KR102463618B1 - 열경화성 수지 조성물, 커버레이 필름, 접착 시트 및 플렉시블 프린트 배선판 - Google Patents

열경화성 수지 조성물, 커버레이 필름, 접착 시트 및 플렉시블 프린트 배선판 Download PDF

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KR102463618B1
KR102463618B1 KR1020227020092A KR20227020092A KR102463618B1 KR 102463618 B1 KR102463618 B1 KR 102463618B1 KR 1020227020092 A KR1020227020092 A KR 1020227020092A KR 20227020092 A KR20227020092 A KR 20227020092A KR 102463618 B1 KR102463618 B1 KR 102463618B1
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epoxy resin
mass
parts
solid epoxy
resin composition
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KR20220088799A (ko
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다카시 곤다이라
가츠히코 후루카와
쇼타 아베
다쿠마 스가이
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가부시키가이샤 아리사와 세이사쿠쇼
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    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/42Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44Polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/74Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/75Polyisocyanates or polyisothiocyanates cyclic cycloaliphatic
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    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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  • Chemical & Material Sciences (AREA)
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  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Epoxy Resins (AREA)
KR1020227020092A 2020-07-22 2021-07-05 열경화성 수지 조성물, 커버레이 필름, 접착 시트 및 플렉시블 프린트 배선판 Active KR102463618B1 (ko)

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JPJP-P-2020-124865 2020-07-22
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PCT/JP2021/025253 WO2022019095A1 (ja) 2020-07-22 2021-07-05 熱硬化性樹脂組成物、カバーレイフィルム、接着シート、及びフレキシブルプリント配線板

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US (1) US11884815B2 (https=)
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JP2023062672A (ja) * 2021-10-21 2023-05-08 Dic株式会社 熱硬化性組成物、その硬化物、半導体封止材料、プリプレグ、回路基板及びビルドアップフィルム
CN120187797A (zh) * 2022-12-19 2025-06-20 株式会社有泽制作所 热固性树脂组合物、覆盖膜及柔性印刷布线板
WO2025183038A1 (ja) * 2024-02-27 2025-09-04 日東シンコー株式会社 接着シート

Citations (3)

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Publication number Priority date Publication date Assignee Title
JP2007204715A (ja) 2006-02-06 2007-08-16 Toyobo Co Ltd 接着剤組成物及びそれを用いたフレキシブル銅張積層板
JP2009096940A (ja) 2007-10-19 2009-05-07 Toyo Ink Mfg Co Ltd 難燃性接着剤組成物、カバーレイおよび接着剤シート、フレキシブルプリント配線板
JP2013176965A (ja) 2011-05-31 2013-09-09 Toyobo Co Ltd フレキシブル金属張積層体、フレキシブルプリント基板、及び電子機器

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