TWI804658B - 覆金屬積層板和電路基板 - Google Patents

覆金屬積層板和電路基板 Download PDF

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Publication number
TWI804658B
TWI804658B TW108126128A TW108126128A TWI804658B TW I804658 B TWI804658 B TW I804658B TW 108126128 A TW108126128 A TW 108126128A TW 108126128 A TW108126128 A TW 108126128A TW I804658 B TWI804658 B TW I804658B
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TW
Taiwan
Prior art keywords
layer
polyimide
diamine
polyimide layer
thickness
Prior art date
Application number
TW108126128A
Other languages
English (en)
Chinese (zh)
Other versions
TW202010635A (zh
Inventor
須藤芳樹
鈴木智之
安達康弘
Original Assignee
日商日鐵化學材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商日鐵化學材料股份有限公司 filed Critical 日商日鐵化學材料股份有限公司
Publication of TW202010635A publication Critical patent/TW202010635A/zh
Application granted granted Critical
Publication of TWI804658B publication Critical patent/TWI804658B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
TW108126128A 2018-07-25 2019-07-24 覆金屬積層板和電路基板 TWI804658B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-139844 2018-07-25
JP2018139844 2018-07-25

Publications (2)

Publication Number Publication Date
TW202010635A TW202010635A (zh) 2020-03-16
TWI804658B true TWI804658B (zh) 2023-06-11

Family

ID=69180524

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108126128A TWI804658B (zh) 2018-07-25 2019-07-24 覆金屬積層板和電路基板

Country Status (5)

Country Link
JP (1) JP7428646B2 (https=)
KR (2) KR20250024859A (https=)
CN (1) CN112469560B (https=)
TW (1) TWI804658B (https=)
WO (1) WO2020022129A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021170603A (ja) * 2020-04-16 2021-10-28 東洋紡株式会社 金属貼積層板および回路基板
EP4174929A4 (en) 2020-06-26 2024-07-10 Sumitomo Bakelite Co.Ltd. PRINTED CIRCUIT BOARD
TWI858113B (zh) * 2020-08-19 2024-10-11 國立中興大學 具低介電損失的軟性銅箔基板、其製備方法以及電子裝置
JP7730627B2 (ja) * 2020-09-14 2025-08-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法
JP2022050927A (ja) * 2020-09-18 2022-03-31 住友ベークライト株式会社 金属箔付樹脂フィルムおよび高周波回路用基板の製造方法
US20240339389A1 (en) * 2021-02-15 2024-10-10 Dai Nippon Printing Co., Ltd. Through via substrate
JP7714391B2 (ja) * 2021-06-30 2025-07-29 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板
EP4386041A4 (en) * 2021-08-13 2025-09-10 Lg Electronics Inc COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
CN113604045B (zh) * 2021-08-31 2022-09-02 烟台丰鲁精细化工有限责任公司 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法
JP2023097389A (ja) * 2021-12-27 2023-07-07 日鉄ケミカル＆マテリアル株式会社 樹脂積層体、金属張積層板、回路基板、電子デバイス及び電子機器
CN119342684B (zh) * 2023-07-21 2025-10-14 鹏鼎控股(深圳)股份有限公司 柔性电路板、可穿戴设备以及柔性电路板的制作方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017144730A (ja) * 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) * 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031396B2 (ja) 1979-03-14 1985-07-22 松下電器産業株式会社 スピ−カシステム
JPS5927224Y2 (ja) 1981-12-06 1984-08-07 株式会社 同和 分解組立自在の炊飯レンジ
JPS6031396U (ja) 1983-08-08 1985-03-02 河野　真一郎 給水用殺菌設備
JP3482723B2 (ja) * 1995-02-21 2004-01-06 宇部興産株式会社 多層芳香族ポリイミドフィルム
JP3827859B2 (ja) * 1998-04-13 2006-09-27 三井化学株式会社 ポリイミド−金属積層体及びその製造方法
JP5886027B2 (ja) 2011-12-21 2016-03-16 新日鉄住金化学株式会社 両面金属張積層板およびその製造方法
JP2016188298A (ja) * 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP6515180B2 (ja) * 2015-03-31 2019-05-15 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
JP6427454B2 (ja) 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6473028B2 (ja) 2015-03-31 2019-02-20 日鉄ケミカル＆マテリアル株式会社 銅張積層板、プリント配線板及びその使用方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017144730A (ja) * 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) * 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Also Published As

Publication number Publication date
CN112469560A (zh) 2021-03-09
KR20210036342A (ko) 2021-04-02
KR20250024859A (ko) 2025-02-19
JPWO2020022129A1 (ja) 2021-08-05
TW202010635A (zh) 2020-03-16
CN112469560B (zh) 2023-05-16
JP7428646B2 (ja) 2024-02-06
WO2020022129A1 (ja) 2020-01-30

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