TWI828702B - 樹脂模製裝置及樹脂模製方法 - Google Patents

樹脂模製裝置及樹脂模製方法 Download PDF

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Publication number
TWI828702B
TWI828702B TW108120048A TW108120048A TWI828702B TW I828702 B TWI828702 B TW I828702B TW 108120048 A TW108120048 A TW 108120048A TW 108120048 A TW108120048 A TW 108120048A TW I828702 B TWI828702 B TW I828702B
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TW
Taiwan
Prior art keywords
workpiece
resin
mold
molding
holding part
Prior art date
Application number
TW108120048A
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English (en)
Chinese (zh)
Other versions
TW202012138A (zh
Inventor
中村一雄
西澤義晃
北島德幸
伊藤幸雄
Original Assignee
日商山田尖端科技股份有限公司
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Publication of TW202012138A publication Critical patent/TW202012138A/zh
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Publication of TWI828702B publication Critical patent/TWI828702B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/20—Opening, closing or clamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/50—Removing moulded articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
TW108120048A 2018-08-10 2019-06-11 樹脂模製裝置及樹脂模製方法 TWI828702B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-151906 2018-08-10
JP2018151906A JP7068094B2 (ja) 2018-08-10 2018-08-10 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法

Publications (2)

Publication Number Publication Date
TW202012138A TW202012138A (zh) 2020-04-01
TWI828702B true TWI828702B (zh) 2024-01-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW108120048A TWI828702B (zh) 2018-08-10 2019-06-11 樹脂模製裝置及樹脂模製方法

Country Status (4)

Country Link
JP (1) JP7068094B2 (ja)
KR (1) KR20200018314A (ja)
CN (1) CN110815707B (ja)
TW (1) TWI828702B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7341105B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7430125B2 (ja) 2020-08-28 2024-02-09 Ｔｏｗａ株式会社 成形型、樹脂成形装置、及び樹脂成形品の製造方法
JP7341106B2 (ja) * 2020-08-28 2023-09-08 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法
JP7444452B2 (ja) 2020-10-26 2024-03-06 アピックヤマダ株式会社 樹脂封止装置及びワーク搬送方法
JP7394798B2 (ja) 2021-02-09 2023-12-08 Ｔｏｗａ株式会社 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
CN113977820B (zh) * 2021-11-04 2023-06-23 株洲时代瑞唯减振装备有限公司 一种硫化机模具的开合模方法和便于脱模的硫化机模具
JP2024013299A (ja) * 2022-07-20 2024-02-01 Ｔｏｗａ株式会社 樹脂成形装置、及び樹脂成形品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5987737A (en) * 1995-07-25 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Gate break device and gate break method
CN101167172A (zh) * 2005-04-29 2008-04-23 飞科公司 用于提供和卸除具有电子元件的承载器的方法和设备
CN104576475A (zh) * 2013-10-17 2015-04-29 东和株式会社 半导体基板供给方法及半导体基板供给装置
TW201801882A (zh) * 2016-04-28 2018-01-16 Ｔｏｗａ股份有限公司 樹脂密封裝置及樹脂密封方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06830A (ja) * 1992-06-22 1994-01-11 Toshiba Corp モールドシステム
JP3473149B2 (ja) * 1995-02-16 2003-12-02 三菱化学株式会社 樹脂製ディスク基板の製造方法
JP3642637B2 (ja) * 1996-08-20 2005-04-27 アピックヤマダ株式会社 樹脂モールド装置
JP3517770B2 (ja) * 1997-09-11 2004-04-12 株式会社名機製作所 ディスク成形方法
JP3825161B2 (ja) * 1997-12-02 2006-09-20 株式会社サイネックス 半導体モールド装置
JP3609824B1 (ja) 2003-10-30 2005-01-12 第一精工株式会社 樹脂封止成形装置
JP2011116063A (ja) * 2009-12-04 2011-06-16 Nippon Densan Corp 樹脂成型品の製造方法および装置並びにターンテーブルの製造方法
JP6151610B2 (ja) 2013-09-06 2017-06-21 アピックヤマダ株式会社 モールド金型及び樹脂モールド装置並びに樹脂モールド方法
JP5947331B2 (ja) * 2014-04-30 2016-07-06 エムテックスマツムラ株式会社 樹脂成形装置およびそれを用いたチップオンテープ型半導体装置の製造装置
JP6744780B2 (ja) * 2016-08-09 2020-08-19 アピックヤマダ株式会社 樹脂モールド装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5987737A (en) * 1995-07-25 1999-11-23 Mitsubishi Denki Kabushiki Kaisha Gate break device and gate break method
CN101167172A (zh) * 2005-04-29 2008-04-23 飞科公司 用于提供和卸除具有电子元件的承载器的方法和设备
CN104576475A (zh) * 2013-10-17 2015-04-29 东和株式会社 半导体基板供给方法及半导体基板供给装置
TW201801882A (zh) * 2016-04-28 2018-01-16 Ｔｏｗａ股份有限公司 樹脂密封裝置及樹脂密封方法

Also Published As

Publication number Publication date
CN110815707A (zh) 2020-02-21
JP7068094B2 (ja) 2022-05-16
TW202012138A (zh) 2020-04-01
KR20200018314A (ko) 2020-02-19
JP2020026088A (ja) 2020-02-20
CN110815707B (zh) 2024-03-26

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