TWI822901B - 洗淨模組以及具備洗淨模組之基板處理裝置 - Google Patents

洗淨模組以及具備洗淨模組之基板處理裝置 Download PDF

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Publication number
TWI822901B
TWI822901B TW108140562A TW108140562A TWI822901B TW I822901 B TWI822901 B TW I822901B TW 108140562 A TW108140562 A TW 108140562A TW 108140562 A TW108140562 A TW 108140562A TW I822901 B TWI822901 B TW I822901B
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TW
Taiwan
Prior art keywords
substrate
roller
cleaning
edge
polishing
Prior art date
Application number
TW108140562A
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English (en)
Chinese (zh)
Other versions
TW202027867A (zh
Inventor
水野稔夫
檜森洋輔
馬場枝里奈
石橋知淳
小畠厳貴
Original Assignee
日商荏原製作所股份有限公司
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Publication of TW202027867A publication Critical patent/TW202027867A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW108140562A 2018-11-16 2019-11-08 洗淨模組以及具備洗淨模組之基板處理裝置 TWI822901B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-215456 2018-11-16
JP2018215456A JP7265858B2 (ja) 2018-11-16 2018-11-16 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法

Publications (2)

Publication Number Publication Date
TW202027867A TW202027867A (zh) 2020-08-01
TWI822901B true TWI822901B (zh) 2023-11-21

Family

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Family Applications (1)

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TW108140562A TWI822901B (zh) 2018-11-16 2019-11-08 洗淨模組以及具備洗淨模組之基板處理裝置

Country Status (7)

Country Link
US (1) US12033847B2 (enExample)
JP (1) JP7265858B2 (enExample)
KR (1) KR102778937B1 (enExample)
CN (1) CN113165142B (enExample)
SG (1) SG11202105091PA (enExample)
TW (1) TWI822901B (enExample)
WO (1) WO2020100609A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138732B2 (en) * 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN112976266A (zh) * 2021-03-04 2021-06-18 王仕英 一种陶瓷生产用胚体修复装置
JP7623225B2 (ja) * 2021-06-11 2025-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
CN119609909A (zh) * 2024-08-06 2025-03-14 浙江创芯集成电路有限公司 晶圆研磨装置以及晶圆研磨设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

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DE2415580A1 (de) 1974-03-30 1975-10-02 Schleifenbaum & Steinmetz Verfahren zum reinigen von blechen und reinigungsmaschine zur durchfuehrung des verfahrens
JP3030796B2 (ja) * 1992-07-24 2000-04-10 東京エレクトロン株式会社 洗浄処理方法
US5861066A (en) 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
JP3577173B2 (ja) * 1996-09-09 2004-10-13 昭和電工株式会社 ディスク基板の洗浄ユニット及び連続洗浄装置
JPH10335279A (ja) 1997-05-30 1998-12-18 Shibaura Eng Works Co Ltd 洗浄装置
JP4843167B2 (ja) 2001-09-20 2011-12-21 株式会社東芝 ローラ清掃装置
JP2003151925A (ja) 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003151943A (ja) 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2003317703A (ja) 2002-04-24 2003-11-07 Sony Corp 電池およびその製造方法
JP3933670B2 (ja) * 2005-03-29 2007-06-20 東京エレクトロン株式会社 基板洗浄方法及び基板洗浄装置
JP2007317703A (ja) 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
JP4858042B2 (ja) 2006-09-26 2012-01-18 ミツミ電機株式会社 半導体基板の洗浄方法
KR100853378B1 (ko) * 2006-10-24 2008-08-21 주식회사 케이씨텍 대면적 기판의 접촉식 세정장치
US9700988B2 (en) * 2014-08-26 2017-07-11 Ebara Corporation Substrate processing apparatus

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

Also Published As

Publication number Publication date
US20220013352A1 (en) 2022-01-13
SG11202105091PA (en) 2021-06-29
US12033847B2 (en) 2024-07-09
KR20210089671A (ko) 2021-07-16
CN113165142A (zh) 2021-07-23
TW202027867A (zh) 2020-08-01
JP2020088000A (ja) 2020-06-04
JP7265858B2 (ja) 2023-04-27
KR102778937B1 (ko) 2025-03-11
CN113165142B (zh) 2023-12-22
WO2020100609A1 (ja) 2020-05-22

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