TWI833889B - 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 - Google Patents

遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 Download PDF

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Publication number
TWI833889B
TWI833889B TW109103203A TW109103203A TWI833889B TW I833889 B TWI833889 B TW I833889B TW 109103203 A TW109103203 A TW 109103203A TW 109103203 A TW109103203 A TW 109103203A TW I833889 B TWI833889 B TW I833889B
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TW
Taiwan
Prior art keywords
mask
adapter
information
detected
mask adapter
Prior art date
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TW109103203A
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English (en)
Chinese (zh)
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TW202102945A (zh
Inventor
小宮山弘樹
八田澄夫
長野智和
寺西瀬名
浅海博圭
高橋大輔
大川智之
Original Assignee
日商尼康股份有限公司
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Publication of TW202102945A publication Critical patent/TW202102945A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW109103203A 2019-02-06 2020-02-03 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法 TWI833889B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019020167 2019-02-06
JP2019-020167 2019-02-06

Publications (2)

Publication Number Publication Date
TW202102945A TW202102945A (zh) 2021-01-16
TWI833889B true TWI833889B (zh) 2024-03-01

Family

ID=71947346

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109103203A TWI833889B (zh) 2019-02-06 2020-02-03 遮罩配接器、遮罩配接器安裝工具、曝光裝置以及元件製造方法

Country Status (5)

Country Link
JP (1) JP7517155B2 (enExample)
KR (1) KR20210122240A (enExample)
CN (2) CN113330370B (enExample)
TW (1) TWI833889B (enExample)
WO (1) WO2020162396A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230109818A (ko) * 2022-01-13 2023-07-21 삼성디스플레이 주식회사 마스크, 이를 포함하는 마스크 조립체, 및 기판 이송 설비
TWI868646B (zh) * 2023-03-30 2025-01-01 家碩科技股份有限公司 降低粉塵汙染的光罩內盒承載裝置及光罩內盒的光學檢查設備
JP2025164347A (ja) 2024-04-19 2025-10-30 キヤノン株式会社 露光装置、露光方法、及び物品の製造方法
TWI894069B (zh) * 2024-12-10 2025-08-11 華洋精機股份有限公司 光罩圖樣面朝下之光罩移載裝置
CN120044767A (zh) * 2025-04-23 2025-05-27 新毅东(北京)科技有限公司 掩模板预对准装置及晶圆曝光设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433927A (en) * 1987-07-30 1989-02-03 Canon Kk Mask holder and mask conveying method using the same
JPH06325996A (ja) * 1993-05-12 1994-11-25 Hitachi Ltd レティクルフレーム
JP2004165249A (ja) * 2002-11-11 2004-06-10 Sony Corp 露光装置及び露光方法
JP2004531923A (ja) * 2001-01-12 2004-10-14 ビジブル テクノーレッジー， エルエルシー 電子インクを使用したスマート電子ラベル

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0248196A (ja) * 1988-06-15 1990-02-16 Canon Inc 搬送装置
JP3412193B2 (ja) * 1993-06-29 2003-06-03 株式会社ニコン 露光装置
JP3912884B2 (ja) * 1998-02-03 2007-05-09 ローム株式会社 投影露光装置における露光マスクサイズ変換用治具の構造
JP4048593B2 (ja) * 1998-04-03 2008-02-20 ソニー株式会社 露光装置
JP2001033943A (ja) 1999-07-23 2001-02-09 Mitsubishi Electric Corp マスク装置
DE10153851B4 (de) 2001-11-02 2006-11-16 Suss Microtec Lithography Gmbh Vorrichtung zum Ausrichten von Masken in der Fotolithographie
US7236233B2 (en) 2003-10-27 2007-06-26 Asml Netherlands B.V. Assembly of a reticle holder and a reticle
JP4723398B2 (ja) * 2006-02-22 2011-07-13 Ｈｏｙａ株式会社 スピン洗浄装置
US20100085554A1 (en) 2008-10-02 2010-04-08 Fan Chih-Shen Adaptor of an aligner system
JP5334675B2 (ja) 2009-05-13 2013-11-06 株式会社日立ハイテクノロジーズ プロキシミティ露光装置、プロキシミティ露光装置のマスクの位置ずれ防止方法、及び表示用パネル基板の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6433927A (en) * 1987-07-30 1989-02-03 Canon Kk Mask holder and mask conveying method using the same
JPH06325996A (ja) * 1993-05-12 1994-11-25 Hitachi Ltd レティクルフレーム
JP2004531923A (ja) * 2001-01-12 2004-10-14 ビジブル テクノーレッジー， エルエルシー 電子インクを使用したスマート電子ラベル
JP2004165249A (ja) * 2002-11-11 2004-06-10 Sony Corp 露光装置及び露光方法

Also Published As

Publication number Publication date
TW202102945A (zh) 2021-01-16
CN113330370A (zh) 2021-08-31
KR20210122240A (ko) 2021-10-08
JPWO2020162396A1 (ja) 2021-12-02
CN113330370B (zh) 2024-04-09
JP7517155B2 (ja) 2024-07-17
CN118068658A (zh) 2024-05-24
WO2020162396A1 (ja) 2020-08-13

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