TWI809042B - 熔融球狀二氧化矽粉末及其製造方法 - Google Patents

熔融球狀二氧化矽粉末及其製造方法 Download PDF

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Publication number
TWI809042B
TWI809042B TW108105071A TW108105071A TWI809042B TW I809042 B TWI809042 B TW I809042B TW 108105071 A TW108105071 A TW 108105071A TW 108105071 A TW108105071 A TW 108105071A TW I809042 B TWI809042 B TW I809042B
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TW
Taiwan
Prior art keywords
fused
silica powder
silica
powder
fused spherical
Prior art date
Application number
TW108105071A
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English (en)
Chinese (zh)
Other versions
TW201936498A (zh
Inventor
浦川孝雄
永野尊凡
柏木政斗
梶山俊重
Original Assignee
日商德山股份有限公司
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Publication of TW201936498A publication Critical patent/TW201936498A/zh
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Silicon Compounds (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
TW108105071A 2018-03-01 2019-02-15 熔融球狀二氧化矽粉末及其製造方法 TWI809042B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018036100 2018-03-01
JP2018-036100 2018-03-01

Publications (2)

Publication Number Publication Date
TW201936498A TW201936498A (zh) 2019-09-16
TWI809042B true TWI809042B (zh) 2023-07-21

Family

ID=67805329

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108105071A TWI809042B (zh) 2018-03-01 2019-02-15 熔融球狀二氧化矽粉末及其製造方法

Country Status (5)

Country Link
JP (2) JP7275100B2 (ja)
KR (1) KR102649474B1 (ja)
CN (1) CN111629998B (ja)
TW (1) TWI809042B (ja)
WO (1) WO2019167618A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス
CN115515899A (zh) * 2020-04-24 2022-12-23 电化株式会社 球状二氧化硅粉末
US20240166552A1 (en) 2021-03-31 2024-05-23 Denka Company Limited Inorganic oxide powder
JP7041786B1 (ja) * 2021-10-20 2022-03-24 デンカ株式会社 球状シリカ粒子及びそれを用いた樹脂組成物
JPWO2023153355A1 (ja) * 2022-02-09 2023-08-17

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020041963A1 (en) * 2000-08-15 2002-04-11 Yoshiharu Konya Spherical silica particles and method of production

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000191316A (ja) 1998-12-25 2000-07-11 Tokuyama Corp 凝集性の小さい溶融シリカ
JP2000191315A (ja) * 1998-12-25 2000-07-11 Tokuyama Corp 溶融シリカ粒子の製造方法
JP4112125B2 (ja) * 1999-08-13 2008-07-02 電気化学工業株式会社 微細球状シリカ粉末の製造方法
JP4614214B2 (ja) * 1999-12-02 2011-01-19 信越化学工業株式会社 半導体装置素子用中空パッケージ
JP4313924B2 (ja) * 2000-03-16 2009-08-12 電気化学工業株式会社 球状シリカ粉末及びその製造方法
JP5230051B2 (ja) 2002-09-11 2013-07-10 株式会社トクヤマ 微小溶融シリカ粒子
JP2005119884A (ja) * 2003-10-14 2005-05-12 Mitsubishi Rayon Co Ltd 非孔性球状シリカ及びその製造方法
JP4691321B2 (ja) * 2003-12-26 2011-06-01 三菱レイヨン株式会社 高純度酸化ケイ素粉末の製造方法
JP4112540B2 (ja) 2004-08-26 2008-07-02 電気化学工業株式会社 球状無機質中空粉体の製造方法。
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
JP5199569B2 (ja) * 2006-06-27 2013-05-15 パナソニック株式会社 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
CN101743198B (zh) * 2007-08-01 2012-12-12 电气化学工业株式会社 二氧化硅粉末、其制造方法以及使用该二氧化硅粉末的组合物
JP2010143806A (ja) * 2008-12-19 2010-07-01 Tokuyama Corp 表面処理シリカ系粒子及びその製造方法
KR101260346B1 (ko) 2012-11-16 2013-05-07 주식회사 신아티앤씨 에폭시 수지 조성물
JP2015086120A (ja) * 2013-10-31 2015-05-07 株式会社トクヤマ 球状シリカ微粉末とその製造方法
CN105084373A (zh) * 2015-07-24 2015-11-25 陈林 低介电常数硅微粉的制备方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020041963A1 (en) * 2000-08-15 2002-04-11 Yoshiharu Konya Spherical silica particles and method of production

Also Published As

Publication number Publication date
KR102649474B1 (ko) 2024-03-20
WO2019167618A1 (ja) 2019-09-06
JP2023087034A (ja) 2023-06-22
CN111629998B (zh) 2023-06-30
TW201936498A (zh) 2019-09-16
CN111629998A (zh) 2020-09-04
JPWO2019167618A1 (ja) 2021-02-25
KR20200127159A (ko) 2020-11-10
JP7275100B2 (ja) 2023-05-17

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