CN113165142B - 清洗组件及具备清洗组件的基板处理装置 - Google Patents

清洗组件及具备清洗组件的基板处理装置 Download PDF

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Publication number
CN113165142B
CN113165142B CN201980075357.7A CN201980075357A CN113165142B CN 113165142 B CN113165142 B CN 113165142B CN 201980075357 A CN201980075357 A CN 201980075357A CN 113165142 B CN113165142 B CN 113165142B
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China
Prior art keywords
substrate
roller
cleaning
edge
polishing
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CN201980075357.7A
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English (en)
Chinese (zh)
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CN113165142A (zh
Inventor
水野稔夫
桧森洋辅
马场枝里奈
石桥知淳
小畠严贵
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Ebara Corp
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Ebara Corp
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CN201980075357.7A 2018-11-16 2019-10-31 清洗组件及具备清洗组件的基板处理装置 Active CN113165142B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018215456A JP7265858B2 (ja) 2018-11-16 2018-11-16 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法
JP2018-215456 2018-11-16
PCT/JP2019/042773 WO2020100609A1 (ja) 2018-11-16 2019-10-31 洗浄モジュール、洗浄モジュールを備える基板処理装置と洗浄方法

Publications (2)

Publication Number Publication Date
CN113165142A CN113165142A (zh) 2021-07-23
CN113165142B true CN113165142B (zh) 2023-12-22

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CN201980075357.7A Active CN113165142B (zh) 2018-11-16 2019-10-31 清洗组件及具备清洗组件的基板处理装置

Country Status (7)

Country Link
US (1) US12033847B2 (enExample)
JP (1) JP7265858B2 (enExample)
KR (1) KR102778937B1 (enExample)
CN (1) CN113165142B (enExample)
SG (1) SG11202105091PA (enExample)
TW (1) TWI822901B (enExample)
WO (1) WO2020100609A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138732B2 (en) 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
CN112976266A (zh) * 2021-03-04 2021-06-18 王仕英 一种陶瓷生产用胚体修复装置
JP7623225B2 (ja) * 2021-06-11 2025-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄装置
CN114887976B (zh) * 2022-05-25 2024-01-23 宁波芯丰精密科技有限公司 一种清洁装置
CN119609909A (zh) * 2024-08-06 2025-03-14 浙江创芯集成电路有限公司 晶圆研磨装置以及晶圆研磨设备

Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1493334A (en) * 1974-03-30 1977-11-30 Schleifenbaum & Steinmetz Cleaning machine and process for cleaning metal sheets
JPH0645302A (ja) * 1992-07-24 1994-02-18 Tokyo Electron Ltd 処理装置
JPH1080668A (ja) * 1996-09-09 1998-03-31 Mitsubishi Chem Corp ディスク基板の洗浄ユニット及び連続洗浄装置
JP2003088811A (ja) * 2001-09-20 2003-03-25 Toshiba Corp ローラ清掃装置
JP2003151925A (ja) * 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
WO2006103859A1 (ja) * 2005-03-29 2006-10-05 Tokyo Electron Limited 基板洗浄方法および基板洗浄装置
JP2007317703A (ja) * 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
JP2008084934A (ja) * 2006-09-26 2008-04-10 Mitsumi Electric Co Ltd 半導体基板の洗浄方法
KR20080036903A (ko) * 2006-10-24 2008-04-29 주식회사 케이씨텍 대면적 기판의 접촉식 세정장치
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
CN105382677A (zh) * 2014-08-26 2016-03-09 株式会社荏原制作所 抛光处理组件、基板处理装置及抛光垫清洗方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5861066A (en) 1996-05-01 1999-01-19 Ontrak Systems, Inc. Method and apparatus for cleaning edges of contaminated substrates
JPH10335279A (ja) 1997-05-30 1998-12-18 Shibaura Eng Works Co Ltd 洗浄装置
JP2003317703A (ja) 2002-04-24 2003-11-07 Sony Corp 電池およびその製造方法

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1493334A (en) * 1974-03-30 1977-11-30 Schleifenbaum & Steinmetz Cleaning machine and process for cleaning metal sheets
JPH0645302A (ja) * 1992-07-24 1994-02-18 Tokyo Electron Ltd 処理装置
JPH1080668A (ja) * 1996-09-09 1998-03-31 Mitsubishi Chem Corp ディスク基板の洗浄ユニット及び連続洗浄装置
JP2003088811A (ja) * 2001-09-20 2003-03-25 Toshiba Corp ローラ清掃装置
JP2003151925A (ja) * 2001-11-12 2003-05-23 Yac Co Ltd ウェーハエッジ研磨処理装置
JP2003151943A (ja) * 2001-11-19 2003-05-23 Speedfam Clean System Co Ltd スクラブ洗浄装置
WO2006103859A1 (ja) * 2005-03-29 2006-10-05 Tokyo Electron Limited 基板洗浄方法および基板洗浄装置
JP2007317703A (ja) * 2006-05-23 2007-12-06 Fujifilm Corp ブラシ洗浄方法、半導体の製造方法及びブラシ洗浄装置
JP2008084934A (ja) * 2006-09-26 2008-04-10 Mitsumi Electric Co Ltd 半導体基板の洗浄方法
KR20080036903A (ko) * 2006-10-24 2008-04-29 주식회사 케이씨텍 대면적 기판의 접촉식 세정장치
JP2010040943A (ja) * 2008-08-07 2010-02-18 Tokyo Electron Ltd 基板洗浄装置及び基板洗浄方法
CN105382677A (zh) * 2014-08-26 2016-03-09 株式会社荏原制作所 抛光处理组件、基板处理装置及抛光垫清洗方法
JP2018113393A (ja) * 2017-01-13 2018-07-19 株式会社ディスコ ウエーハ洗浄装置

Also Published As

Publication number Publication date
SG11202105091PA (en) 2021-06-29
US20220013352A1 (en) 2022-01-13
JP2020088000A (ja) 2020-06-04
KR102778937B1 (ko) 2025-03-11
WO2020100609A1 (ja) 2020-05-22
TWI822901B (zh) 2023-11-21
US12033847B2 (en) 2024-07-09
JP7265858B2 (ja) 2023-04-27
CN113165142A (zh) 2021-07-23
TW202027867A (zh) 2020-08-01
KR20210089671A (ko) 2021-07-16

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