JP7140960B2 - Ｅｆｅｍ - Google Patents

Ｅｆｅｍ Download PDF

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Publication number
JP7140960B2
JP7140960B2 JP2018048470A JP2018048470A JP7140960B2 JP 7140960 B2 JP7140960 B2 JP 7140960B2 JP 2018048470 A JP2018048470 A JP 2018048470A JP 2018048470 A JP2018048470 A JP 2018048470A JP 7140960 B2 JP7140960 B2 JP 7140960B2
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JP
Japan
Prior art keywords
gas
transfer chamber
upper space
port
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018048470A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019161120A (ja
Inventor
俊宏 河合
源五郎 小倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sinfonia Technology Co Ltd
Original Assignee
Sinfonia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sinfonia Technology Co Ltd filed Critical Sinfonia Technology Co Ltd
Priority to JP2018048470A priority Critical patent/JP7140960B2/ja
Priority to TW107133738A priority patent/TWI799449B/zh
Priority to TW112110392A priority patent/TWI821138B/zh
Priority to CN202410172505.XA priority patent/CN118073256A/zh
Priority to CN201910137404.8A priority patent/CN110277338B/zh
Priority to KR1020190022296A priority patent/KR102652346B1/ko
Publication of JP2019161120A publication Critical patent/JP2019161120A/ja
Priority to JP2022132184A priority patent/JP7417023B2/ja
Application granted granted Critical
Publication of JP7140960B2 publication Critical patent/JP7140960B2/ja
Priority to KR1020240040343A priority patent/KR20240041902A/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Amplifiers (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Prostheses (AREA)
JP2018048470A 2018-03-15 2018-03-15 Ｅｆｅｍ Active JP7140960B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2018048470A JP7140960B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍ
TW112110392A TWI821138B (zh) 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ）
TW107133738A TWI799449B (zh) 2018-03-15 2018-09-26 設備前端模組（ｅｆｅｍ）
CN201910137404.8A CN110277338B (zh) 2018-03-15 2019-02-25 设备前端模块
CN202410172505.XA CN118073256A (zh) 2018-03-15 2019-02-25 设备前端模块
KR1020190022296A KR102652346B1 (ko) 2018-03-15 2019-02-26 이에프이엠
JP2022132184A JP7417023B2 (ja) 2018-03-15 2022-08-23 Ｅｆｅｍ
KR1020240040343A KR20240041902A (ko) 2018-03-15 2024-03-25 이에프이엠

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018048470A JP7140960B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022132184A Division JP7417023B2 (ja) 2018-03-15 2022-08-23 Ｅｆｅｍ

Publications (2)

Publication Number Publication Date
JP2019161120A JP2019161120A (ja) 2019-09-19
JP7140960B2 true JP7140960B2 (ja) 2022-09-22

Family

ID=67958138

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2018048470A Active JP7140960B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍ
JP2022132184A Active JP7417023B2 (ja) 2018-03-15 2022-08-23 Ｅｆｅｍ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022132184A Active JP7417023B2 (ja) 2018-03-15 2022-08-23 Ｅｆｅｍ

Country Status (4)

Country Link
JP (2) JP7140960B2 (zh)
KR (2) KR102652346B1 (zh)
CN (2) CN110277338B (zh)
TW (2) TWI821138B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113436984A (zh) * 2020-03-23 2021-09-24 台湾积体电路制造股份有限公司 用于半导体制程机台的设备接口系统
TWI744834B (zh) * 2020-03-23 2021-11-01 台灣積體電路製造股份有限公司 用於半導體製程機台之設備介面系統

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286282A (ja) 2001-03-27 2002-10-03 Muto Denki:Kk ブローノズル
JP2006286682A (ja) 2005-03-31 2006-10-19 Tokyo Electron Ltd 基板処理装置
JP2007045606A (ja) 2005-08-11 2007-02-22 Murata Mach Ltd 搬送台車
JP2015115517A (ja) 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ
JP2016162818A (ja) 2015-02-27 2016-09-05 シンフォニアテクノロジー株式会社 搬送室
JP2017092233A (ja) 2015-11-10 2017-05-25 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP2017161103A (ja) 2016-03-07 2017-09-14 トヨタ自動車株式会社 空気浄化システム
JP2018037475A (ja) 2016-08-30 2018-03-08 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5047863A (en) * 1990-05-24 1991-09-10 Polaroid Corporation Defect correction apparatus for solid state imaging devices including inoperative pixel detection
JPH0441673A (ja) * 1990-06-06 1992-02-12 Fujitsu Ltd 真空装置及び真空装置でのリーク方法
JPH0462345A (ja) * 1990-06-29 1992-02-27 Hitachi Ltd クリーンルーム内の吸気ダクト方式
JP2600237Y2 (ja) * 1993-03-11 1999-10-04 日新電機株式会社 エアーロック室
JPH10318576A (ja) * 1997-05-21 1998-12-04 Taisei Corp 還気設備およびこれが一体化された製造装置
JP4552362B2 (ja) * 2000-06-14 2010-09-29 シンフォニアテクノロジー株式会社 ウェハ搬送装置
JP3880343B2 (ja) * 2001-08-01 2007-02-14 株式会社ルネサステクノロジ ロードポート、基板処理装置および雰囲気置換方法
WO2006104121A1 (ja) * 2005-03-29 2006-10-05 Hitachi Kokusai Electric Inc. 半導体製造装置
JP5925474B2 (ja) * 2011-12-06 2016-05-25 株式会社日立ハイテクマニファクチャ＆サービス ウエハ処理装置
JP2014038888A (ja) * 2012-08-10 2014-02-27 Hitachi High-Tech Control Systems Corp ミニエンバイロメント装置及びその内部雰囲気置換方法
JP6024980B2 (ja) * 2012-10-31 2016-11-16 Tdk株式会社 ロードポートユニット及びｅｆｅｍシステム
JP6403431B2 (ja) * 2013-06-28 2018-10-10 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 基板処理装置、流量監視方法及び半導体装置の製造方法並びに流量監視プログラム
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
KR102413271B1 (ko) * 2015-11-02 2022-06-28 삼성전자주식회사 기판 이송 장치
JP6679906B2 (ja) * 2015-12-11 2020-04-15 Tdk株式会社 Ｅｆｅｍ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286282A (ja) 2001-03-27 2002-10-03 Muto Denki:Kk ブローノズル
JP2006286682A (ja) 2005-03-31 2006-10-19 Tokyo Electron Ltd 基板処理装置
JP2007045606A (ja) 2005-08-11 2007-02-22 Murata Mach Ltd 搬送台車
JP2015115517A (ja) 2013-12-13 2015-06-22 シンフォニアテクノロジー株式会社 基板搬送装置及びｅｆｅｍ
JP2016162818A (ja) 2015-02-27 2016-09-05 シンフォニアテクノロジー株式会社 搬送室
JP2017092233A (ja) 2015-11-10 2017-05-25 シンフォニアテクノロジー株式会社 ロボット搬送装置
JP2017161103A (ja) 2016-03-07 2017-09-14 トヨタ自動車株式会社 空気浄化システム
JP2018037475A (ja) 2016-08-30 2018-03-08 株式会社日立ハイテクマニファクチャ＆サービス ウェーハ搬送装置

Also Published As

Publication number Publication date
TWI799449B (zh) 2023-04-21
TWI821138B (zh) 2023-11-01
JP7417023B2 (ja) 2024-01-18
JP2022162003A (ja) 2022-10-21
CN118073256A (zh) 2024-05-24
KR102652346B1 (ko) 2024-03-29
CN110277338B (zh) 2024-02-27
TW202331911A (zh) 2023-08-01
TW201939654A (zh) 2019-10-01
KR20240041902A (ko) 2024-04-01
JP2019161120A (ja) 2019-09-19
KR20190109246A (ko) 2019-09-25
CN110277338A (zh) 2019-09-24

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