TWI799449B - 設備前端模組（ｅｆｅｍ） - Google Patents

設備前端模組（ｅｆｅｍ） Download PDF

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Publication number
TWI799449B
TWI799449B TW107133738A TW107133738A TWI799449B TW I799449 B TWI799449 B TW I799449B TW 107133738 A TW107133738 A TW 107133738A TW 107133738 A TW107133738 A TW 107133738A TW I799449 B TWI799449 B TW I799449B
Authority
TW
Taiwan
Prior art keywords
efem
end module
equipment front
equipment
module
Prior art date
Application number
TW107133738A
Other languages
English (en)
Other versions
TW201939654A (zh
Inventor
河合俊宏
小倉源五郎
Original Assignee
日商昕芙旎雅股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昕芙旎雅股份有限公司 filed Critical 日商昕芙旎雅股份有限公司
Publication of TW201939654A publication Critical patent/TW201939654A/zh
Application granted granted Critical
Publication of TWI799449B publication Critical patent/TWI799449B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Prostheses (AREA)
  • Amplifiers (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
TW107133738A 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ） TWI799449B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018048470A JP7140960B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍ
JP2018-048470 2018-03-15

Publications (2)

Publication Number Publication Date
TW201939654A TW201939654A (zh) 2019-10-01
TWI799449B true TWI799449B (zh) 2023-04-21

Family

ID=67958138

Family Applications (2)

Application Number Title Priority Date Filing Date
TW107133738A TWI799449B (zh) 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ）
TW112110392A TWI821138B (zh) 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ）

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW112110392A TWI821138B (zh) 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ）

Country Status (4)

Country Link
JP (2) JP7140960B2 (zh)
KR (2) KR102652346B1 (zh)
CN (2) CN118073256A (zh)
TW (2) TWI799449B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI744834B (zh) * 2020-03-23 2021-11-01 台灣積體電路製造股份有限公司 用於半導體製程機台之設備介面系統

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246441A (ja) * 2000-06-14 2002-08-30 Shinko Electric Co Ltd ウェハ搬送装置
US20090053021A1 (en) * 2005-03-29 2009-02-26 Norichika Yamagishi Semiconductor manufacturing apparatus
US20150000591A1 (en) * 2013-06-28 2015-01-01 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0441673A (ja) * 1990-06-06 1992-02-12 Fujitsu Ltd 真空装置及び真空装置でのリーク方法
JPH0462345A (ja) * 1990-06-29 1992-02-27 Hitachi Ltd クリーンルーム内の吸気ダクト方式
JP2600237Y2 (ja) * 1993-03-11 1999-10-04 日新電機株式会社 エアーロック室
JPH10318576A (ja) * 1997-05-21 1998-12-04 Taisei Corp 還気設備およびこれが一体化された製造装置
JP3300952B1 (ja) * 2001-03-27 2002-07-08 株式会社武藤電機 ブローノズル
JP3880343B2 (ja) * 2001-08-01 2007-02-14 株式会社ルネサステクノロジ ロードポート、基板処理装置および雰囲気置換方法
JP4744175B2 (ja) * 2005-03-31 2011-08-10 東京エレクトロン株式会社 基板処理装置
JP4715383B2 (ja) * 2005-08-11 2011-07-06 村田機械株式会社 搬送台車
JP5925474B2 (ja) * 2011-12-06 2016-05-25 株式会社日立ハイテクマニファクチャ＆サービス ウエハ処理装置
JP2014038888A (ja) * 2012-08-10 2014-02-27 Hitachi High-Tech Control Systems Corp ミニエンバイロメント装置及びその内部雰囲気置換方法
JP6024980B2 (ja) * 2012-10-31 2016-11-16 Tdk株式会社 ロードポートユニット及びｅｆｅｍシステム
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2015115517A (ja) * 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ
JP6511858B2 (ja) * 2015-02-27 2019-05-15 シンフォニアテクノロジー株式会社 搬送室
KR102413271B1 (ko) * 2015-11-02 2022-06-28 삼성전자주식회사 기판 이송 장치
JP6555091B2 (ja) * 2015-11-10 2019-08-07 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP6679906B2 (ja) * 2015-12-11 2020-04-15 Tdk株式会社 Ｅｆｅｍ
JP6501076B2 (ja) * 2016-03-07 2019-04-17 トヨタ自動車株式会社 空気浄化システム
JP6674869B2 (ja) * 2016-08-30 2020-04-01 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002246441A (ja) * 2000-06-14 2002-08-30 Shinko Electric Co Ltd ウェハ搬送装置
US20090053021A1 (en) * 2005-03-29 2009-02-26 Norichika Yamagishi Semiconductor manufacturing apparatus
US20150000591A1 (en) * 2013-06-28 2015-01-01 Hitachi Kokusai Electric Inc. Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium

Also Published As

Publication number Publication date
JP7140960B2 (ja) 2022-09-22
TWI821138B (zh) 2023-11-01
CN110277338B (zh) 2024-02-27
KR102652346B1 (ko) 2024-03-29
KR20240041902A (ko) 2024-04-01
KR20190109246A (ko) 2019-09-25
JP2019161120A (ja) 2019-09-19
CN110277338A (zh) 2019-09-24
TW202331911A (zh) 2023-08-01
CN118073256A (zh) 2024-05-24
JP2022162003A (ja) 2022-10-21
TW201939654A (zh) 2019-10-01
JP7417023B2 (ja) 2024-01-18

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