TWI811477B - 表面保護膜及光學構件 - Google Patents
表面保護膜及光學構件 Download PDFInfo
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- TWI811477B TWI811477B TW108140053A TW108140053A TWI811477B TW I811477 B TWI811477 B TW I811477B TW 108140053 A TW108140053 A TW 108140053A TW 108140053 A TW108140053 A TW 108140053A TW I811477 B TWI811477 B TW I811477B
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- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000012169 petroleum derived wax Substances 0.000 description 1
- 235000019381 petroleum wax Nutrition 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002849 poly(3-ethoxythiophene) polymer Polymers 0.000 description 1
- 229920000301 poly(3-hexylthiophene-2,5-diyl) polymer Polymers 0.000 description 1
- 229920002850 poly(3-methoxythiophene) polymer Polymers 0.000 description 1
- 229920000371 poly(diallyldimethylammonium chloride) polymer Polymers 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229960002796 polystyrene sulfonate Drugs 0.000 description 1
- 239000011970 polystyrene sulfonate Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 125000002924 primary amino group Chemical class [H]N([H])* 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical class C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 125000000467 secondary amino group Chemical class [H]N([*:1])[*:2] 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000012177 spermaceti Substances 0.000 description 1
- 229940084106 spermaceti Drugs 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001302 tertiary amino group Chemical class 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Substances C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Natural products 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- PVNIQBQSYATKKL-UHFFFAOYSA-N tripalmitin Chemical compound CCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCC PVNIQBQSYATKKL-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003673 urethanes Chemical class 0.000 description 1
- 239000012178 vegetable wax Substances 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Vessels, Lead-In Wires, Accessory Apparatuses For Cathode-Ray Tubes (AREA)
- Pens And Brushes (AREA)
- Prostheses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018208826 | 2018-11-06 | ||
| JP2018-208826 | 2018-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202028394A TW202028394A (zh) | 2020-08-01 |
| TWI811477B true TWI811477B (zh) | 2023-08-11 |
Family
ID=70610994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108140053A TWI811477B (zh) | 2018-11-06 | 2019-11-05 | 表面保護膜及光學構件 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7277478B2 (ko) |
| KR (1) | KR102583836B1 (ko) |
| CN (1) | CN113056534B (ko) |
| TW (1) | TWI811477B (ko) |
| WO (1) | WO2020095828A1 (ko) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1431682A (zh) * | 2002-01-11 | 2003-07-23 | 三井化学株式会社 | 半导体晶片表面保护粘结膜及使用其的半导体晶片加工方法 |
| JP2004006630A (ja) * | 2002-01-11 | 2004-01-08 | Mitsui Chemicals Inc | 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法 |
| WO2018003893A1 (ja) * | 2016-06-30 | 2018-01-04 | 三井化学東セロ株式会社 | 半導体ウェハ加工用粘着性フィルム |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3936810B2 (ja) * | 1998-09-14 | 2007-06-27 | 日東電工株式会社 | 帯電防止透明フィルム及びその光学部材 |
| JP4336427B2 (ja) * | 1999-10-01 | 2009-09-30 | 帝人株式会社 | 表面保護フィルムおよびそれからなる積層体 |
| JP2003027019A (ja) * | 2001-07-23 | 2003-01-29 | Hitachi Chem Co Ltd | 光学シート保護用粘着フィルム |
| JP5174303B2 (ja) * | 2001-09-11 | 2013-04-03 | 三菱樹脂株式会社 | フィルム |
| JP4707936B2 (ja) * | 2003-02-24 | 2011-06-22 | 三井化学株式会社 | 半導体ウエハの表面保護用粘着フィルム、及び該粘着フィルムを用いる半導体ウエハの保護方法 |
| JP5565620B2 (ja) | 2010-07-07 | 2014-08-06 | ナガセケムテックス株式会社 | 帯電防止性粘着剤組成物、粘着剤層、粘着シート、表面保護フィルム及び偏光板 |
| TWI645967B (zh) * | 2012-03-26 | 2019-01-01 | 日東電工股份有限公司 | Surface protection film |
| JP2016074899A (ja) | 2014-10-08 | 2016-05-12 | 昭和電工株式会社 | 表面保護フィルム用粘着剤組成物及び表面保護フィルム |
| JP6419548B2 (ja) * | 2014-11-27 | 2018-11-07 | 日東電工株式会社 | 表面保護フィルム、表面保護フィルムの製造方法、及び、光学部材 |
| JP2018161783A (ja) * | 2017-03-24 | 2018-10-18 | 日東電工株式会社 | 表層材付き樹脂シート |
-
2019
- 2019-11-01 JP JP2020556033A patent/JP7277478B2/ja active Active
- 2019-11-01 KR KR1020217012809A patent/KR102583836B1/ko active IP Right Grant
- 2019-11-01 WO PCT/JP2019/042963 patent/WO2020095828A1/ja active Application Filing
- 2019-11-01 CN CN201980071806.0A patent/CN113056534B/zh active Active
- 2019-11-05 TW TW108140053A patent/TWI811477B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1431682A (zh) * | 2002-01-11 | 2003-07-23 | 三井化学株式会社 | 半导体晶片表面保护粘结膜及使用其的半导体晶片加工方法 |
| JP2004006630A (ja) * | 2002-01-11 | 2004-01-08 | Mitsui Chemicals Inc | 半導体ウエハ表面保護用粘着フィルム及び該粘着フィルムを用いる半導体ウエハの裏面加工方法 |
| WO2018003893A1 (ja) * | 2016-06-30 | 2018-01-04 | 三井化学東セロ株式会社 | 半導体ウェハ加工用粘着性フィルム |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102583836B1 (ko) | 2023-10-04 |
| TW202028394A (zh) | 2020-08-01 |
| KR20210087942A (ko) | 2021-07-13 |
| JPWO2020095828A1 (ja) | 2021-09-30 |
| JP7277478B2 (ja) | 2023-05-19 |
| CN113056534B (zh) | 2022-12-02 |
| WO2020095828A1 (ja) | 2020-05-14 |
| CN113056534A (zh) | 2021-06-29 |
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