TWI830901B - 半導體裝置的製造方法 - Google Patents

半導體裝置的製造方法 Download PDF

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Publication number
TWI830901B
TWI830901B TW109112888A TW109112888A TWI830901B TW I830901 B TWI830901 B TW I830901B TW 109112888 A TW109112888 A TW 109112888A TW 109112888 A TW109112888 A TW 109112888A TW I830901 B TWI830901 B TW I830901B
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Taiwan
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wafer
sheet
film
support
adhesive
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TW109112888A
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English (en)
Chinese (zh)
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TW202044423A (zh
Inventor
太郎
谷口紘平
矢羽田達也
尾崎義信
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日商力森諾科股份有限公司
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/953—Materials of bond pads not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/24—Configurations of stacked chips at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
TW109112888A 2019-04-25 2020-04-17 半導體裝置的製造方法 TWI830901B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2019/017713 2019-04-25
PCT/JP2019/017713 WO2020217404A1 (ja) 2019-04-25 2019-04-25 ドルメン構造を有する半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW202044423A TW202044423A (zh) 2020-12-01
TWI830901B true TWI830901B (zh) 2024-02-01

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TW109112888A TWI830901B (zh) 2019-04-25 2020-04-17 半導體裝置的製造方法

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US (1) US12412880B2 (https=)
JP (1) JP7294410B2 (https=)
KR (1) KR102711424B1 (https=)
CN (1) CN113574663B (https=)
SG (1) SG11202110111YA (https=)
TW (1) TWI830901B (https=)
WO (1) WO2020217404A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020217394A1 (ja) * 2019-04-25 2020-10-29 日立化成株式会社 ドルメン構造を有する半導体装置及びその製造方法、並びに、支持片形成用積層フィルム及びその製造方法
WO2020217404A1 (ja) 2019-04-25 2020-10-29 日立化成株式会社 ドルメン構造を有する半導体装置及びその製造方法
JP7452545B2 (ja) * 2019-08-29 2024-03-19 株式会社レゾナック 支持片の製造方法、半導体装置の製造方法、及び支持片形成用積層フィルム
JP2023102570A (ja) 2022-01-12 2023-07-25 株式会社レゾナック 個片化体形成用積層フィルム及びその製造方法、並びに半導体装置の製造方法
CN120981923A (zh) * 2023-07-21 2025-11-18 株式会社力森诺科 半导体装置及半导体装置的制造方法
WO2025164537A1 (ja) * 2024-02-02 2025-08-07 株式会社レゾナック 個片化体形成用積層フィルム及び半導体装置の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201038699A (en) * 2009-03-23 2010-11-01 Hitachi Chemical Co Ltd Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
CN103178036A (zh) * 2011-12-20 2013-06-26 株式会社东芝 半导体器件及其制造方法

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3210126B2 (ja) 1993-03-15 2001-09-17 株式会社東芝 液晶表示装置の製造方法
US5721452A (en) 1995-08-16 1998-02-24 Micron Technology, Inc. Angularly offset stacked die multichip device and method of manufacture
JP2002222889A (ja) 2001-01-24 2002-08-09 Nec Kyushu Ltd 半導体装置及びその製造方法
KR20030018204A (ko) * 2001-08-27 2003-03-06 삼성전자주식회사 스페이서를 갖는 멀티 칩 패키지
US6787916B2 (en) * 2001-09-13 2004-09-07 Tru-Si Technologies, Inc. Structures having a substrate with a cavity and having an integrated circuit bonded to a contact pad located in the cavity
US6930378B1 (en) 2003-11-10 2005-08-16 Amkor Technology, Inc. Stacked semiconductor die assembly having at least one support
DE10360708B4 (de) 2003-12-19 2008-04-10 Infineon Technologies Ag Halbleitermodul mit einem Halbleiterstapel, Umverdrahtungsplatte, und Verfahren zur Herstellung derselben
US7312261B2 (en) * 2004-05-11 2007-12-25 International Business Machines Corporation Thermal interface adhesive and rework
JP4188337B2 (ja) * 2004-05-20 2008-11-26 株式会社東芝 積層型電子部品の製造方法
US7064430B2 (en) * 2004-08-31 2006-06-20 Stats Chippac Ltd. Stacked die packaging and fabrication method
TWI292617B (en) * 2006-02-03 2008-01-11 Siliconware Precision Industries Co Ltd Stacked semiconductor structure and fabrication method thereof
JP4954569B2 (ja) * 2006-02-16 2012-06-20 日東電工株式会社 半導体装置の製造方法
WO2007109326A2 (en) * 2006-03-21 2007-09-27 Promerus Llc Methods and materials useful for chip stacking, chip and wafer bonding
US20080029885A1 (en) 2006-08-07 2008-02-07 Sandisk Il Ltd. Inverted Pyramid Multi-Die Package Reducing Wire Sweep And Weakening Torques
TWI317993B (en) 2006-08-18 2009-12-01 Advanced Semiconductor Eng Stackable semiconductor package
JP2010040835A (ja) * 2008-08-06 2010-02-18 Toshiba Corp 積層型半導体装置の製造方法
JP5791866B2 (ja) 2009-03-06 2015-10-07 株式会社ディスコ ワーク分割装置
US8169058B2 (en) 2009-08-21 2012-05-01 Stats Chippac, Ltd. Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars
KR20120080634A (ko) * 2009-11-13 2012-07-17 히다치 가세고교 가부시끼가이샤 반도체 장치, 반도체 장치의 제조 방법 및 접착제층 부착 반도체 웨이퍼
KR20110083969A (ko) * 2010-01-15 2011-07-21 삼성전자주식회사 반도체 패키지 및 그 제조 방법
JP4976522B2 (ja) 2010-04-16 2012-07-18 日東電工株式会社 熱硬化型ダイボンドフィルム、ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
JP5013148B1 (ja) 2011-02-16 2012-08-29 株式会社東京精密 ワーク分割装置及びワーク分割方法
KR101774938B1 (ko) * 2011-08-31 2017-09-06 삼성전자 주식회사 지지대를 갖는 반도체 패키지 및 그 형성 방법
JP5537515B2 (ja) * 2011-09-01 2014-07-02 株式会社東芝 積層型半導体装置の製造方法と製造装置
JP2013127014A (ja) * 2011-12-16 2013-06-27 Hitachi Chemical Co Ltd 接着シート
WO2013133275A1 (ja) 2012-03-08 2013-09-12 日立化成株式会社 接着シート及び半導体装置の製造方法
KR101906269B1 (ko) * 2012-04-17 2018-10-10 삼성전자 주식회사 반도체 패키지 및 그 제조 방법
CN105143380B (zh) 2013-03-28 2019-05-17 古河电气工业株式会社 粘合带及晶片加工用胶带
JP2015176906A (ja) 2014-03-13 2015-10-05 株式会社東芝 半導体装置および半導体装置の製造方法
KR102161776B1 (ko) 2014-03-28 2020-10-06 에스케이하이닉스 주식회사 적층 패키지
US9418974B2 (en) 2014-04-29 2016-08-16 Micron Technology, Inc. Stacked semiconductor die assemblies with support members and associated systems and methods
US9412722B1 (en) 2015-02-12 2016-08-09 Dawning Leading Technology Inc. Multichip stacking package structure and method for manufacturing the same
DE102015204698B4 (de) * 2015-03-16 2023-07-20 Disco Corporation Verfahren zum Teilen eines Wafers
JP6603479B2 (ja) 2015-05-18 2019-11-06 日東電工株式会社 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置
US10297575B2 (en) * 2016-05-06 2019-05-21 Amkor Technology, Inc. Semiconductor device utilizing an adhesive to attach an upper package to a lower die
WO2018159305A1 (ja) 2017-02-28 2018-09-07 パナソニックＩｐマネジメント株式会社 ピラー供給用シートの製造方法、ガラスパネルユニットの製造方法及びガラス窓の製造方法
WO2020217404A1 (ja) 2019-04-25 2020-10-29 日立化成株式会社 ドルメン構造を有する半導体装置及びその製造方法
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201038699A (en) * 2009-03-23 2010-11-01 Hitachi Chemical Co Ltd Resin paste for die bonding, process for producing semiconductor device using the resin paste, and semiconductor device
CN103178036A (zh) * 2011-12-20 2013-06-26 株式会社东芝 半导体器件及其制造方法

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KR102711424B1 (ko) 2024-09-26
CN113574663B (zh) 2025-12-12
SG11202110111YA (en) 2021-11-29
JP7294410B2 (ja) 2023-06-20
CN113574663A (zh) 2021-10-29
TW202044423A (zh) 2020-12-01
KR20210145737A (ko) 2021-12-02
WO2020217404A1 (ja) 2020-10-29
JPWO2020217404A1 (https=) 2020-10-29
US12412880B2 (en) 2025-09-09
US20220157802A1 (en) 2022-05-19

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