TWI791537B - 引線框架及其製造方法 - Google Patents

引線框架及其製造方法 Download PDF

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Publication number
TWI791537B
TWI791537B TW107120434A TW107120434A TWI791537B TW I791537 B TWI791537 B TW I791537B TW 107120434 A TW107120434 A TW 107120434A TW 107120434 A TW107120434 A TW 107120434A TW I791537 B TWI791537 B TW I791537B
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TW
Taiwan
Prior art keywords
lead frame
barrier
lead
lead wire
barrier bar
Prior art date
Application number
TW107120434A
Other languages
English (en)
Chinese (zh)
Other versions
TW201906117A (zh
Inventor
大川內竜二
Original Assignee
日商大口電材股份有限公司
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Publication date
Application filed by 日商大口電材股份有限公司 filed Critical 日商大口電材股份有限公司
Publication of TW201906117A publication Critical patent/TW201906117A/zh
Application granted granted Critical
Publication of TWI791537B publication Critical patent/TWI791537B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW107120434A 2017-06-22 2018-06-14 引線框架及其製造方法 TWI791537B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2017-122548 2017-06-22
JP2017122548A JP6327732B1 (ja) 2017-06-22 2017-06-22 リードフレーム及びその製造方法

Publications (2)

Publication Number Publication Date
TW201906117A TW201906117A (zh) 2019-02-01
TWI791537B true TWI791537B (zh) 2023-02-11

Family

ID=62186693

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107120434A TWI791537B (zh) 2017-06-22 2018-06-14 引線框架及其製造方法

Country Status (3)

Country Link
JP (1) JP6327732B1 (ja)
CN (1) CN109119395B (ja)
TW (1) TWI791537B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021205891A1 (ja) * 2020-04-07 2021-10-14 株式会社村田製作所 リードフレームの製造方法、リードフレームおよび電源装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166695A (ja) * 2003-11-28 2005-06-23 Mitsui High Tec Inc リードフレーム及び半導体装置の製造方法
TW200623344A (en) * 2004-12-27 2006-07-01 Advanced Semiconductor Eng Leadframe, semiconductor package and method for manufacturing the same
TW200713554A (en) * 2005-09-29 2007-04-01 Siliconware Precision Industries Co Ltd Lead frame structure and package for integrating the same
US20080283980A1 (en) * 2007-05-18 2008-11-20 Freescale Semiconductor, Inc Lead frame for semiconductor package
TW201438174A (zh) * 2013-01-11 2014-10-01 Mitsui High Tec 引線架
US20140319663A1 (en) * 2013-04-18 2014-10-30 Dai Nippon Printing Co., Ltd. Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
US20140329360A1 (en) * 2013-05-06 2014-11-06 Samsung Techwin Co., Ltd. Method of manufacturing lead frame
US20150228561A1 (en) * 2014-02-07 2015-08-13 Dawning Leading Technology Inc Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03296254A (ja) * 1990-02-06 1991-12-26 Dainippon Printing Co Ltd リードフレーム
JPH0846129A (ja) * 1994-07-29 1996-02-16 Toppan Printing Co Ltd リードフレーム
JP5214911B2 (ja) * 2006-12-27 2013-06-19 株式会社デンソー モールドパッケージの製造方法
KR20110038620A (ko) * 2008-07-10 2011-04-14 시마 덴시 가부시키가이샤 리드 프레임 및 그 제조 방법
JP5807800B2 (ja) * 2010-11-18 2015-11-10 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
US20120126378A1 (en) * 2010-11-24 2012-05-24 Unisem (Mauritius ) Holdings Limited Semiconductor device package with electromagnetic shielding
JP5899614B2 (ja) * 2010-11-26 2016-04-06 大日本印刷株式会社 リードフレームおよびリードフレームの製造方法
JP5997971B2 (ja) * 2012-08-09 2016-09-28 株式会社三井ハイテック リードフレーム
JP6319644B2 (ja) * 2013-10-01 2018-05-09 大日本印刷株式会社 リードフレームおよびその製造方法、ならびに半導体装置の製造方法
CN103681585B (zh) * 2013-12-31 2015-04-01 苏州日月新半导体有限公司 引线框架、qfn封装体、及形成qfn封装体的方法
JP6443978B2 (ja) * 2015-01-30 2018-12-26 大口マテリアル株式会社 リードフレーム及びその製造方法
CN104659010B (zh) * 2015-02-11 2018-03-16 江苏长电科技股份有限公司 一种四方扁平无引脚型态封装的引线框结构与封装体结构
JP6638951B2 (ja) * 2015-09-28 2020-02-05 大口マテリアル株式会社 リードフレーム及びその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005166695A (ja) * 2003-11-28 2005-06-23 Mitsui High Tec Inc リードフレーム及び半導体装置の製造方法
TW200623344A (en) * 2004-12-27 2006-07-01 Advanced Semiconductor Eng Leadframe, semiconductor package and method for manufacturing the same
TW200713554A (en) * 2005-09-29 2007-04-01 Siliconware Precision Industries Co Ltd Lead frame structure and package for integrating the same
US20080283980A1 (en) * 2007-05-18 2008-11-20 Freescale Semiconductor, Inc Lead frame for semiconductor package
TW201438174A (zh) * 2013-01-11 2014-10-01 Mitsui High Tec 引線架
US20140319663A1 (en) * 2013-04-18 2014-10-30 Dai Nippon Printing Co., Ltd. Lead frame, method for manufacturing lead frame, semiconductor device, and method for manufacturing semiconductor device
US20140329360A1 (en) * 2013-05-06 2014-11-06 Samsung Techwin Co., Ltd. Method of manufacturing lead frame
US20150228561A1 (en) * 2014-02-07 2015-08-13 Dawning Leading Technology Inc Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure

Also Published As

Publication number Publication date
JP2019009239A (ja) 2019-01-17
CN109119395A (zh) 2019-01-01
JP6327732B1 (ja) 2018-05-23
CN109119395B (zh) 2022-11-25
TW201906117A (zh) 2019-02-01

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