-03 Canon Kk Mask holder and mask conveying method using the same
JPH06325996A (ja) * 1993-05-12 1994-11-25 Hitachi Ltd レティクルフレーム
JP2004165249A (ja) * 2002-11-11 2004-06-10 Sony Corp 露光装置及び露光方法
JP2004531923A (ja) * 2001-01-12 2004-10-14 ビジブル テクノーレッジー， エルエルシー 電子インクを使用したスマート電子ラベル

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248196A (ja) * 1988-06-15 1990-02-16 Canon Inc 搬送装置
JP3412193B2 (ja) * 1993-06-29 2003-06-03 株式会社ニコン 露光装置
JP3912884B2 (ja) * 1998-02-03 2007-05-09 ローム株式会社 投影露光装置における露光マスクサイズ変換用治具の構造
JP4048593B2 (ja) 1998-04-03 2008-02-20 ソニー株式会社 露光装置
JP2001033943A (ja) 1999-07-23 2001-02-09 Mitsubishi Electric Corp マスク装置
DE10153851B4 (de) 2001-11-02 2006-11-16 Suss Microtec Lithography Gmbh Vorrichtung zum Ausrichten von Masken in der Fotolithographie
US7236233B2 (en) 2003-10-27 2007-06-26 Asml Netherlands B.V. Assembly of a reticle holder and a reticle
JP4723398B2 (ja) * 2006-02-22 2011-07-13 Ｈｏｙａ株式会社 スピン洗浄装置
US20100085554A1 (en) 2008-10-02 2010-04-08 Fan Chih-Shen Adaptor of an aligner system
JP5334675B2 (ja) 2009-05-13 2013-11-06 株式会社日立ハイテクノロジーズ プロキシミティ露光装置、プロキシミティ露光装置のマスクの位置ずれ防止方法、及び表示用パネル基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433927A (en) * 1987-07-30 1989-02-03 Canon Kk Mask holder and mask conveying method using the same
JPH06325996A (ja) * 1993-05-12 1994-11-25 Hitachi Ltd レティクルフレーム
JP2004531923A (ja) * 2001-01-12 2004-10-14 ビジブル テクノーレッジー， エルエルシー 電子インクを使用したスマート電子ラベル
JP2004165249A (ja) * 2002-11-11 2004-06-10 Sony Corp 露光装置及び露光方法

Also Published As

Publication number Publication date
TW202102945A (zh) 2021-01-16
CN113330370A (zh) 2021-08-31
CN118068658A (zh) 2024-05-24
JP7517155B2 (ja) 2024-07-17
JPWO2020162396A1 (ja) 2021-12-02
CN113330370B (zh) 2024-04-09
KR20210122240A (ko) 2021-10-08
WO2020162396A1 (ja) 2020-08-13

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