KR102778937B1 - 세정 모듈과, 세정 모듈을 구비하는 기판 처리 장치 - Google Patents

세정 모듈과, 세정 모듈을 구비하는 기판 처리 장치 Download PDF

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Publication number
KR102778937B1
KR102778937B1 KR1020217014827A KR20217014827A KR102778937B1 KR 102778937 B1 KR102778937 B1 KR 102778937B1 KR 1020217014827 A KR1020217014827 A KR 1020217014827A KR 20217014827 A KR20217014827 A KR 20217014827A KR 102778937 B1 KR102778937 B1 KR 102778937B1
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South Korea
Prior art keywords
substrate
roller
cleaning
edge
cleaning unit
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Korean (ko)
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KR20210089671A (ko
Inventor
도시오 미즈노
요스케 히모리
에리나 바바
도모아츠 이시바시
이츠키 고바타
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가부시키가이샤 에바라 세이사꾸쇼
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020217014827A 2018-11-16 2019-10-31 세정 모듈과, 세정 모듈을 구비하는 기판 처리 장치 Active KR102778937B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018215456A JP7265858B2 (ja) 2018-11-16 2018-11-16 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法
JPJP-P-2018-215456 2018-11-16
PCT/JP2019/042773 WO2020100609A1 (ja) 2018-11-16 2019-10-31 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法

Publications (2)

Publication Number Publication Date
KR20210089671A KR20210089671A (ko) 2021-07-16
KR102778937B1 true KR102778937B1 (ko) 2025-03-11

Family

ID=70730502

Family Applications (1)

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KR1020217014827A Active KR102778937B1 (ko) 2018-11-16 2019-10-31 세정 모듈과, 세정 모듈을 구비하는 기판 처리 장치

Country Status (7)

Country Link
US (1) US12033847B2 (enExample)
JP (1) JP7265858B2 (enExample)
KR (1) KR102778937B1 (enExample)
CN (1) CN113165142B (enExample)
SG (1) SG11202105091PA (enExample)
TW (1) TWI822901B (enExample)
WO (1) WO2020100609A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN112976266A (zh) * 2021-03-04 2021-06-18 王仕英 一种陶瓷生产用胚体修复装置
JP7623225B2 (ja) * 2021-06-11 2025-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
CN119609909A (zh) * 2024-08-06 2025-03-14 浙江创芯集成电路有限公司 晶圆研磨装置以及晶圆研磨设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2415580A1 (de) 1974-03-30 1975-10-02 Schleifenbaum & Steinmetz Verfahren zum reinigen von blechen und reinigungsmaschine zur durchfuehrung des verfahrens
JP2003088811A (ja) 2001-09-20 2003-03-25 Toshiba Corp ローラ清掃装置
JP2003151943A (ja) 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2003151925A (ja) * 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003317703A (ja) 2002-04-24 2003-11-07 Sony Corp 電池およびその製造方法
JP2007317703A (ja) 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
KR100887272B1 (ko) * 2005-03-29 2009-03-06 도쿄엘렉트론가부시키가이샤 기판 세정 방법 및 기판 세정 장치
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3030796B2 (ja) * 1992-07-24 2000-04-10 東京エレクトロン株式会社 洗浄処理方法
US5861066A (en) 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
JP3577173B2 (ja) * 1996-09-09 2004-10-13 昭和電工株式会社 ディスク基板の洗浄ユニット及び連続洗浄装置
JPH10335279A (ja) 1997-05-30 1998-12-18 Shibaura Eng Works Co Ltd 洗浄装置
JP4858042B2 (ja) * 2006-09-26 2012-01-18 ミツミ電機株式会社 半導体基板の洗浄方法
KR100853378B1 (ko) * 2006-10-24 2008-08-21 주식회사 케이씨텍 대면적 기판의 접촉식 세정장치
SG10201906815XA (en) * 2014-08-26 2019-08-27 Ebara Corp Substrate processing apparatus
JP6910148B2 (ja) * 2017-01-13 2021-07-28 株式会社ディスコ ウエーハ洗浄装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2415580A1 (de) 1974-03-30 1975-10-02 Schleifenbaum & Steinmetz Verfahren zum reinigen von blechen und reinigungsmaschine zur durchfuehrung des verfahrens
JP2003088811A (ja) 2001-09-20 2003-03-25 Toshiba Corp ローラ清掃装置
JP2003151925A (ja) * 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003151943A (ja) 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
JP2003317703A (ja) 2002-04-24 2003-11-07 Sony Corp 電池およびその製造方法
KR100887272B1 (ko) * 2005-03-29 2009-03-06 도쿄엘렉트론가부시키가이샤 기판 세정 방법 및 기판 세정 장치
JP2007317703A (ja) 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法

Also Published As

Publication number Publication date
SG11202105091PA (en) 2021-06-29
US20220013352A1 (en) 2022-01-13
JP2020088000A (ja) 2020-06-04
WO2020100609A1 (ja) 2020-05-22
TWI822901B (zh) 2023-11-21
US12033847B2 (en) 2024-07-09
CN113165142B (zh) 2023-12-22
JP7265858B2 (ja) 2023-04-27
CN113165142A (zh) 2021-07-23
TW202027867A (zh) 2020-08-01
KR20210089671A (ko) 2021-07-16

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