JP7428646B2 - 金属張積層板及び回路基板 - Google Patents

金属張積層板及び回路基板 Download PDF

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Publication number
JP7428646B2
JP7428646B2 JP2020532311A JP2020532311A JP7428646B2 JP 7428646 B2 JP7428646 B2 JP 7428646B2 JP 2020532311 A JP2020532311 A JP 2020532311A JP 2020532311 A JP2020532311 A JP 2020532311A JP 7428646 B2 JP7428646 B2 JP 7428646B2
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Japan
Prior art keywords
polyimide
residue
layer
diamine
thickness
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JP2020532311A
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English (en)
Japanese (ja)
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JPWO2020022129A5 (https=
JPWO2020022129A1 (ja
Inventor
芳樹 須藤
智之 鈴木
康弘 安達
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
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Nippon Steel Chemical and Materials Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
JP2020532311A 2018-07-25 2019-07-17 金属張積層板及び回路基板 Active JP7428646B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018139844 2018-07-25
JP2018139844 2018-07-25
PCT/JP2019/027994 WO2020022129A1 (ja) 2018-07-25 2019-07-17 金属張積層板及び回路基板

Publications (3)

Publication Number Publication Date
JPWO2020022129A1 JPWO2020022129A1 (ja) 2021-08-05
JPWO2020022129A5 JPWO2020022129A5 (https=) 2022-07-08
JP7428646B2 true JP7428646B2 (ja) 2024-02-06

Family

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Family Applications (1)

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JP2020532311A Active JP7428646B2 (ja) 2018-07-25 2019-07-17 金属張積層板及び回路基板

Country Status (5)

Country Link
JP (1) JP7428646B2 (https=)
KR (2) KR20250024859A (https=)
CN (1) CN112469560B (https=)
TW (1) TWI804658B (https=)
WO (1) WO2020022129A1 (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021170603A (ja) * 2020-04-16 2021-10-28 東洋紡株式会社 金属貼積層板および回路基板
EP4174929A4 (en) 2020-06-26 2024-07-10 Sumitomo Bakelite Co.Ltd. PRINTED CIRCUIT BOARD
TWI858113B (zh) * 2020-08-19 2024-10-11 國立中興大學 具低介電損失的軟性銅箔基板、其製備方法以及電子裝置
JP7730627B2 (ja) * 2020-09-14 2025-08-28 日鉄ケミカル＆マテリアル株式会社 ポリイミドフィルムの製造方法及び金属張積層板の製造方法
JP2022050927A (ja) * 2020-09-18 2022-03-31 住友ベークライト株式会社 金属箔付樹脂フィルムおよび高周波回路用基板の製造方法
US20240339389A1 (en) * 2021-02-15 2024-10-10 Dai Nippon Printing Co., Ltd. Through via substrate
JP7714391B2 (ja) * 2021-06-30 2025-07-29 日鉄ケミカル＆マテリアル株式会社 ポリアミド酸、ポリイミド、ポリイミドフィルム、金属張積層板及び回路基板
EP4386041A4 (en) * 2021-08-13 2025-09-10 Lg Electronics Inc COMPOSITE POLYIMIDE SUBSTRATE, COMPOSITE POLYIMIDE COMPOSITION, AND PRINTED CIRCUIT BOARD USING SAME
CN113604045B (zh) * 2021-08-31 2022-09-02 烟台丰鲁精细化工有限责任公司 一种低介电性能的热塑性聚酰亚胺树脂复合薄膜及其制备方法
JP2023097389A (ja) * 2021-12-27 2023-07-07 日鉄ケミカル＆マテリアル株式会社 樹脂積層体、金属張積層板、回路基板、電子デバイス及び電子機器
CN119342684B (zh) * 2023-07-21 2025-10-14 鹏鼎控股(深圳)股份有限公司 柔性电路板、可穿戴设备以及柔性电路板的制作方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016159060A1 (ja) 2015-03-31 2016-10-06 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
JP2017144730A (ja) 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031396B2 (ja) 1979-03-14 1985-07-22 松下電器産業株式会社 スピ−カシステム
JPS5927224Y2 (ja) 1981-12-06 1984-08-07 株式会社 同和 分解組立自在の炊飯レンジ
JPS6031396U (ja) 1983-08-08 1985-03-02 河野　真一郎 給水用殺菌設備
JP3482723B2 (ja) * 1995-02-21 2004-01-06 宇部興産株式会社 多層芳香族ポリイミドフィルム
JP3827859B2 (ja) * 1998-04-13 2006-09-27 三井化学株式会社 ポリイミド−金属積層体及びその製造方法
JP5886027B2 (ja) 2011-12-21 2016-03-16 新日鉄住金化学株式会社 両面金属張積層板およびその製造方法
JP6427454B2 (ja) 2015-03-31 2018-11-21 日鉄ケミカル＆マテリアル株式会社 銅張積層板及びプリント配線板
JP6473028B2 (ja) 2015-03-31 2019-02-20 日鉄ケミカル＆マテリアル株式会社 銅張積層板、プリント配線板及びその使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016188298A (ja) 2015-03-30 2016-11-04 新日鉄住金化学株式会社 ポリイミド、樹脂フィルム、金属張積層体及び回路基板
WO2016159060A1 (ja) 2015-03-31 2016-10-06 株式会社カネカ 多層接着フィルム及びフレキシブル金属張積層板
JP2017144730A (ja) 2016-02-12 2017-08-24 株式会社カネカ 多層ポリイミドフィルム、およびフレキシブル金属張積層板
WO2018061727A1 (ja) 2016-09-29 2018-04-05 新日鉄住金化学株式会社 ポリイミドフィルム、銅張積層板及び回路基板

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Publication number Publication date
CN112469560A (zh) 2021-03-09
KR20210036342A (ko) 2021-04-02
KR20250024859A (ko) 2025-02-19
JPWO2020022129A1 (ja) 2021-08-05
TW202010635A (zh) 2020-03-16
CN112469560B (zh) 2023-05-16
TWI804658B (zh) 2023-06-11
WO2020022129A1 (ja) 2020-01-30

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