TWI805646B - 芯材的製造方法及覆銅層積板的製造方法 - Google Patents
芯材的製造方法及覆銅層積板的製造方法 Download PDFInfo
- Publication number
- TWI805646B TWI805646B TW107140502A TW107140502A TWI805646B TW I805646 B TWI805646 B TW I805646B TW 107140502 A TW107140502 A TW 107140502A TW 107140502 A TW107140502 A TW 107140502A TW I805646 B TWI805646 B TW I805646B
- Authority
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- Prior art keywords
- core material
- grinding
- copper
- suction cup
- manufacturing
- Prior art date
Links
- 239000011162 core material Substances 0.000 title claims abstract description 121
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 8
- 239000010949 copper Substances 0.000 title claims abstract description 8
- 238000000227 grinding Methods 0.000 claims abstract description 57
- 238000000034 method Methods 0.000 claims abstract description 38
- 239000003365 glass fiber Substances 0.000 claims abstract description 30
- 239000011889 copper foil Substances 0.000 claims abstract description 18
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 14
- 239000000057 synthetic resin Substances 0.000 claims abstract description 14
- 238000001035 drying Methods 0.000 claims abstract description 6
- 238000002360 preparation method Methods 0.000 claims abstract description 6
- 239000004575 stone Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000003825 pressing Methods 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 2
- 238000005498 polishing Methods 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 238000005470 impregnation Methods 0.000 description 3
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 238000009415 formwork Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Classifications
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C25/00—Surface treatment of fibres or filaments made from glass, minerals or slags
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- B29C67/0014—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping tubes or blown tubular films
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- B29C67/0025—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 for shaping tubes or blown tubular films using an internal mandrel and pressure difference
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- B—PERFORMING OPERATIONS; TRANSPORTING
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Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Composite Materials (AREA)
- Textile Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017220965A JP7062331B2 (ja) | 2017-11-16 | 2017-11-16 | 芯材の製造方法及び銅張積層板の製造方法 |
| JP2017-220965 | 2017-11-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201922877A TW201922877A (zh) | 2019-06-16 |
| TWI805646B true TWI805646B (zh) | 2023-06-21 |
Family
ID=66335883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107140502A TWI805646B (zh) | 2017-11-16 | 2018-11-15 | 芯材的製造方法及覆銅層積板的製造方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20190144619A1 (enExample) |
| JP (1) | JP7062331B2 (enExample) |
| KR (1) | KR102633608B1 (enExample) |
| CN (1) | CN109795208B (enExample) |
| DE (1) | DE102018219425A1 (enExample) |
| TW (1) | TWI805646B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020070386A (ja) * | 2018-11-01 | 2020-05-07 | 株式会社ディスコ | 芯材の製造方法及び銅張積層板の製造方法 |
| CN120439623A (zh) * | 2019-01-11 | 2025-08-08 | 株式会社力森诺科 | 覆金属层叠板的制造方法、覆金属层叠板、印刷布线板及半导体封装体、以及无芯基板形成用支承体及半导体再布线层形成用支承体 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1134221A (ja) * | 1997-07-15 | 1999-02-09 | Matsushita Electric Works Ltd | 銅張り積層板の製造方法 |
| TW201400294A (zh) * | 2012-03-30 | 2014-01-01 | Sumitomo Bakelite Co | 被研磨物保持材及用於此之積層板 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56118853A (en) | 1980-02-25 | 1981-09-18 | Fujitsu Ltd | Manufacture of copper lined laminate |
| JPS5856276B2 (ja) * | 1980-03-31 | 1983-12-14 | 日立化成工業株式会社 | 難燃耐熱性銅張り積層板の製造法 |
| JPS5939546A (ja) * | 1982-08-30 | 1984-03-03 | 東芝ケミカル株式会社 | 銅張積層板 |
| JPH0641063B2 (ja) * | 1987-05-28 | 1994-06-01 | 雅博 今川 | Frpパイプの内面研削装置 |
| JPH04346494A (ja) * | 1991-05-24 | 1992-12-02 | Matsushita Electric Ind Co Ltd | 多層プリント配線板の製造方法 |
| JPH0556355U (ja) * | 1991-12-30 | 1993-07-27 | 有限会社村上技研 | ネットディスクの保持具 |
| US5439164A (en) * | 1992-06-05 | 1995-08-08 | Matsushita Electric Industrial Co., Ltd. | Methods for joining copper or its alloys |
| TW453141B (en) * | 1998-09-28 | 2001-09-01 | Ibiden Co Ltd | Printed circuit board and its manufacture method |
| ES2305058T3 (es) * | 2000-03-03 | 2008-11-01 | Hitachi Chemical Company, Ltd. | Procedimiento de reparacion de una preimpregnacion. |
| JP2002232135A (ja) * | 2001-01-30 | 2002-08-16 | Matsushita Electric Ind Co Ltd | 積層用両面回路基板とその製造方法及びそれを用いた多層プリント配線板 |
| US7874937B2 (en) * | 2007-12-19 | 2011-01-25 | Taylor Made Golf Company, Inc. | Composite articles and methods for making the same |
| JP5492577B2 (ja) | 2010-01-25 | 2014-05-14 | 旭化成イーマテリアルズ株式会社 | 印刷原版及び印刷版の製造方法 |
| JP2012174874A (ja) * | 2011-02-21 | 2012-09-10 | Fujitsu Ltd | プリント配線板の製造方法及びプリント配線板 |
| CN103649185B (zh) * | 2011-06-28 | 2017-06-09 | 住友电木株式会社 | 半固化片、层压板、半导体封装件及层压板的制造方法 |
| JP6015303B2 (ja) * | 2012-09-27 | 2016-10-26 | 日立化成株式会社 | プリプレグ、積層板及びプリント配線板 |
| JP2016060031A (ja) | 2014-09-22 | 2016-04-25 | 株式会社ディスコ | 研削ホイール |
| CN105619841A (zh) * | 2015-12-29 | 2016-06-01 | 东华大学 | 一种热塑性复合材料成型方法 |
-
2017
- 2017-11-16 JP JP2017220965A patent/JP7062331B2/ja active Active
-
2018
- 2018-11-08 KR KR1020180136472A patent/KR102633608B1/ko active Active
- 2018-11-12 CN CN201811338968.XA patent/CN109795208B/zh active Active
- 2018-11-13 US US16/189,478 patent/US20190144619A1/en not_active Abandoned
- 2018-11-14 DE DE102018219425.4A patent/DE102018219425A1/de active Pending
- 2018-11-15 TW TW107140502A patent/TWI805646B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1134221A (ja) * | 1997-07-15 | 1999-02-09 | Matsushita Electric Works Ltd | 銅張り積層板の製造方法 |
| TW201400294A (zh) * | 2012-03-30 | 2014-01-01 | Sumitomo Bakelite Co | 被研磨物保持材及用於此之積層板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019089978A (ja) | 2019-06-13 |
| CN109795208B (zh) | 2023-05-12 |
| TW201922877A (zh) | 2019-06-16 |
| KR20190056303A (ko) | 2019-05-24 |
| JP7062331B2 (ja) | 2022-05-06 |
| DE102018219425A1 (de) | 2019-05-16 |
| CN109795208A (zh) | 2019-05-24 |
| KR102633608B1 (ko) | 2024-02-02 |
| US20190144619A1 (en) | 2019-05-16 |
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