TWI795842B - 熱硬化性樹脂組成物、覆蓋膜、接著片及可撓性印刷配線板 - Google Patents

熱硬化性樹脂組成物、覆蓋膜、接著片及可撓性印刷配線板 Download PDF

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TWI795842B
TWI795842B TW110126000A TW110126000A TWI795842B TW I795842 B TWI795842 B TW I795842B TW 110126000 A TW110126000 A TW 110126000A TW 110126000 A TW110126000 A TW 110126000A TW I795842 B TWI795842 B TW I795842B
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mass
epoxy resin
parts
resin composition
solid epoxy
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TW110126000A
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Chinese (zh)
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TW202208574A (zh
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権平貴志
古川勝彦
阿部将太
須貝拓馬
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日商有澤製作所股份有限公司
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    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
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TW110126000A 2020-07-22 2021-07-15 熱硬化性樹脂組成物、覆蓋膜、接著片及可撓性印刷配線板 TWI795842B (zh)

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US (1) US11884815B2 (https=)
JP (1) JP7090824B1 (https=)
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JP2023062672A (ja) * 2021-10-21 2023-05-08 Dic株式会社 熱硬化性組成物、その硬化物、半導体封止材料、プリプレグ、回路基板及びビルドアップフィルム
CN120187797A (zh) * 2022-12-19 2025-06-20 株式会社有泽制作所 热固性树脂组合物、覆盖膜及柔性印刷布线板
WO2025183038A1 (ja) * 2024-02-27 2025-09-04 日東シンコー株式会社 接着シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007204715A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP2009096940A (ja) * 2007-10-19 2009-05-07 Toyo Ink Mfg Co Ltd 難燃性接着剤組成物、カバーレイおよび接着剤シート、フレキシブルプリント配線板
CN103443158A (zh) * 2011-05-31 2013-12-11 东洋纺株式会社 含羧基聚酰亚胺、热固性树脂组合物及柔性覆金属层叠体
TW201522497A (zh) * 2013-09-26 2015-06-16 Toyo Boseki 聚胺酯樹脂組成物與利用此樹脂組成物之接著劑組成物、疊層體及印刷電路板
TW201703207A (zh) * 2015-02-26 2017-01-16 日立化成股份有限公司 密封用薄膜及使用該密封用薄膜之電子零件裝置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62501299A (ja) * 1985-06-26 1987-05-21 ザ ダウ ケミカル カンパニ− ゴム改質エポキシ化合物
JP4425118B2 (ja) 2003-12-03 2010-03-03 株式会社有沢製作所 難燃性樹脂組成物、並びに該組成物を用いたフレキシブルプリント配線板用金属張積層板、カバーレイ、接着シート及びフレキシブルプリント配線板
JP5190976B2 (ja) * 2004-09-21 2013-04-24 昭和電工株式会社 ウレタン樹脂を用いた熱硬化性樹脂組成物
JP5393959B2 (ja) * 2007-07-13 2014-01-22 太陽ホールディングス株式会社 光硬化性・熱硬化性樹脂組成物及びその硬化物
JP2010143981A (ja) * 2008-12-17 2010-07-01 Toyo Ink Mfg Co Ltd 硬化性導電性ポリウレタンポリウレア接着剤組成物、硬化性電磁波シールド性接着性フィルムおよびその製造方法
EP2468792A1 (en) * 2010-12-23 2012-06-27 3M Innovative Properties Company Curable adhesive composition
JP5712851B2 (ja) 2011-07-29 2015-05-07 富士通株式会社 データ分割装置、データ分割方法およびデータ分割プログラム
JP2020038915A (ja) * 2018-09-05 2020-03-12 戸田工業株式会社 多層印刷回路板の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007204715A (ja) * 2006-02-06 2007-08-16 Toyobo Co Ltd 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP2009096940A (ja) * 2007-10-19 2009-05-07 Toyo Ink Mfg Co Ltd 難燃性接着剤組成物、カバーレイおよび接着剤シート、フレキシブルプリント配線板
CN103443158A (zh) * 2011-05-31 2013-12-11 东洋纺株式会社 含羧基聚酰亚胺、热固性树脂组合物及柔性覆金属层叠体
TW201522497A (zh) * 2013-09-26 2015-06-16 Toyo Boseki 聚胺酯樹脂組成物與利用此樹脂組成物之接著劑組成物、疊層體及印刷電路板
TW201703207A (zh) * 2015-02-26 2017-01-16 日立化成股份有限公司 密封用薄膜及使用該密封用薄膜之電子零件裝置

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